CN113101818A - Metal dissolving device and dissolving method thereof - Google Patents
Metal dissolving device and dissolving method thereof Download PDFInfo
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- CN113101818A CN113101818A CN202110371890.7A CN202110371890A CN113101818A CN 113101818 A CN113101818 A CN 113101818A CN 202110371890 A CN202110371890 A CN 202110371890A CN 113101818 A CN113101818 A CN 113101818A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 69
- 239000002184 metal Substances 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002923 metal particle Substances 0.000 claims abstract description 76
- 239000007921 spray Substances 0.000 claims abstract description 76
- 238000005507 spraying Methods 0.000 claims abstract description 75
- 238000005192 partition Methods 0.000 claims abstract description 33
- 238000004090 dissolution Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000004891 communication Methods 0.000 claims abstract description 4
- 230000000712 assembly Effects 0.000 claims abstract description 3
- 238000000429 assembly Methods 0.000 claims abstract description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 56
- 239000007788 liquid Substances 0.000 claims description 39
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 21
- 229910001431 copper ion Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- -1 cerium ions Chemical class 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 229910001456 vanadium ion Inorganic materials 0.000 claims description 8
- 229910052684 Cerium Inorganic materials 0.000 claims description 6
- 229910001437 manganese ion Inorganic materials 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims description 4
- 238000011978 dissolution method Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 5
- 238000009713 electroplating Methods 0.000 description 20
- 238000007747 plating Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F21/00—Dissolving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F21/00—Dissolving
- B01F21/02—Methods
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Abstract
The invention provides a metal dissolving device and a dissolving method thereof, wherein the metal dissolving device comprises a shell, at least two mutually communicated dissolving cavities are formed in the shell through partition plate components along the material flow direction, each partition plate component comprises an upper partition plate and a lower partition plate which are arranged in a staggered mode, and a communication flow passage is formed between the upper partition plate and the lower partition plate; the dissolving cavity is internally provided with spraying assemblies at intervals, and the dissolving cavity is filled with metal particles. According to the invention, the at least two dissolving cavities are separated by the partition board component, and the solution flows in the dissolving cavities and the communicating flow channel in a bending manner, so that the solution is ensured to fully dissolve metal particles; in addition, the spraying assembly sprays the metal particles, the contact between the metal particles and the solution is further improved through spraying, turbulence is increased in the dissolving cavity, the dissolution of the metal particles is enhanced, and the use of the metal particles is reduced, so that the device has the characteristics of simple structure, high dissolving efficiency, low cost and the like.
Description
Technical Field
The invention belongs to the technical field of electroplating, relates to metal dissolution, and particularly relates to a metal dissolution device and a dissolution method thereof.
Background
In the technique of electroplating Printed Circuit Boards (PCBs), the main components of the copper electroplating solution are main salts (ions for providing electrodeposited metals), conductive media (for increasing the conductivity of the solution), anode active agents (for promoting anode dissolution, increasing the current density of the anode), buffering agents (for adjusting and controlling the ph of the solution), and special electroplating additives (for improving the performance of the plating layer and the quality of the plating). As the electroplating proceeds, the ions in the main salt providing the electrodeposited metal are continuously consumed, and the current density and electroplating effect of the electroplating solution are reduced, thereby affecting the electroplating effect. Therefore, the plating solution needs to be replenished with the metal ions to be plated in time.
Copper ion supplement is achieved in various modes, phosphorus copper balls can be filled into a titanium basket to serve as a soluble anode, and copper ions are gradually dissolved out of the phosphorus copper balls serving as the anode along with electroplating. The method is the most traditional method for supplementing copper ions and has wide application, but because the phosphorus-containing copper balls are used, the phosphorus content in the electroplating solution is increased, the pollution of the electroplating solution is easily caused, the electroplating effect is influenced, and the phosphorus is harmful to human bodies and the environment, so that higher requirements are provided for the discharge of the electroplating solution. In addition, can also supply the copper ion through the mode of adding the cupric oxide powder, but the cupric oxide powder is difficult to dissolve, needs to add sulphuric acid and carries out supplementary dissolution, increases waste water and liquid medicine consumption, and is expensive, and when dissolving inadequately simultaneously, the solid particle is attached to the circuit board face and can be influenced the electroplating effect.
CN107059104A discloses an apparatus and a method for supplying plating solution to a plating tank, a plating system, a powder container, and a plating method. The apparatus is used for adding copper oxide powder to a plating solution and supplying the plating solution to a plating tank. The device for supplying a plating solution in which a powder containing at least copper is dissolved to a plating tank includes: a hopper having an inlet connectable to a powder duct of a powder container containing powder; a feeder which is communicated with the lower opening of the hopper; a motor connected to the feeder; and a plating solution tank connected to the outlet of the feeder to dissolve the powder in the plating solution. The copper powder is not fully dissolved, so that solid particles are attached to the surface of a circuit board to influence the electroplating effect.
CN103422147A discloses a device for adjusting the concentration of heavy metal ions in electroplating solution, which is to arrange an adjusting tank in the electroplating bath, use an inert anode plate as an anode in the adjusting tank body, and adjust the current in the electroplating bath and the adjusting tank by a power ballast. The device can improve the electroplating quality, reduce the production cost and control the heavy metal pollution by adjusting the concentration of the copper heavy metal ions. The electroplating speed is adjusted by adjusting the current, and copper ion supplement cannot be performed.
The existing metal dissolving device has the problems of complex structure, insufficient dissolution, low dissolving speed and the like, so that the problems that the metal dissolving efficiency is high, the cost is low and the like can be ensured under the condition that the metal dissolving device is simple in structure, and the problem that the existing metal dissolving device needs to be solved urgently at present is solved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a metal dissolving device and a dissolving method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a metal dissolving device, which comprises a shell, wherein the shell is divided into at least two mutually communicated dissolving cavities by partition board components along the material flow direction, each partition board component comprises an upper partition board and a lower partition board which are arranged in a staggered mode, and a communication flow channel is formed between the upper partition board and the lower partition board; the dissolving cavity is internally provided with spraying assemblies at intervals, and the dissolving cavity is filled with metal particles.
According to the invention, the at least two dissolving cavities are separated by the partition board component, and the solution flows in the dissolving cavities and the communicating flow channel in a bending manner, so that the solution is ensured to fully dissolve metal particles; in addition, the spraying assembly sprays the metal particles, the contact between the metal particles and the solution is further improved through spraying, turbulence is increased in the dissolving cavity, the dissolution of the metal particles is enhanced, and the use of the metal particles is reduced, so that the device has the characteristics of simple structure, high dissolving efficiency, low cost and the like.
As a preferred technical scheme of the invention, the spray assembly comprises a main spray pipe, at least one vertically arranged spray pipe is connected to the main spray pipe, and at least one spray head is arranged on the spray pipe.
Preferably, the spray pipes are arranged in a matrix in the dissolving cavity.
Preferably, the sum of the cross-sectional areas of the showers is 10 to 30% of the area of the bottom of the dissolution chamber, for example, 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28% or 30%, but not limited to the recited values, and other values not recited in this range are also applicable.
According to the invention, the total of the sectional areas of the spray pipes accounts for 10-30% of the area of the bottom of the dissolution cavity, the spray area is ensured by adjusting the proportion of the sectional areas of the spray pipes, and if the proportion of the sectional areas of the spray pipes is lower than 10% of the area of the bottom of the dissolution cavity, the dissolution efficiency is affected due to poor spray effect of the spray pipes; if the proportion of the cross section area of the spray pipe is higher than 30% of the area of the bottom of the dissolving cavity, the filled metal particles are less, so that more spray solution is sprayed, the dissolving rate is too high, and the concentration of metal ions in the solution is too high to exceed the use requirement.
In a preferred embodiment of the present invention, the metal particles have a spherical or cylindrical shape.
In a preferred embodiment of the present invention, the metal dissolving device is further connected to a reservoir in a circulating manner.
The invention ensures the concentration of metal ions by circularly connecting the liquid storage tanks and circularly flowing the solution in the device.
Preferably, the liquid storage tank and the metal dissolving device are circularly connected through a first circulating pipeline and a second circulating pipeline, the bottom of the first circulating pipeline is connected to the inlet of the metal dissolving device, and the outlet of the second circulating pipeline is connected to the top of the liquid storage tank.
Preferably, the inlet of the metal dissolution device is located at the bottom of the housing.
Preferably, the bottom of the dissolving cavity is provided with a grid net.
The invention prevents the metal particles from leaking out by arranging the grid net, and further prevents the metal particles from entering the spray assembly to block the spray head.
As a preferable technical scheme of the invention, the top of the shell is provided with a top cover which is detachably connected.
It should be noted that the detachable connection form of the present invention is not particularly required or limited, and those skilled in the art may reasonably select the detachable connection form according to the operation requirement, for example, the detachable connection form is a bolt connection.
Preferably, a sealing structure is arranged at the joint of the top cover and the shell.
It should be noted that the form of the sealing structure is not specifically required and limited, and those skilled in the art can reasonably select the form of the sealing structure according to the operation requirement, for example, the sealing structure is a sealing ring.
As a preferable technical solution of the present invention, the first circulation pipeline is provided with a circulation pump.
Preferably, the main spray pipe is connected with a spray pump, and the spray pump pumps the solution at the bottom of the grid net.
According to the invention, the circulating pump is used for circularly spraying the solution on the metal particles, so that the using amount of the solution is reduced, the dissolution of the metal particles is improved, and the solution at the bottom of the grid mesh is extracted to prevent the metal particles from entering the spraying pump.
As a preferable technical solution of the present invention, the metal dissolving device further includes a concentration sensor disposed in the reservoir, and the concentration sensor is configured to detect a metal ion concentration of the liquid in the reservoir.
Preferably, the metal dissolving device further comprises a controller, the controller is respectively and independently electrically connected with the concentration sensor, the circulating pump and the spraying pump, and the controller is used for receiving signals sent by the concentration sensor and controlling the flow rate of the circulating pump and the flow rate of the spraying pump in a feedback mode.
In a second aspect, the present invention provides a dissolving method for dissolving a metal using the metal dissolving apparatus according to the first aspect, the dissolving method comprising:
and filling metal particles into the dissolving cavities, spraying the metal particles by the spraying assembly for dissolving, and enabling the solution to flow through the dissolving cavities in sequence.
As a preferred technical solution of the present invention, the dissolution method specifically comprises the following steps:
filling metal particles into a dissolving cavity, introducing a solution in a liquid storage tank into the dissolving cavity by a circulating pump, and introducing a part of the solution into the dissolving cavity through a grid net; the rest part enters the spraying component through the circulating pump and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump and the spraying pump in a feedback mode, so that the flow of the circulating pump and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump and the spraying pump in a feedback mode, the flow of the circulating pump and the flow of the spraying pump are reduced, and the use concentration is guaranteed.
As a preferred embodiment of the present invention, the solution in the reservoir includes oxidized metal ions.
Preferably, the material of the metal particles comprises copper.
Preferably, the oxidation state metal ions comprise one or a combination of at least two of manganese ions, cerium ions, iron ions or vanadium ions.
Preferably, the flow rate of the spray pump is adjusted in the range of 600 to 3000L/h, for example 600L/h, 800L/h, 1000L/h, 1200L/h, 1400L/h, 1600L/h, 1800L/h, 2000L/h, 2200L/h, 2400L/h, 2600L/h, 2800L/h or 3000L/h, but not limited to the values listed, and other values not listed in this range of values are equally suitable.
Preferably, the concentration of the oxidized form metal ion is 1 to 50g/L, for example, 1g/L, 5g/L, 10g/L, 15g/L, 20g/L, 25g/L, 30g/L, 35g/L, 40g/L, 45g/L or 50g/L, but not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the concentration used is the concentration of copper ions, the concentration of copper ions is 10-60 g/L, for example, 10g/L, 15g/L, 20g/L, 25g/L, 30g/L, 35g/L, 40g/L, 45g/L, 50g/L, 55g/L or 60g/L, but not limited to the recited values, and other values not recited in this range of values are equally applicable.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the at least two dissolving cavities are separated by the partition board component, and the solution flows in the dissolving cavities and the communicating flow channel in a bending manner, so that the solution is ensured to fully dissolve metal particles; in addition, the spraying assembly sprays the metal particles, the contact between the metal particles and the solution is further improved through spraying, turbulence is increased in the dissolving cavity, the dissolution of the metal particles is enhanced, and the use of the metal particles is reduced, so that the device has the characteristics of simple structure, high dissolving efficiency, low cost and the like.
Drawings
Fig. 1 is a schematic structural view of a metal dissolution apparatus according to an embodiment of the present invention.
Wherein, 1-shell; 2-a dissolution cavity; 3-a spray assembly; 4-a lower baffle plate; 5-an upper partition plate; 6-a first circulation line; 7-a circulating pump; 8-a liquid storage tank; 9-a second circulation line; 10-grid net.
Detailed Description
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical solution of the present invention is further explained by the following embodiments.
In one embodiment, the invention provides a metal dissolving device, as shown in fig. 1, the metal dissolving device comprises a shell 1, wherein the shell 1 is divided into at least two dissolving cavities 2 which are communicated with each other by a partition board group along the material flow direction, the partition board group comprises upper partition boards 5 and lower partition boards 4 which are arranged in a staggered mode, and a communication flow channel is formed between the upper partition boards 5 and the lower partition boards 4; the dissolving cavity 2 is internally provided with spraying components 3 at intervals, and the dissolving cavity 2 is internally filled with metal particles.
According to the invention, the at least two dissolving cavities 2 are separated by the partition board component, and the solution flows in the dissolving cavities 2 and the communicating flow channel in a bending manner, so that the solution is ensured to fully dissolve metal particles; in addition, the spraying component 3 is used for spraying the metal particles, the contact between the metal particles and the solution is further improved through spraying, turbulence is increased in the dissolving cavity 2, the dissolution of the metal particles is enhanced, and the use of the metal particles is reduced, so that the device has the characteristics of simple structure, high dissolving efficiency, low cost and the like.
Further, the spraying assembly 3 comprises a spraying main pipe, at least one vertically arranged spraying pipe is connected to the spraying main pipe, and at least one spray head is arranged on the spraying pipe. The spray pipes are arranged in a matrix in the dissolving cavity 2. Furthermore, the sum of the sectional areas of the spray pipes accounts for 10-30% of the bottom area of the dissolving cavity 2.
According to the invention, the sum of the sectional areas of the spray pipes accounts for 10-30% of the bottom area of the dissolving cavity 2, the spray area is ensured by adjusting the proportion of the sectional areas of the spray pipes, and if the proportion of the sectional areas of the spray pipes is lower than 10% of the bottom area of the dissolving cavity 2, the dissolving efficiency is influenced due to poor spray effect of the spray pipes; if the proportion of the cross section area of the spray pipe is higher than 30% of the bottom area of the dissolving cavity 2, the filled metal particles are less, the spray solution is more, the dissolving speed is too high, the concentration of metal ions in the solution is too high, and the use requirement is exceeded.
Further, the metal particles are spherical or cylindrical in shape. Furthermore, the metal dissolving device is further connected with a liquid storage tank 8 in a circulating mode, the liquid storage tank 8 and the metal dissolving device are connected through a first circulating pipeline 6 and a second circulating pipeline 9 in a circulating mode, the first circulating pipeline 6 is connected to the inlet of the metal dissolving device from the bottom of the liquid storage tank 8, the second circulating pipeline 9 is connected to the top of the liquid storage tank 8 from the outlet of the metal dissolving device, and the inlet of the metal dissolving device is located at the bottom of the shell 1. The invention ensures the concentration of metal ions by circularly flowing solution in the device through the circularly connected liquid storage tank 8.
Further, the bottom of the dissolution chamber 2 is provided with a grid mesh 10. According to the invention, the grid net 10 is arranged, so that metal particles are prevented from leaking out, and further, the metal particles are prevented from entering the spray component 3 to block the spray head.
Further, the top of the housing 1 is provided with a top cover which can be detachably connected, optionally, the detachable connection is in the form of bolt connection, and a sealing structure is arranged at the joint of the top cover and the housing 1, optionally, the sealing structure is a sealing ring.
Further, a circulation pump 7 is provided on the first circulation line 6. The main spray pipe is connected with a spray pump which extracts the solution at the bottom of the grid net 10. In the invention, the circulating pump 7 is used for circularly spraying the solution on the metal particles, so that the using amount of the solution is reduced, the dissolution of the metal particles is improved, and the solution at the bottom of the grid net 10 is extracted to prevent the metal particles from entering the spraying pump.
Further, the metal dissolving device further comprises a concentration sensor arranged in the liquid storage tank 8, and the concentration sensor is used for detecting the metal ion concentration of the liquid in the liquid storage tank 8. The metal dissolving device further comprises a controller, the controller is respectively and independently electrically connected with the concentration sensor, the circulating pump 7 and the spraying pump, and the controller is used for receiving signals sent by the concentration sensor and controlling the flow of the circulating pump 7 and the flow of the spraying pump in a feedback mode.
In another embodiment, the present invention provides a dissolving method for dissolving a metal by using the above metal dissolving apparatus, wherein the dissolving method specifically includes the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidation state metal ions, the material of the metal particles comprises copper, the oxidation state metal ions comprise one or a combination of at least two of manganese ions, cerium ions, iron ions or vanadium ions, the flow regulating range of the spray pump is 600-3000L/h, the concentration of the oxidation state metal ions is 1-50 g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 10-60 g/L.
Example 1
The embodiment provides a metal dissolving device, based on embodiment 1 the metal dissolving device, wherein, the casing 1 is divided into two mutually-communicated dissolving cavities 2 through the partition board component, the sum of the cross-sectional areas of the spray pipes accounts for 20% of the bottom area of the dissolving cavities 2, and the metal particles are spherical.
The embodiment also provides a dissolving method for dissolving metal by adopting the metal dissolving device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise manganese ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 25g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 35 g/L.
Example 2
The embodiment provides a metal dissolving device, based on embodiment 1 metal dissolving device, wherein, in the casing 1, through the partition plate component for four dissolving chamber 2 that communicate each other, the sum of shower cross-sectional area accounts for 10% of dissolving chamber 2 bottom surface area, the shape of metal granule is the globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the metal dissolving device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise cerium ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 1g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 10 g/L.
Example 3
The embodiment provides a metal dissolving device, based on embodiment 1 metal dissolving device, wherein, the casing 1 is interior to be divided into five dissolving chamber 2 that communicate with each other through the baffle component, and the sum of shower cross-sectional area accounts for 30% of dissolving chamber 2 bottom surface area, and the shape of metal particle is cylindric.
The embodiment also provides a dissolving method for dissolving metal by adopting the metal dissolving device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise vanadium ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 50g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 60 g/L.
Example 4
The embodiment provides a metal dissolving device, based on embodiment 1 metal dissolving device, wherein, the casing 1 is interior to be divided into six dissolving chamber 2 that communicate each other through the baffle component, the sum of shower cross-sectional area accounts for 15% of dissolving chamber 2 bottom surface area, the shape of metal particle is globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the metal dissolving device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the material of the metal particles comprises copper, the oxidized metal ions comprise a combination of iron ions and vanadium ions, the molar ratio of the iron ions to the vanadium ions is 1:1, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 8g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 25 g/L.
Example 5
The embodiment provides a metal dissolving device, based on embodiment 1 the metal dissolving device, wherein, the casing 1 is divided into eight mutually-communicated dissolving cavities 2 through partition board components, the sum of the cross-sectional areas of the spray pipes accounts for 25% of the bottom area of the dissolving cavities 2, and the metal particles are spherical.
The embodiment also provides a dissolving method for dissolving metal by adopting the metal dissolving device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7 and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, the flow rates of the circulating pump 7 and the spraying pump are reduced, and the use concentration is guaranteed.
The solution in the liquid storage tank 8 comprises oxidation state metal ions, the material of the metal particles comprises copper, the oxidation state metal ions comprise a combination of manganese ions, cerium ions and vanadium ions, the molar ratio of the manganese ions to the cerium ions to the vanadium ions is 1:1:1, the flow regulating range of the spray pump is 600-3000L/h, the concentration of the oxidation state metal ions is 35g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 40 g/L.
Through the embodiment, the at least two dissolving cavities 2 are separated by the partition board component, and the solution flows in the dissolving cavities 2 and the communicating flow channel in a bending way, so that the metal particles are fully dissolved by the solution; in addition, the spraying component 3 is used for spraying the metal particles, the contact between the metal particles and the solution is further improved through spraying, turbulence is increased in the dissolving cavity 2, the dissolution of the metal particles is enhanced, and the use of the metal particles is reduced, so that the device has the characteristics of simple structure, high dissolving efficiency, low cost and the like.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. The metal dissolving device is characterized by comprising a shell, wherein the shell is divided into at least two dissolving cavities which are communicated with each other through partition plates along the material flow direction, each partition plate group comprises upper partition plates and lower partition plates which are arranged in a staggered mode, and a communication flow channel is formed between each upper partition plate and each lower partition plate;
the dissolving cavity is internally provided with spraying assemblies at intervals, and the dissolving cavity is filled with metal particles.
2. The metal dissolving device according to claim 1, wherein the spray assembly comprises a main spray pipe, at least one vertically arranged spray pipe is connected to the main spray pipe, and at least one spray head is arranged on the spray pipe;
preferably, the spray pipes are arranged in a matrix in the dissolving cavity;
preferably, the sum of the sectional areas of the spray pipes accounts for 10-30% of the area of the bottom of the dissolving cavity.
3. The metal dissolution apparatus according to claim 1 or 2, wherein the metal particles have a spherical or cylindrical shape.
4. The metal dissolution apparatus according to any one of claims 1 to 3, wherein a reservoir is further connected to the metal dissolution apparatus in a circulating manner;
preferably, the liquid storage tank and the metal dissolving device are circularly connected through a first circulating pipeline and a second circulating pipeline, the bottom of the first circulating pipeline is connected to the inlet of the metal dissolving device, and the outlet of the second circulating pipeline is connected to the top of the liquid storage tank;
preferably, the inlet of the metal dissolution device is located at the bottom of the housing;
preferably, the bottom of the dissolving cavity is provided with a grid net.
5. The metal dissolution apparatus according to any one of claims 1 to 4, wherein a top cover detachably attached is provided on a top of the housing;
preferably, a sealing structure is arranged at the joint of the top cover and the shell.
6. The metal dissolving apparatus as claimed in claim 4 or 5, wherein a circulation pump is provided on the first circulation line;
preferably, the main spray pipe is connected with a spray pump, and the spray pump pumps the solution at the bottom of the grid net.
7. The metal dissolving device according to any one of claims 4 to 6, further comprising a concentration sensor disposed in the reservoir, wherein the concentration sensor is configured to detect a concentration of metal ions in the liquid in the reservoir;
preferably, the metal dissolving device further comprises a controller, the controller is respectively and independently electrically connected with the concentration sensor, the circulating pump and the spraying pump, and the controller is used for receiving signals sent by the concentration sensor and controlling the flow rate of the circulating pump and the flow rate of the spraying pump in a feedback mode.
8. A dissolving method for dissolving a metal using the metal dissolving apparatus as set forth in any one of claims 1 to 7, wherein the dissolving method comprises:
and filling metal particles into the dissolving cavities, spraying the metal particles by the spraying assembly for dissolving, and enabling the solution to flow through the dissolving cavities in sequence.
9. The dissolution method according to claim 8, characterized in that it comprises in particular the following steps:
filling metal particles into a dissolving cavity, introducing a solution in a liquid storage tank into the dissolving cavity by a circulating pump, and introducing a part of the solution into the dissolving cavity through a grid net; the rest part enters the spraying component through the circulating pump and is sprayed out through the spray head to spray and dissolve the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump and the spraying pump in a feedback mode, so that the flow of the circulating pump and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the circulating pump and the spraying pump in a feedback mode, the flow of the circulating pump and the flow of the spraying pump are reduced, and the use concentration is guaranteed.
10. The dissolution method according to claim 9, wherein the reservoir comprises metal ions in an oxidized state in a solution;
preferably, the material of the metal particles comprises copper;
preferably, the oxidation state metal ions comprise one or a combination of at least two of manganese ions, cerium ions, iron ions or vanadium ions;
preferably, the flow regulating range of the spray pump is 600-3000L/h;
preferably, the concentration of the oxidation state metal ions is 1-50 g/L;
preferably, the using concentration is the concentration of copper ions, and the concentration of the copper ions is 10-60 g/L.
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| CN202110371890.7A CN113101818A (en) | 2021-04-07 | 2021-04-07 | Metal dissolving device and dissolving method thereof |
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Application publication date: 20210713 |