CN113098591A - Distributed DTU optical fiber differential protection circuit - Google Patents

Distributed DTU optical fiber differential protection circuit Download PDF

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Publication number
CN113098591A
CN113098591A CN202110206192.1A CN202110206192A CN113098591A CN 113098591 A CN113098591 A CN 113098591A CN 202110206192 A CN202110206192 A CN 202110206192A CN 113098591 A CN113098591 A CN 113098591A
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resistor
pin
chip
circuit
dm9000aep
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CN202110206192.1A
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CN113098591B (en
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舒亿兵
于丽娇
陈治国
齐斌
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Cloud Valley Technology Zhuhai Co ltd
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Cloud Valley Technology Zhuhai Co ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/03Arrangements for fault recovery
    • H04B10/032Arrangements for fault recovery using working and protection systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25Arrangements specific to fibre transmission
    • H04B10/2507Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/806Arrangements for feeding power

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Optical Communication System (AREA)

Abstract

The invention provides a distributed DTU optical fiber differential protection circuit, and relates to the technical field of optical fiber communication circuit protection. Including a plurality of DTU terminal equipment, it is a plurality of DTU terminal equipment sets up relatively, and is relative DTU terminal equipment utilizes optical fiber connection, arbitrary DTU terminal equipment including the circuit breaker, be used for gathering current signal's collection system and be used for carrying out the optical fiber communication circuit of logical processing to the signal of gathering, collection system's output with optical fiber communication circuit's input is connected, optical fiber communication circuit's output with the input of circuit breaker is connected. The circuit fault removal can be completed quickly, the whole circuit is guaranteed not to be damaged by the voltage or current of an external power supply, the safety is improved, and the manual maintenance cost is saved.

Description

Distributed DTU optical fiber differential protection circuit
Technical Field
The invention relates to the technical field of optical fiber communication circuit protection, in particular to a distributed DTU optical fiber differential protection circuit.
Background
In the optical fiber communication circuit of the distributed DTU (light ray terminal equipment), after a power supply is connected, when voltage or current oscillates, electronic components in the optical fiber communication circuit of the distributed DTU are extremely easy to damage, so that optical fiber communication in the whole area is influenced, and a large number of circuits are required to be combed to find out problems during maintenance, time and labor are wasted, the use of peripheral facilities is influenced, and therefore a circuit for rapidly carrying out fault removal when the external power supply oscillates is required, and the occurrence of accidents is reduced.
Disclosure of Invention
The invention aims to provide a distributed DTU optical fiber differential protection circuit which can rapidly complete circuit fault removal, ensure that the whole circuit is not damaged by the voltage or current of an external power supply, improve the safety and save the manpower maintenance cost.
The embodiment of the invention is realized by the following steps:
the embodiment of the application provides a distributing type DTU optic fibre differential protection circuit, it includes a plurality of DTU terminal equipment, a plurality of DTU terminal equipment set up relatively, relative DTU terminal equipment utilizes optic fibre to connect, arbitrary DTU terminal equipment includes the circuit breaker, an optical fiber communication circuit that is used for gathering the collection system of current signal and is used for carrying out logic processing to the signal of gathering, collection system's output is connected with optical fiber communication circuit's input, optical fiber communication circuit's output is connected with the input of circuit breaker.
In some embodiments of the present invention, the optical fiber communication circuit includes an ethernet PHY chip circuit and an optical module communication circuit, and an output terminal of the ethernet PHY chip circuit is connected to an input terminal of the optical module communication circuit.
In some embodiments of the invention, the Ethernet PHY chip circuitry employs a DM9000AEP chip.
In some embodiments of the invention, the ethernet PHY chip circuit further includes a resistor R25, a resistor R599, a resistor R606, a resistor R609, a resistor R610, a capacitor C508, a capacitor C509, a capacitor C510, a capacitor C511, a capacitor C512, a capacitor C513, and an SMD-5032 resonator, the TX + pin, the TX-pin, the RX + pin, and the RX-pin of the DM9000AEP chip are respectively connected to the input terminal of the optical module communication circuit, the EECK pin of the DM9000AEP chip is connected to one end of the resistor R610, the other end of the resistor R610 is connected to an external power supply, the TXGND pin of the DM9000AEP chip is connected to ground, the BGRES pin of the DM rx9000 AEP chip is connected to one end of the resistor R25, the other end of the resistor R25 is connected to ground, the bgpin of the DM GND 9000AEP chip is connected to ground, the DM9000AEP chip is connected to the external power supply, VDD pin of the DM9000AEP chip is connected to one end of the capacitor C35508, and the other end of the capacitor C508 is connected to the GND pin of the, the GND pin of the DM9000AEP chip is grounded, the capacitor C509 and the capacitor C510 are respectively connected with the capacitor C508 in parallel, the pin X1 of the DM9000AEP chip is connected with the pin OSC1 of the SMD-5032 resonator, one end of the capacitor C512 is connected with the pin X1 of the DM9000AEP chip, the other end of the capacitor C512 is grounded, the GND pin of the SMD-5032 resonator is grounded, the pin OSC2 of the SMD-5032 resonator is connected with the pin X2 of the DM9000AEP chip, one end of the capacitor C511 is connected with the pin OSC2 of the SMD-5032 resonator, the other end of the capacitor C511 is grounded, the SD pin of the DM9000AEP chip is connected with one end of a resistor R599, the other end of the resistor R599 is connected with an external power supply, the pin PW9000 AEP chip is connected with one end of a resistor R609, the other end of the resistor R609 is connected with one end of the capacitor C513, the other end of the capacitor C513 is grounded, the TEST pin of the DM 9000.
In some embodiments of the present invention, the optical module communication circuit includes a first conversion circuit, a second conversion circuit, and an inverter circuit, an input terminal of the first conversion circuit is connected to a TX + pin, a TX-pin, an RX + pin, and an RX-pin of the DM9000AEP chip, respectively, an output terminal of the first conversion circuit is connected to an input terminal of the second conversion circuit, an input terminal of the inverter circuit is connected to an SD pin of the DM9000AEP chip, and an output terminal of the inverter circuit is connected to the second conversion circuit.
In some embodiments of the present invention, the first conversion circuit comprises a resistor R466, a resistor R467, a resistor R468, a resistor R469, a resistor R470, a resistor R471, a resistor R472, and a resistor R473, one end of the resistor R468 is connected to the TX + pin of the DM9000AEP chip, the other end of the resistor R468 is connected to the external power supply, one end of the resistor R467 is connected to the TX-pin of the DM9000AEP chip, the other end of the resistor R467 is connected to the external power supply, one end of the resistor R473 is connected to the RX + pin of the DM9000AEP chip, the other end of the resistor R473 is connected to the external power supply, one end of the resistor R471 is connected to the RX + pin of the DM9000AEP chip, the other end of the resistor R471 is connected to ground, one end of the resistor R472 is connected to the TX-pin of the DM9000AEP chip, the other end of the resistor R470 is connected to the ground, one end of the resistor R470 is connected to the DM9000AEP chip, the other end of the resistor R470 is grounded, one end of the resistor R469 is connected to the RX-pin of the DM9000AEP chip, and the other end of the resistor R469 is grounded.
In some embodiments of the present invention, the second conversion circuit includes an SFP1X1 chip, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a capacitor C4, an electrolytic capacitor C3, and a ferrite bead FB1, the TD _ P pin of the SFP1X1 chip is connected to the TX + pin of the DM9000AEP chip, the TD _ N pin of the SFP1X1 chip is connected to the TX-pin of the DM9000AEP chip, the RD _ P pin of the SFP1X1 chip is connected to the RX + pin of the DM9000AEP chip, the RD _ N pin of the SFP1X1 chip is connected to the RX-pin of the DM9000AEP chip, one end of the resistor R8 is connected to the TD _ P pin of the SFP1X1 chip, the other end of the resistor R8 is connected to the TD _ X pin of the SFP1X1, and the other end of the resistor R9 is connected to the RD _ P9, the RD _ P9 pin of the SFP 9, the VCC _ T pin of the SFP1X1 chip is connected with the VCC _ R pin of the SFP1X1 chip, the VCC _ R pin of the SFP1X1 chip is connected with one end of a ferrite bead FB1, and the other end of the ferrite bead FB1 is connected with an external power supply; the anode of the electrolytic capacitor is connected with a VCC _ R pin of the SFP1X1 chip, and the cathode of the electrolytic capacitor is grounded; one end of the capacitor C4 is connected with a VCC _ R pin of the SFP1X1 chip, and the other end of the capacitor C4 is grounded; the RATE _ SEL pin of the SFP1X1 chip is connected to an external power supply through a resistor R1; the TX _ DIS pin of the SFP1X1 chip is grounded through a resistor R2; the MOD _ DEF0 pin of the SFP1X1 chip is connected to an external power supply through a resistor R3; the MOD _ DEF1 pin of the SFP1X1 chip is connected to an external power supply through a resistor R4; the MOD _ DEF2 pin of the SFP1X1 chip is connected to an external power supply through a resistor R5; the TX _ FAUL pin of the SFP1X1 chip is connected to an external power supply through a resistor R6; the RX _ LOS pin of the SFP1X1 chip is connected to an external power supply through a resistor R7.
In some embodiments of the present invention, the inverter circuit includes a resistor R454, a resistor R455, a resistor R450, and a transistor Q1, a collector of the transistor Q1 is connected to an SD pin of the DM9000AEP chip, a collector of the transistor Q1 is connected to an external power supply via the resistor R455, an emitter of the transistor Q1 is grounded, a base of the transistor Q1 is connected to an RX _ LOS pin of the SFP1X1 chip via the resistor R454, one end of the resistor R450 is connected to a collector of the transistor Q1, and the other end of the resistor R450 is connected to an RX _ LOS pin of the SFP1X1 chip.
In some embodiments of the present invention, the circuit breaker is a high pressure air type circuit breaker.
In some embodiments of the invention, the collection device is a current transformer.
Compared with the prior art, the embodiment of the invention has at least the following advantages or beneficial effects:
the utility model provides a distributing type DTU optic fibre differential protection circuit, including a plurality of DTU terminal equipment, a plurality of DTU terminal equipment set up relatively, relative DTU terminal equipment utilizes optical fiber connection, arbitrary DTU terminal equipment includes the circuit breaker, be used for gathering current signal's collection system and be used for carrying out the optical fiber communication circuit of logic processing to the signal of gathering, collection system's output is connected with optical fiber communication circuit's input, optical fiber communication circuit's output is connected with the input of circuit breaker.
In order to solve the problem that the communication circuit in the distributed DTU causes equipment damage or failure when the current is reversed or oscillated, the design is provided with a collecting device for collecting current signals, the design aim is to detect the direction of the current or the voltage in a power supply circuit, when the current or the voltage is found to be reversed, an optical fiber communication circuit for carrying out logic processing on the collected signals is used for identifying and processing, the judgment of the current or the voltage direction is carried out according to kirchhoff's law, namely the sum of the currents flowing into the nodes is equal to the sum of the currents flowing out of the nodes at any time on any node in the circuit, so that the division is internal failure or external failure, and then signals are sent to a breaker, so that the breaker disconnects the equipment from an external power supply, thereby the circuit failure removal is rapidly completed, and the whole circuit is ensured not to be damaged by the voltage or the current of the external power supply, the safety is improved, and the manpower maintenance cost is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a distributed DTU fiber differential protection circuit according to the present invention;
FIG. 2 is a block diagram of an optical fiber communication circuit according to the present invention;
FIG. 3 is a schematic circuit diagram of an optical module communication circuit according to the present invention;
FIG. 4 is a schematic circuit diagram of an Ethernet PHY chip circuit according to the present invention;
fig. 5 is a schematic circuit diagram of the inverter circuit of the present invention.
Icon: 1. a collection device; 2. a circuit breaker; 3. an optical fiber communication circuit; 31. an Ethernet PHY chip circuit; 32. an optical module communication circuit; 321. a first conversion circuit; 322. a second conversion circuit; 323. an inverter circuit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the individual features of the embodiments can be combined with one another without conflict.
Examples
Referring to fig. 1, fig. 1 is a schematic diagram of a distributed DTU fiber differential protection circuit provided in an embodiment of the present application, where the distributed DTU fiber differential protection circuit includes a plurality of DTU terminal devices, the DTU terminal devices are arranged oppositely, the opposite DTU terminal devices are connected by using optical fibers, any DTU terminal device includes a circuit breaker 2, a collection device 1 for collecting current signals, and a fiber communication circuit 3 for performing logic processing on the collected signals, an output end of the collection device 1 is connected to an input end of the fiber communication circuit 3, and an output end of the fiber communication circuit 3 is connected to an input end of the circuit breaker 2.
In some embodiments of the present invention, in order to solve the problem that the communication circuit in the distributed DTU causes equipment damage or failure when the current is reversed or oscillated, the design is provided with a collecting device 1 for collecting current signals, the design purpose of the collecting device is to detect the direction of the current or voltage in the power line, and when the current or voltage is found to be reversed, the collecting device is identified and processed by an optical fiber communication circuit 3 for logically processing the collected signals, the judgment of the current or voltage direction is carried out according to kirchhoff's law, that is, the sum of the currents flowing into the nodes is equal to the sum of the currents flowing out of the nodes at any time on any node in the circuit, so as to identify whether the fault is an intra-area fault or an extra-area fault, and then a signal is sent to a circuit breaker 2, so that the circuit breaker 2 disconnects the equipment from an external power supply, thereby quickly completing circuit fault removal, the circuit has the advantages that the circuit is prevented from being damaged by the voltage or current of an external power supply, the safety is improved, and the manpower maintenance cost is saved.
Referring to fig. 2, in some embodiments of the present invention, the optical fiber communication circuit 3 includes an ethernet PHY chip circuit 31 and an optical module communication circuit 32, and an output end of the ethernet PHY chip circuit 31 is connected to an input end of the optical module communication circuit 32.
In some embodiments of the present invention, in order to make the distributed DTU fiber differential protection circuit and the optical fiber better perform matching connection, the design sets an ethernet PHY chip circuit 31 for collecting and processing electrical signals, and additionally sets an optical module communication circuit 32 for converting the electrical signals into optical signals and transmitting the optical signals through the optical fiber, thereby matching the use of the entire optical fiber communication circuit 3.
In some embodiments of the present invention, the Ethernet PHY chip circuitry 31 employs a DM9000AEP chip.
In some embodiments of the present invention, the purpose of the present design using the DM9000AEP chip is that this chip is fully integrated and cost-effective single-chip fast ethernet MAC controller to general processing interface, an 10/100M adaptive PHY and 4K DWORD SRAM. In addition, the purpose of selecting the method is to support the tolerance of 3.3V and 5V in low power consumption and high performance process, thereby saving the cost on the premise of ensuring the performance.
Referring to fig. 4, in some embodiments of the invention, the ethernet PHY chip circuit 31 further includes a resistor R25, a resistor R599, a resistor R606, a resistor R609, a resistor R610, a capacitor C508, a capacitor C509, a capacitor C510, a capacitor C511, a capacitor C512, a capacitor C513, and an SMD-5032 resonator, the TX + pin, the TX-pin, the RX + pin, and the RX-pin of the DM9000AEP chip are respectively connected to the input terminal of the optical module communication circuit 32, the EECK pin of the DM9000AEP chip is connected to one end of the resistor R610, the other end of the resistor R610 is connected to an external power supply, the TXGND pin of the DM9000AEP chip is grounded, the RXGND pin of the DM9000AEP chip is grounded, the BGRES pin of the DM9000AEP chip is connected to one end of the resistor R25, the other end of the resistor R25 is grounded, the BGGND pin of the DM9000AEP chip is grounded, the VDD pin of the DM9000AEP chip is connected to the external power supply, the other end of the capacitor AEP pin of the capacitor R9000 is connected to the GND pin 508, the GND pin of the DM9000AEP chip is grounded, the capacitor C509 and the capacitor C510 are respectively connected with the capacitor C508 in parallel, the pin X1 of the DM9000AEP chip is connected with the pin OSC1 of the SMD-5032 resonator, one end of the capacitor C512 is connected with the pin X1 of the DM9000AEP chip, the other end of the capacitor C512 is grounded, the GND pin of the SMD-5032 resonator is grounded, the pin OSC2 of the SMD-5032 resonator is connected with the pin X2 of the DM9000AEP chip, one end of the capacitor C511 is connected with the pin OSC2 of the SMD-5032 resonator, the other end of the capacitor C511 is grounded, the SD pin of the DM9000AEP chip is connected with one end of a resistor R599, the other end of the resistor R599 is connected with an external power supply, the pin PW9000 AEP chip is connected with one end of a resistor R609, the other end of the resistor R609 is connected with one end of the capacitor C513, the other end of the capacitor C513 is grounded, the TEST pin of the DM 9000.
In some embodiments of the present invention, the specific implementation of the ethernet PHY chip circuit 31 is described in the above circuit structure, and the basic principle thereof is that a plurality of DTU terminals transmit and receive sampling data to a plurality of opposite DTU terminals in real time, the plurality of DTU terminals on both sides use their own current data and current data on opposite sides to perform differential current calculation according to phases, and at the same time, the DTUs perform judgment according to a braking characteristic equation of current differential protection, and determine that the distributed DTU trips when an intra-area fault occurs (i.e., the circuit breaker 2 performs a circuit breaking operation), and determine that the distributed DTU does not work when an extra-area fault occurs, and the three-phase circuit can perform judgment simultaneously, and the device trips when one phase satisfies a condition, thereby ensuring safety.
Referring to fig. 3, in some embodiments of the invention, the optical module communication circuit 32 includes a first conversion circuit 321, a second conversion circuit 322, and an inverter circuit 323, wherein an input end of the first conversion circuit 321 is connected to a TX + pin, a TX-pin, an RX + pin, and an RX-pin of the DM9000AEP chip, an output end of the first conversion circuit 321 is connected to an input end of the second conversion circuit 322, an input end of the inverter circuit 323 is connected to an SD pin of the DM9000AEP chip, and an output end of the inverter circuit 323 is connected to the second conversion circuit 322.
In some embodiments of the present invention, the first conversion circuit 321 in the optical module communication circuit 32 is configured to convert the differential signal output by the ethernet PHY chip circuit 31 in a network chip into a PECL level that can be identified by the second conversion circuit 322, and the second conversion circuit 322 converts the PECL level into an optical signal and transmits the optical signal to the opposite optical module communication circuit 32 by using an optical fiber.
Referring to fig. 3, in some embodiments of the invention, the first conversion circuit 321 includes a resistor R466, a resistor R467, a resistor R468, a resistor R469, a resistor R470, a resistor R471, a resistor R472, and a resistor R473, one end of the resistor R468 is connected to the TX + pin of the DM9000AEP chip, the other end of the resistor R468 is connected to the external power source, one end of the resistor R467 is connected to the TX-pin of the DM9000AEP chip, the other end of the resistor R467 is connected to the external power source, one end of the resistor R473 is connected to the RX + pin of the DM9000AEP chip, the other end of the resistor R473 is connected to the external power source, one end of the resistor R466 is connected to the RX-pin of the DM9000AEP chip, the other end of the resistor R471 is connected to the TX + pin, the other end of the resistor R472 is connected to the TX-pin of the DM9000AEP chip, one end of the resistor R470 is connected to the TX + pin of the DM9000AEP chip, the other end of the resistor R470 is grounded, one end of the resistor R469 is connected to the RX-pin of the DM9000AEP chip, and the other end of the resistor R469 is grounded.
In some embodiments of the present invention, the principle of the first conversion circuit 321 is that the resistor R466, the resistor R467, the resistor R468, the resistor R469, the resistor R470, the resistor R471, the resistor R472, and the resistor R473 are utilized, according to the above connection manner, the differential signal sent by the DM9000AEP chip in the ethernet PHY chip circuit 31 is converted into a PECL level and transmitted to the second conversion circuit 322, so that the second conversion circuit 322 can receive the signal more clearly, and the accuracy and stability of data transmission are improved.
Referring to fig. 3, in some embodiments of the invention, the second conversion circuit 322 includes an SFP1X1 chip, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a capacitor C4, an electrolytic capacitor C3, and a ferrite bead FB1, the TD _ P pin of the SFP1X1 chip is connected to the TX + pin of the DM9000AEP chip, the TD _ N pin of the SFP1X1 chip is connected to the TX-pin of the DM9000AEP chip, the RD _ P pin of the SFP1X1 chip is connected to the RX + pin of the DM9000AEP chip, the RX _ N pin of the SFP1X1 chip is connected to the RX-pin of the DM9000AEP chip, one end of the resistor R8 is connected to the TD _ P pin of the SFP1X1 chip, the other end of the resistor R8 is connected to the TD _ P pin of the SFP1X 9, and the other end of the SFP 36x 9, and the resistor RD _ N pin of the SFP 9 is connected to the SFP 36x 9, the VCC _ T pin of the SFP1X1 chip is connected with the VCC _ R pin of the SFP1X1 chip, the VCC _ R pin of the SFP1X1 chip is connected with one end of a ferrite bead FB1, and the other end of the ferrite bead FB1 is connected with an external power supply; the anode of the electrolytic capacitor is connected with a VCC _ R pin of the SFP1X1 chip, and the cathode of the electrolytic capacitor is grounded; one end of the capacitor C4 is connected with a VCC _ R pin of the SFP1X1 chip, and the other end of the capacitor C4 is grounded; the RATE _ SEL pin of the SFP1X1 chip is connected to an external power supply through a resistor R1; the TX _ DIS pin of the SFP1X1 chip is grounded through a resistor R2; the MOD _ DEF0 pin of the SFP1X1 chip is connected to an external power supply through a resistor R3; the MOD _ DEF1 pin of the SFP1X1 chip is connected to an external power supply through a resistor R4; the MOD _ DEF2 pin of the SFP1X1 chip is connected to an external power supply through a resistor R5; the TX _ FAUL pin of the SFP1X1 chip is connected to an external power supply through a resistor R6; the RX _ LOS pin of the SFP1X1 chip is connected to an external power supply through a resistor R7.
In some embodiments of the invention, the SFP1X1 chip is specifically ATR-S0104DT in the type and is SFP packaged, and the selection is made so that the chip is a common module for power communication, has strong anti-interference capability, can meet the requirements of a power system on the functions and performance of electronic products, has a communication distance as long as 40 km, completely meets the requirements of a distribution automation circuit, and ensures the stability of the circuit.
Referring to fig. 5, in some embodiments of the invention, the inverter circuit 323 includes a resistor R454, a resistor R455, a resistor R450, and a transistor Q1, a collector of the transistor Q1 is connected to an SD pin of the DM9000AEP chip, a collector of the transistor Q1 is connected to an external power source through the resistor R455, an emitter of the transistor Q1 is grounded, a base of the transistor Q1 is connected to an RX _ LOS pin of the SFP1X1 chip through the resistor R454, one end of the resistor R450 is connected to a collector of the transistor Q1, and the other end of the resistor R450 is connected to an RX _ LOS pin of the SFP1X1 chip.
In some embodiments of the present invention, the inverter circuit 323 is configured to invert the signal by using the transistor Q1, so that the effect of the signal converting the differential signal output by the ethernet chip into the optical signal through the optical module circuit is more significant, thereby improving the accuracy of circuit signal transmission. Therefore, as shown in fig. 1, when a line normally operates or an external fault occurs, the phases of currents on two sides of the line are opposite, assuming that the M side is a power transmission end and the N side is a power reception end, the current on the M side is a bus flowing to the line, the current on the N side is a line flowing to the bus, the currents on the two sides are equal in magnitude and opposite in direction, and the differential current on the two sides of the line is zero at this time; when the line has an internal fault, the fault current flows from the bus to the line in the same direction, the differential current of the currents on two sides of the line is no longer zero, and when the differential current meets the action characteristic equation of current differential protection, the protection device sends out a trip to quickly cut off the fault phase.
In some embodiments of the present invention, the circuit breaker 2 is a high pressure air type circuit breaker.
In some embodiments of the invention, the air circuit breaker has the advantages of convenient installation, safe operation, multiple protections, reliable work, no need of replacing elements after installation and the like, so the air circuit breaker is adopted in the embodiment, and the high-voltage air circuit breaker is selected to be safer and more reliable because the distributed DTU optical fiber differential protection circuit is connected to a high-voltage power supply.
In some embodiments of the invention, the acquisition device 1 is a current transformer.
In some embodiments of the present invention, since the voltage in the circuit is relatively inconvenient to measure, and since the high voltage power supply is connected, the voltage of the high voltage line is directly monitored, which is very likely to cause damage to the monitoring device or decrease in the service life, the collecting device 1 of this embodiment is configured as a current transformer, which improves the service life and ensures long-term operation of the distributed DTU optical fiber differential protection circuit.
To sum up, the differential protection circuit of distributed DTU optic fibre that this application embodiment provided, including a plurality of DTU terminal equipment, a plurality of DTU terminal equipment set up relatively, relative DTU terminal equipment utilizes optical fiber connection, arbitrary DTU terminal equipment includes circuit breaker 2, the collection system 1 that is used for gathering current signal and the optic fibre communication circuit 3 that is used for carrying out logic processing to the signal of gathering, collection system 1's output is connected with optic fibre communication circuit 3's input, optic fibre communication circuit 3's output is connected with circuit breaker 2's input.
In order to solve the problem that the communication circuit in the distributed DTU causes equipment damage or failure under the condition that the current is reversed or oscillated, the design is provided with a collecting device 1 for collecting current signals, the design aim is to detect the direction of the current or voltage in a power supply circuit, when the current or voltage is found to be reversed, an optical fiber communication circuit 3 for carrying out logic processing on the collected signals is used for identifying and processing, the judgment of the current or voltage direction is carried out according to kirchhoff's law, namely the sum of the currents flowing into nodes is equal to the sum of the currents flowing out of the nodes at any time on any node in the circuit, so as to identify whether the fault is an intra-area fault or an extra-area fault, and then a signal is sent to a circuit breaker 2, so that the circuit breaker 2 disconnects the equipment from an external power supply, thereby quickly completing circuit fault removal, and ensuring that the whole circuit is not damaged by the voltage or the current of the external power, the safety is improved, and the manpower maintenance cost is saved.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (10)

1. The utility model provides a distributing type DTU optic fibre differential protection circuit, its characterized in that, includes a plurality of DTU terminal equipment, and is a plurality of DTU terminal equipment sets up relatively, sets up relatively DTU terminal equipment utilizes optic fibre to connect, arbitrary DTU terminal equipment includes the circuit breaker, is used for gathering the collection system of electric current signal and is used for carrying out the optical fiber communication circuit of logical processing to the signal of gathering, collection system's output with optical fiber communication circuit's input is connected, optical fiber communication circuit's output with the input of circuit breaker is connected.
2. The distributed DTU fiber differential protection circuit of claim 1, wherein the fiber communication circuit comprises an ethernet PHY chip circuit and an optical module communication circuit, and an output of the ethernet PHY chip circuit is connected to an input of the optical module communication circuit.
3. The distributed DTU fiber differential protection circuit of claim 2, wherein the ethernet PHY chip circuit employs a DM9000AEP chip.
4. The distributed DTU fiber differential protection circuit of claim 3, wherein the Ethernet PHY chip circuit further comprises a resistor R25, a resistor R599, a resistor R606, a resistor R609, a resistor R610, a capacitor C508, a capacitor C509, a capacitor C510, a capacitor C511, a capacitor C512, a capacitor C513, and an SMD-5032 resonator, the TX + pin, the TX-pin, the RX + pin, and the RX-pin of the DM9000AEP chip are respectively connected to the input terminal of the optical module communication circuit, the EECK pin of the DM9000AEP chip is connected to one end of the resistor R610, the other end of the resistor R610 is connected to an external power supply, the TXGND pin of the DM9000AEP chip is connected to ground, the RXGND pin of the DM9000AEP chip is connected to ground, the BGRES pin of the DM9000AEP chip is connected to one end of the resistor R25, the other end of the resistor R25 is connected to ground, the BGGND pin of the DM9000AEP chip is connected to the external power supply, a VDD pin of the DM9000AEP chip is connected to one end of the capacitor C508, the other end of the capacitor C508 is connected to a GND pin of the DM9000AEP chip, the GND pin of the DM9000AEP chip is grounded, the capacitor C509 and the capacitor C510 are respectively connected in parallel to the capacitor C508, an X1 pin of the DM9000AEP chip is connected to an OSC1 pin of the SMD-5032 resonator, one end of the capacitor C512 is connected to an X1 pin of the DM9000AEP chip, the other end of the capacitor C512 is grounded, a GND pin of the SMD-5032 resonator is grounded, an OSC2 pin of the SMD-5032 resonator is connected to an X2 pin of the DM9000AEP chip, one end of the capacitor C511 is connected to an OSC2 pin of the SD-5032 resonator, the other end of the capacitor C511 is grounded, a pin of the DM9000AEP chip is connected to one end of the resistor R599, and the other end of the SMD 599 is connected to an external resistor R599, the PWRST pin of the DM9000AEP chip is connected to one end of the resistor R609, the other end of the resistor R609 is connected to one end of the capacitor C513, the other end of the capacitor C513 is grounded, the TEST pin of the DM9000AEP chip is connected to one end of the resistor R606, and the other end of the resistor R606 is grounded.
5. The distributed DTU fiber differential protection circuit of claim 4, wherein the optical module communication circuit comprises a first conversion circuit, a second conversion circuit and an inverter circuit, wherein the input terminal of the first conversion circuit is connected to the TX + pin, the TX-pin, the RX + pin and the RX-pin of the DM9000AEP chip, respectively, the output terminal of the first conversion circuit is connected to the input terminal of the second conversion circuit, the input terminal of the inverter circuit is connected to the SD pin of the DM9000AEP chip, and the output terminal of the inverter circuit is connected to the second conversion circuit.
6. The distributed DTU fiber differential protection circuit of claim 5, wherein the first conversion circuit comprises a resistor R466, a resistor R467, a resistor R468, a resistor R469, a resistor R470, a resistor R471, a resistor R472, and a resistor R473, wherein one end of the resistor R468 is connected to the TX + pin of the DM9000AEP chip, the other end of the resistor R468 is connected to an external power source, one end of the resistor R467 is connected to the TX-pin of the DM9000AEP chip, the other end of the resistor R467 is connected to the external power source, one end of the resistor R473 is connected to the RX + pin of the DM9000AEP chip, the other end of the resistor R466 is connected to the RX-pin of the DM9000AEP chip, the other end of the resistor R466 is connected to the external power source, one end of the resistor R471 is connected to the TX + pin of the DM9000AEP chip, and the other end of the resistor R471 is connected to ground, one end of the resistor R472 is connected to the TX pin of the DM9000AEP chip, the other end of the resistor R472 is grounded, one end of the resistor R470 is connected to the RX + pin of the DM9000AEP chip, the other end of the resistor R470 is grounded, one end of the resistor R469 is connected to the RX pin of the DM9000AEP chip, and the other end of the resistor R469 is grounded.
7. The distributed DTU fiber differential protection circuit of claim 6, wherein the second conversion circuit comprises an SFP1X1 chip, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a capacitor C4, an electrolytic capacitor C3, and a ferrite bead FB1, the TD _ P pin of the SFP1X1 chip is connected to the TX + pin of the DM9000AEP chip, the TD _ N pin of the SFP1X1 chip is connected to the TX-pin of the DM9000AEP chip, the RD _ P pin of the SFP1X1 chip is connected to the RX + pin of the DM9000AEP chip, the RD _ N pin of the SFP1X 5 chip is connected to the RX-pin of the DM9000AEP chip, one end of the resistor R8 is connected to the TD _ P1 pin, and the other end of the resistor R59P 6342 is connected to the TD _ P pin of the SFP1X 469, the other end of the resistor R9 is connected with an RD _ N pin of the SFP1X1 chip, a VEE _ T pin and a VEE _ R pin of the SFP1X1 chip are grounded, a VCC _ T pin of the SFP1X1 chip is connected with a VCC _ R pin of the SFP1X1 chip, a VCC _ R pin of the SFP1X1 chip is connected with one end of the ferrite bead FB1, and the other end of the ferrite bead FB1 is connected with an external power supply; the anode of the electrolytic capacitor is connected with a VCC _ R pin of the SFP1X1 chip, and the cathode of the electrolytic capacitor is grounded; one end of the capacitor C4 is connected with a VCC _ R pin of the SFP1X1 chip, and the other end of the capacitor C4 is grounded; the RATE _ SEL pin of the SFP1X1 chip is connected to an external power supply through the resistor R1; the TX _ DIS pin of the SFP1X1 chip is grounded through a resistor R2; the MOD _ DEF0 pin of the SFP1X1 chip is connected to an external power supply through the resistor R3; the MOD _ DEF1 pin of the SFP1X1 chip is connected to an external power supply through the resistor R4; the MOD _ DEF2 pin of the SFP1X1 chip is connected to an external power supply through the resistor R5; the TX _ FAUL pin of the SFP1X1 chip is connected to an external power supply through the resistor R6; and an RX _ LOS pin of the SFP1X1 chip is connected to an external power supply through the resistor R7.
8. The distributed DTU fiber differential protection circuit of claim 7, wherein the inverter circuit comprises a resistor R454, a resistor R455, a resistor R450, and a transistor Q1, wherein a collector of the transistor Q1 is connected to the SD pin of the DM9000AEP chip, a collector of the transistor Q1 is connected to an external power source via the resistor R455, an emitter of the transistor Q1 is grounded, a base of the transistor Q1 is connected to the RX _ LOS pin of the SFP1X1 chip via the resistor R454, one end of the resistor R450 is connected to a collector of the transistor Q1, and the other end of the resistor R450 is connected to the RX _ LOS pin of the SFP1X1 chip.
9. The distributed DTU fiber differential protection circuit of claim 1, wherein the circuit breaker is a high pressure air circuit breaker.
10. The distributed DTU fiber differential protection circuit of claim 1, the collection device being a current transformer.
CN202110206192.1A 2021-02-24 2021-02-24 Distributed DTU optical fiber differential protection circuit Active CN113098591B (en)

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Denomination of invention: A distributed DTU optical fiber differential protection circuit

Effective date of registration: 20230117

Granted publication date: 20220401

Pledgee: Bank of China Limited by Share Ltd. Zhuhai branch

Pledgor: Cloud Valley Technology (Zhuhai) Co.,Ltd.

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