CN113130467B - COB display panel with automatically adjusted contrast - Google Patents
COB display panel with automatically adjusted contrast Download PDFInfo
- Publication number
- CN113130467B CN113130467B CN202110387884.0A CN202110387884A CN113130467B CN 113130467 B CN113130467 B CN 113130467B CN 202110387884 A CN202110387884 A CN 202110387884A CN 113130467 B CN113130467 B CN 113130467B
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- Prior art keywords
- circuit board
- heat dissipation
- display panel
- dissipation plate
- groove
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a COB display panel with an automatic contrast adjusting function, which comprises a circuit board and a plurality of semicircular grooves, wherein the bottom of the circuit board is formed in each semicircular groove and penetrates through the circuit board, the plurality of semicircular grooves are uniformly distributed at the bottom of the circuit board, a heat radiating mechanism for radiating the circuit board is arranged in each semicircular groove, a plurality of circular grooves are formed in the top of the circuit board, reflectors are arranged in each circular groove, LED chips are horizontally arranged at the bottoms of the reflectors, and strip-shaped grooves are formed in the top of the circuit board and are uniformly arranged at the top of the circuit board. The invention avoids the condition that the prior display panel only depends on natural heat dissipation to dissipate heat of the circuit board, thereby improving the heat dissipation efficiency and the heat dissipation effect of the display panel.
Description
Technical Field
The invention relates to the technical field of COB (chip on board), in particular to a COB display panel with automatically adjusted contrast.
Background
COB technique is an emerging LED packaging technique, and is different with traditional SMD surface mounting formula encapsulation, and it is integrated in the PCB board with luminescent chip, and non-one welds in PCB, and COB has effectively promoted the luminous photochromic of LED display screen, risk reduction, reduce cost to present COB display panel all has contrast automatically regulated's function.
Present contrast automatically regulated's COB display panel, the radiating effect is not good, leads to in-service use in-process, has reduced COB display panel's performance.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a COB display panel with an automatically adjusted contrast ratio.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a COB display panel of contrast automatically regulated, includes circuit board and half slot, the half slot has seted up the circuit board bottom and runs through the circuit board, and the half slot has a plurality ofly and evenly distributed in the circuit board bottom, and is a plurality of the inside heat dissipation mechanism that is used for the circuit board heat dissipation that all is equipped with of half slot, and the circuit board top has seted up a plurality of circular recesses, and is a plurality of the inside reflector panel of all installing of circular recess, and the equal horizontal installation in a plurality of reflector panels bottom has the LED chip, the bar recess has been seted up at the circuit board top and has a plurality ofly evenly to set up in the circuit board top.
Preferably, the heat dissipation mechanism comprises a heat dissipation plate, the heat dissipation plate is horizontally arranged inside the semicircular groove, and a reinforcing mechanism for reinforcing the heat dissipation of the circuit board is arranged on the side surface of the heat dissipation plate.
Preferably, the shape and the size of the reflector are matched with those of the circular groove, and the interior of the reflector is provided with packaging glue.
Preferably, the bottom of the circuit board is provided with a driving device, the number of the driving device is equal to that of the LED chips, and the driving devices are electrically connected with the LED chips respectively.
Preferably, the reinforcing mechanism comprises a rectangular groove, the rectangular groove is provided with a side face of the heat dissipation plate and penetrates through the heat dissipation plate, and the rectangular groove is provided with a plurality of grooves which are uniformly distributed on the side face of the heat dissipation plate.
Preferably, the reinforcing mechanism includes the triangular groove, and the triangular groove has seted up the heating panel side and runs through the heating panel, the triangular groove has a plurality ofly and evenly distributed in the heating panel side.
The invention has the beneficial effects that:
1. in addition, through the arrangement of the rectangular groove, the contact area of the heat dissipation plate and air is increased, the heat dissipation efficiency of the heat dissipation plate on the circuit board is increased, the circuit board is further effectively dissipated, the phenomenon that the conventional display panel only depends on natural heat dissipation to dissipate the heat of the circuit board is avoided, and the heat dissipation efficiency and the heat dissipation effect of the display panel are further improved.
2. In the invention, through the arrangement of the reflector, the light generated by the LED chip can irradiate on the reflector and be reflected out, thereby increasing the brightness of the display panel, and in addition, through the arrangement of the strip-shaped groove, the contact area between the circuit board and the outside is increased, the heat dissipation effect on the circuit board is further improved, and the LED display panel has good stability, strong protection performance and low manufacturing cost.
3. In addition, through the arrangement of the triangular groove, the contact area of the heat dissipation plate and air is increased, the heat dissipation efficiency of the heat dissipation plate on the circuit board is increased, the circuit board is further effectively dissipated, the phenomenon that the conventional display panel only depends on natural heat dissipation to dissipate the heat of the circuit board is avoided, and the heat dissipation efficiency and the heat dissipation effect of the display panel are further improved.
Drawings
Fig. 1 is a schematic structural view of a contrast self-adjusting COB display panel according to embodiment 1 of the present invention;
fig. 2 is a partial sectional view of a circuit board of a contrast auto-adjusting COB display panel according to embodiment 1 of the present invention;
fig. 3 is a cross-sectional view of a contrast-automatically-adjusting COB display panel according to embodiment 2 of the present invention.
In the figure: the LED light source comprises a circuit board 1, a reflector 2, an LED chip 3, a semicircular groove 4, a strip-shaped groove 5, a heat dissipation plate 6, a rectangular groove 7, a driving device 8, a circular groove 9, packaging glue 10 and a triangular groove 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
Referring to fig. 1-2, a COB display panel of contrast automatically regulated, including circuit board 1 and half slot 4, half slot 4 has seted up circuit board 1 bottom and runs through circuit board 1, and half slot 4 has a plurality ofly and evenly distributed in circuit board 1 bottom, the inside heat dissipation mechanism that is used for 1 radiating to circuit board that all is equipped with of a plurality of half slots 4, and circuit board 1 top has seted up a plurality of circular recesses 9, reflector panel 2 is all installed to the inside reflector panel 2 that all installs of a plurality of circular recesses 9, and the equal horizontal installation in bottom has LED chip 3 in a plurality of reflector panels 2, bar recess 5 has been seted up and has a plurality ofly evenly set up in circuit board 1 top at circuit board 1 top.
In this embodiment, the heat dissipation mechanism includes the heat dissipation plate 6, and the heat dissipation plate 6 is horizontally installed inside the semicircular groove 4, and the side of the heat dissipation plate 6 is provided with a reinforcing mechanism for reinforcing the heat dissipation of the circuit board.
In this embodiment, the shape and size of the reflector 2 and the circular groove 9 are matched, and the interior of the reflector 2 is provided with the packaging adhesive 10.
In this embodiment, the driving device 8 is installed at the bottom of the circuit board 1, the number of the driving devices 8 is the same as that of the LED chips 3, and the plurality of driving devices 8 are electrically connected to the plurality of LED chips 3, respectively.
In this embodiment, the reinforcing mechanism includes rectangular channel 7, and rectangular channel 7 has seted up the heating panel 6 side and has run through heating panel 6, and rectangular channel 7 has a plurality ofly and evenly distributed in the heating panel 6 side.
The working principle of the embodiment is as follows: in the time of in-service use, through the setting of heating panel 6, can give off the heat on the circuit board 1 to the external world entirely, thereby can carry out preliminary heat dissipation to circuit board 1, in addition through the setting of rectangular channel 7, the area of contact of heating panel 6 and air has been increased, then the radiating efficiency of heating panel 6 to circuit board 1 has been increased, further carry out effectual heat dissipation to circuit board 1, avoided present display panel to only rely on the radiating condition of natural heat dissipation to circuit board 1 to take place alone, and then improved this display panel's radiating efficiency and radiating effect, setting through reflector panel 2, the light that LED chip 3 produced can shine and is being reflected away on reflector panel 2, thereby display panel's luminance has been increased, in addition through bar-shaped groove 5's setting, circuit board 1 and external area of contact has been increased, further improvement the radiating effect to circuit board 1, and good stability, strong protective properties, low in manufacturing cost.
Example 2
Referring to fig. 1 and 3, a COB display panel of contrast automatically regulated, including circuit board 1 and half slot 4, half slot 4 has seted up 1 bottom of circuit board and has run through circuit board 1, and half slot 4 has a plurality ofly and evenly distributed in 1 bottom of circuit board, a plurality of 4 inside all are equipped with and are used for the radiating heat dissipation mechanism of circuit board 1 of half slot, and 1 top of circuit board has seted up a plurality of circular recess 9, the inside reflector panel 2 that all installs of a plurality of circular recess 9, and the equal horizontal installation in bottom has LED chip 3 in a plurality of reflector panels 2, bar recess 5 has been seted up at 1 top of circuit board and has a plurality ofly evenly set up in 1 top of circuit board.
In this embodiment, the heat dissipation mechanism includes a heat dissipation plate 6, the heat dissipation plate 6 is horizontally installed inside the semicircular slot 4, and a reinforcing mechanism for reinforcing heat dissipation of the circuit board is disposed on a side surface of the heat dissipation plate 6.
In this embodiment, the shape and size of the reflector 2 and the circular groove 9 are matched, and the interior of the reflector 2 is provided with the packaging adhesive 10.
In this embodiment, the driving device 8 is installed at the bottom of the circuit board 1, the number of the driving devices 8 is the same as that of the LED chips 3, and the plurality of driving devices 8 are electrically connected to the plurality of LED chips 3, respectively.
In this embodiment, strengthening mechanism includes triangular groove 11, and triangular groove 11 has seted up the heating panel 6 side and runs through heating panel 6, and triangular groove 11 has a plurality ofly and evenly distributed in heating panel 6 side.
The working principle of the embodiment is as follows: when in actual use, through the setting of heating panel 6, can give off the heat on the circuit board 1 to the external world entirely, thereby can tentatively dispel the heat to circuit board 1, in addition through the setting of triangular groove 11, the area of contact of heating panel 6 and air has been increased, then the radiating efficiency of heating panel 6 to circuit board 1 has been increased, further carry out effectual heat dissipation to circuit board 1, avoided present display panel to only rely on the radiating condition of nature heat dissipation to take place to circuit board 1 alone, and then improved this display panel's radiating efficiency and radiating effect.
Having shown and described the basic principles and essential features of the invention and its advantages, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof, and it is therefore intended that the embodiments be considered as illustrative and not restrictive in all respects, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, any reference signs in the claims being therefore intended to be embraced therein.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (5)
1. The utility model provides a contrast automatically regulated's COB display panel, includes circuit board (1) and half slot (4), its characterized in that, circuit board (1) bottom has been seted up and circuit board (1) has been run through in half slot (4), and half slot (4) have a plurality ofly and evenly distributed in circuit board (1) bottom, and are a plurality of half slot (4) inside all is equipped with and is used for radiating heat dissipation mechanism to circuit board (1), and circuit board (1) top has seted up a plurality of circular recess (9), and is a plurality of circular recess (9) inside all installs reflector panel (2), and the equal horizontal installation in bottom has LED chip (3) in a plurality of reflector panel (2), bar recess (5) have been seted up at circuit board (1) top and have a plurality ofly evenly to set up in circuit board (1) top, reflector panel (2) and circular recess (9) shape size looks adaptation, and reflector panel (2) inside is provided with packaging glue (10).
2. The COB display panel with the automatically adjusted contrast ratio according to claim 1, wherein the heat dissipation mechanism comprises a heat dissipation plate (6), the heat dissipation plate (6) is horizontally installed inside the semicircular groove (4), and a reinforcing mechanism for reinforcing heat dissipation of the circuit board is arranged on the side surface of the heat dissipation plate (6).
3. The COB display panel with automatically adjusted contrast according to claim 2, wherein the circuit board (1) is provided with a plurality of driving devices (8) at the bottom, the number of the driving devices (8) is the same as that of the LED chips (3), and the plurality of driving devices (8) are electrically connected with the plurality of LED chips (3) respectively.
4. The COB display panel with the automatically adjusted contrast according to claim 3, wherein the reinforcing mechanism comprises a rectangular groove (7), the rectangular groove (7) is provided with the side face of the heat dissipation plate (6) and penetrates through the heat dissipation plate (6), and the rectangular grooves (7) are distributed on the side face of the heat dissipation plate (6) in a plurality and uniformly.
5. A COB display panel with automatically adjusted contrast according to claim 3, characterized in that the reinforcing mechanism comprises a triangular groove (11), and the triangular groove (11) is provided with a heat dissipation plate (6) side and penetrates through the heat dissipation plate (6), and the triangular groove (11) is provided with a plurality of grooves uniformly distributed on the heat dissipation plate (6) side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110387884.0A CN113130467B (en) | 2021-04-12 | 2021-04-12 | COB display panel with automatically adjusted contrast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110387884.0A CN113130467B (en) | 2021-04-12 | 2021-04-12 | COB display panel with automatically adjusted contrast |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113130467A CN113130467A (en) | 2021-07-16 |
| CN113130467B true CN113130467B (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110387884.0A Active CN113130467B (en) | 2021-04-12 | 2021-04-12 | COB display panel with automatically adjusted contrast |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465099A (en) * | 2001-07-09 | 2003-12-31 | 大金工业株式会社 | Power module and air conditioner |
| TW200739763A (en) * | 2006-04-11 | 2007-10-16 | Brilliant Technology Co Ltd | Packaging process of power chips |
| CN205680373U (en) * | 2016-05-30 | 2016-11-09 | 深圳市奥蕾达科技有限公司 | A kind of novel all-colour LED luminescent panel and display screen thereof |
| CN208336278U (en) * | 2018-05-16 | 2019-01-04 | 深圳市新光台显示应用有限公司 | A kind of full-color LED display screen COB encapsulation module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | All-colour LED luminescent panel |
| CN207560621U (en) * | 2017-11-14 | 2018-06-29 | 东莞市启勤精密热导科技有限公司 | A kind of high-power SKIVING cooling fins of charging pile |
-
2021
- 2021-04-12 CN CN202110387884.0A patent/CN113130467B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465099A (en) * | 2001-07-09 | 2003-12-31 | 大金工业株式会社 | Power module and air conditioner |
| TW200739763A (en) * | 2006-04-11 | 2007-10-16 | Brilliant Technology Co Ltd | Packaging process of power chips |
| CN205680373U (en) * | 2016-05-30 | 2016-11-09 | 深圳市奥蕾达科技有限公司 | A kind of novel all-colour LED luminescent panel and display screen thereof |
| CN208336278U (en) * | 2018-05-16 | 2019-01-04 | 深圳市新光台显示应用有限公司 | A kind of full-color LED display screen COB encapsulation module |
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| Publication number | Publication date |
|---|---|
| CN113130467A (en) | 2021-07-16 |
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