CN113160729A - Display module, test method thereof and display device - Google Patents
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
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Abstract
The invention provides a display module, a test method thereof and a display device. The display module comprises a display panel, a driving chip and a flexible circuit board; the driving chip and the flexible circuit board are both bound in a non-display area of the display panel; an output pin of the driving chip is bound and connected with a first pin on the display panel to form an output binding unit; the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, and the second test structure is used for transmitting a test signal to the first test structure during impedance test; the impedance of the secondary test structure is the same as the impedance of the second test structure. And respectively carrying out impedance test on the main test structure and the auxiliary test structure, and then comparing the test results to obtain the binding impedance of the binding connection of the output pin and the display panel, thereby realizing the accurate detection of the binding impedance of the output pin.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a test method thereof and a display device.
Background
In the current display technology, a driver chip for driving a display panel to work needs to be bound on the display panel, a flexible circuit board is bound at one end of the display panel, and the driver chip is connected to a main board chip through the flexible circuit board. Before the display panel leaves the factory, the reliability of the binding connection between the driver chip and the display panel needs to be tested, so that the product with poor binding connection is prevented from leaving the factory. When testing the bonding connection reliability of the output pins (pins connected to signal lines in the display panel) of the driver chip and the display panel, it is usually necessary to set longer metal wires in the display panel, and the metal wires set on the display panel have higher impedance, and the impedance of the pin bonding connection is much smaller than the impedance of the metal wires, so that the difference of the impedance of the output pin bonding connection during testing cannot be well expressed, and the abnormal bonding condition of the output pins cannot be accurately detected.
Disclosure of Invention
The embodiment of the invention provides a display module, a test method thereof and a display device, and aims to solve the technical problem that in the prior art, the binding abnormal condition of the binding connection between an output pin of a drive chip and a display panel is difficult to detect.
In a first aspect, an embodiment of the present invention provides a display module, including: the display panel comprises a display panel, a driving chip and a flexible circuit board; the driving chip and the flexible circuit board are both bound in a non-display area of the display panel, and the flexible circuit board is bound on one side of the driving chip, which is far away from the display area of the display panel;
the driving chip comprises a plurality of output pins and a plurality of input pins, the output pins are positioned on one sides of the input pins close to the display area, and the input pins and the output pins are both bound and connected with the display panel; the display panel comprises a plurality of first pins, and the output pins and the first pins are bound and connected to form an output binding unit;
the display module comprises an output binding test structure, and the output binding test structure is used for testing the binding impedance of the binding connection of the output pin and the display panel; wherein the content of the first and second substances,
the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, the second test structure is electrically connected with the first test structure, and the second test structure is used for transmitting test signals to the first test structure during impedance test; the impedance of the secondary test structure is the same as the impedance of the second test structure.
In a second aspect, an embodiment of the present invention provides a display device, including the display module provided in any embodiment of the present invention.
In a third aspect, an embodiment of the present invention provides a method for testing a display module, where the display module includes a display panel, a driving chip, and a flexible circuit board; the driving chip and the flexible circuit board are both bound in a non-display area of the display panel, and the flexible circuit board is bound on one side of the driving chip, which is far away from the display area of the display panel;
the driving chip comprises a plurality of output pins and a plurality of input pins, the output pins are positioned on one sides of the input pins close to the display area, and the input pins and the output pins are both bound and connected with the display panel; the display panel comprises a plurality of first pins, and the output pins and the first pins are bound and connected to form an output binding unit;
the display module comprises an output binding test structure, the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, the second test structure is electrically connected with the first test structure, and the second test structure is used for transmitting test signals to the first test structure during impedance test; the impedance of the secondary test structure is the same as the impedance of the second test structure; the test method comprises the following steps:
performing impedance test on the main test structure to obtain a first impedance, wherein the first impedance is the sum of the impedance of the first test structure and the impedance of the second test structure;
carrying out impedance test on the auxiliary test structure to obtain a second impedance;
and comparing the first impedance with the second impedance to obtain the impedance of the output binding unit.
The display module, the test method thereof and the display device provided by the embodiment of the invention have the following beneficial effects: the method comprises the steps that a display module is arranged and comprises an output binding test structure, the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure which are connected, the first test structure comprises two output binding units which are connected in series, and an output pin of a driving chip and a first pin positioned on a display panel are bound and connected to form an output binding unit; the impedance of the secondary test structure is the same as the impedance of the second test structure. During the impedance test, the bound impedance of the binding connection between the output pin of the driver chip and the display panel is obtained by respectively performing impedance test on the main test structure and the auxiliary test structure and performing comparison calculation instead of directly testing the bound impedance of the binding connection between the output pin of the driver chip and the display panel. The invention can test the bound impedance by using a comparative measurement method, solves the problem that the abnormal bound impedance cannot be accurately detected due to the overlarge impedance of the metal wiring on the panel in the prior art, and realizes the accurate detection of the bound impedance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without inventive labor.
FIG. 1 is a schematic diagram of a display module according to the prior art;
FIG. 2 is a flow chart of a testing method provided by an embodiment of the present invention;
fig. 3 is a schematic view of a display module according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional view taken along line A-A' of FIG. 3;
FIG. 5 is a schematic cross-sectional view taken along line B-B' of FIG. 3;
FIG. 6 is a schematic view of another display module according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view taken along line C-C' of FIG. 6;
FIG. 8 is a schematic cross-sectional view taken along line D-D' of FIG. 6;
FIG. 9 is a schematic view of another display module according to an embodiment of the present invention;
FIG. 10 is a schematic view of another display module according to an embodiment of the present invention;
FIG. 11 is a schematic view of another display module according to an embodiment of the present invention;
FIG. 12 is a schematic view of another display module according to an embodiment of the present invention;
fig. 13 is a schematic view of a display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Fig. 1 is a schematic diagram of a display module in the prior art, and as shown in fig. 1, a driver chip 01 is bound on a display panel 02, and the driver chip 01 includes an input pin 011 and an output pin 012, where the input pin 011 and the output pin 012 are respectively bound and connected with a corresponding binding end (not shown in the figure) on the display panel 02. The flexible circuit board 03 is bound at one end of the display panel 02, and the flexible circuit board 03 includes a connection pin 031, and the connection pin 031 is bound and connected with a corresponding binding end (not shown in the figure) on the display panel 02. The output binding test structure of the driver chip 01 is illustrated in the figure, because signal wiring on the display panel 02 is dense, and there is no space for placing the test structure, the existing design electrically connects two output pins 012, after the two output pins 012 are bound and connected with the binding end on the display panel, the two output pins 012 are respectively connected to the connection pins 031 of the flexible circuit board 03 through wiring 041 on the display panel 02, so as to test the impedance of the binding connection between the output pins 012 and the binding end, and detect the binding condition of the output pins 012. Since the output pin 012 is generally located on a side of the input pin 011, which is far away from the connection pin 031, the length of the trace 041 located on the display panel 02 is longer, and the trace 041 is generally fabricated on the same layer as a metal structure in a film layer structure of the display panel 02, so that the impedance of the trace 041 is higher, which is generally about 110 Ω. And the impedance of the bond connection between the output pin 012 and the bonding terminal is low, typically less than 5 Ω. Therefore, when the bonding impedance is tested, the difference in the impedance of the bonding connection of the output pin 012 cannot be expressed well, and the abnormal bonding of the output pin 012 cannot be detected accurately.
Based on the problems in the prior art, the embodiment of the invention provides a display module, which comprises an output binding test structure, wherein the output binding test structure is used for testing the binding impedance of the binding connection between an output pin and a display panel. The output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, and an output pin of the driving chip and a first pin positioned on the display panel are bound and connected to form the output binding unit; the second test structure is connected with the first test structure, and the second test structure is used for transmitting test signals to the first test structure during impedance test, namely when the impedance of the main test structure is tested, the second test structure and the first test structure are in the same circuit structure. And the impedance of the secondary test structure is the same as the impedance of the second test structure. During the impedance test, the bound impedance of the binding connection between the output pin of the driver chip and the display panel is obtained by respectively performing impedance test on the main test structure and the auxiliary test structure and performing comparison calculation instead of directly testing the bound impedance of the binding connection between the output pin of the driver chip and the display panel. The method for testing the bound impedance by using a comparative measurement method can solve the problem that the bound impedance is abnormal and cannot be accurately detected due to overlarge impedance of metal wiring on a panel in the prior art, and realizes accurate detection of the bound impedance.
It should be noted that, in the embodiment of the present invention, the fact that the impedance of the secondary test structure is the same as the impedance of the second test structure means that the impedances of the secondary test structure and the second test structure are substantially the same, that is, the impedances of the secondary test structure and the second test structure are considered to be the same within a certain error range. Specifically, the impedance of the sub-test structure is Z1, and the impedance of the second test structure is Z2, wherein | Z1-Z2 | ≦ 4 Ω. In the prior art, the binding impedance of a single control output pin and a display panel is usually less than 5 Ω, and the first test structure includes two output binding units connected in series, so that the binding impedance of the main test structure needs to be controlled and less than 2 × 5 Ω during testing. Setting | Z1-Z2 | ≦ 40%. multidot.10Ω, that is, the difference between the impedance of the sub test structure and the impedance of the second test structure is less than 40% of the bound impedance control value, so as to ensure that poor binding of the output pin during the impedance test can be obviously reflected.
Specifically, the embodiment of the invention provides a test method for a display module, which can be used for testing the binding impedance of the binding connection between the output pin of the driver chip and the display panel in the display module provided by the embodiment of the invention. Fig. 2 is a flowchart of a testing method according to an embodiment of the present invention, and as shown in fig. 2, the testing method includes:
step S101: and performing impedance test on the main test structure to obtain a first impedance, wherein the main test structure comprises a first test structure and a second test structure, and the first impedance is the sum of the impedance of the first test structure and the impedance of the second test structure.
Step S102: carrying out impedance test on the auxiliary test structure to obtain a second impedance; in the implementation of the invention, the impedance of the secondary test structure is the same as the impedance of the second test structure, i.e. the impedance of the second test structure is low-temperature impedance.
Step S103: and comparing the first impedance with the second impedance to obtain the impedance of the output binding unit. The impedance of the first test structure can be obtained by comparing the difference between the first impedance and the second impedance, wherein the first test structure comprises two output binding units connected in series, i.e. the impedance of the output binding units can be obtained.
According to the testing method provided by the embodiment of the invention, the output bound impedance is tested by using a method of a comparative measurement method, the problem that the bound impedance is abnormal and cannot be accurately detected due to overlarge impedance of metal wires on a panel in the prior art can be solved, and the accurate detection of the bound impedance is realized.
Specifically, in an embodiment, fig. 3 is a schematic view of a display module according to an embodiment of the present invention, and fig. 4 is a schematic cross-sectional view of a position of a tangent line a-a' in fig. 3.
As shown in fig. 3, the display module includes a display panel 10, a driving chip 20, and a flexible circuit board 30; the driver chip 20 and the flexible circuit board 30 are both bound in the non-display area BA of the display panel 10, and the flexible circuit board 30 is bound in a side of the driver chip 20 away from the display area AA of the display panel 10. The driving chip 20 includes a plurality of output pins 21 and a plurality of input pins 22, the output pins 21 are located on one side of the input pins 22 close to the display area AA, and the input pins 22 and the output pins 21 are both connected to the display panel 10 in a binding manner. The input pin 22 of the driving chip 20 is electrically connected to the flexible circuit board 30, and the output pin 21 of the driving chip 20 is electrically connected to the signal line in the display panel 10.
The display panel 10 includes a plurality of first pins 11, a plurality of second pins, and a plurality of first connection pins. The output pin 21 and the first pin 11 are bound and connected to form an output binding unit, and the input pin 22 and the second pin are bound and connected to form an input binding unit. The flexible circuit board 30 includes a plurality of second connection pins, and the second connection pins are bound and connected with the first connection pins to form a third binding unit. Specifically, the output binding test structure in the embodiment of the present invention is used for testing the binding impedance of the binding connection between the output pin and the display panel, that is, testing the binding impedance of the output binding unit.
Specifically, as shown in fig. 4, the output pin 21 of the driver chip 20 and the first pin 11 on the display panel 10 are bound and connected to form an output binding unit C1. The figure also shows an anisotropic conductive adhesive 80, and the output pin 21 and the first pin 11 are bound and connected through the anisotropic conductive adhesive 80.
The output test structure in the embodiment of the present invention includes a main test structure 41 and a sub test structure 42. Wherein the main test structure 41 includes a first test structure 411 and a second test structure 412, the first test structure 411 includes two output binding units C1 connected in series, the second test structure 412 is electrically connected to the first test structure 411, and the second test structure 412 is used for transmitting a test signal to the first test structure 411 during the impedance test. The impedance of secondary test structure 42 is the same as the impedance of second test structure 412.
As shown in fig. 3, the second test structure 412 includes two first metal traces 51 on the display panel 10, and one first metal trace 51 is electrically connected to one output binding unit C1. One end of the first metal trace 51 on the display panel 10 is connected to the first pin 11 on the display panel 10, so that the first metal trace 51 is electrically connected to the output binding unit C1. The two output pins 21 are electrically connected inside the driver chip 20 in the main test structure 41 to realize the series connection of the two output binding units C1.
As shown in fig. 3, the sub-test structure 42 includes a second metal trace 52 on the display panel 10, and the resistance of the second metal trace 52 is equal to the sum of the resistances of the two first metal traces 51. It should be noted that, in the embodiment of the present invention, the fact that the resistance of the second metal trace 52 is equal to the sum of the resistances of the two first metal traces 51 is understood that the resistance of the second metal trace 52 is approximately the same as the sum of the resistances of the two first metal traces 51, that is, the difference between the resistances of the two first metal traces 51 can be considered as the same resistance within a certain error range. Specifically, the resistance of the second metal trace is R1, and the sum of the resistances of the two first metal traces is R2, where | R1-R2 | ≦ 4 Ω, i.e., so that the difference between the impedance of the sub-test structure and the impedance of the second test structure is less than 40% of the bound impedance control value, thereby ensuring that the poor binding of the output pin during the impedance test can be obviously reflected.
In addition, in the embodiment of the present invention, the first metal line 51 and the second metal line 52 are connected to the test point on the flexible circuit board 30 to implement the test of the bound impedance. In this way, no test point needs to be disposed on the display panel 10, and the space of the non-display area BA of the display panel 10 can be saved. Specifically, fig. 5 is a schematic cross-sectional view of a position of a tangent line B-B' in fig. 3, as illustrated in fig. 5, the display panel 10 includes a plurality of first connection pins 13, the flexible circuit board 30 includes a plurality of second connection pins 31, and the first connection pins 13 and the second connection pins 31 are bonded and connected by an anisotropic conductive adhesive. One end of the first metal wire 51 is connected to an output bonding unit C1, and the other end is connected to a first connection pin 13, so that the output bonding unit C1 can be connected to a wire 32 on the flexible circuit board 30 through the first metal wire 51, the first connection pin 13 and the second connection pin 31, and then connected to a corresponding test point (not shown) through the wire 32. The two ends of the second metal trace 52 are respectively connected to a first connection pin 13, and the second metal trace 52 can be connected to the wires 33 on the flexible circuit board 30 through the first connection pin 13 and the second connection pin 31, and then connected to the corresponding test points (not shown) through the wires 33. Specifically, the lengths of the wires 32 and 33 are the same to ensure the accuracy of the bound impedance test.
In the display module provided in this embodiment, the sub-test structure includes a second metal trace located on the display panel, and a resistance of the second metal trace is the same as a resistance of a first metal trace located on the display panel in the second test structure, so that an impedance of the second metal trace is the same as an impedance of the first metal trace. The impedance of the secondary test structure comprises the impedance of the second metal routing, the binding impedance of the display panel and the flexible circuit board, and the impedance of a circuit structure positioned on the flexible circuit board; the impedance of the main test structure comprises the impedance of the first metal routing, the impedance of the output binding unit, the binding impedance of the display panel and the flexible circuit board, and the impedance of the circuit structure on the flexible circuit board. The impedance of the main test structure and the impedance of the auxiliary test structure are respectively tested during impedance testing, and then the impedance of the output binding unit can be obtained through comparison and calculation, so that whether the binding impedance of the binding connection between the output pin of the driving chip and the display panel is abnormal or not is determined.
With continued reference to FIG. 3, the display module further includes an input bonding test structure 60, wherein the input bonding test structure 60 is used for testing the bonding impedance of the bonding connection between the input pins 22 and the display panel 10. I.e. the input binding test structure 60 is used to test the impedance of the input binding unit.
With continued reference to fig. 3, the display module further includes a third binding test structure 70, and the third binding test structure 70 is used for testing the binding impedance of the binding connection between the flexible circuit board 30 and the display panel 10. That is, the third binding test structure 70 is used for testing the impedance of the third binding unit, and specifically, in the third binding test structure 70, two third binding units are connected in series, wherein two first connection pins on the display panel in the two third binding units are electrically connected to realize series connection.
Specifically, the first metal trace 51 and the second metal trace 52 on the display panel 10 are made of the same material in the same layer. The first metal trace 51 and the second metal trace 52 are manufactured in the same process, so that the resistance of the second metal trace 52 can be controlled to be equal to the sum of the resistances of the two first metal traces 51 more easily.
In another embodiment, fig. 6 is a schematic view of another display module according to an embodiment of the present invention, fig. 7 is a schematic cross-sectional view taken at a position of a tangent line C-C 'in fig. 6, and fig. 8 is a schematic cross-sectional view taken at a position of a tangent line D-D' in fig. 6. As shown in fig. 6, the display module includes a display panel 10, a driving chip 20, and a flexible circuit board 30. The display panel 10 includes a plurality of first pins and a plurality of second pins, as shown in fig. 7, the output pin 21 is connected to the first pin 11 in a binding manner to form an output binding unit C1. As shown in fig. 8, the input pin 22 and the second pin 12 are bound and connected to form an input binding unit C2.
The output test structure in this embodiment includes a primary test structure 41 and a secondary test structure 42. Wherein the content of the first and second substances,
the main test structure 41 comprises a first test structure 411 and a second test structure 412, the first test structure 411 comprises two output binding units C1 connected in series, the second test structure 412 comprises two input binding units C2, and both the input binding unit C2 and the output binding unit C1 are connected in series in the main test structure 41. Specifically, as illustrated in fig. 7, the two first pins 11 of the two output binding units C1 are electrically connected to realize the series connection of the two output binding units C1.
The impedance of secondary test structure 42 is the same as the impedance of second test structure 412. The secondary test structure 42 includes two input binding units C2 connected in series. Specifically, the two input pins 22 are electrically connected inside the driver chip 20 to realize that the two input binding units C2 are connected in series.
In the display module provided by the embodiment, after the impedance of the main test structure and the impedance of the auxiliary test structure are respectively tested, the impedance of the output binding unit can be obtained through comparison and calculation, so that whether the binding impedance of the binding connection between the output pin of the driving chip and the display panel is abnormal or not is determined, the binding impedance is tested through a method of a comparison measurement method, the problem that the binding impedance is abnormal and cannot be accurately detected due to too high impedance of metal wires on the display panel is solved, and the accurate detection of the size of the binding impedance is realized.
Specifically, in the main test structure 41: an input binding unit C2, an output binding unit C1, another input binding unit C1 and another output binding unit C2 are connected in series in sequence; the driver chip 20 includes a connecting wire 23, one end of the connecting wire 23 is electrically connected to the output pin 21 of the output binding unit C1, and the other end of the connecting wire 23 is electrically connected to the input pin 22 of the input binding unit C2. The connecting wire 23 is located in the driver chip 20, and in the main test structure 41, the impedance of the connecting wire 23 is significantly smaller than the impedance of the bonding connection between the output pin 21 and the first pin 11, so that the impedance of the connecting wire 23 does not affect the appearance of the bonding connection between the output pin 21 and the first pin 11 when the bonding impedance is tested.
In addition, as illustrated in fig. 5, the display panel 10 includes a plurality of first connection pins 13, the flexible circuit board 30 includes a plurality of second connection pins 31, and the first connection pins 13 and the second connection pins 31 are bound and connected to form a third binding unit C3. As shown in fig. 6, the main test structure 41 further includes a third metal trace 53 on the display panel 10, wherein one end of the third metal trace 53 is electrically connected to one input binding unit C2, and the other end is electrically connected to the first connection pin 13. That is, the input bonding unit C2 is connected to the third metal trace 53 in the main test structure 41, connected to the first connection pin 13 through the third metal trace 53, connected to the second connection pin 31, and connected to the test point on the flexible circuit board 30. The sub-test structure 42 further includes a fourth metal trace 54 located on the display panel, one end of the fourth metal trace 54 is electrically connected to the input bonding unit C2, and the other end is electrically connected to the first connection pin 11; in the secondary test structure 42, the input binding unit C2 is connected to the second connection pin 22 through the first connection pin 11 and then to the test point on the flexible circuit board 30. Specifically, the resistance of the third metal trace 53 is equal to the resistance of the fourth metal trace 54.
The impedance of the secondary test structure comprises the impedance of the input binding unit, the binding impedance of the display panel and the flexible circuit board (also connected with the impedance of the third binding unit), the impedance of the fourth metal wire and the impedance of the circuit structure on the flexible circuit board; the impedance of the main test structure is the sum of the impedance of the first test structure and the impedance of the second test structure, wherein the impedance of the first test structure comprises the impedance of the output binding unit, and the impedance of the second test structure comprises the impedance of the input binding unit, the impedance of the third metal wire, the binding impedance of the display panel and the flexible circuit board, and the impedance of the circuit structure on the flexible circuit board. After the impedance of the main test structure and the impedance of the auxiliary test structure are respectively tested, the impedance of the output binding unit can be obtained through comparison and calculation, so that whether the binding impedance of the binding connection between the output pin of the drive chip and the display panel is abnormal or not is determined, the binding impedance is tested through a method of a comparison measurement method, the problem that the binding impedance is abnormal and cannot be accurately detected due to the fact that the metal wiring impedance on the display panel is too large is solved, and accurate detection of the size of the binding impedance is achieved.
Specifically, in the display module provided in the embodiment of fig. 6, the display module further includes an input binding test structure 60, where the input binding test structure 60 is used to test the binding impedance of the binding connection between the input pin 22 and the display panel 10; where secondary test structure 42 is multiplexed into input binding test structure 60. Also, the partial structure in the output binding structure can realize the binding impedance of the binding connection of the input pins and the display panel to be tested, the input binding test structure does not need to be additionally arranged, the number of the input pins can be saved, the number of the second pins in the display panel is correspondingly reduced, and the space saving is facilitated.
In another embodiment, fig. 9 is a schematic diagram of another display module according to the embodiment of the invention, and as shown in fig. 9, an input binding unit C2 (not labeled, and understood with reference to fig. 8) in the second test structure 412 is multiplexed into an input binding unit C2 in the sub-test structure 42. That is, the second test structure 412 and the sub-test structure 42 share one input binding unit C2, which can save the number of input pins, and correspondingly reduce the number of second pins in the display panel, thereby being beneficial to saving space.
Specifically, in the embodiment of the present invention, second test structure 412 includes a first test point, and sub-test structure 42 includes a second test point; in performing the impedance test, a test meter (e.g., a multimeter) is connected to the first test point to test the impedance of the primary test structure 41, and a test meter is connected to the second test point to test the impedance of the secondary test structure 42. The first test point and the second test point are both located on the flexible circuit board 30, and no test point needs to be set on the display panel 10, so that the space of the non-display area BA of the display panel 10 can be saved.
In an embodiment, fig. 10 is a schematic view of another display module according to an embodiment of the present invention, as shown in fig. 10, a first test point and a second test point are both located on a flexible circuit board 30, the first test point includes a first copper leakage 81, and the second test point includes a second copper leakage 82; as illustrated in the drawing, the second test structure 412 includes an input binding unit, a third binding unit, metal lines on the display panel, conductive lines on the flexible circuit board 30, and a first copper drain 81, and tests the impedance of the main test structure 41 by connecting a test meter to the first copper drain 81 at the time of the impedance test. Accordingly, the sub test structure 42 includes an input binding unit, a third binding unit, a metal line on the display panel, a conductive line on the flexible circuit board 30, and a second copper drain 82, and tests the impedance of the sub test structure 42 by connecting the test instrument to the second copper drain 82 during the impedance test. According to the embodiment, the copper leakage is arranged on the flexible circuit board to serve as the test point, and the test pin does not need to be added on the flexible circuit board.
In another embodiment, fig. 11 is a schematic diagram of another display module according to an embodiment of the present invention, as shown in fig. 11, the first test point includes a first test pin 91, and the second test point includes a second test pin 92. The figure also shows a third pin 33 on the flexible circuit board 30, where the third pin 33 is used to realize the connection between the flexible circuit board 30 and the system motherboard chip, and the first test pin 91 and the second test pin 92 can be manufactured in the same process as the third pin 33. In the impedance test, a test meter is connected to the first test pin 91 to test the impedance of the main test structure 41, and a test meter is connected to the second test pin 92 to test the impedance of the sub-test structure 42.
In another embodiment, fig. 12 is a schematic view of another display module according to an embodiment of the present invention, and as shown in fig. 12, the display module includes a display panel 10, a driving chip 20, and a flexible circuit board 30; the driver chip 20 and the flexible circuit board 30 are both bound in the non-display area BA of the display panel 10, and the flexible circuit board 30 is bound in a side of the driver chip 20 away from the display area AA of the display panel 10. The driving chip 20 includes a plurality of output pins 21 and a plurality of input pins 22, the output pins 21 are located on one side of the input pins 22 close to the display area AA, and the input pins 22 and the output pins 21 are both connected to the display panel 10 in a binding manner. The display panel comprises a plurality of first pins, and the output pin 21 is connected with the first pins in a binding manner to form an output binding unit C1; the output binding unit can be understood with reference to the above-described embodiments, and is not illustrated in the drawings.
The display module comprises an output binding test structure, the output binding test structure comprises an output binding unit C1 and a test capacitor Ct, and the output binding test structure is used for testing the binding impedance of the output pin 21 and the display panel in binding connection according to the charging and discharging delay of the test capacitor Ct. Specifically, the output test binding structure includes a detection module 23 located in the driver chip 20, where the detection module 23 is configured to provide a pulse signal to a circuit where the output binding unit C1 and the test capacitor Ct are located, and detect a delay of charging and discharging of the test capacitor Ct.
Specifically, the detection module 23 is electrically connected to a communication module in the driving chip 20, and is connected to a circuit trace in the flexible circuit board 30 through the communication module, so as to implement the detection result of the read-back detection module 23.
In this embodiment, the test capacitor Ct and the output binding unit C1 form a capacitor delay circuit, and after the display module is manufactured, the capacitor in the circuit structure is basically fixed according to the delay formula T ═ R × C, where T is the delay and R is the resistance in the capacitor delay circuit. R can be determined by detecting the time delay of the charging and discharging of the capacitor, and thus the impedance of the output binding unit C1 can be determined.
Specifically, the detection module 23 includes an operational amplifier and an integrating operational circuit. The embodiment is provided with a detection module 23 in the driving chip 20 to test the impedance of the bonding connection between the output pin and the display panel.
Specifically, in one embodiment, a first plate of the test capacitor Ct is grounded, and a second plate of the test capacitor Ct is electrically connected to the output binding unit C1.
Specifically, in another embodiment, the output binding test structure includes two output test binding units C1, wherein two first pins of the two output binding units C1 are electrically connected to form a common electrode; the common electrode is multiplexed as a second plate.
Fig. 13 is a schematic view of a display device according to an embodiment of the present invention, and as shown in fig. 13, the display device includes the display module 100 according to any embodiment of the present invention. The structure of the display module 100 has already been described in the above embodiments of the display module, and is not described herein again. The display device in the embodiment of the invention can be any equipment with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book, a television, an intelligent wearable product and the like.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (14)
1. A display module is characterized by comprising a display panel, a driving chip and a flexible circuit board; the driving chip and the flexible circuit board are both bound in a non-display area of the display panel, and the flexible circuit board is bound on one side of the driving chip, which is far away from the display area of the display panel;
the driving chip comprises a plurality of output pins and a plurality of input pins, the output pins are positioned on one side of the input pins close to the display area, and the input pins and the output pins are both in binding connection with the display panel; the display panel comprises a plurality of first pins, and the output pins and the first pins are bound and connected to form an output binding unit;
the display module comprises an output binding test structure, and the output binding test structure is used for testing the binding impedance of the binding connection between the output pin and the display panel; wherein the content of the first and second substances,
the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, the second test structure is electrically connected with the first test structure, and the second test structure is used for transmitting test signals to the first test structure during impedance test; the impedance of the secondary test structure is the same as the impedance of the second test structure.
2. The display module of claim 1,
the second test structure comprises two first metal wires positioned on the display panel, and one first metal wire is electrically connected with one output binding unit;
the secondary test structure comprises a second metal wire positioned on the display panel, and the resistance of the second metal wire is equal to the sum of the resistances of the two first metal wires.
3. The display module of claim 2,
the first metal routing and the second metal routing are made of the same material on the same layer.
4. The display module of claim 2,
the display panel comprises a plurality of first connecting pins, the flexible structure plate comprises a plurality of second connecting pins, and the first connecting pins and the second connecting pins are connected in a binding mode;
one end of the first metal wire is connected with one output binding unit, and the other end of the first metal wire is connected with one first connecting pin;
and two ends of the second metal wire are respectively connected with one first connecting pin.
5. The display module of claim 1,
the display panel comprises a plurality of second pins, and the input pins and the second pins are bound and connected to form an input binding unit;
the second test structure comprises two input binding units, and the input binding units and the output binding units are connected in series in the main test structure;
the secondary test structure comprises two of the input binding units connected in series.
6. The display module of claim 5,
the display module further comprises an input binding test structure, and the input binding test structure is used for testing the binding impedance of the binding connection between the input pin and the display panel; wherein the content of the first and second substances,
the secondary test structure is multiplexed into the input binding test structure.
7. The display module of claim 5,
the display panel comprises a plurality of first connecting pins, the flexible structure plate comprises a plurality of second connecting pins, and the first connecting pins and the second connecting pins are connected in a binding mode;
the second test structure comprises a third metal wire positioned on the display panel, one end of the third metal wire is electrically connected with the input binding unit, and the other end of the third metal wire is electrically connected with the first connecting pin;
the auxiliary test structure also comprises a fourth metal wire positioned on the display panel, wherein one end of the fourth metal wire is electrically connected with the input binding unit, and the other end of the fourth metal wire is electrically connected with the first connecting pin; wherein the content of the first and second substances,
the resistance of the third metal wire is equal to the resistance of the fourth metal wire.
8. The display module of claim 5,
one of the input binding units in the second test structure is multiplexed as one of the input binding units in the secondary test structure.
9. The display module of claim 5,
in the main test structure: one of the input binding units, one of the output binding units, the other of the output binding units, and the other of the input binding units are sequentially connected in series; wherein the content of the first and second substances,
the driving chip comprises a connecting wire, one end of the connecting wire is electrically connected with the output pin in the output binding unit, and the other end of the connecting wire is electrically connected with the input pin in the input binding unit.
10. The display module of claim 5,
and two first pins in the two output binding units are electrically connected.
11. The display module of claim 1,
the second test structure comprises a first test point, and the secondary test structure comprises a second test point; the first test point and the second test point are both located on the flexible circuit board.
12. The display module of claim 11,
the first test point comprises first leakage copper, and the second test point comprises second leakage copper;
or, the first test point comprises a first test pin, and the second test point comprises a second test pin.
13. A display device, comprising the display module according to any one of claims 1 to 12.
14. The test method of the display module is characterized in that the display module comprises a display panel, a driving chip and a flexible circuit board; the driving chip and the flexible circuit board are both bound in a non-display area of the display panel, and the flexible circuit board is bound on one side of the driving chip, which is far away from the display area of the display panel;
the driving chip comprises a plurality of output pins and a plurality of input pins, the output pins are positioned on one side of the input pins close to the display area, and the input pins and the output pins are both in binding connection with the display panel; the display panel comprises a plurality of first pins, and the output pins and the first pins are bound and connected to form an output binding unit;
the display module comprises an output binding test structure, the output binding test structure comprises a main test structure and an auxiliary test structure, the main test structure comprises a first test structure and a second test structure, the first test structure comprises two output binding units which are connected in series, the second test structure is electrically connected with the first test structure, and the second test structure is used for transmitting a test signal to the first test structure during impedance test; the impedance of the secondary test structure is the same as the impedance of the second test structure; the test method comprises the following steps:
performing impedance test on the main test structure to obtain a first impedance, wherein the first impedance is the sum of the impedance of the first test structure and the impedance of the second test structure;
carrying out impedance test on the auxiliary test structure to obtain a second impedance;
and comparing the first impedance with the second impedance to obtain the impedance of the output binding unit.
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