CN113161281B - Method for preventing solder from flowing when solder sinters substrate - Google Patents
Method for preventing solder from flowing when solder sinters substrate Download PDFInfo
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- CN113161281B CN113161281B CN202110435183.XA CN202110435183A CN113161281B CN 113161281 B CN113161281 B CN 113161281B CN 202110435183 A CN202110435183 A CN 202110435183A CN 113161281 B CN113161281 B CN 113161281B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L2224/81 - H01L2224/86
Abstract
A method for preventing solder flow when solder sintering a substrate, comprising the steps of: s1: fixing the substrate by adopting a clamping device, and forming holes on the substrate according to design requirements; s2: selecting a solder sheet according to the welding requirement and forming the solder sheet, wherein the shape of the removed part of the solder sheet is matched with the position and the external dimension of the opening of the substrate in the S1; s3: marking a hole groove on the shell according to the position and the overall dimension of the hole of the substrate in the S1; s4: the substrate obtained in S1 and the solder sheet obtained in S2 were mounted in the case obtained in S3, and placed in a sintering tool, and soldering was performed by setting a sintering temperature in accordance with the melting point of the solder sheet. According to the invention, the hole plugging of the substrate opening is not required by using the peelable glue, the later peelable glue removing process is omitted, the welding flux is prevented from flowing to the substrate opening position by marking the hole groove on the shell, the chip mounting is convenient, the signal transmission quality of the chip can be improved and the welding effect is ensured by optimizing the substrate opening size and the welding flux sheet.
Description
Technical Field
The invention relates to the technical field of microwave product production, in particular to a method for preventing solder from flowing when the solder is used for sintering a substrate.
Background
When microwave products are assembled, a substrate, a bare chip and the like are assembled in a shell, and electrical connection is performed through some interconnection modes so as to realize signal transmission. In order to realize the installation of the bare chip, the design of the substrate needs to be provided with a hole, so that the bare chip can be conveniently installed in the hole, the hole needs to be protected when the substrate is sintered on the shell, and the phenomenon that the solder overflows into the hole to influence the installation of the chip is avoided. Adopt the strippable to glue to hinder the mode and block up the hole before, the many stifled holes in hole cost time is longer, can have partial stifled hole effect not good, leads to the solder to flow to downthehole, and the chip mounted position is uneven, needs the cost time to clear up the solder. Therefore, a solder resist method is proposed which prevents the solder from flowing freely when the substrate is sintered with the solder.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a method for preventing solder from flowing when the solder sinters the substrate, which does not need to use strippable glue to block holes of the substrate, omits the subsequent strippable glue removing procedure, prevents the solder from flowing to the positions of the holes of the substrate by marking the hole grooves on the shell, is convenient for chip installation, and can improve the signal transmission quality of the chip and ensure the welding effect by optimizing the size of the holes of the substrate and the solder pieces.
In order to achieve the above object, the present invention employs the following techniques:
a method for preventing solder flow when solder sintering a substrate, comprising the steps of:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and the chip is 0.15-0.25 mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.6-0.8 mm;
s2: selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.02mm-0.1mm, molding the solder sheet by using a laser marking machine, and matching the shape of the removed part of the solder sheet with the position and the external dimension of the opening of the substrate in S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking a hole groove on the shell by using a laser marking machine, only marking the cladding of the shell after marking without damaging the metal shell raw base material, wherein the depth of the hole groove is 5-30 mu m;
s4: and (3) mounting the substrate obtained in the step (S1) and the solder sheet obtained in the step (S2) in the shell obtained in the step (S3), placing the shell in a sintering tool, positioning the solder sheet in the marking hole groove of the shell, positioning the solder sheet between the substrate and the shell, and setting the sintering temperature according to the melting point of the solder sheet for welding.
Further, the distance between the edge of the opening in the line direction and the chip in S1 is 0.2 mm.
Further, the distance between the edge of the non-wiring direction opening and the chip in S1 is 0.7 mm.
Further, the thickness of the solder sheet in S2 is 0.06 mm.
Further, in S3, the shape of the opening groove of the case is identical to the shape of the opening of the substrate.
Further, the depth of the pore groove in S3 was 18 μm.
Further, in S1, the clamping device is used for fixing the substrate during the substrate hole opening, the substrate is firstly placed on the top surface of the clamping blocks, then the belt pulley is driven to rotate by the motor, the drive rod is controlled to move synchronously in the reverse direction through the rotation of the bidirectional screw rod, the gap between the two clamping blocks is adjusted, the two ends of the substrate are clamped by the end plate, when the gap between the two clamping blocks is reduced, the moving plate moves horizontally along the plane where the end plate is located, the substrate is pushed to move to contact with the side plate, and when the bidirectional screw rod rotates, the position of the bidirectional screw rod is limited by the limiting block.
Further, in S1, when the moving plate moves horizontally along the plane of the end plate, the clamping plate pushes the base plate to move towards the side plate, and when the base plate contacts with the side plate, the spring is compressed, and the base plate contacts with the side plate elastically.
Further, in S1, when the clamping plate moves toward the side plate, the rubber roller connected to the clamping plate contacts the substrate and pushes the substrate to move, the gap between the two clamping blocks gradually decreases, and meanwhile, the rubber roller rotates relative to the bracket, and the rubber roller contacts the side surface of the substrate in a rolling manner.
Further, in S1, when the bidirectional screw rotates, the two limit rings fixedly connected to the bidirectional screw respectively attach to the inner sides of the limit blocks.
The invention has the beneficial effects that:
1. according to the invention, the hole plugging of the substrate opening is not required by using the peelable glue, the later peelable glue removing process is omitted, the welding flux is prevented from flowing to the substrate opening position by marking the hole groove on the shell, the chip mounting is convenient, the signal transmission quality of the chip can be improved and the welding effect is ensured by optimizing the substrate opening size and the welding flux sheet.
2. The clamping device is adopted to fix the substrate, and then holes are formed in the substrate according to design requirements, so that the hole forming precision can be improved, the chip mounting effect is ensured, and signal transmission is facilitated.
3. The invention adopts elastic clamping to fix the substrate, and the rubber roller 207 is in rolling contact with the side surface of the substrate, thereby reducing the abrasion to the side surface of the substrate.
Drawings
FIG. 1 is a schematic view of the process of the present invention.
FIG. 2 is a schematic view of a clamping device according to the present invention.
Fig. 3 is a schematic view of the splint structure of the present invention.
FIG. 4 is a schematic view of the structure of the bi-directional screw of the present invention.
Fig. 5 is a schematic view of a partial structure a in fig. 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example 1:
in this embodiment, the process shown in fig. 1 is adopted to perform the substrate solder sintering, and the specific steps are as follows:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.2mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.7 mm;
s2: selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.06mm, molding the solder sheet by using a laser marker, and matching the shape of the removed part of the solder sheet with the position and the shape size of the opening of the substrate in the S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell after marking without damaging the metal shell raw base material, and the depth of the opening groove is 18 mu m;
s4: the substrate obtained in S1 and the solder sheet obtained in S2 were mounted in the case obtained in S3, and placed in a sintering tool, and soldering was performed by setting a sintering temperature in accordance with the melting point of the solder sheet.
Further, in S1, when the substrate is punched, the substrate is fixed by using the clamping device shown in fig. 2 to 5, the substrate is firstly placed on the top surface of the clamping block 2, then the motor 304 is used to drive the belt pulley 302 to rotate, and further the driving rod 301 is controlled to rotate in a reverse synchronous manner through the rotation of the bidirectional screw 3, so that the gap between the two clamping blocks 2 is reduced, the end plate 201 clamps the two ends of the substrate, when the gap between the two clamping blocks 2 is reduced, the moving plate 203 horizontally moves along the plane where the end plate 201 is located, the substrate is pushed to move to contact with the side plate 202, so as to clamp the two side surfaces of the substrate, when the bidirectional screw 3 rotates, the position of the bidirectional screw 3 is limited by the limiting block 305, and the transmission effect on the driving rod 301 is prevented from being influenced by the deviation of the bidirectional screw 3.
Further, in S1, when the moving plate 203 moves horizontally along the plane of the end plate 201, the clamping plate 205 pushes the substrate to move toward the side plate 202, and the spring 204 is compressed when the substrate contacts the side plate 202, thereby achieving elastic clamping of the substrate.
Further, in S1, when the clamping plate 205 pushes the substrate to move toward the side plate 202, the rubber roller 207 connected to the clamping plate 205 contacts the substrate and pushes the substrate to move, the gap between the two clamping blocks 2 gradually decreases, and meanwhile, the rubber roller 207 rotates relative to the bracket 206, and the rubber roller 207 rolls and contacts the side surface of the substrate, thereby reducing the abrasion to the substrate.
Further, in S1, when the bidirectional screw 3 rotates, the two limiting rings 306 fixedly connected to the bidirectional screw 3 respectively attach to the inner sides of the limiting blocks 305, so as to prevent the bidirectional screw 3 from moving along the central axis of the bidirectional screw 3 during rotation, which may cause position changes of the two clamping blocks 2 and affect the substrate drilling accuracy.
Further, the clamping device comprises a clamping platform 1, a pair of limiting rods 101 which are parallel to each other is arranged above the clamping platform 1, mounting heads 102 are clamped at two ends of each limiting rod 101, the mounting heads 102 are fixed on the clamping platform 1, slide rods 103 are slidably arranged at two ends of each limiting rod 101 in a penetrating manner, a clamping block 2 is connected to the top end of each slide rod 103, an end plate 201 is connected to one end of the top surface of each clamping block 2, the end plate 201 is perpendicular to the limiting rods 101, a side plate 202 is connected to one side of the top surface of each clamping block 2, the side plate 202 is perpendicular to the end plate 201, a clamping plate 203 is slidably arranged on the top surface of each clamping block 2, the clamping plate 203 can horizontally move along the plane of the end plate 201, a bidirectional screw 3 is arranged between the two limiting rods 101, the bidirectional screw 3 is parallel to the limiting rods 101, driving rods 301 are connected to two ends of the bidirectional screw 3 through threads, the driving rods 301 are fixedly connected to the clamping blocks 2, a belt pulley 302 is sleeved in the middle of the bidirectional screw 3, and the central axis of the belt pulley 302 coincides with the bidirectional screw 3, belt pulley 302 is connected with motor 304 through belt 303, and motor 304 is fixed in the 1 bottom of centre gripping platform, and two-way screw rod 3 rotates and is connected with a pair of stopper 305, and belt pulley 302 both sides are located respectively to stopper 305, and stopper 305 is fixed in centre gripping platform 1.
Further, a plurality of horizontally arranged springs 204 are uniformly connected to the inner side of the moving plate 203, a clamping plate 205 is connected to the springs 204, and the clamping plate 205 is parallel to the moving plate 203.
Further, a plurality of brackets 206 are uniformly connected to the inner sides of the side plates 202 and the clamping plates 205, the brackets 206 are rotatably connected with rubber rollers 207, and the central axes of the rubber rollers 207 are perpendicular to the top surface of the clamping block 2.
Further, the bidirectional screw 3 is fixed with a pair of limiting rings 306, and the two limiting rings 306 are respectively attached to the inner sides of the limiting blocks 305.
The chip mounting effect after the substrate is sintered is good, the thickness of the solder sheet is moderate, no solder flows into the substrate opening, and the connection stability of the substrate and the shell is high.
Example 2:
this example used the same procedure as in example 1 for the substrate solder sintering, except that:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.15mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.6 mm;
s2: selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.02mm, molding the solder sheet by using a laser marker, and matching the shape of the removed part of the solder sheet with the position and the external dimension of the opening of the substrate in the S1;
s3: and (5) positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the step S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell without damaging the metal shell raw base material after marking, and the depth of the opening groove is 5 microns.
The chip and the substrate opening gap after the substrate is sintered are small, so that the chip is not convenient to mount, the thickness of the solder sheet is small, the connection stability of the substrate and the shell is poor, and no solder flows into the substrate opening.
Example 3:
this example used the same procedure as in example 1 for the substrate solder sintering, except that:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.25mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.8 mm;
s2: selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.1mm, molding the solder sheet by using a laser marking machine, and matching the shape of the removed part of the solder sheet with the position and the external dimension of the opening of the substrate in the S1;
s3: and (6) positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell without damaging the metal shell raw base material after marking, and the depth of the opening groove is 30 microns.
The chip and the base plate trompil gap are great after the base plate sintering of this embodiment, and the chip mounting of being convenient for, solder piece thickness is thicker, and base plate and casing connection stability are high, but the solder piece use amount is big, and has a small amount of solder to flow to in the base plate trompil, need carry out the solder clearance.
Comparative example 1:
in the embodiment, the substrate solder sintering is performed by adopting the traditional process, and the specific steps are as follows:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.2mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.7 mm;
s2: plugging holes of the substrate in the S1 by using peelable glue, and selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.06mm, and the shape of the solder sheet is matched with the outline size of the substrate in the S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell after marking without damaging the metal shell raw base material, and the depth of the opening groove is 18 mu m;
s4: the substrate obtained in S1 and the solder sheet obtained in S2 were mounted in the case obtained in S3, and placed in a sintering tool, and soldering was performed by setting a sintering temperature in accordance with the melting point of the solder sheet.
S5: and (5) removing the peelable glue and the solder in the opening of the substrate after sintering in the S4.
The chip mounting effect is good after the base plate of this embodiment sinters, and solder piece thickness is moderate, and a small amount of solder flows to in the base plate opening, and base plate and casing connection stability are high, need carry out strippable glue after base plate and the casing welding and get rid of, then carry out the chip mounting.
Comparative example 2:
in the embodiment, the substrate solder sintering is performed by adopting the traditional process, and the specific steps are as follows:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.15mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.6 mm;
s2: plugging holes of the substrate in the S1 by using peelable glue, and selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.02mm, and the shape of the solder sheet is matched with the shape and size of the substrate in the S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell after marking without damaging the metal shell raw base material, and the depth of the opening groove is 5 mu m;
s4: the substrate obtained in S1 and the solder sheet obtained in S2 were mounted in the case obtained in S3, and placed in a sintering tool, and soldering was performed by setting a sintering temperature in accordance with the melting point of the solder sheet.
S5: and (5) removing the peelable glue and the solder in the opening of the substrate after sintering in the S4.
The chip and the base plate trompil gap are less after the base plate sintering of this embodiment, and the chip installation of being not convenient for, and the solder piece thickness is thinner, and base plate and casing connection stability is poor, and a small amount of solder flows to in the base plate trompil, needs to carry out the strippable after base plate and the casing welding and glues and get rid of.
Comparative example 3:
in the embodiment, the substrate solder sintering is performed by adopting the traditional process, and the specific steps are as follows:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and a chip is 0.25mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.8 mm;
s2: plugging holes of the substrate in the S1 by using peelable glue, and selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.1mm, and the shape of the solder sheet is matched with the shape and size of the substrate in the S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking the opening groove of the shell by using a laser marking machine, wherein the shape of the opening groove is consistent with that of the opening of the substrate, adjusting power parameters to only mark the coating of the shell after marking without damaging the metal shell raw base material, and the depth of the opening groove is 30 mu m;
s4: the substrate obtained in S1 and the solder sheet obtained in S2 were mounted in the case obtained in S3, and placed in a sintering tool, and soldering was performed by setting a sintering temperature in accordance with the melting point of the solder sheet.
S5: and (5) removing the peelable glue and the solder in the opening of the substrate after sintering in the S4.
The chip and the base plate trompil gap are great after the base plate sintering of this embodiment, and the chip mounting of being convenient for, solder piece thickness is thicker, and base plate and casing connection stability are high, but the solder piece use amount is big, and has a large amount of solders to flow to the base plate trompil in, need carry out the solder clearance.
Compared with the embodiment of sintering the substrate solder by the traditional process, the embodiment of the invention does not need to use the peelable glue to block the holes of the substrate, omits the subsequent peelable glue removing process, prevents the solder from flowing to the positions of the holes of the substrate by marking the hole grooves on the shell, is convenient for chip installation, and can improve the signal transmission quality of the chip and ensure the welding effect by optimizing the size of the holes of the substrate and the solder pieces.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A method for preventing solder flow during solder sintering of a substrate, comprising the steps of:
s1: fixing the substrate by using a clamping device, and forming holes on the substrate according to design requirements, wherein the distance between the edge of the hole in the line direction and the chip is 0.15-0.25 mm, and the distance between the edge of the hole in the non-line direction and the chip is 0.6-0.8 mm;
s2: selecting a solder sheet according to the welding requirement, wherein the thickness of the solder sheet is 0.02mm-0.1mm, molding the solder sheet by using a laser marking machine, and matching the shape of the removed part of the solder sheet with the position and the external dimension of the opening of the substrate in S1;
s3: positioning by adopting a visual technology according to the position and the overall dimension of the opening of the substrate in the S1, marking a hole groove on the shell by using a laser marking machine, only marking the cladding of the shell after marking without damaging the metal shell raw base material, wherein the depth of the hole groove is 5-30 mu m;
s4: mounting the substrate obtained in the step S1 and the solder sheet obtained in the step S2 in the shell obtained in the step S3, placing the substrate and the solder sheet in a sintering tool, wherein the solder sheet is positioned in the marking hole groove of the shell and is arranged between the substrate and the shell, and setting sintering temperature according to the melting point of the solder sheet for welding;
in S1, when the substrate is drilled, a clamping device is used for fixing the substrate, the substrate is placed on the top surfaces of clamping blocks (2), a motor (304) is used for driving a belt pulley (302) to rotate, a driving rod (301) is controlled to reversely and synchronously move through rotation of a bidirectional screw (3), a gap between the two clamping blocks (2) is adjusted, so that the two ends of the substrate are clamped by an end plate (201), the gap between the two clamping blocks (2) is reduced, meanwhile, a moving plate (203) horizontally moves along the plane of the end plate (201) to push the substrate to move to contact with a side plate (202), and when the bidirectional screw (3) rotates, a limiting block (305) is used for limiting the position of the bidirectional screw (3);
when the moving plate (203) moves horizontally along the plane of the end plate (201), the clamping plate (205) pushes the base plate to move towards the side plate (202), when the base plate is contacted with the side plate (202), the spring (204) is compressed, and the base plate is elastically contacted with the side plate (202);
when the clamping plate (205) moves towards the side plate (202), the rubber roller (207) connected with the clamping plate (205) is in contact with the substrate and pushes the substrate to move, the gap between the two clamping blocks (2) is gradually reduced, meanwhile, the rubber roller (207) and the bracket (206) rotate relatively, and the rubber roller (207) is in rolling contact with the side face of the substrate;
when the bidirectional screw (3) rotates, two limiting rings (306) fixedly connected with the bidirectional screw (3) are respectively attached to the inner sides of the limiting blocks (305).
2. A method for preventing solder flow when solder sintering a substrate according to claim 1, characterized in that: the distance between the edge of the opening in the line direction and the chip in S1 is 0.2 mm.
3. A method for preventing solder flow when solder sintering a substrate according to claim 1, characterized in that: the distance between the edge of the non-wiring direction opening and the chip in S1 is 0.7 mm.
4. A method for preventing solder flow when solder sintering a substrate according to claim 1, characterized in that: the thickness of the solder sheet in S2 was 0.06 mm.
5. A method for preventing solder flow when solder sintering a substrate according to claim 1, characterized in that: and S3, the shape of the hole groove formed on the shell is consistent with that of the substrate.
6. A method for preventing solder flow when solder sintering a substrate according to claim 1, characterized in that: the depth of the pore groove in S3 was 18 μm.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08203905A (en) * | 1995-01-25 | 1996-08-09 | Toshiba Corp | Method of forming solder bump |
| CN106876267A (en) * | 2015-12-11 | 2017-06-20 | 中国航空工业集团公司雷华电子技术研究所 | A kind of ltcc substrate component and its eutectic sintering process method |
| CN108351370A (en) * | 2015-08-11 | 2018-07-31 | 多元来思微株式会社 | Probe welder and utilize its probe welding method |
| CN108376677A (en) * | 2018-03-12 | 2018-08-07 | 成都海威华芯科技有限公司 | A kind of offside cascaded semiconductor chip apparatus and Cascading Methods |
| CN210607217U (en) * | 2019-11-19 | 2020-05-22 | 浙江芯丰科技有限公司 | IGBT welding tool |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7007835B2 (en) * | 2001-05-21 | 2006-03-07 | Jds Uniphase Corporation | Solder bonding technique for assembling a tilted chip or substrate |
| DE112012007155T5 (en) * | 2012-11-21 | 2015-08-06 | Mitsubishi Electric Corp. | Semiconductor device and method for its production |
| CN109671663B (en) * | 2018-11-29 | 2023-09-15 | 贵州振华风光半导体股份有限公司 | Sintering method of high-power hybrid integrated circuit device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203905A (en) * | 1995-01-25 | 1996-08-09 | Toshiba Corp | Method of forming solder bump |
| CN108351370A (en) * | 2015-08-11 | 2018-07-31 | 多元来思微株式会社 | Probe welder and utilize its probe welding method |
| CN106876267A (en) * | 2015-12-11 | 2017-06-20 | 中国航空工业集团公司雷华电子技术研究所 | A kind of ltcc substrate component and its eutectic sintering process method |
| CN108376677A (en) * | 2018-03-12 | 2018-08-07 | 成都海威华芯科技有限公司 | A kind of offside cascaded semiconductor chip apparatus and Cascading Methods |
| CN210607217U (en) * | 2019-11-19 | 2020-05-22 | 浙江芯丰科技有限公司 | IGBT welding tool |
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