CN113146364A

CN113146364A - Method and jig for removing welding residues of optical device

Info

Publication number: CN113146364A
Application number: CN202110187551.3A
Authority: CN
Inventors: 宋晓; 李林科; 吴天书; 杨现文; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2021-02-18
Filing date: 2021-02-18
Publication date: 2021-07-23

Abstract

The invention relates to the technical field of manufacturing of photoelectric devices, in particular to a method and a jig for removing welding residues of a photoelectric device, which comprises the following steps: providing a clamp with a jack or a long and narrow accommodating hole; putting the surface to be ground of the product downwards into the accommodating hole of the clamp; adjusting the size of the accommodating hole to clamp and fix the product in the clamp; clamping the whole clamp with the fixed product in a grinding clamp; grinding and polishing the to-be-ground surface of the product in the clamp fixed by the clamp by using a grinding clamp to remove laser welding residues of the to-be-ground surface; adjusting the size of the accommodating hole to take out the product; the surface to be ground is washed by using an air gun, and dirt which cannot be washed away by the air gun is cleaned by using cotton swab sticky alcohol. The product to be ground is fixed in the clamp through four surfaces and is vertical to the clamp, so that the ground surface is not uneven because the product to be ground is not vertical; a plurality of products to be ground can be ground simultaneously, and the consistency and the yield are ensured while the production efficiency in unit time is also considered.

Description

Method and jig for removing welding residues of optical device

Technical Field

The invention relates to the technical field of manufacturing of photoelectric devices, in particular to a method and a jig for removing welding residues of a photoelectric device.

Background

Because of the increase in the amount of transmission rate information in communication networks, optical modules are required to be able to operate at transmission rates of 100G, 200G, 400G, and even higher. At this time, the light emitting/receiving module as the core component of the optical module inevitably uses a plurality of active components (a plurality of lasers or detectors, hereinafter referred to as ld (laser diode) or pd (photo diode)) to perform wavelength division/multiplexing to achieve a desired transmission rate.

Because the traditional active component only has a channel (single LD or PD), in order to adapt to large-scale mass production, a round structure (an adapter and a pipe body) is used for optical alignment and laser welding in the industry, after the condition that parameters are unqualified or the end face of a product is damaged occurs, the unqualified device is generally split, because the product is the round structure, a three-axis small lathe can be used for clamping the adapter or the pipe body to be repaired, then a turning tool is used for turning the residue of the laser welding, and the similar repairing mode is used in most device factories.

However, as a plurality of LDs or PDs are required to be used in the device, and passive elements such as wavelength division multiplexing/demultiplexing (hereinafter, referred to as MUX/DEMUX) are added to realize the functions of combining and dividing the wave, the high-speed optical device needs to use a gold BOX (hereinafter, referred to as BOX) type packaging mode; because the structure of the BOX causes mutual non-concentricity between the adapter and the BOX, the traditional three-axis small lathe cannot be used for turning the laser welding residues of bad devices, the BOX is fixed by using a clamp in the industry at present, then the laser welding residues are ground by using a file, because the circle is non-concentric and the center of gravity is unstable, a grinding surface can form an inclined plane after grinding, the whole device cannot be reused, and the efficiency and the yield for removing the welding residues are very low.

Therefore, it is necessary to design a new method for removing the welding residue to solve the above problems.

Disclosure of Invention

The invention provides a method and a jig for removing welding residues of an optical device, which solve the technical problems of very low efficiency and yield of removing the welding residues.

The invention provides a method for removing welding residues of an optical device for solving the technical problems, which comprises the following steps:

step 100, providing a clamp with a jack or a long and narrow accommodating hole;

200, placing the surface to be ground of the product downwards into an accommodating hole of the clamp;

step 300, adjusting the size of the accommodating hole to enable the product to be clamped and fixed in the clamp;

step 400, integrally clamping the clamp fixed with the product in a grinding clamp;

500, grinding and polishing the to-be-ground surface of the product in the clamp fixed by the clamp by using a grinder to remove laser welding residues of the to-be-ground surface;

step 600, taking the clamp out of the grinding clamp;

step 700, adjusting the size of the accommodating hole to take out the product;

and 800, washing the surface to be ground by using an air gun, observing whether the residue of the ground surface is completely removed under a white light microscope, and wiping off dirt which cannot be washed away by the air gun by using cotton swab sticky alcohol.

Optionally, the receiving hole of the clamp is square, and the receiving hole has two mutually perpendicular and fixed surfaces, and the two mutually perpendicular and fixed surfaces are also mutually perpendicular to the bottom surface of the clamp;

the clamping block is arranged in the accommodating hole and connected with the clamp through a bolt, and the clamping block moves in the accommodating hole relative to the clamping body so as to enlarge or reduce the space of the accommodating hole.

Optionally, the clamping block includes two mutually perpendicular and fixed movable surfaces, and when the clamping block moves, the movable surfaces move parallel to the fixed surfaces.

Optionally, the bolt is screwed by using a torque wrench, and the two movable surfaces are pushed to clamp the fixing surface of the product to be ground so as to completely fix the product to be ground in the accommodating hole of the clamp.

Optionally, a plurality of fixtures are placed into the grinding fixture at a time and ground simultaneously.

Optionally, after the fixture is installed in the grinding fixture, the horizontal degree of freedom of the fixture is limited and a vertically downward elastic force is provided on the fixture.

Optionally, a cylinder is arranged on the grinding clamp, and an adaptive hole inserted into the cylinder is arranged on the grinding clamp.

The invention also provides a jig, and the jig is used for a method for removing the welding residues of the optical device.

Has the advantages that: the invention provides a method and a jig for removing welding residues of optical devices, which comprises the following steps: providing a clamp with a jack or a long and narrow accommodating hole; putting the surface to be ground of the product downwards into the accommodating hole of the clamp; adjusting the size of the accommodating hole to enable the product to be clamped and fixed in the clamp; integrally clamping the clamp fixed with the product in a grinding clamp; grinding and polishing the to-be-ground surface of the product in the clamp fixed by the clamp by using a grinding clamp to remove laser welding residues of the to-be-ground surface; removing the jig from the grinding jig; adjusting the size of the accommodating hole to take out the product; and (3) washing the surface to be ground by using an air gun, observing whether the residue of the ground surface is completely removed under a white light microscope, and wiping off dirt which cannot be washed away by the air gun by using cotton swab sticky alcohol. The product to be ground is fixed in the clamp through four surfaces and is vertical to the clamp, so that the ground surface is not uneven because the product to be ground is not vertical; the torsion of the product to be ground in the process of being loaded into the clamp is controllable, so that the condition that the product to be ground is deformed due to uncontrollable force in the process of manually clamping the product to be ground is completely avoided, and the consistency and the yield after grinding are ensured to the maximum extent; can grind a plurality ofly simultaneously treat the product of grinding, when guaranteeing uniformity and yield, still compromise the production efficiency in the unit interval.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:

FIG. 1 is a flow chart of a preferred embodiment of the present invention;

FIG. 2 is a detailed structural diagram of the jig in the method for removing welding residues shown in FIG. 1;

FIG. 3 is a detailed structural diagram of the grinding jig in the method for removing welding residues shown in FIG. 1;

FIG. 4 is a view illustrating an assembly of the jig in the method of removing the welding residues shown in FIG. 1;

FIG. 5 is a detailed structural view of a jig according to another embodiment;

FIG. 6 is a schematic diagram of another embodiment of a polishing fixture;

FIG. 7 is a schematic diagram of a product of the present invention with welding residue to be ground.

Detailed Description

The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The first embodiment is as follows: refer to fig. 1 to 4.

The method for removing the welding residues in the embodiment of the invention comprises the following steps:

step 100, providing a fixture with a hole or a long and narrow receiving hole as shown in FIG. 2

Referring to fig. 2, in the embodiment of the present invention, the material of the clamp may be, but is not limited to, stainless steel, which is mainly used for the purpose of reducing cost effectively.

Step 200, placing the product to be ground with the ground surface 810 facing downward and the non-ground surface 820 facing upward into the jig receiving hole 210 shown in fig. 2, wherein the two

surfaces

830 and 840 are attached to two surfaces 220 of the jig shown in fig. 2, which are perpendicular to each other and fixed.

In step 300, the bolt 250 shown in fig. 2 is screwed by using a torque wrench, and the two movable surfaces 240 are pushed to clamp the

fixing surfaces

850 and 860 of the product to be ground, so that the product to be ground can be completely fixed in the receiving hole 210 of the clamp shown in fig. 2. The left bolt 250 is moved inward so that the movable surface 240 is compressed inward to reduce the size of the receiving hole 210. Bolt 250 on the right side wears on a slider, and the slider is inserted in the slide opening of anchor clamps, and the big one end of slider one end is little, along with the wrong income of bolt for in the slider gradually stretched into the slide opening, the big absolutely of slider gradually gets into in the slide opening with the inside extrusion of activity face 240, makes accepting hole 210 diminish, otherwise grow.

Step 400, placing the fixture shown in fig. 2, on which the product to be ground shown in fig. 7 is fixed, into the grinding fixture shown in fig. 3, wherein the two fitting holes 230 shown in fig. 2 are fitted with the two cylinders 320 shown in fig. 3, so as to ensure the perpendicularity of the fixture shown in fig. 2 after being assembled with the grinding fixture shown in fig. 3; the surface 810 to be ground of the product to be ground of fig. 7 held by the jig of fig. 2 is exposed from the hole of the grinding jig 310 of fig. 3; the spring post 330 of the lapping fixture of fig. 3 applies a downward force to the fixture of fig. 2 to ensure the amount of lapping of the lapping surface 810 shown in fig. 7 during lapping.

Step 500, a common optical fiber grinder is used for grinding the grinding product shown in fig. 3, and lubricating liquid, grinding liquid and other liquid do not need to be added in the grinding process, so that the cost is further reduced.

Step 600, the fixture as shown in FIG. 2 is removed from the grinding fixture as shown in FIG. 3.

In step 700, a torque wrench is used to turn the bolt 250 shown in FIG. 2, and two movable surfaces 240 of the fixture shown in FIG. 2 are loosened, which clamp the fixed

surfaces

850, 860 of the product to be ground, so that the product to be ground is in a loose state as shown in FIG. 7.

Example two: as shown in fig. 5 to 7.

In step 100, a fixture with a receptacle or elongated receptacle is provided as shown in fig. 5.

Step 200, the surface to be ground 810 of the product to be ground is placed downwards and the non-grinding surface 820 is placed upwards into the receiving hole 510 of the fixture shown in fig. 2, wherein two

surfaces

830 and 840 are attached to two mutually perpendicular and fixed fixing surfaces 520 of the fixture shown in fig. 5.

In step 300, a torque wrench is used to turn a bolt 540 as shown in fig. 5, and the two movable surfaces 530 are pushed to clamp the two vertical

adjacent surfaces

850, 860 of the product to be ground, so that the product to be ground can be completely fixed in the receiving hole 510 of the clamp shown in fig. 5.

Step 400, the jig shown in fig. 5 holding the product to be ground shown in fig. 7 is placed into the placing hole 610 of the grinding jig shown in fig. 6, and then the top surface 550 of the jig shown in fig. 5 is pressed by using the pressing plate 620, wherein the spring bar 630 of fig. 6 presses the top surface 550 of the jig shown in fig. 5 through the pressing plate 620, so as to give a downward force to the jig, thereby ensuring the grinding amount of the surface 810 to be ground of fig. 7 during grinding.

The clip is directly inserted into the receiving hole 510, similar to the plug structure of a socket.

Step 500, using a common optical fiber polishing fixture to polish the polishing fixture shown in fig. 6, without adding liquid such as lubricating liquid, polishing liquid and the like during polishing, thereby further reducing cost.

Step 600, the fixture as shown in FIG. 5 is removed from the grinding fixture as shown in FIG. 6.

In step 700, a torque wrench is used to turn the bolt 540 shown in FIG. 5, and two movable surfaces 530 of the fixture shown in FIG. 5, which clamp the fixed

surfaces

850, 860 of the product to be ground, are loosened, so that the product to be ground is in a loose state as shown in FIG. 7.

And 800, washing the grinding surface by using an air gun, observing whether the residue of the grinding surface is completely removed under a white light microscope, and wiping off the dirt which cannot be washed away by the air gun by using cotton swab sticky alcohol.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; the present invention may be readily implemented by those of ordinary skill in the art as illustrated in the accompanying drawings and described above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the scope of the invention as defined by the appended claims; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. A method of removing solder residue from an optical device, comprising:

step 600, taking the clamp out of the grinding clamp;

step 700, adjusting the size of the accommodating hole to take out the product;

2. The method of claim 1, wherein the receiving hole of the jig has a square shape, and the receiving hole has two surfaces perpendicular to each other and fixed to each other, and the two surfaces perpendicular to each other and fixed to the bottom surface of the jig are also perpendicular to each other;

3. A method for removing welding residues of optical devices according to claim 2, wherein the clamping block comprises two mutually perpendicular and fixed movable surfaces, and the clamping block moves while the movable surfaces move in parallel with respect to the fixed surfaces.

4. A method for removing welding residues of optical devices as claimed in claim 3, wherein the bolt is turned by a torque wrench to push the two movable surfaces to clamp the fixed surface of the product to be ground, so as to fix the product to be ground completely in the receiving hole of the fixture.

5. A method of removing welding residues of optical devices according to claim 1, wherein a plurality of jigs are simultaneously ground each time they are placed in the grinding jig.

6. A method for removing welding residues of optical devices as recited in claim 1, wherein said fixture is mounted to said grinding fixture to limit a horizontal degree of freedom of said fixture and to provide a vertically downward spring force on said fixture.

7. A method for removing welding residues of optical devices as claimed in claim 1, wherein the grinding fixture is provided with a cylinder, and the fixture is provided with an adaptive hole inserted into the cylinder.

8. A jig for use in the method for removing soldering residue of optical device according to claims 1 to 7.