CN113097156B - Oriented and localized heat-conducting composite material and preparation method thereof - Google Patents
Oriented and localized heat-conducting composite material and preparation method thereof Download PDFInfo
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- CN113097156B CN113097156B CN202110440255.XA CN202110440255A CN113097156B CN 113097156 B CN113097156 B CN 113097156B CN 202110440255 A CN202110440255 A CN 202110440255A CN 113097156 B CN113097156 B CN 113097156B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Abstract
The invention relates to an oriented and localized heat-conducting composite material, which comprises a base body, wherein the base body comprises a high heat-conducting area and a low heat-conducting area, the high heat-conducting area is of a hollow structure or is provided with a grid structure, the grid structure comprises at least two accommodating grooves which are arranged at intervals along the left and right directions of the base body, the accommodating grooves penetrate through the upper surface and the lower surface of the base body, and the base body between the adjacent accommodating grooves forms a flow-guiding partition plate; filling a filling module in the accommodating groove or in the hollow structure, wherein the filling module comprises heat-conducting filler and adhesive for fixing the heat-conducting filler and the accommodating groove together; the high heat conduction area and the low heat conduction area are arranged to realize the localized heat conduction of heat, the flow guide partition plate can realize the guide of the heat-conducting filler and the adhesive, and the formed filling module can realize the directional heat conduction of heat, so that the heat of the high heat conduction area can be quickly led out, and the influence of the heat of the high heat conduction area on components of the low heat conduction area is avoided.
Description
Technical Field
The invention belongs to the technical field of composite materials, and particularly relates to an oriented and localized heat conduction composite material and a preparation method thereof.
Background
As electronic products are becoming more integrated, lighter, and faster, the local heat release phenomenon becomes more serious. It can be seen from the study that the electronic device is sensitive to temperature, and the service life of the electronic device is shortened by two times or more when the working temperature is increased by 10-15 ℃ (Ceramics International 2014, 40, 2047-2056). Therefore, the preparation of the polymer-based packaging material with efficient thermal management performance is crucial to the stable operation and light weight development of electronic devices and products.
At present, the direct addition of high-efficiency heat-conducting filler into a polymer matrix is a common method for preparing polymer-based packaging materials. Researches find that a more continuous and compact heat conduction network can be built under the condition of lower or same filler amount by designing and building a localized distribution structure of the filler, so that the heat conduction performance can be remarkably improved, such as an isolation structure, a multilayer structure and the like. However, the current method cannot simultaneously realize the controllable design of the distribution structure and the distribution area of the heat-conducting filler, so that the prepared polymer-based composite material often shows the structural characteristics of the filler of uniform dispersion and uniform distribution. Thus, the composite material prepared performs heat dissipation mainly in a manner of "uniform heat dissipation".
In highly integrated electronic equipment, high heating element spare and low heating element spare closely arrange, when adopting the combined material of "homogenization heat dissipation" to encapsulate, the used heat that high heating element spare produced can inevitably transmit low heating element spare to can produce serious waste heat harm to low heating element spare, still can increase electronic equipment's preparation and running cost simultaneously. Therefore, the preparation of the composite material with excellent oriented and localized heat conduction performance is very important for improving the heat management capability and the operation stability of the electronic equipment through controllable design and morphological control.
Disclosure of Invention
The invention aims to provide an oriented and localized heat conduction composite material, which aims to solve the problem that the heat can seriously damage a low-heating component by residual heat when the composite material dissipates the heat in a mode of 'homogenizing heat dissipation'; in addition, the invention also provides a preparation method of the oriented and localized heat-conducting composite material.
In order to achieve the purpose, the technical scheme adopted by the oriented and localized heat-conducting composite material is as follows:
an oriented, localized, thermally conductive composite comprising:
matrix: the heat-conducting plate comprises a high heat-conducting area and a low heat-conducting area, wherein the high heat-conducting area is of a hollow structure or is provided with a grid structure, the grid structure comprises at least two accommodating grooves which are arranged at intervals along the left and right directions of a base body, the accommodating grooves penetrate through the upper surface and the lower surface of the base body, and a flow-guiding partition plate is formed between the base bodies of the adjacent accommodating grooves;
a filling module: and the filling module is filled in the hollow structure or the accommodating groove and comprises heat-conducting filler and adhesive for fixing the heat-conducting filler and the matrix together.
Has the advantages that: according to the invention, the matrix of the composite material is divided into the high heat conduction area and the low heat conduction area, when the high heat conduction area is of a hollow structure or a grid structure, the grid structure comprises the accommodating grooves which are arranged at intervals along the left and right directions of the matrix, the accommodating grooves penetrate through the upper surface and the lower surface of the matrix, the hollow structure or the accommodating grooves are filled with the filling modules, and the filling modules comprise the heat conduction fillers and the adhesive, so that the matrix can be divided into areas according to the heat conduction requirement, the heat of the high heat conduction area can be rapidly led out by utilizing the high heat conduction efficiency effect of the heat conduction fillers in the filling modules, the influence of the heat of the high heat conduction area on components of the low heat conduction area is avoided, and the serious waste heat hazard is avoided to increase the preparation and running cost of the electronic equipment.
Further, the holding tank includes the rectangular groove that extends the setting along upper and lower direction, sets up in rectangular groove upper end and with the last intercommunication groove of rectangular groove intercommunication, set up at rectangular groove lower extreme and with the lower intercommunication groove of rectangular groove intercommunication.
Has the advantages that: the upper communicating groove and the lower communicating groove in the accommodating groove can be respectively provided with a corner structure between the upper communicating groove and the lower communicating groove, the contact area of the heat-conducting filler, the adhesive and the accommodating groove can be increased due to the formation of the corner structure, the heat-conducting filler and the adhesive can be firmly fixed in the relative accommodating groove at the corner, and the filling module can be more stably fixed in the accommodating groove of the base body.
And a heat insulation pore is arranged between the high heat conduction area and the low heat conduction area of the substrate.
Has the beneficial effects that: set up adiabatic hole between high heat-conducting area and low heat-conducting area, the heat that high heat-conducting area can be avoided to low heat-conducting area diffusion to setting up in adiabatic hole, and then causes the influence to the components and parts of low heat-conducting area.
Further, a foaming structure is arranged in the heat insulation pore.
Has the advantages that: firstly, the foaming structure has lower heat conductivity, and the foaming structure is filled in the heat insulation pores, so that the heat of the high heat conduction area can be prevented from being conducted to the low heat conduction area; in addition, filling the foam structure in the heat insulation hole can make the foam structure support for the heat insulation hole, even if set up the heat insulation hole on the base member, the setting of foam structure can reduce the influence of heat insulation hole department to base member structural strength.
Further, the thermally insulating apertures are continuous through-holes disposed adjacent the high thermal conductivity area and the low thermal conductivity area.
Has the beneficial effects that: the continuous opening of the heat insulation holes is conveniently realized.
Further, adiabatic hole is the U type, and the surface about adiabatic hole runs through the base member, and adiabatic hole includes left hole, lower hole, right hole, and lower hole intercommunication sets up the lower extreme in left hole and right hole.
Has the advantages that: the structure of the heat insulation hole is simple, and the heat insulation hole is convenient to open.
The heat insulation hole comprises a plurality of heat dissipation holes arranged at intervals, and the plurality of heat dissipation holes are arranged around the high heat conduction area in an enclosing mode.
Has the beneficial effects that: this adiabatic pore's setting can surround high heat conduction district completely, can be at high heat conduction district week upwards even block the heat to low heat conduction district diffusion.
The heat conducting filler is one or more of graphite, carbon black, graphene, carbon nano tubes, copper, silver, gold, aluminum, nickel, silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, aluminum oxide or zinc oxide.
Has the advantages that: the selectivity of the heat-conducting filler is stronger.
The matrix material is one or more of polyamides, polyurethanes, polyolefins, polyesters or polylactic acids.
Has the beneficial effects that: the substrate material has stronger selectivity.
A preparation method of an oriented and localized heat conduction composite material comprises the following steps:
step 1: preparing a matrix with a hollow high-heat-conduction area or a grid structure in the high-heat-conduction area by a thermoplastic forming method;
for the matrix with the high heat conduction area in the hollow structure, the following preparation steps are as follows:
step 2: preparing the heat-conducting filler in the filling module into a sticky state;
and 3, step 3: injecting the viscous heat-conducting filler into the hollow structure, realizing the construction of an oriented structure of the heat-conducting filler by an electric field method, a magnetic field method or a freezing template method before curing and forming, and then curing and forming to form a composite material with oriented and localized heat-conducting properties;
for a matrix with a grid structure in a high heat conduction area, the following preparation steps are as follows:
step 2 ， : mixing the heat-conducting filler and the adhesive into a viscous mixture;
step 3 ， : the viscous heat-conducting filler and adhesive mixture is injected into the containing grooves, the viscous mixture is cut and guided by the flow guide partition plates between the adjacent containing grooves to realize the construction of the orientation structure of the filling module and form the filling module, and after the filling module is cured and molded, the composite material with the oriented and localized heat-conducting performance is formed.
Has the advantages that: the matrix of the composite material is divided into a high heat conduction area and a low heat conduction area, for the matrix with the high heat conduction area in a hollow structure, firstly, the heat conduction filler in the filling module is prepared into a viscous shape, then, the viscous heat conduction filler is injected into the hollow structure, before the heat conduction filler is cured and formed, the construction of an orientation structure of the heat conduction filler is realized by an electric field method, a magnetic field method or a freezing template method, and then, the heat conduction filler and the matrix are fixed by an adhesive to form the composite material with the oriented and localized heat conduction performance. The invention can divide the area of the substrate according to the heat conduction requirement, quickly guide out the heat of the high heat conduction area by utilizing the high heat conduction efficiency of the heat conduction filler in the filling module, further promote the quick guide out of the heat by utilizing the construction of the orientation structure of the heat conduction filler, avoid the influence of the heat of the high heat conduction area on the components of the low heat conduction area, and avoid generating serious waste heat harm to increase the preparation and operation cost of the electronic equipment.
For a matrix with a grid structure in a high heat conduction area, firstly mixing a heat conduction filler and an adhesive into a viscous mixture, then injecting the viscous mixture into the accommodating grooves, shearing and guiding the viscous mixture by the flow guide partition plates between the adjacent accommodating grooves to realize the construction of an oriented structure of the filling module and form the filling module, and forming a composite material with oriented and localized heat conduction performance after the filling module is cured and molded; the invention can divide the area of the base body according to the heat conduction requirement, quickly guide out the heat of the high heat conduction area by utilizing the high heat conduction efficiency of the heat conduction filler in the filling module, realize the construction of the orientation structure of the filling module by utilizing the grid structure, further promote the quick guide out of the heat, avoid the influence of the heat of the high heat conduction area on the components of the low heat conduction area, and avoid generating serious waste heat harm to increase the preparation and operation cost of the electronic equipment.
Drawings
FIG. 1 is a schematic structural view of a first embodiment of an oriented, localized, thermally conductive composite of the present invention;
FIG. 2 is a schematic diagram of a first embodiment of a matrix of the oriented, localized thermally conductive composite material of FIG. 1;
fig. 3 is a schematic structural diagram of a third embodiment of a matrix of an oriented, localized, thermally conductive composite material in accordance with the present invention.
Reference numerals: 1-a substrate; 2-a low thermal conductivity area; 3-high thermal conductivity area; 4-a filling module; 5-insulating voids; 6-long groove; 7-upper communicating groove; 8-lower communicating groove; 9-high thermal conductivity areas; 10-heat dissipation holes.
Detailed Description
The oriented and localized heat-conducting composite material and the preparation method thereof according to the present invention are further described in detail with reference to the accompanying drawings and the specific embodiments:
the specific embodiment of the structure of the oriented and localized heat-conducting composite material is shown in fig. 1, the composite material comprises a base body 1 and a filling module 4, specifically, the base body 1 comprises a high heat-conducting area 3 and a low heat-conducting area 2, a grid structure is arranged on the high heat-conducting area 3, the grid structure comprises accommodating grooves which are arranged at intervals along the left and right directions of the base body 1, the accommodating grooves penetrate through the upper and lower surfaces of the base body 1, the base body 1 between adjacent accommodating grooves forms a flow-guiding partition plate, and the filling module 4 is filled in the accommodating grooves.
Specifically, as shown in fig. 2, the holding tank includes rectangular groove 6 that sets up along extending from top to bottom, sets up in rectangular groove 6 upper end and with rectangular groove 6 intercommunication last intercommunication groove 7, set up at rectangular groove 6 lower extreme and with rectangular groove 6 intercommunication lower intercommunication groove 8, go up intercommunication groove 7 and lower intercommunication groove 8 parallel arrangement from top to bottom, the water conservancy diversion baffle is the base member 1 between the adjacent rectangular groove 6 of holding tank. Moreover, corner structures can be formed between the upper communicating groove 7 and the lower communicating groove 8 in the accommodating groove and the long groove 6 respectively, the contact area of the heat-conducting filler and the adhesive and the accommodating groove can be increased due to the corner structures, namely the corners can fix the heat-conducting filler and the adhesive firmly relative to the accommodating groove, and thus the filling module 4 can be fixed in the accommodating groove of the base body 1 more stably.
The accommodating groove is filled with a filling module 4, and in this embodiment, the filling module 4 includes a heat conductive filler and an adhesive for fixing the heat conductive filler and the accommodating groove together.
In this embodiment, be provided with adiabatic hole 5 between high heat conduction district 3 and low heat conduction district 2, in this embodiment, adiabatic hole 5 is the U-shaped, and adiabatic hole 5 runs through base member 1 upper and lower surface, and adiabatic hole 5 includes left hole, lower hole, right hole, and lower hole intercommunication sets up the lower extreme in left hole and right hole. Firstly, the structure of the pores is simple, and the heat insulation pores are convenient to open; second, the setting up of adiabatic hole can avoid the heat of high conducting area 3 to hang down the 2 diffusion of conducting area, and then causes the influence to the components and parts of hanging down conducting area 2.
In order to avoid the influence of the opening of the heat insulation holes on the strength of the matrix structure, in the embodiment, the foam structure is arranged in the heat insulation holes and has lower heat conductivity, so that the foam structure is filled in the heat insulation holes to prevent the heat of the high heat conduction area from being conducted to the low heat conduction area.
In this embodiment, the heat conductive filler is one or more of graphite, carbon black, graphene, carbon nanotubes, copper, silver, gold, aluminum, nickel, silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, aluminum oxide, or zinc oxide; the material of the substrate 1 is one or more of polyamides, polyurethanes, polyolefins, polyesters or polylactic acids.
For the matrix with the grid structure as the high heat conduction area in the embodiment, when the directional and localized heat conduction composite material is prepared, the method mainly comprises the following steps:
step 1: preparing a matrix 1 with a grid structure by a thermoplastic forming method; in this embodiment, the substrate 1 with the grid structure is prepared by a 3D printing technique, which not only simplifies the molding process of the substrate 1, but also provides the molded substrate 1 with the grid structure with strong structural strength.
And 2, step: the heat-conducting filler and the adhesive are mixed into a viscous mixture.
And 3, step 3: the viscous heat-conducting filler and adhesive mixture is injected into the containing grooves, the viscous mixture is cut and guided by the guide partition plates between the adjacent containing grooves to realize the construction of the orientation structure of the filling module and form the filling module, and after the filling module is cured and molded, the composite material with oriented and localized heat-conducting performance is formed.
According to the invention, a matrix 1 of the composite material is divided into a high heat conduction area 3 and a low heat conduction area 2, a grid structure is arranged in the high heat conduction area 3 and comprises accommodating grooves which are arranged at intervals, the accommodating grooves penetrate through the upper surface and the lower surface of the matrix 1, heat conduction filler and adhesive are filled in the accommodating grooves, the heat of the high heat conduction area 3 can be rapidly transferred by utilizing the high heat conduction efficiency of the heat conduction filler in the accommodating grooves, the influence of the heat of the high heat dissipation area on components of the low heat dissipation area is avoided, the accommodating grooves are arranged in the high heat conduction mode, and the heat conduction filler is filled in the accommodating grooves, so that the localized heat conduction of the composite material can be realized.
The heat insulation hole 5 is formed between the high heat conduction area 3 and the low heat conduction area 2, and the heat of the high heat conduction area 3 can be prevented from being diffused to the low heat conduction area 2 by the heat insulation hole 5, so that the influence on components of the low heat conduction area 2 is further avoided.
In addition, the flow guide partition plates are formed between the base bodies 1 between the adjacent accommodating grooves of the grid structure of the base bodies 1, and the flow guide partition plates can shear and guide the heat-conducting fillers and adhesives in a molten state when the accommodating grooves are filled with the filling modules 4, so that the heat-conducting fillers and the adhesives flow along the flow guide partition plates to form an oriented structure which extends in the vertical direction and has high heat-conducting performance, the oriented structure can obviously improve the contact force and the contact area of particles of the high heat-conducting fillers in the oriented structure, and the interface heat conduction among the heat-conducting fillers is improved, so that the heat-conducting fillers in the accommodating grooves have high heat-conducting capacity; the arrangement of the flow guide partition plate can realize the directional heat conduction of the heat of the high heat conduction area 3 of the composite material.
The composite material realizes controllable localized distribution of the heat-conducting filler, and simultaneously constructs an oriented structure of the heat-conducting filler (the diversion partition plate shears and guides the heat-conducting filler and the adhesive in a molten state, so that the heat-conducting filler and the adhesive flow along the diversion partition plate, and an oriented structure with high heat-conducting performance extending along the vertical direction is formed in the accommodating groove, and the oriented structure can conduct heat in the vertical direction of the substrate 1, so that the composite material is endowed with excellent directional and localized heat-conducting performance.
According to the second specific embodiment of the structure of the oriented and localized heat-conducting composite material, the composite material comprises a base body and a filling module, specifically, the base body comprises a high heat-conducting area and a low heat-conducting area, the high heat-conducting area is provided with a hollow structure, and the filling module is filled in the hollow structure. The filling module comprises a heat-conducting filler and an adhesive for fixing the heat-conducting filler and the matrix together.
In the second embodiment, a thermal insulation hole is disposed between the high thermal conductive area and the low thermal conductive area, in this embodiment, the thermal insulation hole is U-shaped, the thermal insulation hole penetrates through the upper and lower surfaces of the substrate, the thermal insulation hole includes a left hole, a lower hole, and a right hole, and the lower hole is disposed at the lower end of the left hole and the lower end of the right hole in a communicating manner. Firstly, the structure of the pores is simple, and the heat insulation pores are convenient to open; second, the setting up of adiabatic hole can avoid the heat in high heat conduction district to low heat conduction district diffusion, and then causes the influence to the components and parts in low heat conduction district.
In the second embodiment, the heat conductive filler is one or more of graphite, carbon black, graphene, carbon nanotubes, copper, silver, gold, aluminum, nickel, silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, aluminum oxide, or zinc oxide; the material of the substrate 1 is one or more of polyamides, polyurethanes, polyolefins, polyesters or polylactic acids.
For the matrix with the hollow structure in the high heat conduction area in this embodiment, when the directional and localized heat conduction composite material is prepared, the method mainly includes the following steps:
step 1: preparing a hollow structure in the high heat conduction area by a thermoplastic forming method; in this embodiment, the substrate 1 with the grid structure is prepared by a 3D printing technology, which not only simplifies the molding process of the substrate 1, but also enables the molded substrate 1 with the grid structure to have strong structural strength.
Step 2: preparing the heat-conducting filler in the filling module into a sticky state;
and step 3: injecting the viscous heat-conducting filler into the hollow structure, realizing the construction of the oriented structure of the heat-conducting filler by an electric field method, a magnetic field method or a freezing template method before curing and forming, and then curing and forming to form the composite material with oriented and localized heat-conducting performance. In this embodiment, the electric field method, the magnetic field method, or the freezing template method belongs to the prior art, and will not be described again.
Fig. 3 shows an embodiment of a substrate of an oriented, localized heat-conducting composite material, which is different from the first embodiment in that the heat-insulating apertures include a plurality of heat dissipation holes 10 disposed at intervals and penetrating through the upper and lower surfaces of the substrate, and the plurality of heat dissipation holes 10 are formed to surround the high heat-conducting area 9.
In the above embodiment, the accommodating groove includes a long groove extending in the up-down direction, an upper communicating groove provided at the upper end of the long groove and communicating with the long groove, and a lower communicating groove provided at the lower end of the long groove and communicating with the long groove; in other embodiments, the accommodating groove includes a long groove extending in the vertical direction, and both the upper communicating groove and the lower communicating groove may not be provided; alternatively, the receiving groove may have other structures, such as an arc-shaped groove; alternatively, the accommodating groove may be arranged in other manners.
In the above embodiment, the upper communicating groove and the lower communicating groove are arranged in parallel up and down; in other embodiments, the upper communication groove and the lower communication groove may not be parallel.
In the above embodiment, the thermal insulation pores are U-shaped, penetrate through the upper and lower surfaces of the substrate, and include a left pore, a lower pore, and a right pore, the lower pore being communicated with the lower end of the left pore and the lower end of the right pore; in other embodiments, the insulation apertures may also be L-shaped, or the insulation apertures may have other configurations, as long as the arrangement of the insulation apertures does not cause separation of the high thermal conductivity area from the low thermal conductivity area and prevents heat from the high thermal conductivity area from diffusing to the low thermal conductivity area.
In the above embodiments, the heat conductive filler is one or more of graphite, carbon black, graphene, carbon nanotube, copper, silver, gold, aluminum, nickel, silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, aluminum oxide, or zinc oxide; in other embodiments, the heat conductive filler may also be other materials with better heat conductive effect.
In the above embodiments, the base material is one or more of polyamides, polyurethanes, polyolefins, polyesters, or polylactic acids; in other embodiments, the base material may be other materials.
In the above embodiment, the substrate with the grid structure is formed by 3D printing; in other embodiments, the matrix with the grid structure can also be formed by hot press molding, injection molding and splicing molding.
Claims (1)
1. A preparation method of an oriented and localized heat conduction composite material is characterized by comprising the following steps:
step 1: preparing a matrix with a hollow high-heat-conduction area or a grid structure in the high-heat-conduction area by a thermoplastic forming method;
for the matrix with the high heat conduction area in the hollow structure, the following preparation steps are as follows:
step 2: preparing the heat-conducting filler in the filling module into a sticky state;
and step 3: injecting the viscous heat-conducting filler into the hollow structure, realizing the construction of an oriented structure of the heat-conducting filler by an electric field method, a magnetic field method or a freezing template method before curing and forming, and then curing and forming to form a composite material with oriented and localized heat-conducting properties;
for a matrix with a grid structure in a high heat conduction area, the following preparation steps are as follows:
step 2 ， : mixing the heat-conducting filler and the adhesive into a viscous mixture;
step 3 ， : injecting a mixture of viscous heat-conducting filler and adhesive into the accommodating grooves, shearing and guiding the viscous mixture by the flow-guiding partition plates between the adjacent accommodating grooves to realize the construction of the orientation structure of the filling module and form the filling module, and forming a composite material with oriented and localized heat-conducting property after the filling module is cured and molded;
the heat conducting filler is one or more of graphite, carbon black, graphene, carbon nano tubes, copper, silver, gold, aluminum, nickel, silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, aluminum oxide or zinc oxide;
the matrix material is one or more of polyamides, polyurethanes, polyolefins, polyesters or polylactic acids.
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6115255A (en) * | 1996-10-10 | 2000-09-05 | Samsung Electronics Co., Ltd. | Hybrid high-power integrated circuit |
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| JP3558548B2 (en) * | 1999-04-02 | 2004-08-25 | 電気化学工業株式会社 | Resin molding, method of manufacturing the same, and heat radiating member for electronic component using the same |
| JP2008169267A (en) * | 2007-01-10 | 2008-07-24 | Sumitomo Electric Ind Ltd | Heat radiator and method for producing the same |
| JP2014093342A (en) * | 2012-11-01 | 2014-05-19 | Mitsubishi Electric Corp | Insulation base and semiconductor device |
| CN104378955B (en) * | 2014-11-03 | 2018-02-06 | 广东美的制冷设备有限公司 | Insulating assembly and circuit board |
| JP6870538B2 (en) * | 2017-08-30 | 2021-05-12 | トヨタ自動車株式会社 | Heat dissipation sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6115255A (en) * | 1996-10-10 | 2000-09-05 | Samsung Electronics Co., Ltd. | Hybrid high-power integrated circuit |
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