CN113163620A - SMT surface mounting technology for PCBA mainboard processing - Google Patents
SMT surface mounting technology for PCBA mainboard processing Download PDFInfo
- Publication number
- CN113163620A CN113163620A CN202110322263.4A CN202110322263A CN113163620A CN 113163620 A CN113163620 A CN 113163620A CN 202110322263 A CN202110322263 A CN 202110322263A CN 113163620 A CN113163620 A CN 113163620A
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- Prior art keywords
- pcba
- mounting
- soldering
- test
- tin
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an SMT surface mounting technology for PCBA mainboard processing, which comprises the steps of solder paste printing, component mounting, component post-mounting inspection, reflow soldering, post-reflow soldering inspection, cleaning, performance testing and packaging. The SMT surface mounting process provided by the invention can be used for checking, cleaning and testing the mounting process to ensure the qualification of the PCBA, wherein the problems can be found out through checking and detecting once the problems occur in any part of the PCBA, so that the problems can be solved in time, the phenomenon that a large number of PCBA main board mounting pieces are unqualified is prevented, and the SMT surface mounting process is suitable for popularization and use.
Description
Technical Field
The invention relates to the technical field of a chip mounting process, in particular to an SMT surface chip mounting process for PCBA mainboard processing.
Background
The printed circuit board, also known as printed circuit board, often using the acronym PCB, is an important electronic component, is the support of electronic components, is the provider of electronic component circuit connection, because it is made by using electronic printing technology, it is called "printed" circuit board, SMT paster refers to the short for a series of process flows processed on the basis of PCBA, SMT is surface assembly technology, is the most popular technology and process in the electronic assembly industry, electronic circuit surface assembly technology, called surface mount or surface mount technology, is a circuit assembly technology that mounts leadless or short-lead surface assembly components on the surface of printed circuit board or other substrates, and is assembled by soldering by means of reflow soldering or dip soldering.
At present, in the SMT chip mounting process, due to the fact that various nonstandard manufacturing operations cause the qualification rate of a circuit board to be reduced, the SMT surface chip mounting technology for PCBA mainboard processing is provided for solving the problem.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
The invention aims to provide an SMT surface mounting technology for PCBA mainboard processing, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the SMT surface mounting technology for machining the PCBA mainboard is characterized by comprising the following specific steps: (1) and printing solder paste:
the tin paste is eutectic tin-lead alloy, namely 65% of tin; 35% of lead, placing eutectic tin-lead alloy into a soldering pot for stirring, constantly controlling the solder temperature in the soldering pot, then placing a small amount of eutectic tin-lead alloy on a PCBA mainboard, and starting a printer;
(2) and component mounting:
the component mounting method comprises the following steps that an automatic mounting machine is adopted to pick up surface mounted components from a feeder and accurately mount the surface mounted components onto a printed PCBA board;
(3) and inspecting after component mounting:
after mounting, carefully checking whether the mounting position deviates or not, and preventing the phenomena of component abrasion, unqualified mounting, bending deformation and the like;
(4) and reflow soldering:
firstly, pre-heating PCBA and materials (components) to ensure that the welded materials reach thermal equilibrium, and secondly, removing surface oxides; thirdly, from the melting point of the solder to the peak value, the melting point is reduced, and the PAD and the solder form welding in the melting process of the solder; cooling the fourth step;
(5) and checking after reflow soldering:
the appearance of the PCBA mainboard is checked, and the reflow soldering position in the PCBA mainboard is checked to prevent the problems of empty soldering, short circuit, component offset and missing soldering;
(6) and cleaning:
residues formed by the combination of organic components such as rosin and the like in reflow soldering and water in the atmosphere after soldering have strong chemical corrosivity and can be remained on the PCBA board to hinder the reliability of circuit connection, so that the chemical substances are required to be thoroughly cleaned;
(7) and performance test:
the performance test mainly comprises an online test and a functional test, wherein the online test is used for checking whether the connection between each single element and the test circuit is good in function, and the functional test is used for testing the performance of the test circuit by simulating the working environment of the circuit;
(8) and packaging:
and packaging the qualified product, and adopting different packaging materials and packaging modes according to different types.
Further, the temperature of the eutectic tin-lead alloy is 185 ℃, and the temperature is uniform.
Further, it is necessary to check whether there is little tin and much tin after the first printing.
Furthermore, the equipment used in the performance test is a PCBA mainboard function detector.
Compared with the prior art, the invention has the following beneficial effects:
(1) the SMT surface mounting process provided by the invention can be used for checking, cleaning and testing the mounting process to ensure the qualification of the PCBA, wherein the problems can be found out through checking and detecting once the problems occur in any part of the PCBA, so that the problems can be solved in time, the phenomenon that a large number of PCBA main board mounting pieces are unqualified is prevented, and the SMT surface mounting process is suitable for popularization and use.
Detailed Description
The SMT surface mounting technology for PCBA mainboard processing is characterized by comprising the following specific steps: (1) and printing solder paste:
the tin paste is eutectic tin-lead alloy, namely 65% of tin; 35% of lead, placing eutectic tin-lead alloy into a soldering pot for stirring, constantly controlling the solder temperature in the soldering pot, then placing a small amount of eutectic tin-lead alloy on a PCBA mainboard, and starting a printer;
(2) and component mounting:
the component mounting method comprises the following steps that an automatic mounting machine is adopted to pick up surface mounted components from a feeder and accurately mount the surface mounted components onto a printed PCBA board;
(3) and inspecting after component mounting:
after mounting, carefully checking whether the mounting position deviates or not, and preventing the phenomena of component abrasion, unqualified mounting, bending deformation and the like;
(4) and reflow soldering:
firstly, pre-heating PCBA and materials (components) to ensure that the welded materials reach thermal equilibrium, and secondly, removing surface oxides; thirdly, from the melting point of the solder to the peak value, the melting point is reduced, and the PAD and the solder form welding in the melting process of the solder; cooling the fourth step;
(5) and checking after reflow soldering:
the appearance of the PCBA mainboard is checked, and the reflow soldering position in the PCBA mainboard is checked to prevent the problems of empty soldering, short circuit, component offset and missing soldering;
(6) and cleaning:
residues formed by the combination of organic components such as rosin and the like in reflow soldering and water in the atmosphere after soldering have strong chemical corrosivity and can be remained on the PCBA board to hinder the reliability of circuit connection, so that the chemical substances are required to be thoroughly cleaned;
(7) and performance test:
the performance test mainly comprises an online test and a functional test, wherein the online test is used for checking whether the connection between each single element and the test circuit is good in function, and the functional test is used for testing the performance of the test circuit by simulating the working environment of the circuit;
(8) and packaging:
and packaging the qualified product, and adopting different packaging materials and packaging modes according to different types.
By adopting the scheme of the invention, the temperature of the eutectic tin-lead alloy is 185 ℃, and the temperature is uniform.
By the scheme of the invention, whether the tin is less or more or not needs to be checked after the first printing.
Through the scheme of the invention, the equipment used in the performance test is a PCBA mainboard function detector.
In specific application, the SMT surface mounting process provided by the invention can be used for processing the PCBA mainboard, the qualification of the PCBA mainboard is ensured by checking, cleaning and testing the mounting process, and once problems occur in any part of the PCBA mainboard, the problems can be found out through checking and detecting, so that the problems can be solved in time, the phenomenon that a large number of PCBA mainboard mounting pieces are unqualified is prevented, and the SMT surface mounting process is suitable for popularization and use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the invention as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The SMT surface mounting technology for machining the PCBA mainboard is characterized by comprising the following specific steps: (1) and printing solder paste:
the tin paste is eutectic tin-lead alloy, namely 65% of tin; 35% of lead, placing eutectic tin-lead alloy into a soldering pot for stirring, constantly controlling the solder temperature in the soldering pot, then placing a small amount of eutectic tin-lead alloy on a PCBA mainboard, and starting a printer;
(2) and component mounting:
the component mounting method comprises the following steps that an automatic mounting machine is adopted to pick up surface mounted components from a feeder and accurately mount the surface mounted components onto a printed PCBA board;
(3) and inspecting after component mounting:
after mounting, carefully checking whether the mounting position deviates or not, and preventing the phenomena of component abrasion, unqualified mounting, bending deformation and the like;
(4) and reflow soldering:
firstly, pre-heating PCBA and materials (components) to ensure that the welded materials reach thermal equilibrium, and secondly, removing surface oxides; thirdly, from the melting point of the solder to the peak value, the melting point is reduced, and the PAD and the solder form welding in the melting process of the solder; cooling the fourth step;
(5) and checking after reflow soldering:
the appearance of the PCBA mainboard is checked, and the reflow soldering position in the PCBA mainboard is checked to prevent the problems of empty soldering, short circuit, component offset and missing soldering;
(6) and cleaning:
residues formed by the combination of organic components such as rosin and the like in reflow soldering and water in the atmosphere after soldering have strong chemical corrosivity and can be remained on the PCBA board to hinder the reliability of circuit connection, so that the chemical substances are required to be thoroughly cleaned;
(7) and performance test:
the performance test mainly comprises an online test and a functional test, wherein the online test is used for checking whether the connection between each single element and the test circuit is good in function, and the functional test is used for testing the performance of the test circuit by simulating the working environment of the circuit;
(8) and packaging:
and packaging the qualified product, and adopting different packaging materials and packaging modes according to different types.
2. An SMT surface mount technology according to claim 1, wherein the temperature of the eutectic tin-lead alloy is 185 ℃ and is made uniform.
3. An SMT surface mount technology for processing PCBA main boards according to claim 1, wherein after the first printing, whether tin is low or high needs to be checked.
4. An SMT surface mount technology for PCBA motherboard machining according to claim 1, wherein the equipment used in the performance test is a PCBA motherboard function detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110322263.4A CN113163620A (en) | 2021-03-25 | 2021-03-25 | SMT surface mounting technology for PCBA mainboard processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110322263.4A CN113163620A (en) | 2021-03-25 | 2021-03-25 | SMT surface mounting technology for PCBA mainboard processing |
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| Publication Number | Publication Date |
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| CN113163620A true CN113163620A (en) | 2021-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110322263.4A Pending CN113163620A (en) | 2021-03-25 | 2021-03-25 | SMT surface mounting technology for PCBA mainboard processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692139A (en) * | 2021-10-21 | 2021-11-23 | 深圳市百千成电子有限公司 | PCBA circuit board processing test method and system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080083816A1 (en) * | 2006-10-04 | 2008-04-10 | Leinbach Glen E | Statistical process control of solder paste stenciling using a replicated solder paste feature distributed across a printed circuit board |
| CN103551756A (en) * | 2013-11-12 | 2014-02-05 | 宁波市鄞州恒迅电子材料有限公司 | Sn-Ag-Cu system lead-free soldering paste |
| CN111629529A (en) * | 2020-06-03 | 2020-09-04 | 重庆金茂联合电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
-
2021
- 2021-03-25 CN CN202110322263.4A patent/CN113163620A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080083816A1 (en) * | 2006-10-04 | 2008-04-10 | Leinbach Glen E | Statistical process control of solder paste stenciling using a replicated solder paste feature distributed across a printed circuit board |
| CN103551756A (en) * | 2013-11-12 | 2014-02-05 | 宁波市鄞州恒迅电子材料有限公司 | Sn-Ag-Cu system lead-free soldering paste |
| CN111629529A (en) * | 2020-06-03 | 2020-09-04 | 重庆金茂联合电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692139A (en) * | 2021-10-21 | 2021-11-23 | 深圳市百千成电子有限公司 | PCBA circuit board processing test method and system |
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Application publication date: 20210723 |
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