CN113097188A - Modularized power assembly and wind power converter - Google Patents
Modularized power assembly and wind power converter Download PDFInfo
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- CN113097188A CN113097188A CN201911329732.4A CN201911329732A CN113097188A CN 113097188 A CN113097188 A CN 113097188A CN 201911329732 A CN201911329732 A CN 201911329732A CN 113097188 A CN113097188 A CN 113097188A
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- 239000003990 capacitor Substances 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012938 design process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/70—Wind energy
- Y02E10/76—Power conversion electric or electronic aspects
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Abstract
A modular power module and a wind power converter are provided, the modular power module comprising: the capacitor battery module comprises a first laminated busbar and a plurality of capacitors electrically connected with the first laminated busbar; the power module comprises a plurality of power modules, a plurality of first laminated busbars and a plurality of second laminated busbars, wherein each power module comprises at least two IGBT units which are connected in parallel and the second laminated busbars which are electrically connected with the at least two IGBT units; and the integrated control module is respectively connected with each power module and respectively sends the control instruction to each power module so as to control the on and off of the IGBT unit in each power module. The modularized power assembly and the wind power converter based on the exemplary embodiment of the invention can unify interface design, reduce material quantity and reduce cost by adopting modularized design.
Description
Technical Field
The present invention relates generally to the field of power electronics, and more particularly, to a modular power assembly and a wind power converter including the same.
Background
In recent years, power semiconductor devices are developed rapidly, the power density of the semiconductor devices is improved continuously, the development is towards the direction of higher switching frequency and lower loss, and the development of wind power converters towards higher power level is promoted greatly. However, conventional resistance-capacitance devices and heat dissipation devices that make up power modules have evolved relatively slowly, which has limited the increase in power density of power modules.
With the more and more careful demands of market customers of wind power converters, the power levels of the converters and core devices (power modules) thereof are more and more finely divided while the converters and the core devices (power modules) thereof are developing towards the direction of high power levels.
In the design process of the conventional power module, the integration level is high, and taking fig. 1 as an example, when the power of the power module is increased, if a certain part of the power module cannot meet the requirement, the size and the interface of the power module need to be redesigned, so that the versions of the power module and the converter are various, and the management is complex.
As shown in fig. 1, a drive control portion (module controller), a drive board, an IGBT, a heat sink, a laminated busbar, and a capacitor of a conventional power module are integrated together, so that a power portion of the power module has a short board during design, power density is difficult to increase, and even if the power module can be made into a module, cost is also high, and system requirements cannot be well met.
Therefore, the traditional power module has the problems of difficult power rise, low power density, inconsistent interfaces of different modules and high overall cost of the module.
Disclosure of Invention
An object of an exemplary embodiment of the present invention is to provide a modular power module and a wind power converter, which can unify interface design by adopting a modular design, and facilitate power boost of the power module to achieve coverage of different power levels.
In one general aspect, there is provided a modular power assembly comprising: the capacitor battery module comprises a first laminated busbar and a plurality of capacitors electrically connected with the first laminated busbar; the power module comprises a plurality of power modules, a plurality of first laminated busbars and a plurality of second laminated busbars, wherein each power module comprises at least two IGBT units which are connected in parallel and the second laminated busbars which are electrically connected with the at least two IGBT units; and the integrated control module is respectively connected with each power module and respectively sends the control instruction to each power module so as to control the on and off of the IGBT unit in each power module.
Optionally, each power module may further include: and the IGBT unit in each power module is arranged on the radiator through a fastener and is electrically connected with the second laminated busbar through the fastener.
Optionally, the plurality of capacitors are electrically connected to the first laminated busbar through a fastener, and the second laminated busbar in each power module is electrically connected to the first laminated busbar through a fastener.
Optionally, each power module may further include: and the input end of the driving board receives the control command, and the output end of the driving board is connected to the control end of each IGBT unit so as to control the on and off of each IGBT unit.
Optionally, the modular power assembly may further comprise: and the alternating current copper bar is electrically connected to the alternating current outlet end of each IGBT unit, and the direct current terminal of each IGBT unit is electrically connected to the second laminated busbar.
Optionally, the second laminated busbar in each power module is arranged in parallel.
In another general aspect, there is provided a modular power assembly comprising a plurality of power modules and a capacitive pool module, wherein the capacitive pool module comprises: a first laminated busbar for electrically connecting to a direct current bus bar, a plurality of capacitors electrically connected to the first laminated busbar, wherein each power module includes: the second laminated busbar is electrically connected to the first laminated busbar, the at least two IGBT modules are electrically connected to the direct current terminals of the at least two IGBT modules, the radiator is arranged on the radiator, and the direct current terminals of the at least two IGBT modules are electrically connected to the second laminated busbar.
Optionally, the second laminated busbar in each power module is arranged above the first laminated busbar in parallel, the plurality of capacitors are arranged below the first laminated busbar, the IGBT module in each power module is arranged above the second laminated busbar corresponding to the IGBT module, and the heat sink is arranged above the IGBT module corresponding to the heat sink.
In another general aspect, there is provided a wind power converter comprising a plurality of modular power assemblies as described above.
Alternatively, the integrated control module in the modular power assembly may be a master controller of the wind power converter.
By adopting the modularized power assembly and the wind power converter of the exemplary embodiment of the invention, the interface design can be unified by adopting the modularized design, and the problems of low power density, difficult power rise and inconsistent interfaces of different modules of the power assembly are solved.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings which illustrate exemplary embodiments.
Fig. 1 illustrates a topology of a conventional power module;
FIG. 2 illustrates a topological block diagram of a modular power assembly in accordance with an exemplary embodiment of the present invention;
FIG. 3 illustrates a layout diagram of a modular power assembly according to an exemplary embodiment of the present invention;
fig. 4 shows a schematic layout of a combination of a heat sink and an IGBT cell according to an exemplary embodiment of the invention;
fig. 5 illustrates a layout diagram of a capacitance pool module according to an exemplary embodiment of the present invention.
Detailed Description
Various example embodiments will now be described more fully with reference to the accompanying drawings, in which some example embodiments are shown.
Fig. 2 illustrates a topological structure diagram of a modular power assembly according to an exemplary embodiment of the present invention.
As shown in fig. 2, the modular power assembly 10 according to an exemplary embodiment of the present invention includes a capacitor pool module A3 and a plurality of power modules (e.g., a2_1 to a2_ n), where n denotes the number of power modules and n is a natural number greater than zero.
Specifically, the capacitor cell module A3 includes a first laminated bus bar A3-1 and a capacitor bank A3-2, and the capacitor bank A3-2 includes a plurality of capacitors electrically connected to the first laminated bus bar A3-1. Here, the first laminated busbar a3-1 is connected in parallel with a plurality of capacitors for maintaining the dc bus voltage stable.
Each power module includes at least two Insulated Gate Bipolar Transistor (IGBT) cells connected in parallel and a second laminated bus bar (not shown in the drawings), and the at least two IGBT cells are electrically connected to the second laminated bus bar. Here, the second laminated bus bar in each power module is electrically connected to the first laminated bus bar a3-1, respectively, to form a modular power assembly.
As an example, the first laminated busbar A3-1 and the second laminated busbar may each have a guiding groove formed thereon, and the guiding grooves may make the current distribution flowing through the first laminated busbar A3-1, the second laminated busbar, the IGBT unit, and the capacitor bank more uniform, and the first laminated busbar A3-1 and the second laminated busbar generate heat more uniformly.
The laminated busbar is provided with the diversion trenches, so that current can uniformly flow through the IGBT units and the capacitor bank, the whole current equalizing effect is better, the increase of design allowance due to nonuniform current distribution is avoided, and the design cost is reduced.
In a preferred example, each power module may further include a heat sink, where the heat sink may be arranged in the power module using various arrangements. As an example, the heat sink may be selected according to the use condition, the use environment, and the parameters of the IGBT unit, so as to ensure the requirement of heat dissipation when the IGBT unit operates.
Here, the capacitor cell module a3 and the plurality of power modules may be packaged into the modular power assembly 10 using various existing packaging methods.
For example, the modular power assembly 10 according to an exemplary embodiment of the present invention may further include a case covering the plurality of power modules and the capacitor cell module a3, and the second laminated bus bars in each of the power modules may be arranged in parallel.
The specific layout of the devices in the modular power assembly is described below with reference to fig. 3.
Fig. 3 shows a layout schematic of a modular power assembly according to an exemplary embodiment of the present invention.
In the example shown in fig. 3, assuming that the modular power assembly includes three power modules, taking any one of the power modules as an example, the first surface of the IGBT module in the any one power module may be disposed on the heat sink through the fastener, and in particular, in order to reduce the contact thermal resistance, a layer of thermal grease may be applied between the heat sink and the IGBT module. The second surface of the IGBT module in any one of the power modules may be electrically connected to the first surface of the second laminated busbar through a fastener, where the first surface and the second surface of the IGBT module may refer to two surfaces facing away from each other.
The capacitor bank A3-2 can be electrically connected with the first surface of the first laminated busbar A3-1 through a fastener, and the second surface of the second laminated busbar in each power module can be electrically connected with the second surface of the first laminated busbar A3-1 through a fastener respectively. Here, the first surface and the second surface of the first laminated bus bar a3-1 may refer to two surfaces facing away from each other, and the first surface and the second surface of the second laminated bus bar may refer to two surfaces facing away from each other.
In other words, taking the layout shown in fig. 3 as an example, the second laminated busbar in each power module is arranged above the first laminated busbar A3-1 in parallel, the capacitor bank A3-2 is arranged below the first laminated busbar A3-1, the IGBT module in each power module is arranged above its corresponding second laminated busbar, the heat sink is arranged above the corresponding IGBT module, and the plurality of power modules and the capacitor cell module are placed in the accommodating space formed by the housing in the layout manner described above, so as to form the modular power assembly.
Spatially relative terms, such as "under", "under …", "over", and the like, may be used herein to readily describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "above" the other elements or features. Thus, the exemplary term "lower" can encompass both an orientation of upper and lower. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In a preferred example, each of the power modules according to the exemplary embodiments of the present invention may further include: and the input end of the driving board receives a control command, and the output end of the driving board is connected to the control end of the IGBT unit so as to control the on and off of the IGBT unit. Here, the driving board and the IGBT unit may be packaged into an IGBT module using various conventional packaging methods.
In operation, the modular power assembly 10 according to an exemplary embodiment of the present invention may further include an integrated control module a1, which is respectively connected to the input terminals of the driving board (e.g., the driving board 13 to the driving board n3) of each power module, and respectively sends a control command to the driving board of each power module to control the on and off of the IGBT unit (e.g., the IGBT unit 11 to the IGBT unit n1) in each power module.
In the exemplary embodiment of the invention, the integrated control module a1 can control a plurality of power modules in a centralized manner, when IGBTs of a conventional power module are connected in parallel, the module controllers are correspondingly connected in parallel, so that the number of the module controllers is multiplied, in the invention, the integrated control module a1 is not increased along with the parallel number of the power modules, and a plurality of power modules share one control module, thereby realizing a platform design and saving the cost.
In a preferred embodiment, the plurality of power modules may include at least one type of sub-power module, that is, the plurality of power modules may include one type of sub-power module, and may also include multiple types of sub-power modules, and each type of sub-power module is formed by connecting a predetermined number of IGBT units in parallel. As an example, the number of IGBT cells connected in parallel in each type of sub-power module may be different, and/or the type of IGBT cells in each type of sub-power module may also be different.
Several types of sub-power module layouts are listed below with reference to fig. 4.
Fig. 4 shows a schematic layout of a combination of a heat sink and an IGBT cell according to an exemplary embodiment of the invention.
Fig. 4 shows several types of sub-power modules (e.g., a2_ 1-a 2_6), and in this example, it is assumed that the types of IGBT cells may include three, e.g., IGBT _ A, IGBT _ B, IGBT _ C.
As shown in fig. 4, the sub power module a2_1 may include two IGBTs _ a connected in parallel and disposed on the heat sink 12, and the sub power module a2_4 is formed by connecting three IGBTs _ a in parallel, and the three IGBTs _ a connected in parallel are disposed on the heat sink 42.
The sub power module a2_2 may include two IGBTs _ B connected in parallel and disposed on the heat sink 22, and the sub power module a2_5 may be formed with three IGBTs _ B connected in parallel, with the three IGBTs _ B connected in parallel disposed on the heat sink 52.
The sub power module a2_3 may include two IGBTs _ C connected in parallel and disposed on the heat sink 32, and the sub power module a2_6 is formed by connecting three IGBTs _ C in parallel, and the three IGBTs _ C connected in parallel are disposed on the heat sink 62.
Here, the IGBT unit and the heat sink (which may also include the driving board) may be packaged into the sub power module using various existing packaging methods. In exemplary embodiments of the present invention, different numbers and/or types of sub-power modules may be selected as a plurality of power modules to form a modular power assembly according to power requirements.
That is, the power level of the output power provided by the plurality of power modules may be changed by changing the number and/or type of sub power modules included in the plurality of power modules, so that the plurality of power modules can provide output power of different power levels.
It should be understood that the types of IGBTs listed in fig. 4 and the schemes of implementing two-parallel and three-parallel IGBTs on the heat sink are only a preferred example, and the combination form of the IGBTs in the sub-power module is not limited to the two-parallel and three-parallel schemes, but also can be a multi-parallel scheme to meet the output requirements of different power levels.
The heat sink selected for use in the exemplary embodiments of the present invention may operate at Q1、Q2……QnThe power grade under the condition that different IGBTs are connected in parallel under the condition of different flow rates is P1、P2、P3……PnThe efficiency of each power class at different flow rates is represented by η, which is denoted by Q1Flow rate for example, power class P under different IGBT parallel connection1、P2、P3……PnActual output power of P1×η11，P2×η21，P3×η31……Pn×ηn1. The ability to module power components for different combinations of flows and power levels is shown in table 1.
TABLE 1
| Traffic/power class | P1 | P2 | P3 | …… | Pn |
| Q1 | P1×η11 | P2×η21 | P3×η31 | …… | Pn×ηn1 |
| Q2 | P1×η12 | P2×η22 | P3×η32 | …… | Pn×ηn2 |
| …… | …… | …… | …… | …… | …… |
| Qn | P1×η1n | P2×η2n | P3×η3n | …… | Pn×ηnn |
By the combination mode of the sub-power modules of different types and/or numbers in the exemplary embodiment of the invention, the division of the power levels of the modular power components is greatly refined, and the output requirements of different power levels can be met.
As an example, the capacitor bank A3-2 may comprise a plurality of capacitors, i.e. the first laminated busbar A3-1 is connected in parallel with a plurality of capacitors. In a preferred example, the first laminated busbar a3-1 may further have a resistor for discharging capacitive charge.
In particular operation, the capacity of capacitor bank A3-2 should be matched to the power level of the output power provided by the plurality of power modules, e.g., the capacity of capacitor bank A3-2 may be varied by varying the number and/or types of capacitors included in capacitor bank A3-2.
Fig. 5 illustrates a layout diagram of a capacitance pool module according to an exemplary embodiment of the present invention.
In the example shown in fig. 5, it is assumed that the capacitive cell module may include A3_1, A3_2 … … A3_ n, and A3_1, A3_2 … … A3_ n may be composed of different types and/or numbers of capacitors to meet the output capability of different power levels, so as to realize the output of A3_1, A3_2 … … A3_ n at different power levels.
That is, the number and/or type of capacitors included in capacitor bank a3-2 may vary depending on the power class requirements, and the capacitors may be arranged in different ways to conserve space depending on the space of the modular power assembly.
In an exemplary embodiment of the invention, the first laminated busbar A3-1 in the capacitor cell module A3 is used for electrically connecting to a dc bus, and the function of the modular power assembly 10 is to convert the dc bus voltage to an ac voltage output.
Optionally, the modular power assembly 10 according to an exemplary embodiment of the present invention may further include an ac busbar (not shown in the figure), the ac busbar being electrically connected to the ac outlet terminal of each IGBT cell, and the dc terminal of each IGBT cell being electrically connected to the second laminated busbar.
For example, the dc terminals of each IGBT cell may include a positive dc terminal and a negative dc terminal. The direct-current positive terminal of each IGBT unit is electrically connected with the direct-current positive electrode of the second laminated busbar, and the direct-current negative terminal of each IGBT unit is electrically connected with the direct-current negative electrode of the second laminated busbar.
The positive electrode of each capacitor is electrically connected to the direct-current positive electrode of the first laminated busbar, the direct-current positive electrode of the first laminated busbar is electrically connected to the positive electrode of the direct-current bus, the negative electrode of each capacitor is electrically connected to the direct-current negative electrode of the first laminated busbar, and the direct-current negative electrode of the first laminated busbar is electrically connected to the negative electrode of the direct-current bus.
The direct current positive pole of the second laminated busbar in each power module is respectively and electrically connected to the direct current positive pole of the first laminated busbar, and the direct current negative pole of the second laminated busbar in each power module is respectively and electrically connected to the direct current negative pole of the first laminated busbar.
In addition, in a specific operation, the first laminated busbar and the second laminated busbar may be integrally formed, that is, the dc positive electrode and the dc negative electrode of the laminated busbar are integrally formed with the main body portion of the laminated busbar. In the exemplary embodiment of the invention, because the integrated laminated busbar is adopted, the structure is simple, the reliability is higher, and the parallel connection of a plurality of power modules is facilitated.
In the case that the modular power assembly comprises the housing, the direct-current positive electrode of the first laminated busbar can be used as the first direct-current wiring terminal and led out of the housing so as to be connected from the outside. The first direct current wiring terminal is connected to the positive electrode of the direct current bus, the direct current negative electrode of the first laminated busbar can be used as the second direct current wiring terminal and led out of the shell to connect the second direct current wiring terminal to the negative electrode of the direct current bus, and the alternating current copper bar can be used as the alternating current wiring terminal and led out of the shell to facilitate wiring from the outside so as to provide alternating current voltage output to the outside.
Alternatively, the integrated control module a1 may be included within the modular power assembly 10 or may be implemented by an external controller outside of the modular power assembly 10. For the case that the integrated control module a1 is an external controller, the modular power assembly 10 may further include a signal interface, where the signal interface is used to connect the integrated control module a1, and the signal interface is further respectively connected to the input end of the driving board of each power module, so as to send the control command received from the integrated control module a1 to the driving board of each power module. As an example, the signal interface may be upgraded to a fiber optic interface as needed.
As an example, the ac copper bar may be electrically connected to the ac outlet terminal of each IGBT unit by a fastener, the dc positive terminal of each IGBT unit may be electrically connected to the dc positive electrode of the second laminated busbar by a fastener, the dc negative terminal of each IGBT unit is electrically connected to the dc negative electrode of the second laminated busbar by a fastener, the dc positive electrode of the second laminated busbar in each power module is electrically connected to the dc positive electrode of the first laminated busbar by a fastener, and the dc negative electrode of the second laminated busbar in each power module is electrically connected to the dc negative electrode of the first laminated busbar by a fastener.
By way of example, the fasteners may include, but are not limited to, bolts, through which the electrical connection may be made by screwing or plugging.
There is also provided in accordance with another aspect of an exemplary embodiment of the present invention a wind power converter including a plurality of modular power assemblies as described above. In a preferred example, the main controller of the wind power converter can be used as an integrated control module in the modular power assembly to control the on and off of the IGBT units in each power module. However, the present invention is not limited to this, and other controllers in the wind power converter may also be used as an integrated control module, or an independent controller may be provided in the wind power converter as an integrated control module.
Compared with the traditional power module topological structure, the modularized power assembly and the wind power converter in the exemplary embodiment of the invention adopt the modularized design, can unify the interface design, reduce the material quantity, reduce the management cost and the production cost, and are suitable for the condition of subdividing the wind power generation power grade.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Claims (10)
1. A modular power assembly, characterized in that the modular power assembly comprises:
the capacitor battery module comprises a first laminated busbar and a plurality of capacitors electrically connected with the first laminated busbar;
the power module comprises a plurality of power modules, a plurality of first laminated busbars and a plurality of second laminated busbars, wherein each power module comprises at least two IGBT units which are connected in parallel and the second laminated busbars which are electrically connected with the at least two IGBT units;
and the integrated control module is respectively connected with each power module and respectively sends the control instruction to each power module so as to control the on and off of the IGBT unit in each power module.
2. The modular power assembly of claim 1, wherein each power module further comprises: and the IGBT unit in each power module is arranged on the radiator through a fastener and is electrically connected with the second laminated busbar through the fastener.
3. The modular power assembly of claim 2, wherein the plurality of capacitors are electrically connected to the first laminated busbar by fasteners, and the second laminated busbar in each power module is electrically connected to the first laminated busbar by fasteners, respectively.
4. The modular power assembly of claim 1, wherein each power module further comprises: and the input end of the driving board receives the control command, and the output end of the driving board is connected to the control end of each IGBT unit so as to control the on and off of each IGBT unit.
5. The modular power assembly of claim 1, further comprising: and the alternating current copper bar is electrically connected to the alternating current outlet end of each IGBT unit, and the direct current terminal of each IGBT unit is electrically connected to the second laminated busbar.
6. Modular power assembly according to claim 1, characterized in that the second laminated busbar in each power module is arranged in parallel.
7. A modular power assembly, characterized in that it comprises a capacitive battery module and a plurality of power modules,
wherein the capacitance pool module comprises:
a first laminated bus bar for electrically connecting to a DC bus bar,
a plurality of capacitors electrically connected to the first laminated bus bar,
wherein each power module comprises:
a second laminated bus bar electrically connected to the first laminated bus bar,
at least two IGBT modules, the DC terminals of the at least two IGBT modules are electrically connected to the second laminated busbar,
a heat sink on which the at least two IGBT modules are arranged.
8. The modular power assembly of claim 7, wherein the second laminated busbar in each power module is arranged in parallel above the first laminated busbar, the plurality of capacitors are arranged below the first laminated busbar,
the IGBT module in each power module is arranged above the second laminated busbar corresponding to the IGBT module, and the radiator is arranged above the IGBT module corresponding to the radiator.
9. Wind power converter, characterized in that it comprises a plurality of modular power modules according to any one of claims 1 to 8.
10. The wind power converter according to claim 9, wherein the integrated control module in the modular power assembly is a master controller of the wind power converter.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023037240A1 (en) * | 2021-09-08 | 2023-03-16 | Vijay Bolloju | Substrateless hybrid power module assembly and method for fabricating thereof |
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