CN113163618A - Vacuum device for reflow oven - Google Patents
Vacuum device for reflow oven Download PDFInfo
- Publication number
- CN113163618A CN113163618A CN202010075608.6A CN202010075608A CN113163618A CN 113163618 A CN113163618 A CN 113163618A CN 202010075608 A CN202010075608 A CN 202010075608A CN 113163618 A CN113163618 A CN 113163618A
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- vacuum
- water
- reflow oven
- side door
- cavity body
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- 238000001816 cooling Methods 0.000 claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a vacuum device for a reflow oven, which is arranged at the position of a primary heating module in a reflow zone of the reflow oven and comprises a vacuum cavity, a cooling and collecting auxiliary device and a vacuum pump system which are sequentially connected, wherein the vacuum cavity comprises a cavity body, a top cover and side door mechanisms, the cavity body is fixed in the reflow oven, the top cover covers the top of the cavity body, the front end and the rear end of the cavity body are respectively provided with two through holes, the two side door mechanisms are movably arranged at the front end and the rear end of the cavity body and respectively cover the two through holes in a closed state, the top cover, the cavity body and the side door mechanisms form a fully-closed space, the cavity body is provided with a transmission assembly matched with a product transmission system of the reflow oven, and the two side door mechanisms are correspondingly arranged with the product input front end and the product output rear end of the reflow oven. Compared with the prior art, the invention has the advantages of reducing the size and the number of welding point cavities, reducing the damage rate, having strong applicability and the like.
Description
Technical Field
The invention relates to the technical field of reflow soldering furnaces, in particular to a vacuum device for a reflow soldering furnace.
Background
A Reflow Oven (Reflow Oven) is an apparatus for soldering a circuit board carrying electronic components. It makes the solder paste be heated and melts through providing a heating environment thereby let surface mounted's components and parts and circuit board combine together through the solder paste alloy reliably. The soldering paste used for soldering is prepared by making grease-shaped soldering flux and powder solder into paste, coating the paste on the soldering position of each component of the circuit board by printing, accurately mounting electronic components on the paste, and heating and melting by using a heating module of a reflow oven to achieve reliable soldering of the components.
With the development of the electronic industry towards miniaturization and multi-specification. The requirement to product quality is also higher and higher, in order to adapt to the new demand in market, reduces the product defect that should weld and lead to, improves product productivity and qualification rate, and the reliable stability of welding process should be ensured in reflow soldering stove's design, however, present most SMT reflow soldering stove is in welding process, probably has gaseous unable the discharge, leads to the inside production cavity of solder joint, and then influences the reliability of product welding department. In addition, in the molten state of the solder paste, the flux may damage the heating module equipment of the reflow oven, thereby affecting the processing effect of the reflow oven.
Disclosure of Invention
The present invention is directed to overcoming the above-mentioned drawbacks of the prior art and providing a vacuum apparatus for a reflow oven that reduces the size and number of voids in solder joints.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a vacuum apparatus for reflow oven, locates the reflow zone of reflow oven and heats module position department in, this vacuum apparatus collects auxiliary device and vacuum pump system including vacuum cavity, cooling that connects gradually, vacuum cavity include cavity body, top cap and side door mechanism, the cavity body fix in the reflow oven, the top cap cover at the top of cavity body, front end, the rear end of cavity body be equipped with two through-holes respectively, two the activity of side door mechanism locate front end, the rear end of cavity body, and the side door mechanism under the closed condition covers respectively on two through-holes, makes top cap, cavity body, side door mechanism constitute totally closed space, the cavity body be equipped with the product transmission system assorted transmission assembly of reflow oven, two side door mechanisms and the product input front end of reflow oven, The product output rear end is correspondingly arranged;
in a non-working state, two side door mechanisms at the front end and the rear end of the vacuum cavity are in a closed state, the vacuum cavity is in a fully-closed state, when a product is transmitted to the front of a vacuum device in a hearth, the side door mechanisms at the front end and the rear end are controlled to be opened, the product enters the vacuum cavity, then the side door mechanisms at the front end and the rear end are closed, a vacuum pump system is started, the vacuum pump pumps the gas in the vacuum cavity, and the vacuum pump stops working after the required vacuum degree is reached; after the air returning body of the vacuum cavity returns to normal atmospheric pressure, the side door mechanisms at the front end and the rear end of the vacuum cavity are opened, the product is conveyed out of the vacuum cavity, and in the working process of the vacuum cavity, the cooling and collecting auxiliary device cools and treats the gas, so that the scaling powder in the gas is cooled and liquefied to be collected.
Preferably, the vacuum cavity is connected with a cooling and collecting auxiliary device through a first connecting pipeline, and the cooling and collecting auxiliary device is connected with the vacuum pump system through a second connecting pipeline.
Preferably, the two side door mechanisms are respectively and independently connected with the two telescopic cylinders for adjusting the opening and closing states.
Preferably, the auxiliary device is collected in cooling include air inlet, gas outlet, raceway, first water-cooled cooling unit and second water-cooled cooling unit, first water-cooled cooling unit is connected with second water-cooled cooling unit, the raceway winding in first water-cooled cooling unit, the outside of second water-cooled cooling unit, and the water inlet of raceway locates on first water-cooled cooling unit, the delivery port is located on the second water-cooled cooling unit, first connecting line connect the air inlet, the air inlet locate the one end of first water-cooled cooling unit, the gas outlet locate the one end of second water-cooled cooling unit, and the gas outlet is connected the second connecting line, first water-cooled cooling unit and second water-cooled cooling unit are equipped with respectively and collect the mechanism.
Preferably, the cavity body is a rectangular cavity structure without a top plate, and the rectangular cavity is an integrated structure cavity or a welded structure cavity.
Preferably, the cavity body is an integrated aluminum plate cavity.
Preferably, the cavity body is a welded stainless steel plate cavity.
Preferably, the vacuum device is also provided with a vacuum degree gauge.
Preferably, the vacuum device is further provided with a vacuum degree measuring instrument, the vacuum degree measuring instrument is connected with the PC end, and the controller of the telescopic cylinder is connected with the PC end.
Preferably, a heating assembly is further arranged in the cavity body.
Compared with the prior art, the invention has the following advantages:
1) according to the invention, the vacuum device is used for replacing the heating module in the reflow soldering furnace, the vacuum cavity is vacuumized in the molten state of the solder paste, and the pressure in the cavity can reduce or eliminate the gas in the cavity, so that the size and the number of the welding point cavities are reduced, and the reliability of product welding is improved;
2) the vacuum device is provided with the cooling and collecting auxiliary device between the vacuum cavity and the vacuum pump system, the vacuum pump system performs gas extraction on a product input into the vacuum cavity, the cooling and collecting auxiliary device achieves the effect of cooling gas through heat exchange between water and gas, and meanwhile, soldering flux in the gas is collected after being cooled and liquefied, so that the damage of the soldering flux to the vacuum pump is avoided;
3) the reflow oven with the vacuum device can be used as a common SMT reflow oven and a vacuum reflow oven to meet the requirements of different products, and has stronger applicability.
Drawings
FIG. 1 is a schematic structural view of a vacuum apparatus for a reflow oven in an embodiment of the present invention;
FIG. 2 is a schematic front plan view of a vacuum apparatus for a reflow oven in an embodiment of the present invention;
FIG. 3 is a schematic view showing the mounting structure of a vacuum apparatus for a reflow oven according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a vacuum chamber of a vacuum apparatus for a reflow oven according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a cooling and collecting auxiliary device in a vacuum device for a reflow oven according to an embodiment of the present invention;
the reference numbers in the figures indicate:
1. vacuum chamber, 2, vacuum pump system, 3, auxiliary device is collected in the cooling, 4, the cavity body, 5, the top cap, 6, side door mechanism, 7, the air inlet, 8, the gas outlet, 9, the raceway, 91, the water inlet, 92, the delivery port, 10, first water-cooled cooling unit, 11, the water-cooled cooling unit of second, 12, first connecting line, 13, second connecting line, 14, side door lifting support, 15, the second support, 16, reflow oven, 17, vacuum apparatus.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
Example 1
As shown in fig. 1 and 2, the present invention relates to a vacuum apparatus for a reflow oven, which includes a vacuum chamber 1, a vacuum pump system 2, and a cooling collection auxiliary apparatus 3. The vacuum chamber 1 is connected with the cooling collection auxiliary device 3 through a first connecting pipeline 12, and the cooling collection auxiliary device 3 is connected with the vacuum pump system 2 through a second connecting pipeline 13. The vacuum system 2 is opened and closed by a diaphragm valve. The vacuum device of the present invention replaces the heating module in the reflow oven in the reflow zone, that is, the vacuum chamber 1, the vacuum pump system 2 and the cooling collection auxiliary device 3 are installed in the reflow zone of the reflow oven 16, as shown in fig. 3.
As shown in fig. 4, the vacuum chamber 1 includes a chamber body 4, a top cover 5, and a side door mechanism 6. The chamber body 4 is fixed to the side door lifting bracket 14 and fixed together with the chamber body 4 in the reflow oven 16. The cavity body 4 is internally provided with a transmission assembly matched with a product transmission system of the reflow oven 16. For example, the product transmission system of the reflow oven 16 may adopt a transmission system composed of a guide rail, a mesh belt, a chain, a transportation motor, etc., and the transmission assembly in the cavity body 4 may adopt a slide rail, a conveyor belt, etc. matched with the guide rail to engage with the guide rail, for receiving the product and conveying the vacuum-treated product out of the cavity.
The cavity body 4 is an open-air rectangular cavity without a top plate, and the top cover 5 can be covered on the top of the cavity body 4 through detachable connecting mechanisms such as bolts, nuts and the like. The cavity body 4 is an integrated structure cavity or a welding structure cavity. The integral type structure can adopt aluminum plate integrated into one piece machine-shaping, and welded structure cavity can adopt a plurality of corrosion resistant plate welding combination to form. Two side plates at the front end and the rear end of the cavity body 4 are respectively provided with two through holes at the same position, and the side plates at the two ends are respectively movably provided with a movable side door mechanism 6. Under the vacuum working state, the top cover 5 covers the top of the cavity body 4, the side door mechanism 6 can cover the through hole, and at the moment, the vacuum cavity 1 is a closed space formed by the cavity body 4, the top cover 5 and the side door mechanism 6.
The two side door mechanisms 6 are arranged corresponding to the front end of the product input and the rear end of the product output. The two side door mechanisms 6 are respectively and independently connected to the two telescopic cylinders, and the telescopic cylinders control the side door mechanisms 6 to move up and down, so that the cavity body 4 is in a fully closed state or in a semi-closed state capable of receiving and outputting products. If the telescopic cylinder is used for controlling the lifting of the side door mechanism 6 to adjust the state, the side door mechanism 6 can be arranged on the through hole or below the through hole to be in an open state, and the cavity body 4 is not closed at the moment; the side door mechanism 6 can be arranged to cover the through hole in a closed state, and the cavity body 4 is totally closed at the moment. The vacuum device is provided with a vacuum degree measuring instrument for detecting the vacuum degree in the cavity. The vacuum measuring instrument may be provided at the first connecting line 12 or the like.
As shown in fig. 5, the cooling collection auxiliary device 3 includes an air inlet 7, an air outlet 8, a water delivery pipe 9, a first water-cooled cooling unit 10, a second water-cooled cooling unit 11, and a second bracket 15. Two water-cooled cooling units are provided on the support 15. The first connecting pipeline 12 is connected with the air inlet 7, the air inlet 7 is arranged at one end of the first water-cooled cooling unit 10, the first water-cooled cooling unit 10 is connected with the second water-cooled cooling unit 11, the air outlet 8 is arranged at one end of the second water-cooled cooling unit 11, and the air outlet 8 is connected with the second connecting pipeline 13. The water pipe 9 is wound outside the first water-cooled cooling unit 10 and the second water-cooled cooling unit 11, and a water inlet 91 of the water pipe 9 is arranged on the first water-cooled cooling unit 10 and a water outlet 92 is arranged on the second water-cooled cooling unit 11. The hot gas in the vacuum cavity 1 is sequentially conveyed into the first water-cooled cooling unit 10 and the second water-cooled cooling unit 11 through the first connecting pipeline 12 and the air inlet 7, the auxiliary cooling and collecting device 3 achieves the effect of cooling the gas through the heat exchange between the water and the gas, and meanwhile, the soldering flux in the gas is cooled and liquefied to be collected, so that the damage of the soldering flux to the vacuum pump is avoided. The cooled gas is discharged through the gas outlet 8 and the second connecting pipeline 13. The first water-cooled cooling unit 10 and the second water-cooled cooling unit 11 are provided with a collecting mechanism, respectively. It should be noted that the first water-cooled cooling unit 10 and the second water-cooled cooling unit 11 of the present invention are coolers capable of performing water circulation and provided with a collecting mechanism (such as a collecting cup) in the prior art, and the detailed structure thereof will not be described herein.
The working principle of the invention is as follows:
the vacuum device is adopted to replace a heating module in a reflow soldering furnace in a reflow region, a first support of the vacuum cavity is arranged at the position of the heating module in the reflow region in the reflow soldering furnace, a second support of the cooling and collecting auxiliary device is arranged in the reflow region in the reflow soldering furnace, and the vacuum pump system is fixed in the reflow region in the reflow soldering furnace. Under the non-working state, the two side door mechanisms at the front end and the rear end of the vacuum cavity are in a closed state, namely the telescopic cylinder controls the height positions of the two side door mechanisms, so that the cavity body is in a fully-closed state.
When a product is transmitted to a vacuum device in a hearth, the side door mechanisms at the front end and the rear end of the vacuum cavity are opened by controlling the telescopic cylinder, the product is enabled to enter the vacuum cavity, then the side door mechanisms at the front end and the rear end are closed, the isolating valve is opened, the vacuum pump is enabled to enter a working state, the vacuum pump extracts internal gas of the vacuum cavity, after the required vacuum degree is reached, bubbles in soldering paste of the product can be eliminated or reduced, and the vacuum pump stops working. After the air returning body of the vacuum cavity returns to normal atmospheric pressure, the side door mechanisms at the front end and the rear end of the vacuum cavity are opened, and the product is conveyed out of the vacuum cavity. In the working process of the vacuum cavity, the auxiliary cooling and collecting device can cool the gas through the heat exchange between the water and the gas, and meanwhile, the soldering flux in the gas flows into the collecting cup to be collected after being cooled and liquefied, so that the damage of the soldering flux to the vacuum pump is avoided.
Example 2
As a more preferable scheme, in this embodiment, on the basis of the structure of embodiment 1, the vacuum degree measuring instrument of the chamber body 4 is connected to the PC end, and the controller of each telescopic cylinder is connected to the PC end, so that the control and monitoring of the vacuum operation can be completed through the visual operation interface.
Example 3
As a more preferable scheme, in this embodiment, on the basis of the structure in embodiment 1, an additional heating module is disposed in the cavity body 4, and the heating module may adopt a heating module or an infrared heating module including components such as a circulating fan, a heater, a thermocouple, a circulating air duct, a population exhaust filter, and the like. The heating assembly arranged in the cavity body 4 can prolong the process of the molten state of the solder paste, and can increase the effect of vacuumizing the vacuum cavity. It should be noted that the infrared heating module of this embodiment may adopt a module that uses an infrared heating method to realize heating in the prior art, and the specific structure is not described herein in detail.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and those skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a vacuum apparatus for reflow oven, its characterized in that, this vacuum apparatus locates and heats module position department in the backward flow district of reflow oven (16), and this vacuum apparatus is including vacuum cavity (1), cooling collection auxiliary device (3) and vacuum pump system (2) that connect gradually, vacuum cavity (1) including cavity body (4), top cap (5) and side door mechanism (6), cavity body (4) fix in reflow oven (16), top cap (5) cover the top at cavity body (4), front end, the rear end of cavity body (4) be equipped with two through-holes respectively, two side door mechanism (6) activity locate front end, the rear end of cavity body (4), and side door mechanism (6) under the closed condition cover respectively on two through-holes, make top cap (5), The cavity body (4) and the side door mechanisms (6) form a totally-enclosed space, the cavity body (4) is provided with a transmission assembly matched with a product transmission system of the reflow oven (16), and the two side door mechanisms (6) are arranged corresponding to the product input front end and the product output rear end of the reflow oven (16);
in a non-working state, two side door mechanisms (6) at the front end and the rear end of a vacuum cavity body (1) are in a closed state, the vacuum cavity body (1) is in a fully closed state, when a product is transmitted to the front of a vacuum device in a hearth, the side door mechanisms (6) at the front end and the rear end are controlled to be opened, the product enters the vacuum cavity body (1), then the side door mechanisms (6) at the front end and the rear end are closed, a vacuum pump system (2) is opened, the vacuum pump extracts the internal gas of the vacuum cavity body (1), and the vacuum pump stops working after reaching a required vacuum degree; after the gas returns to normal atmospheric pressure in the vacuum cavity (1), the side door mechanisms (6) at the front end and the rear end of the vacuum cavity (1) are opened, the product is conveyed out of the vacuum cavity (1), and in the working process of the vacuum cavity, the cooling and collecting auxiliary device (3) cools and processes the gas, so that the soldering flux in the gas is cooled and liquefied to be collected.
2. A vacuum device for a reflow oven according to claim 1, wherein the vacuum chamber (1) is connected to a cooling collection auxiliary device (3) through a first connecting line (12), and the cooling collection auxiliary device (3) is connected to the vacuum pump system (2) through a second connecting line (13).
3. The vacuum apparatus for a reflow oven according to claim 1, wherein the two side door mechanisms (6) are independently connected to two telescopic cylinders for adjusting the open and closed states, respectively.
4. The vacuum device for the reflow oven according to claim 2, wherein the cooling collection auxiliary device (3) comprises an air inlet (7), an air outlet (8), a water pipe (9), a first water-cooled cooling unit (10) and a second water-cooled cooling unit (11), the first water-cooled cooling unit (10) is connected with the second water-cooled cooling unit (11), the water pipe (9) is wound outside the first water-cooled cooling unit (10) and the second water-cooled cooling unit (11), an water inlet (91) of the water pipe (9) is arranged on the first water-cooled cooling unit (10), a water outlet (92) is arranged on the second water-cooled cooling unit (11), the first connecting pipeline (12) is connected with the air inlet (7), and the air inlet (7) is arranged at one end of the first water-cooled cooling unit (10), the gas outlet (8) is arranged at one end of the second water-cooled cooling unit (11), the gas outlet (8) is connected with a second connecting pipeline (13), and the first water-cooled cooling unit (10) and the second water-cooled cooling unit (11) are respectively provided with a collecting mechanism.
5. The vacuum device for the reflow oven according to claim 1, wherein the chamber body (4) is a rectangular chamber structure without a top plate, and the rectangular chamber is a one-piece structure chamber or a welding structure chamber.
6. The vacuum apparatus for a reflow oven according to claim 5, wherein the chamber body (4) is a one-piece aluminum plate chamber.
7. The vacuum apparatus for a reflow oven according to claim 5, wherein the chamber body (4) is a soldering type stainless steel plate chamber.
8. The vacuum apparatus for a reflow oven of claim 1, wherein the vacuum apparatus is further provided with a vacuum gauge.
9. The vacuum apparatus for a reflow oven of claim 4, further comprising a vacuum degree measuring instrument, wherein the vacuum degree measuring instrument is connected to the PC terminal, and the controller of the telescopic cylinder is connected to the PC terminal.
10. The vacuum apparatus for a reflow oven according to claim 1, wherein the chamber body (4) further comprises a heating assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010075608.6A CN113163618A (en) | 2020-01-22 | 2020-01-22 | Vacuum device for reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010075608.6A CN113163618A (en) | 2020-01-22 | 2020-01-22 | Vacuum device for reflow oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113163618A true CN113163618A (en) | 2021-07-23 |
Family
ID=76881914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010075608.6A Pending CN113163618A (en) | 2020-01-22 | 2020-01-22 | Vacuum device for reflow oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113163618A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115194286A (en) * | 2022-08-17 | 2022-10-18 | 上海轩田工业设备有限公司 | Cooling area forced cooling device for vacuum reflow soldering furnace |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008177447A (en) * | 2007-01-22 | 2008-07-31 | Matsushita Electric Ind Co Ltd | Reflow furnace |
| TW201404508A (en) * | 2012-07-19 | 2014-02-01 | 3S Silicon Tech Inc | Vacuum reflow soldering apparatus and vacuum reflow soldering method |
| JP2015123503A (en) * | 2014-08-21 | 2015-07-06 | 千住金属工業株式会社 | Vacuum soldering apparatus, and control method therein |
| CN105772886A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Through hole reflow soldering device and control method thereof |
| CN208262124U (en) * | 2018-02-09 | 2018-12-21 | 北京仝志伟业科技有限公司 | Protective gas processing system for vacuum brazing stove |
| CN211481634U (en) * | 2020-01-22 | 2020-09-11 | 上海朗仕电子设备有限公司 | Vacuum device for reflow oven |
-
2020
- 2020-01-22 CN CN202010075608.6A patent/CN113163618A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008177447A (en) * | 2007-01-22 | 2008-07-31 | Matsushita Electric Ind Co Ltd | Reflow furnace |
| TW201404508A (en) * | 2012-07-19 | 2014-02-01 | 3S Silicon Tech Inc | Vacuum reflow soldering apparatus and vacuum reflow soldering method |
| JP2015123503A (en) * | 2014-08-21 | 2015-07-06 | 千住金属工業株式会社 | Vacuum soldering apparatus, and control method therein |
| CN105772886A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Through hole reflow soldering device and control method thereof |
| CN208262124U (en) * | 2018-02-09 | 2018-12-21 | 北京仝志伟业科技有限公司 | Protective gas processing system for vacuum brazing stove |
| CN211481634U (en) * | 2020-01-22 | 2020-09-11 | 上海朗仕电子设备有限公司 | Vacuum device for reflow oven |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115194286A (en) * | 2022-08-17 | 2022-10-18 | 上海轩田工业设备有限公司 | Cooling area forced cooling device for vacuum reflow soldering furnace |
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