CN113168790A

CN113168790A - Flexible panel and manufacturing method thereof

Info

Publication number: CN113168790A
Application number: CN201880097633.5A
Authority: CN
Inventors: 张瑶; 袁泽; 朱林; 陈鑫; 李贺; 胡康军
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-12-19
Filing date: 2018-12-19
Publication date: 2021-07-23
Also published as: WO2020124417A1

Abstract

The application provides a flexible panel and flexible panel manufacturing method, flexible panel (100) includes substrate (10) and electron device (20), substrate (100) be equipped with flexible portion (11) and with stereoplasm portion (12) that flexible portion (11) are connected, stereoplasm portion (12) are equipped with and bind district (121), electron device (20) are fixed in flexible portion (11), electron device (20) with extend to wire (30) of binding district (121) are connected. The flexible panel is characterized in that the base material (10) is provided with the flexible portion (11) and the hard portion (12) connected with the flexible portion, and the hard portion (12) is provided with the binding region (121), so that the binding region (121) is not easy to deform, the base material (10) of the electronic device (20) and the binding region (121) is prevented from being connected with a functional element to be invalid, and the functional stability of the flexible panel (100) is improved.

Description

Flexible panel and manufacturing method thereof

Technical Field

The application relates to the field of flexible equipment, in particular to a flexible panel and a manufacturing method of the flexible panel.

Background

At present, the base material of the flexible display panel or the flexible touch panel is easy to deform under the action of heating and pressing. For example, the substrate is easily deformed during the hot pressing process, so that the electronic device on the substrate cannot be effectively connected with the functional element at the binding region, thereby affecting the functional stability of the flexible panel.

Disclosure of Invention

The application provides a flexible panel and a manufacturing method thereof.

The application provides a flexible panel, wherein, flexible panel includes substrate and electron device, the substrate be equipped with flexible portion and with the stereoplasm portion that flexible portion connects, stereoplasm portion is equipped with binds the district, electron device is fixed in flexible portion, electron device with extend to the wire that binds the district is connected.

The present application provides a method for manufacturing a flexible panel, wherein,

the manufacturing method of the flexible panel comprises the following steps:

providing a base material, wherein the base material is provided with a part to be processed and a flexible part connected with the part to be processed;

processing the part to be processed to form a hard part with a binding area;

forming an electronic device on the flexible portion, and forming a wire connecting the electronic device, the wire extending to the bonding region.

According to the flexible panel and the manufacturing method of the flexible panel, the hard portion connected with the flexible portion is arranged on the base material, the hard portion is provided with the binding area, the base material in the binding area is not prone to deformation, the conducting wire for electrically connecting the electronic device is prevented from being connected with the functional element in the binding area and being out of work, and the functional stability of the flexible panel is improved.

Drawings

Fig. 1 is a schematic view of a flexible panel provided in an embodiment of the present application.

Fig. 2 is a schematic view of a flexible touch display screen provided in an embodiment of the present application.

Fig. 3 is a schematic view of a flexible display screen provided in another embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 5 is another schematic view of a flexible panel provided by an embodiment of the present application.

Fig. 6 is a schematic view of a flexible panel provided in another embodiment of the present application.

Fig. 7 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 8 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 9 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 10 is a schematic processing diagram of step 101 of manufacturing a flexible panel according to an embodiment of the present application.

Fig. 11 is another schematic processing diagram of step 101 of manufacturing a flexible panel according to an embodiment of the present application.

Fig. 12 is a schematic processing diagram of steps 101 to 106 of manufacturing a flexible panel according to an embodiment of the present application.

Fig. 13 is a schematic flow chart of manufacturing a flexible panel according to an embodiment of the present application.

Fig. 14 is a schematic processing diagram of the fabrication of a flexible panel according to another embodiment of the present application.

Fig. 15 is a schematic flow chart of manufacturing a flexible panel according to another embodiment of the present application.

Fig. 16 is a schematic processing diagram of the fabrication of a flexible panel according to another embodiment of the present application.

Fig. 17 is a schematic flow chart illustrating a flexible panel manufacturing process according to another embodiment of the present application.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The technical solutions in the embodiments of the present invention will be described clearly below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, the present application provides a flexible panel 100, the flexible panel 100 includes a substrate 10 and an electronic device 20, the substrate 10 is provided with a flexible portion 11 and a rigid portion 12 connected to the flexible portion 11. The hard portion 12 is provided with a binding region 121. An electronic device 20 is secured to the flexible portion 11, the electronic device 20 being connected to a wire 30 extending to the binding region 121. It is understood that the flexible panel 100 may be a flexible panel such as a flexible sensor, or a flexible display panel, or a flexible touch panel. The flexible panel 100 may be applied in a bendable or stretchable electronic device, which may be a wearable device such as a cell phone, a watch, a wrist guard, etc. The flexible panel 100 may also be used in bendable or stretchable electronic devices in the fields of detection monitoring, entertainment interaction, and smart wear.

The substrate 10 is provided with the flexible portion 11 and the hard portion 12 connected with the flexible portion 11, and the hard portion 12 is provided with the binding region 121, so that the binding region 121 is not easy to deform, the electronic device 20 is prevented from being connected with a functional element to fail, and the functional stability of the flexible panel 100 is improved.

In the present embodiment, the substrate 10 is a flexible substrate having flexible properties or a stretchable substrate having elastic properties. The substrate 10 comprises a first short side 13 and a second short side 14 arranged opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14. The flexible portion 11 occupies a larger area of the substrate 10 and the stiff portion 12 is substantially adjacent to the first short side 13. The hard portion 12 is substantially elongated. The hard portion 12 extends substantially in a direction parallel to the first short side 13. The length of the hard portion 12 is substantially equal to the length of the first short side 13. The hard portion 12 has a hardness greater than that of the flexible portion 11. The thickness of the flexible portion 11 corresponds to the thickness of the hard portion 12. The thickness of the substrate 10 is approximately 5 μm to 80 μm. The flexible portion 11 can be bent as required to meet the bending requirement of the base material 10, and can be stretched as required to meet the stretching requirement of the base material 10. The hard portion 12 has strong internal stress, and the hard portion 12 is not easily deformed under the action of heat and pressure. The hard portion 12 may provide a relatively stable connection structure for the bonding region 121, so as to facilitate reliable connection between the substrate 10 and the functional element in the bonding region 121, prevent disconnection between the electronic device 20 and the functional element in the bonding region 121 of the substrate 10 during hot pressing of the substrate 10, and improve functional stability of the flexible panel 100. Of course, in other embodiments, the hard portion 12 may extend substantially in a direction parallel to the long side 15.

In the present embodiment, the electronic device 20 is a touch electrode. That is, the flexible panel 100 is a flexible touch panel, and the flexible panel 100 may be applied to electronic devices such as a folding mobile phone, a flexible wearable device, and a flexible detection device, which can sense an external signal. As an embodiment, the electronic device 20 may be formed by a plurality of capacitive sensing cells 21. A plurality of capacitive sensing cells 21 are arrayed on the flexible portion 11. The plurality of capacitive sensing cells 21 may be printed on the substrate 10 by a screen printing process. The plurality of capacitive sensing cells 21 may move toward or away from each other as the flexible portion 11 bends or stretches. The conductor 30 includes a plurality of signal lines 31. The signal line 31 is connected to the capacitance sensing units 21, and one end of the signal line 31 extends to the binding region 121, so that the functional elements are conveniently conducted with the signal line 31 in the binding region 121, and sensing signals of a plurality of capacitance sensing units 21 are obtained. The signal line 31 can be bent and stretched along with the flexible portion 11, so that the flexible panel 100 can sense signals in a bent and stretched deformation state. One end of the signal line 31 at the bonding region 121 constitutes a leading end of the electronic device 20. The hard portion 12 reinforces the substrate 10 located in the bonding region 121, prevents the bonding region 121 from being in poor contact with the functional element during the hot pressing process, and increases the functional stability of the flexible panel 100.

In this embodiment, the flexible panel 100 is a flexible touch panel, and as shown in fig. 2, a flexible touch display screen 1000 is provided, where the flexible touch display screen 1000 includes a light-transmitting cover plate 1001, the flexible panel 100, and a display panel 1002. The flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002. The flexible portion 11 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002 such that the flexible panel 100 may form virtual keys in conjunction with the display area of the display panel 1002. The bonding region 121 of the flexible panel 100 may protrude relative to the display panel 1002, so as to be conveniently bonded with the flexible circuit board 70, so that the flexible touch display 1000 has a touch function. Of course, in other embodiments, the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmissive cover 1001, or integrated with the light-transmissive cover 1001. Of course, the flexible panel 100 may also be applied to a wearable device having a touch function, such as a wrist band, a watch, or a strap.

In another embodiment, referring to fig. 3, different from the embodiment shown in fig. 2, the flexible panel 100 is a flexible display panel. A flexible display 2000 is provided, the flexible display 2000 comprising a light transmissive cover 2001 and a flexible panel 100. The flexible panel 100 is attached to the light-transmitting cover plate 2001, and the flexible panel 100 further includes a display layer 110, where the display layer 110 is attached to one side of the substrate 10 where the electronic devices 20 are arranged. The display layer 110 has a plurality of light emitting cells arrayed. The electronic device 20 is a drive electrode. The electronic device 20 may drive the plurality of light emitting cells of the display layer 110 to emit light. The electronic device 20 may be constituted by an array of a plurality of drive units 22. Each driving unit 22 is opposite to each light emitting unit of the display layer 110. Each driving unit 22 may be formed of a thin film transistor diode switch. The flexible portion 11 is substantially aligned with the display area of the display layer 110 to facilitate driving of the display area of the display layer 110 by the electronic device 20 to emit light to display an image. The binding region 121 protrudes relative to the display layer 110, and is conveniently bound to the flexible circuit board 70, so that the flexible display screen 2000 can acquire display signals through the flexible circuit board 70. Of course, in other embodiments, the flexible panel 100 may also be applied to an electronic device with a flexible display function, such as a foldable tablet computer, a foldable display, and the like.

Further, referring to fig. 4 and 5, the substrate 10 is formed with a groove 122, and the hard portion 12 is disposed in the groove 122.

In the present embodiment, the groove 122 may be formed by a hot press mold, may be formed by laser engraving, or may be formed by solvent etching. The substrate 10 has a first surface 115 and a second surface 116 opposite the first surface 115. The binding region 121 is located at the first surface 115. The recess 122 may extend through the first surface 115 toward the second surface 116. The recess 122 has an opening 124 in the first surface 115. The bottom of the recess 122 may be spaced from the second surface 116, i.e., the recess 122 is partially open to the substrate 10. The bottom of the recess 122 may also be through the second surface 116, i.e., the recess 122 may extend completely through the substrate 10. The hard portion 12 may be filled in the groove 122 through an injection process. The hard portion 12 is cured to form a fixed block having a high hardness in the groove 122. The hard portion 12 may be silicone, epoxy, acrylic or other resin containing inorganic nanoparticles. The hard portion 12 has an upper surface 125 that is substantially flush with the first surface 115. The wire 30 may be provided on the upper surface 125 extending to the bonding region 121, with the upper surface 125 of the rigid portion 12 providing a stable attachment platform for the wire 30. The hard portion 12 may be molded in the groove 122, and may be integrally molded with the substrate 10, so as to increase the functional stability of the flexible panel 100 by increasing the structural stability of the substrate 10.

In one embodiment, after the groove 122 is formed in the substrate 10, a material to be hardened is filled into the groove 122, the hard portion 12 is formed after the material to be hardened, and finally the binding region 121 is formed on the hard portion 12. The periphery of the opening 124 of the groove 122 is spaced from the periphery of the bonding area 121, and the edge of the opening 124 of the groove 122 is parallel to the edge of the bonding area 121. I.e., the peripheral side edge of opening 124 is spaced from the peripheral side edge of bonding region 121. The binding region 121 occupies a portion of the hard portion 12, and the hard portion 12 provides a support structure with higher hardness for the binding region 121, so as to facilitate the conduction between the wires 30 in the binding region 121 and the functional element. The hard portion 12 may still provide a stiffer support structure for the wires 30 in the area beyond the bonding region 121, further enhancing the functional stability of the flexible panel 100.

In another embodiment, please refer to fig. 6, which is different from the embodiment shown in fig. 5 in that the groove 122 forms a plurality of sub-grooves 126 arranged at intervals around the bonding region 121. The opening 124 has a plurality of inner edges 1241 generally aligned with the peripheral side edges of the bonded region 121 and a plurality of outer edges 1242 opposite the peripheral side edges of the bonded region 121. The plurality of inner edges 1241 and the plurality of outer edges 1242 are staggered in the circumferential direction of the bonded region 121. That is, the plurality of sub grooves 126 form a saw-toothed groove at the circumferential side of the bonding area 121. The plurality of sub-grooves 126 are arranged around the binding region 121 to reduce the material cost of the hard portion 12 and ensure the structural rigidity of the hard portion 12, so that the functional stability of the flexible panel 100 is improved.

Further, referring to fig. 7, the flexible panel 100 further includes a smoothing layer 40 coated on the substrate 10, wherein the smoothing layer 40 covers the interface between the hard portion 12 and other adjacent regions. The wires 30 are arranged on the side of the smoothing layer 40 facing away from the substrate 10.

In the present embodiment, the smoothing layer 40 is formed on the upper surface 125 of the hard portion 12 and a part of the first surface 115 of the substrate 10. The smoothing layer 40 covers the opening 124. The smoothing layer 40 is molded after the hard portion 12 is filled in the groove 122. The smoothing layer 40 makes up the gap between the hard portion 12 and other adjacent regions, so that the flexible panel 100 can obtain a flat surface at the interface of the hard portion 12 and other adjacent regions to facilitate the wiring of the wires 30 on the hard portion 12 and other adjacent regions. The smoothing layer 40 also covers the bonding region 121 such that the wires 30 extend over the smoothing layer 40 to the bonding region 121, facilitating connection of the wires 30 of the bonding region 121 with an external device. I.e. the wires 30 overlie the smoothing layer 40. The thickness of the smoothing layer 40 is relatively thin, the thickness of the smoothing layer 40 is smaller than that of the hard portion 12, and the thickness difference between the flexible portion 11 and the hard portion 12 of the smoothing layer 40 is negligible, so as to ensure the surface flatness of the flexible panel 100.

Further, referring to fig. 8, the flexible panel 100 further includes a reinforcing layer 50, the reinforcing layer 50 covers the bonding region 121, and the reinforcing layer 50 is located on a side of the substrate 10 away from the conductive line 30. The reinforcing layer 50 and the smoothing layer 40 are respectively located on two opposite sides of the substrate 10. Namely, the stiffening layer 50 is attached to the second surface 116. The stiffening layer 50 covers the recess 122. When the recess 122 has an opening penetrating the second surface 116, the reinforcing layer 50 may cover the opening of the recess 122 on the second surface 116. The stiffening layer 50 may be attached to the substrate 10 before the formation of the recess 122. The reinforcing layer 50 is attached to the substrate 10, and the groove 122 is formed in the position, corresponding to the reinforcing layer 50, of the substrate 10, so that damage to the substrate 10 can be reduced, and the substrate 10 is prevented from being deformed due to stress impact in the process of forming the groove 122 in the substrate 10. The stiffening layer 50 may cover the opening of the recess 122 at the second surface 116 to facilitate filling the hard portion 12 into the recess 122 through the opening 124. The reinforcing layer 50 may be a metal steel sheet or a resin film. The stiffening layer 50 may cover the bonding region 121 to increase the hardness of the bonding region 121, ensure the stable connection of the conductive line 30 with an external device at the bonding region 121, and ensure the functional stability of the flexible panel 100.

Further, referring to fig. 9, the flexible panel 100 further includes a flexible circuit board 70, and a portion of the flexible circuit board 70 is fixed to the bonding area 121 and connected to the wires 30.

In this embodiment, the flexible circuit board 70 includes a first end 71 fixedly connected to the substrate 10 and a second end 72 disposed opposite the first end 71. The first end 71 is fixed to the binding region 121. The first end 71 covers the bonding area 121. The first end 71 is provided with a plurality of bare copper. The plurality of exposed copper are connected to the plurality of wires 30 at the bonding region 121, so that the electronic device 20 can be electrically connected to the flexible circuit board 70 through the wires 30. The second end 72 is offset from the substrate 10. The second end 72 may be provided with a connector 721. The connector 721 is in electrical communication with a plurality of exposed copper via copper foil cables so that the connector 721 can be in electrical communication with the electronic device 20 via the wires 30. When the connector 721 is connected to an external device, the electronic device 20 may transmit the sensing signal to the external device through the flexible circuit board 70, so that the flexible panel 100 may transmit the sensing signal to the outside. The hard portion 12 in the groove 122 is utilized to reinforce the bonding area 121, so as to ensure that the wires 30 opposite to the bonding area 121 can be firmly contacted with the first end 71 of the flexible circuit board 70, thereby increasing the conduction performance.

The flexible circuit board 70 is fixed to the bonding area 121 through the conductive adhesive 80, and is electrically connected to the conductive wires 30 through the conductive adhesive 80. The conductive adhesive 80 is adhered between the smoothing layer 40 and the first end 71 of the flexible printed circuit board 70, so that the flexible printed circuit board 70 is firmly adhered to the substrate 10, and the exposed copper of the flexible printed circuit board 70 can be effectively conducted with the conductive wire 30. In the process of stably connecting the flexible circuit board 70 and the substrate 10 through the conductive adhesive 80, the flexible circuit board 70, the conductive adhesive 80 and the substrate 10 need to be heated, and the conductive adhesive 80 is extruded by the flexible circuit board 70 and the substrate 10 under the action of a large pressure, so that conductive particles in the conductive adhesive 80 are conducted up and down, and the conductive adhesive 80 can exhibit stable bonding and conducting performance. The hard portion 12 in the groove 122 is used for reinforcing the bonding area 121, and the reinforcing layer 50 is used for reinforcing the bonding area 121, so that the hardness of the bonding area 121 is increased, the substrate 10 is not easy to deform at the bonding area 121, and the connection reliability of the flexible circuit board 70 and the substrate 10 and the electronic device 20 is improved.

Referring to fig. 10, 11, 12 and 13, the present application further provides a method for manufacturing a flexible panel, which includes the steps of:

a substrate 10 is provided, and the substrate 10 to be processed has a portion 111 to be processed and a flexible portion 11 connected to the portion 111 to be processed.

In the present embodiment, the substrate 10 may be obtained by a cutting process. The substrate 10 may have a rectangular shape. The portion to be processed 111 may be located at one end in the longitudinal direction of the substrate 10. By providing a region to be processed in advance in the portion to be processed 111, the portion to be processed 111 can be processed in a subsequent step. The thickness of the substrate 110 may be 5 μm to 80 μm. The substrate 10 has a first short side 13 and a second short side 14 arranged opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14. The portion to be processed 111 is adjacent to the first short side 13. The portion to be processed 111 is provided integrally with the flexible portion 11. The portion to be processed 111 is processed to obtain a base material with a certain hardness, so that the safety of the flexible panel is improved.

102: the portion to be processed 111 is processed to form the hard portion 12 having the bonded region 121.

In this embodiment, the step 102 includes the steps of:

a groove 122 is machined in the portion to be machined 111.

The groove 122 may be formed by a hot press mold, a laser engraving, or a solvent etching. The groove 122 is formed by providing a molding region of the groove 122 on the portion to be processed 111 in advance and processing the portion to be processed 111 with a mold. The depth of the recess 122 can be adjusted as desired. The grooves 122 may extend completely through the substrate 110 to be processed, or the depth of the grooves 122 may be less than the thickness of the substrate 10.

The groove 122 is filled with a material to be hardened.

In this embodiment, the material to be hardened may be injected and filled in the groove 122 through a mold, may be filled in the groove 122 through a coating process, or may be filled in the groove 122 through a printing process. The material to be hardened is substantially fluid gel after being filled in the groove 122, and the material to be hardened has no hardness, which cannot meet the strength requirement of the flexible panel, and needs to be further processed. The material to be hardened may be a siloxane, epoxy, acrylic or other resin containing inorganic nanoparticles.

The material to be hardened is processed to form the hard portion 12.

In this embodiment, the material to be hardened is cured, so that the material to be hardened forms a fixed block having a certain hardness. The material to be hardened may be cured by an illumination curing process, or may be cured by a thermal curing process, or may be cured by a combination of illumination curing and thermal curing, so that the hardness of the hard portion 12 may be adjusted as required, and the flexible panel 100 may meet the use requirements, i.e., may ensure a certain hardness, and may also meet the bending and tensile deformation properties. After the hard portion 12 is formed in the groove 122, a binding region 121 may be disposed on the hard portion 12 to enhance the hardness of the binding region 121 by using the hard portion 12, so as to prevent the binding region 121 from deforming under heat and pressure.

The manufacturing method of the flexible panel further comprises the following steps:

103: a smooth layer 40 is formed on the base material 10, and the smooth layer 40 covers the boundary between the hard portion 12 and other adjacent regions.

In this embodiment, the smoothing layer 40 may be formed on the substrate 10 by a printing or coating process. The smooth layer 40 covers the gap between the hard part 12 and other adjacent regions, so that the flexible panel can obtain a relatively flat surface, and the wires 30 of the flexible panel 100 can be conveniently arranged.

104: the electronic device 20 is molded on the flexible part 11, and the lead 30 connected to the electronic device 20 is molded, the lead 30 extending to the bonding region 121.

In the present embodiment, the electronic device 20 and the lead 30 may be printed on the substrate 10 by a process such as screen printing. The electronic device 20 may be composed of a plurality of capacitive sensing cells 21 arranged in an array. The electronic device 20 is molded on the flexible portion 11. The lead 30 is partially formed on the flexible portion 11, and the other portion is formed on a side of the smoothing layer 40 away from the substrate 10, that is, the lead 30 covers the smoothing layer 40.

105: the reinforcing layer 50 is formed on the substrate 10, and the reinforcing layer 50 may be made of a material such as a metal sheet, a plastic sheet, or a resin sheet. The reinforcing layer 50 is attached to the substrate 10 on the side away from the smoothing layer 40. The reinforcing layer 50 is opposite to the bonding region 121 to enhance the hardness of the bonding region 121.

106: providing a flexible circuit board 70, and fixedly connecting the flexible circuit board 70 to the bonding area 121 of the substrate 10 through the conductive adhesive 80.

In this embodiment, the conductive adhesive 80 is coated on the smooth layer 40 corresponding to the bonding area 121, and one end of the flexible circuit board 70 is attached to the conductive adhesive 80. A certain extrusion force is applied to the flexible circuit board 70 and the substrate 10, so that the conductive particles in the conductive adhesive are conducted up and down, and the conductive adhesive 80 is heated, so that the conductive adhesive 80 can be conveniently and stably connected with the flexible circuit board 70 and the substrate 10, and the flexible circuit board 70 is conducted with the lead 30. The reinforcing layer 50 enhances the hardness of the binding region 121, prevents the substrate 10 from deforming, and ensures the functional stability of the flexible panel 100.

In another embodiment, referring to fig. 14 and 15, a method for manufacturing a flexible panel includes the steps of:

a substrate 10 is provided, the substrate 10 having a portion to be processed 111 and a flexible portion 11 connected to the portion to be processed 111.

202: the reinforcing layer 50 is molded on one side of the portion to be processed 111.

In the present embodiment, before the portion to be processed 111 is not processed, the reinforcing layer 50 is attached to the portion to be processed 111, so as to provide a rigid support structure for the portion to be processed 111 during the processing of the portion to be processed 111, and prevent the portion to be processed 111 from being damaged due to excessive processing stress.

203: the portion to be processed 111 is processed so that the portion to be processed 111 forms a hard portion 12 having a bonded region 121.

204: a smoothing layer 40 is formed on the substrate 10, and the smoothing layer 40 covers the bonding regions 121.

205: the electronic device 20 is molded on the flexible portion 12, and the lead 30 connected to the electronic device 20 is molded, the lead 30 extending to the bonding region 121.

206: providing a flexible circuit board 70, and fixedly connecting the flexible circuit board 70 to the bonding area 121 of the substrate 10 through the conductive adhesive 80.

In another embodiment, referring to fig. 16 and 17, a method for manufacturing a flexible panel includes the steps of:

301 a substrate 10 is provided, the substrate 10 having a portion to be processed 111 and a flexible portion 11 connected to the portion to be processed 111.

302: the portion to be processed 111 is processed so that the portion to be processed 111 forms a hard portion 12 having a bonded region 121.

303: a smoothing layer 40 is formed on the substrate 10, and the smoothing layer 40 covers the bonding regions 121.

304: the reinforcing layer 50 is formed on the side of the substrate 10 away from the smoothing layer 40, and the reinforcing layer 50 covers the bonding region 121.

305: the electronic device 20 is molded on the flexible portion 12, and the lead 30 connected to the electronic device 20 is molded, the lead 30 extending to the bonding region 121.

306: providing a flexible circuit board 70, and fixedly connecting the flexible circuit board 70 to the bonding area 121 of the substrate 10 through the conductive adhesive 80.

The hard portion is provided with the flexible portion and the flexible portion, the hard portion is provided with the binding area, the binding area is not prone to deformation, the electronic device and the functional element are prevented from being connected in the binding area to be invalid, and the functional stability of the flexible panel is improved.

The flexible panel and the method for manufacturing the flexible panel provided by the embodiment of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the embodiment of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

The flexible panel is characterized by comprising a substrate and an electronic device, wherein the substrate is provided with a flexible portion and a hard portion connected with the flexible portion, the hard portion is provided with a binding region, the electronic device is fixed on the flexible portion, and the electronic device is connected with a lead extending to the binding region.
The flexible panel of claim 1, wherein the hard portion has a hardness greater than a hardness of the flexible portion.
The flexible panel of claim 1, wherein the substrate defines a recess, and wherein the hard portion is disposed within the recess.
A flexible panel according to claim 3, wherein the recess extends through the flexible substrate or has a depth less than the thickness of the substrate.
A flexible panel according to claim 3, wherein the open edge of the groove is spaced from the bonding area edge and is parallel to the bonding area edge.
The flexible panel according to any one of claims 1 to 5, further comprising a smoothing layer applied to the substrate, the smoothing layer covering the interface between the hard portion and other adjacent regions.
A flexible panel according to claim 6, wherein the smoothing layer has a thickness less than the thickness of the hard portion.
The flexible panel of claim 6, wherein the conductive lines overlie the smoothing layer.
The flexible panel according to any one of claims 1 to 5, further comprising a reinforcing layer, wherein the reinforcing layer covers the bonding region, and the reinforcing layer is located on a side of the substrate facing away from the conductive wire.
The flexible panel according to any one of claims 1 to 5, further comprising a flexible circuit board, a portion of which is fixed to the bonding region and electrically connected to the conductive wire.
The flexible panel of claim 10, wherein the flexible circuit board is fixed to the bonding area via a conductive adhesive and is electrically connected to the conductive line via the conductive adhesive.
A method for manufacturing a flexible panel is characterized by comprising the following steps:

providing a base material, wherein the base material is provided with a part to be processed and a flexible part connected with the part to be processed;

processing the part to be processed to form a hard part with a binding area;

forming an electronic device on the flexible portion, and forming a wire connecting the electronic device, the wire extending to the bonding region.
The method of making a flexible panel according to claim 12, wherein the step of machining the portion to be machined comprises:

processing a groove on the part to be processed;

filling a material to be hardened in the groove;

and processing the material to be hardened to form a hard part.
A method of manufacturing a flexible panel according to claim 13, wherein in the step of processing the material to be hardened, the material to be hardened is photo-cured or/and thermally cured.
The method of claim 13, wherein the material to be hardened is silicone, epoxy, acrylic or other resin containing inorganic nanoparticles.
The method of making a flexible panel according to claim 12, further comprising, after forming the hard portion, the steps of:

and forming a smooth layer on the base material, wherein the smooth layer covers the boundary between the hard part and other adjacent areas.
The method of claim 16, wherein the conductive lines are applied over a smoothing layer.
A method of making a flexible panel according to claim 12, wherein said method further comprises the steps of:

forming a reinforcing layer at a position corresponding to the part to be processed;

the electronic device is located on one side, away from the reinforcing layer, of the base material, and the reinforcing layer covers the binding region.
The method of claim 18, wherein the step of forming a stiffening layer precedes the step of machining the portion to be machined.
The method of manufacturing a flexible panel according to claim 18, wherein the step of forming a reinforcing layer is subsequent to the step of processing the portion to be processed.