CN113133188B

CN113133188B - Flexible circuit board, display module and display device

Info

Publication number: CN113133188B
Application number: CN202110425780.4A
Authority: CN
Inventors: 李裕民; 谢志豪; 冯彬峰
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-04-20
Filing date: 2021-04-20
Publication date: 2022-09-09
Anticipated expiration: 2041-04-20
Also published as: CN113133188A

Abstract

The application provides a flexible circuit board, display module assembly and display device, this flexible circuit board includes: the board comprises a board body, a binding structure and a connecting structure; the binding structure is positioned on one side of the plate body and is used for binding with the bonding area of the display panel; the connecting structure is positioned on one side of the plate body far away from the binding structure and is used for electrically connecting the plate body with an external mainboard; the ratio of the width of the device area on the plate body in the direction perpendicular to the extending direction of the binding structure to the width of the first area in the direction perpendicular to the extending direction of the binding structure is 2/3-1. The application provides a flexible circuit board, the regional width of device in through the reasonable control first region and the ratio of the width in first region, the width that has increased the device region on whole plate body in other words accounts for than, for current flexible circuit board's structure, under the unchangeable condition of the width in the device region, has reduced the width size of whole plate body in other words to can practice thrift the installation space of complete machine.

Description

Flexible circuit board, display module and display device

Technical Field

The application relates to the technical field of display, in particular to a flexible circuit board, a display module and a display device.

Background

A Flexible Printed Circuit (FPC) is a highly reliable and Flexible Printed Circuit board made of a Flexible film as a base material. The flexible circuit board has the characteristics of high wiring density, light weight, thin thickness, good bending property and the like, and is widely applied to various electronic devices such as mobile phones, computers, displays and the like.

With the development of display technology, the development of folding display screen products is more and more, and the demand for the internal space is greater because of more parts inside the folding display screen products. However, in the existing folding display product, the flexible circuit board bound with the display panel inside the folding display screen product occupies a large space after being bent, which affects the installation of parts such as a battery on the back of the product.

Disclosure of Invention

This application provides a flexible circuit board, display module assembly and display device to the shortcoming of current mode to solve the great problem that influences spare part installations such as battery in the space that occupies after buckling of the flexible circuit board in the current folding display product.

In a first aspect, an embodiment of the present application provides a flexible circuit board, including: the plate comprises a plate body, a binding structure and a connecting structure; the binding structure is positioned on one side of the plate body and is used for binding with the bonding area of the display panel; the connecting structure is positioned on one side of the plate body, which is far away from the binding structure, and is used for electrically connecting the plate body with an external mainboard; the plate body comprises a first area, the first area is located on two sides of the connecting structure, a device area used for arranging circuit components is arranged in the first area, the device area is perpendicular to the width of the extending direction of the binding structure, and the ratio of the width of the extending direction of the binding structure to the width of the extending direction of the binding structure is 2/3-1.

Optionally, the ratio of the width of the device region in the direction perpendicular to the extension direction of the binding structure to the width of the first region in the direction perpendicular to the extension direction of the binding structure is 4/5-1.

Optionally, the method further comprises: the epitaxial structure is connected with the plate body and is positioned on one side of the plate body, which is far away from the binding structure; the epitaxial structure comprises an adsorption part which is used for being adsorbed by external equipment; and/or the epitaxial structure comprises a test port, and the test port is electrically connected with the circuit component and the binding structure and is used for detecting the electric connection state of the binding structure and the display panel after binding.

Optionally, a hollowed-out structure is arranged in the epitaxial structure, and the hollowed-out structure is located at a connection position of the epitaxial structure and the plate body; along the extending direction of the plate body close to the side edge of the epitaxial structure, two sides of the hollow structure are connecting points.

Optionally, the hollow structures are multiple, and the multiple hollow structures are arranged at intervals along the extending direction of the side edge of the plate body close to the epitaxial structure.

Optionally, the projection of the hollowed-out structure in the plane of the plate body is trapezoidal.

Optionally, a cutting positioning identification structure is further arranged on the plate body; the cutting positioning identification structure is located at a position, close to the extending structure, of the plate body and used for identifying a cutting position at a joint of the extending structure and the plate body, so that the extending structure is cut when the flexible circuit board is bent to the back of the display panel.

Optionally, the total thickness of the epitaxial structure is less than the total thickness of the plate body.

In a second aspect, an embodiment of the present application further provides a display module, which includes: a display panel and the flexible circuit board of the first aspect; the binding structure is bound with the bonding area of the display panel; the flexible circuit board is located on the back of the display panel.

In a third aspect, an embodiment of the present application further provides a display device, which is characterized by including the display module according to the second aspect.

The beneficial technical effects brought by the technical scheme provided by the embodiment of the application at least comprise:

the flexible circuit board that this application embodiment provided, the regional width of device in through reasonable control first region and the ratio of the width in first region, the width that has increased the device region on whole plate body in other words accounts for than, for current flexible circuit board's structure, under the unchangeable circumstances of the regional width of device, has reduced the width size of whole plate body in other words to can practice thrift the installation space of complete machine.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another flexible circuit board provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of another flexible circuit board provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a flexible circuit board provided in the embodiment of the present application after an epitaxial structure is removed.

Wherein:

100-a plate body; 110 — a first region; 1101-a device region; 120-a second region; 130-cutting

Positioning the identification structure;

200-a binding structure;

300-epitaxial structure; 310-hollow structure; 320-a connection point;

400-an adsorption part;

500-a test port;

600-a connecting structure; 610-connector.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

First, the explanation of the related terms related to the present application is introduced:

PAD bonding: after a Flexible Printed Circuit (FPC) and a display panel are bound (Bonding), in order to obviously shorten the frame width of the display panel, a narrow frame technology that the FPC and the display panel are bent together is adopted;

ART test point: after the flexible circuit board is bound with the display panel, testing points on the FPC are designed for testing open and short circuits and are used for detecting the binding effect;

connection point: a design material feeding point when a connecting plate on the flexible circuit board is fed is convenient for tearing after a Surface Mounting Technology (SMT) process and fixing before the SMT.

The inventor finds that after the flexible circuit board in the prior ART is wired according to the minimum area (the width is about 12 mm), the vacuum adsorption area is required during mechanical bending, and the position of the ART test point for binding the performance test can enlarge the use space of the flexible circuit board according to the normal design. The adsorption space is different according to the requirements of different mechanical equipment, and the required area is larger. When the space on the flexible circuit board is not enough to realize PAD bonding, the conventional process has a scheme of adding a transfer film, but the addition of the transfer film generally needs a flat area about 200 square millimeters, so that the manufacturing process and the material cost are increased.

Based on this, this application embodiment provides a flexible circuit board, display module assembly and display device, aims at solving the above-mentioned shortcoming of prior art.

The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.

As shown in fig. 1 to 3, an embodiment of the present application provides a flexible circuit board, including: a plate body 100, a binding structure 200, and a connecting structure 600.

Specifically, the binding structure 200 is located at one side of the plate body 100 for binding with the bonding region of the display panel. The binding structure 200 generally includes gold fingers, and the extending direction of the gold fingers is the horizontal direction in fig. 1, that is, the extending direction of the binding structure 200 in this embodiment may be regarded as the horizontal direction in fig. 1.

It should be noted that the display panel in the embodiment of the present application may be a flexible display panel, and may also be a rigid display panel. For the flexible display panel, after the binding structure 200 is bound with the flexible display panel, the edge of the flexible display panel is bent, and the whole flexible circuit board is driven to be bent to the back of the flexible display panel; for a rigid display panel, after the binding structure 200 is bound to the rigid display panel, a region of the binding structure 200 connected to the panel body 100 is partially bent. Whether the display panel is a rigid display panel or a flexible display panel, the flexible circuit board can be seen as being bent to the back of the display panel in a bent state after being bound.

Referring to fig. 1 to 3, the connection structure is located on a side of the board body 100 away from the binding structure 200, the connection structure 600 is connected to the board body 100 (including substrate connection and circuit connection), and the connection structure 600 is used to electrically connect the board body 100 to an external motherboard.

Optionally, a connector 610 is disposed at an end of the connecting structure 600 away from the board body 100, and the connector 610 may be conveniently connected to an interface on an external motherboard in a matching manner.

Further, the board body 100 is a core area of the flexible circuit board, and circuit components (not shown) are disposed on the board body 100 and are used for forming a circuit for controlling display of the display panel (not shown).

For convenience of description, in the present embodiment, the regions of the board body 100 located at both sides of the connecting structure are divided into the first region 110, and the region of the board body 100 corresponding to the connecting structure is the second region 120. The device region 1101 is disposed in the first region 110, the device region 1101 is used for arranging circuit devices, a specific arrangement manner of the device region 1101 is similar to that in the prior art, and the arrangement of the region does not relate to an improvement point of the present application, and therefore is not described herein again.

As shown in fig. 1 to 3, the ratio of the width a of the device region 1101 in the direction perpendicular to the extending direction of the binding structure 200 (the horizontal direction in fig. 1) to the width b of the first region 110 in the direction perpendicular to the extending direction of the binding structure 200 (which corresponds to the width of the plate body 100 in the vertical direction in fig. 1) is 2/3-1. Here, since the corresponding wiring and cutting regions need to be reserved on the board body 100, the ratio range of the width a of the device region 1101 to the width b of the first region 110 does not include the end points 2/3 and 1.

Optionally, the ratio of the width a of the device region in the direction perpendicular to the extending direction of the binding structure 200 to the width b of the first region 110 (corresponding to the board body 100) in the direction perpendicular to the extending direction of the binding structure 200 is 4/5-1. Wherein the ratio of the width a of the device region 1101 to the width b of the first region 110 does not include the endpoints 4/5 and 1.

In addition, according to the design requirement of the board body 100, the second region 120 may also be provided with a corresponding device region, and details of the device region in the second region 120 are not described in detail in this embodiment.

In this embodiment, by reasonably controlling the ratio of the width of the device region in the first region 110 to the width of the first region 110, the ratio of the width of the device region on the entire board body 100 is increased, and compared with the structure of the existing flexible circuit board, the width of the device region is not changed, and the width of the entire board body 100 is reduced, so that the installation space of the entire machine can be saved.

In a specific embodiment, as shown in fig. 1 to 3, a flexible circuit board provided in an embodiment of the present application includes: a plate body 100, a binding structure 200, and an epitaxial structure 300.

Specifically, the epitaxial structure 300 is located at the other side of the board body 100 (i.e., the side of the board body 100 away from the binding structure 200), and the epitaxial structure 300 is cut and removed along the edge of the board body 100 after the flexible circuit board is bent, which is beneficial to maintaining the aesthetic property of the flexible circuit board structure. The number of the epitaxial structures 300 illustrated in fig. 1 is two, and the two epitaxial structures 300 are respectively connected to the first regions 110 on the corresponding sides of the board body 100.

As shown in fig. 1, in order to reduce the effective design size of the board body 100 (mainly including the width of the board body 100 along the vertical direction in fig. 1), the epitaxial structure 300 in this embodiment includes an absorption portion 400 (the absorption portion 400 is transferred from the first region 110 of the board body 100 to the epitaxial structure 300), and the absorption portion 400 is a specially reserved point on the epitaxial structure 300, and is mainly used for being absorbed by an external device, so as to facilitate bending of the flexible circuit board. In this embodiment, by optimally designing the flexible circuit board structure, the epitaxial structure 300 that does not affect the circuit structure can be removed after the flexible circuit board is bent. The suction unit 400 may be a vacuum suction unit or an electric suction unit, and may be provided according to the type of an external device.

It should be noted that the bonding region of the display panel is located at the edge of the display panel, the bonding region is a connection region between the display panel and an external circuit, and both the leads of the switch circuit and the leads of the light-emitting circuit can be concentrated in the bonding region during the manufacturing process of the display panel, so as to be electrically connected with the circuit component or the external circuit. In addition, "cutting" in the embodiments of the present application includes machine cutting as well as manual cutting, which may not be particularly limited by the embodiments of the present application.

The flexible circuit board that this embodiment provided, with adsorption part 400 setting on the epitaxial structure 300 that links to each other with plate body 100, can reduce plate body 100's effective design size like this, flexible circuit board is adsorbed and produce after buckling by external equipment simultaneously, can get rid of epitaxial structure 300 including this adsorption part 400 through modes such as cutting, because the plate body 100 size that is remain in the flexible circuit board reduces, thereby be favorable to promoting the installation space of spare parts such as the battery of the back of the display panel of buckling.

In some embodiments, as shown in fig. 2, in order to further reduce the effective design size of the board body 100, the epitaxial structure 300 in the present embodiment further includes a test port 500, i.e., the test port 500(ART test point) is moved from the board body 100 to the epitaxial structure 300.

Specifically, the test port 500 is electrically connected to the circuit component on the board body 100 and the binding structure 200, and the test port 500 is mainly used for detecting an electrical connection state after the binding structure 200 is bound to the display panel. The electric connection state comprises an open circuit and a short circuit, and whether the flexible circuit board and the flexible panel can normally work after being bound can be known through state testing of the open circuit and the short circuit.

It is understood that the test ports 500 can be regarded as exposed metal PADs (PADs) that are connected to the circuit structure of the board body 100 by metal traces (typically copper traces). A portion of the metal trace is located on the epitaxial structure 300 and is cut and removed along with the epitaxial structure 300.

In this embodiment, through all setting up test port 500 and absorption portion 400 at epitaxial structure 300, make the effective design size of plate body 100 further reduce, flexible circuit board is absorbed and produced after buckling by external equipment simultaneously, can get rid of epitaxial structure 300 including this absorption portion 400 and test port 500 through modes such as cutting, because the plate body 100 size that is kept in the flexible circuit board further reduces, thereby the installation space of spare parts such as the battery at the display panel back has further been promoted, can the battery of larger capacity of easy to assemble like this, increase display device's time of endurance.

It should be noted that in some embodiments, the flexible circuit board may also include a structural design that only moves the test port 500 onto the epitaxial structure 300 while leaving the suction portion 400 on the board body 100.

In some embodiments, as shown in fig. 3, the hollow structure 310 is disposed in the epitaxial structure 300, and the hollow structure 310 is located at a side of the epitaxial structure 300 close to the board body 100, that is, the hollow structure 310 is located at a connection position of the epitaxial structure 300 and the board body 100.

Optionally, the side of the hollowed-out structure 310 close to the board body 100 coincides with the side of the board body 100 close to the epitaxial structure 300, so that the epitaxial structure 300 can be conveniently cut along the edge of the board body 100, and the edge of the board body 100 after cutting is neat and beautiful, and does not occupy the space on the back of the display panel.

Along the extending direction of the board 100 close to the side of the epitaxial structure 300, two sides of the hollow structure 310 are connection points 320, and the absorption portion 400 and/or the test port 500 are located on one side of the hollow portion away from the board 100. Wherein the connection point 320 is also part of the epitaxial structure 300.

Alternatively, for the case that the test port 500 is located on the epitaxial structure 300, the metal traces of the test port 500 connected to the board body 100 may be disposed at the connection points 320 on both sides of the hollow structures 310, and the number of the hollow structures 310 is determined according to the number of the test ports 500 (the number of the metal traces).

It can be understood that, on the premise of ensuring that the metal routing is not affected, the number of the hollow structures 310 is as large as possible, and the size of a single hollow structure 310 should not be too large, so as to avoid affecting the connection strength between the epitaxial structure 300 and the board body 100, and avoid the problem that the epitaxial structure 300 is torn by external equipment when being bent.

Optionally, the ratio of the total width of each hollow structure 310 in the horizontal direction in fig. 3 to the width of the corresponding epitaxial structure in the horizontal direction in fig. 3 is between 1/3 and 2/3, excluding the endpoints 1/3 and 2/3.

In the present embodiment, the hollowed-out structure 310 is disposed at the connection position between the epitaxial structure 300 and the board body 100, so as to reduce the actual width of the connection point 320 between the epitaxial structure 300 and the board body 100, so that the epitaxial structure 300 can be cut more easily, the cutting efficiency can be improved, and the manual cutting is more convenient.

Optionally, the number of the hollow-out structures 310 can be adjusted according to the width of the epitaxial structure 300 and the number of the test ports 500. As shown in fig. 3, a plurality of hollow structures 310 are provided in the present embodiment (in fig. 3, each of the epitaxial structures 300 includes two hollow structures 310), and the plurality of hollow structures 310 are disposed at intervals along an extending direction of the board body 100 close to the side of the epitaxial structure 300 (i.e., a length extending direction of the board body 100).

The longitudinal extending direction of the plate body 100 is the horizontal direction in fig. 1 to 3. In addition, the length extending direction of the plate body 100 may also be regarded as a direction parallel to the extending arrangement direction of the binding structure 200.

Optionally, the spacing distances of the hollow structures 310 may be completely the same or partially the same, which is not specifically limited in this embodiment.

In this embodiment, on the premise that the metal trace of the test port 500 is not affected, the actual width of the connection point 320 between the epitaxial structure 300 and the board body 100 can be further reduced by providing the plurality of hollow structures 310, so as to facilitate the cutting of the epitaxial structure 300.

Optionally, the projection of the hollow structure 310 in the plane of the board body 100 is trapezoidal or rectangular. Of course, the projection of the hollow structure 310 on the plane of the board body 100 does not require a trapezoid or a rectangle in a strict sense, and a trapezoid or a rectangle with a chamfer and/or a curved edge may be used. In addition, the trapezoid in the present embodiment may be a regular trapezoid or an inverted trapezoid, and both of them can achieve the effect of facilitating cutting in the present embodiment.

Alternatively, for the trapezoidal hollow structure 310, the side length of the side close to the board body 100 is larger than the side far from the board body 100 (i.e. the regular trapezoidal structure), which is equivalent to that the total width of each connection point 320 in the epitaxial structure 300 close to the board body is smaller, so that the epitaxial structure 300 is easier to be broken when being cut.

In some embodiments, with continued reference to fig. 3, the board body 100 is further provided with a cutting positioning mark structure 130 in addition to the circuit components, the cutting positioning mark structure 130 is located at a position of the board body 100 close to the epitaxial structure 300, and the cutting positioning mark structure 130 is used for identifying a cutting position at a connection position of the corresponding epitaxial structure 300 and the board body 100, so as to facilitate quick positioning alignment of the laser cutting device, so that the epitaxial structure 300 is cut by the laser cutting device when the flexible circuit board is bent to the back of the display panel. According to the preset offset between the cutting positioning identification structure 130 and the cutting position, the actual cutting position can be determined.

Optionally, the cutting positioning identification structure 130 includes a circular identification combined with a cross identification inside the circular identification, and both the circular identification and the cross identification can be achieved by etching a conductive layer (generally, a copper foil) in a substrate.

Optionally, the total thickness of the epitaxial structure 300 is smaller than the total thickness of the plate body 100. Illustratively, the circuit of the epitaxial structure 300 is simple, only the test port 500 is connected, and the circuit can be manufactured by a single-layer flexible circuit board material (generally including front and back copper foils), so that the cutting is convenient; the board body 100 has a complex structure and can be made of multiple layers of flexible circuit board materials (e.g., three layers of flexible circuit board materials), so that the board body 100 has a high structural strength and is convenient for soldering corresponding circuit components.

Alternatively, in fig. 3, the connection structure 600 is located at a middle position in the length extending direction of the plate body 100. The number of the epitaxial structures 300 is even, and the even number of the epitaxial structures 300 are symmetrically arranged on two sides of the connection structure 600, so that the layout of the whole flexible circuit board is more reasonable.

Illustratively, the number of the epitaxial structures 300 is two, two epitaxial structures 300 are symmetrically disposed on two sides of the connection structure 600, and one cutting positioning identification structure 120 is disposed on the board body 100 corresponding to each epitaxial structure 300. During the cutting, the two epitaxial structures 300 may be cut at one time, or may be cut twice, which is not specifically limited in this embodiment.

Fig. 4 illustrates a structural diagram of the flexible circuit board in an unfolded state after the epitaxial structure 300 is cut and removed, in which the width (in the vertical direction in fig. 4) of the board body 100 of the flexible circuit board may be about 6 mm, which is reduced by about 6 mm compared with the existing flexible circuit board, so as to reserve a larger design space for the back of the product.

Correspondingly, with reference to fig. 3, each epitaxial structure 300 is provided with a vacuum absorption portion 400 and a test port 500, so that an external device can perform a bending operation by simultaneously absorbing the vacuum absorption portions 400 on the two epitaxial structures 300, and the stress of the flexible circuit board is more uniform. In addition, for the electrical connection performance test after bonding, the test ports 500 on the two epitaxial structures 300 can be tested simultaneously through a probe or a test head. It is understood that for a flexible circuit board having only one epitaxial structure 300, all vacuum chuck sections 400 and test ports 500 may be concentrated on the same epitaxial structure 300.

In this embodiment, the two epitaxial structures 300 are symmetrically disposed on two sides of the connection structure 600, so that the external device is stressed uniformly when absorbing the vacuum absorption portion 400, thereby facilitating the bending of the flexible circuit board.

Based on the same inventive concept, the embodiment of the present application further provides a display module (not shown in the drawings), including: display panel and the flexible circuit board that has just been described in this application embodiment.

Specifically, the binding structure of the flexible circuit board is bound with the bonding region of the display panel, so that the flexible circuit board is electrically connected with the display panel. After the display panel and the flexible circuit board are bound, the flexible circuit board is bent to the back of the display panel.

It should be noted that the epitaxial structure of the flexible circuit board is cut and removed after the bending of the binding structure or during the secondary assembly, and is not present in the final display module.

Alternatively, the display panel may be a flexible OLED (organic electroluminescent diode) display panel or a rigid OLED display panel.

The display module that this embodiment provided, included aforementioned flexible circuit board, this flexible circuit board is through the regional width of reasonable control device and the ratio of the width in first region, has increased the regional width on whole plate body of device in other words and has taken up the ratio, for current flexible circuit board's structure, under the unchangeable condition of the regional width size of device, has reduced the width size of whole plate body in other words to can practice thrift the installation space of complete machine.

Based on the same inventive concept, the embodiment of the application further provides a display device, which comprises the display module. The display device can be a folding mobile phone or a folding tablet computer and other double-screen electronic equipment.

The embodiments of the application have at least the following technical effects:

1. this flexible circuit board is through the regional width of reasonable control device and the width ratio in first region, has increased the regional width on whole plate body of device in other words and has accounted for the ratio, for current flexible circuit board's structure, under the unchangeable condition of the width size in the device region, has reduced the width size of whole plate body in other words to can practice thrift the installation space of complete machine.

2. The adsorption part is arranged on the epitaxial structure connected with the plate body, so that the effective design size of the plate body can be reduced, meanwhile, after the flexible circuit board is adsorbed by external equipment and bent, the epitaxial structure comprising the adsorption part can be removed in modes such as cutting, and the size of the plate body reserved in the flexible circuit board is reduced, so that the installation space of parts such as a battery on the back of the display panel after bending is favorably promoted.

3. Through also setting up the test port on epitaxial structure for the effective design size of plate body further reduces, flexible circuit board is adsorbed and produce after buckling by external equipment simultaneously, can get rid of the epitaxial structure including this absorption portion and test port through modes such as cutting, because the plate body size that is kept in the flexible circuit board further reduces, thereby the installation space of spare parts such as the battery at the display panel back has further been promoted, can the battery of larger capacity of easy to assemble like this, increase display device's duration.

4. Through set up hollow out construction in the junction of epitaxial structure and plate body, can reduce the actual width size of tie point between epitaxial structure and the plate body for cutting epitaxial structure is cut off more easily, thereby promotes cutting efficiency, and is more convenient to manual cutting.

5. Under the not influenced prerequisite of metal wiring of guaranteeing the test port, can further reduce the actual width size of epitaxial structure and plate body tie point through setting up a plurality of hollow out construction to more be favorable to epitaxial structure's cutting.

6. The projection of hollow out construction in the plate body place plane is trapezoidal, and in trapezoidal hollow out construction, is close to the length of side of plate body one side and is greater than the length of side of keeping away from plate body one side, and the width of epitaxial structure and plate body junction narrows down like this for epitaxial structure breaks off more easily when the cutting.

7. Two epitaxial structure symmetrical arrangement are in connection structure's both sides for the atress is even when external equipment adsorbs the portion of adsorbing, thereby is favorable to buckling of flexible circuit board.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A flexible circuit board, comprising:

a plate body;

the binding structure is positioned on one side of the plate body and is used for binding with the bonding area of the display panel;

the connecting structure is positioned on one side of the plate body, which is far away from the binding structure, and is used for electrically connecting the plate body with an external mainboard;

the board body comprises first areas, the first areas are located on two sides of the connecting structure, device areas used for arranging circuit components are arranged in the first areas, and the ratio of the width of the device areas in the direction perpendicular to the extending direction of the binding structure to the width of the first areas in the direction perpendicular to the extending direction of the binding structure is 2/3-1;

the epitaxial structure is connected with the plate body and is positioned on one side, far away from the binding structure, of the plate body;

the epitaxial structure comprises an adsorption part and a test port, wherein the adsorption part is used for being adsorbed by external equipment; the test port is electrically connected with the circuit component and the binding structure and is used for detecting the electric connection state of the binding structure and the display panel after binding.

2. The flexible circuit board of claim 1, wherein the ratio of the width of the device region in the direction perpendicular to the extension direction of the bonding structure to the width of the first region in the direction perpendicular to the extension direction of the bonding structure is 4/5-1.

3. The flexible circuit board according to claim 1, wherein a hollow structure is disposed in the epitaxial structure, and the hollow structure is located at a connection position of the epitaxial structure and the board body;

and connecting points are arranged on two sides of the hollow structure along the extending direction of the side edge of the plate body close to the epitaxial structure.

4. The flexible circuit board of claim 3, wherein the plurality of hollow structures are arranged at intervals along an extending direction of the side of the board body close to the extending structure.

5. The flexible circuit board of claim 3, wherein the projection of the hollowed-out structure in the plane of the board body is trapezoidal.

6. The flexible circuit board of claim 1, wherein the board body is further provided with a cutting positioning mark structure; the cutting positioning identification structure is located at a position, close to the extending structure, of the plate body and used for identifying a cutting position at a joint of the extending structure and the plate body, so that the extending structure is cut when the flexible circuit board is bent to the back of the display panel.

7. The flexible circuit board of claim 1, wherein the overall thickness of the epitaxial structure is less than the overall thickness of the board body.

8. A display module, comprising: a display panel and the flexible circuit board according to any one of claims 1 to 7;

the binding structure is bound with the bonding area of the display panel; the flexible circuit board is located on the back of the display panel.

9. A display device comprising the display module according to claim 8.