CN113088039A - Insulating adhesive film and preparation method and application thereof - Google Patents
Insulating adhesive film and preparation method and application thereof Download PDFInfo
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- CN113088039A CN113088039A CN202110576515.6A CN202110576515A CN113088039A CN 113088039 A CN113088039 A CN 113088039A CN 202110576515 A CN202110576515 A CN 202110576515A CN 113088039 A CN113088039 A CN 113088039A
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- adhesive film
- insulating adhesive
- epoxy resin
- resin
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 96
- 238000002360 preparation method Methods 0.000 title claims abstract description 38
- 239000002994 raw material Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 239000003822 epoxy resin Substances 0.000 claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 35
- 150000002148 esters Chemical class 0.000 claims abstract description 32
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 32
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 32
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003063 flame retardant Substances 0.000 claims abstract description 25
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 22
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 19
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 19
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 16
- 239000000654 additive Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical group CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 13
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 12
- 239000004843 novolac epoxy resin Substances 0.000 claims description 10
- 229920001955 polyphenylene ether Polymers 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 8
- -1 aralkyl biphenyl Chemical compound 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 7
- 239000004305 biphenyl Substances 0.000 claims description 7
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- DALNRYLBTOJSOH-UHFFFAOYSA-N 3,3,5,7,7-pentamethyl-1,2,4-trioxepane Chemical compound CC1CC(C)(C)OOC(C)(C)O1 DALNRYLBTOJSOH-UHFFFAOYSA-N 0.000 claims description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- GXIPHHIBYMWSMN-UHFFFAOYSA-N 6-phenylbenzo[c][2,1]benzoxaphosphinine 6-oxide Chemical compound O1C2=CC=CC=C2C2=CC=CC=C2P1(=O)C1=CC=CC=C1 GXIPHHIBYMWSMN-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 claims description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 2
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000004185 ester group Chemical group 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002585 base Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- 239000011342 resin composition Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 101150114085 soc-2 gene Proteins 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2471/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
Abstract
The invention provides an insulating adhesive film and a preparation method and application thereof. The preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 20-30 parts of multifunctional epoxy resin, 30-40 parts of active ester, 10-20 parts of phenoxy resin, 15-20 parts of vinyl polyphenyl ether resin, 2-25 parts of cross-linking agent and 150-300 parts of filler. The preparation method comprises the following steps: mixing multifunctional epoxy resin, active ester, phenoxy resin, vinyl polyphenyl ether resin, a cross-linking agent, a filler, a catalyst, an initiator, a solvent, optional liquid epoxy resin and a flame retardant, coating the mixture on a substrate, and drying to obtain the insulating adhesive film. The insulating adhesive film provided by the invention has the advantages of lower dielectric loss, better film forming property and higher elongation at break, and is suitable for preparing a PCB (printed circuit board) by a semi-additive method.
Description
Technical Field
The invention belongs to the technical field of resin composite materials, and particularly relates to an insulating adhesive film, and a preparation method and application thereof.
Background
With the development of society and the improvement of technology level, PCB circuit boards become more and more refined, and the circuit less than 3mil gradually becomes the mainstream, and the circuit of the most advanced PCB is less than 0.8mil (20 μm). The forming method of the PCB circuit board is classified into an additive method and a subtractive method, wherein the circuit is formed by etching in the subtractive method, the circuit is reduced, and the subtractive method is not limited to a hole masking acid etching method or a pattern electroplating alkali etching method; different from the subtractive method, in the additive method, the circuit is formed by a copper deposition method, the fully-additive circuit is selectively deposited with copper to the required thickness, the whole process does not need etching, and the low cylinder of the semi-additive method is formed by copper deposition, so that the circuit needs micro-etching. Most of the dielectric layers added by the semi-addition method at present are epoxy resin layers, but the electrical properties of the epoxy resin layers are poor, so how to improve the electrical properties of the epoxy resin composition and make the epoxy resin composition suitable for being used as the dielectric layers in the semi-addition method becomes a current research hotspot.
CN105936745A discloses a resin composition, which comprises the following components: phosphorus-containing flame retardant, reactive unsaturated bond resin; the resin composition further comprises at least one of a hydrogenated styrene butadiene copolymer, a hydrogenated styrene isoprene copolymer, a hydrogenated styrene-butadiene-divinylbenzene copolymer, a methylstyrene copolymer, a petroleum resin, and a cyclic olefin copolymer, or a combination thereof; the resin composition further comprises one or more of epoxy resin, phenol resin, benzoxazine resin, styrene maleic anhydride resin, polyester, amine curing agent, polyamide, polyimide, hardening accelerator, solvent, silane coupling agent and inorganic filler. The resin composition prepared by the technical scheme has large dielectric loss, can be used for preparing prepregs, resin films, back-glued copper frames, laminated plates or printed circuit boards and the like, but is not suitable for being used as a dielectric layer in a semi-additive method.
CN107915830A discloses an active ester curing agent and an epoxy resin composition, wherein the active ester curing agent has an alternating structure of dicyclopentadiene and phenyl ester; the epoxy resin composition comprises 10-90 parts of epoxy resin, 0.1-0.5 part of imidazole compound and 5-25 parts of active ester curing agent; the epoxy resin composition also comprises a flame retardant and a filler. The epoxy resin composition prepared by the technical scheme has high dielectric loss, is difficult to form a film, can be used for preparing prepreg, laminated board and copper-clad plate, and is not suitable for preparing PCB (printed circuit board) by a semi-additive method.
CN108440903A discloses a halogen-free resin composition and a low-fluidity prepreg thereof. The halogen-free resin composition comprises the following components in parts by weight: 20-80 parts of epoxy resin composition, 10-50 parts of phenoxy resin, 10-50 parts of flame retardant, 3-30 parts of toughening agent, 10-80 parts of inorganic filler, 1-10 parts of curing agent, 0-5 parts of accelerator and 0-80 parts of additive. The epoxy resin prepared by the technical scheme has low viscosity and good wettability, but has high dielectric loss and poor electrochemical performance, and is not suitable for being used as a dielectric layer in a semi-additive method.
Therefore, it is a technical problem to be solved at present how to provide a PCB having low dielectric loss, good film forming property, and good mechanical properties, and being suitable for being used as a dielectric layer of a semi-additive process to prepare a fine PCB.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an insulating glue film, and a preparation method and application thereof. According to the invention, through the design of the raw material components for preparing the insulating adhesive film and the adoption of a dual-curing system, the insulating adhesive film has a dual-curing interpenetrating network structure, and the prepared insulating adhesive film has lower dielectric loss, better film forming property and better mechanical property, and can be used for preparing a PCB circuit board by a semi-additive method.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides an insulating adhesive film, and the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 20-30 parts of multifunctional epoxy resin, 30-40 parts of active ester, 10-20 parts of phenoxy resin, 15-20 parts of vinyl polyphenyl ether resin, 2-25 parts of cross-linking agent and 150-300 parts of filler.
According to the invention, through the design of raw material components for preparing the insulating adhesive film and the adoption of a dual-curing system, the insulating adhesive film has a dual-curing interpenetrating network structure, and the insulating adhesive film prepared at the same time has lower dielectric loss, better film forming property and better mechanical property; meanwhile, the vinyl polyphenyl ether resin and the cross-linking agent are used as a second curing system, and the insulating adhesive film prepared by using the vinyl polyphenyl ether resin and the cross-linking agent has low dielectric loss.
According to the invention, by controlling the weight parts of the vinyl polyphenyl ether resin within a specific range, the prepared insulating adhesive film has low dielectric loss and good mechanical property, and simultaneously, the vinyl polyphenyl ether resin and the raw materials for preparing the insulating adhesive film have good compatibility. If the content of the vinyl polyphenyl ether resin is too low, the dielectric loss of the prepared insulating adhesive film is high; if the content of the vinyl polyphenyl ether resin is too much, the compatibility of the vinyl polyphenyl ether resin and other raw materials is poor, and the mechanical property of the prepared insulating adhesive film is poor.
In the invention, the insulating adhesive film refers to an adhesive film prepared by using an insulating material as a raw material, and the adhesive film prepared by using the insulating material also has good insulating property.
In the present invention, the weight part of the multifunctional epoxy resin may be 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, or the like.
The active ester can be 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts or 40 parts by weight.
The weight portion of the phenoxy resin can be 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts or 20 parts, etc.
The vinyl polyphenylene ether resin may be 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, or the like by weight.
The weight portion of the cross-linking agent can be 2,4, 6, 8, 10, 12, 14, 16, 18, 20, 22 or 25 parts, etc.
The weight parts of the filler may be 150 parts, 160 parts, 170 parts, 180 parts, 190 parts, 200 parts, 210 parts, 220 parts, 230 parts, 240 parts, 250 parts, 260 parts, 270 parts, 280 parts, 290 parts, 300 parts, or the like.
The following is a preferred technical solution of the present invention, but not a limitation to the technical solution provided by the present invention, and the object and advantageous effects of the present invention can be better achieved and achieved by the following preferred technical solution.
In a preferred embodiment of the present invention, the polyfunctional epoxy resin is selected from any one or a combination of at least two of dicyclopentadiene type novolac epoxy resins, aralkyl type novolac epoxy resins, biphenyl type novolac epoxy resins, aralkyl biphenyl type novolac epoxy resins, or naphthol type novolac epoxy resins.
Preferably, the active ester is selected from any one of dicyclopentadiene type active ester, biphenyl type active ester or naphthalene type active ester or a combination of at least two of them.
The molar ratio of the ester group in the active ester to the epoxy group in the polyfunctional epoxy resin is preferably (0.8 to 1: 1), and may be, for example, 0.8:1, 0.82:1, 0.84:1, 0.86:1, 0.88:1, 0.9:1, 0.92:1, 0.94:1, 0.96:1, 0.98:1, or 1: 1.
In a preferred embodiment of the present invention, the weight average molecular weight of the phenoxy resin is 20000 to 50000, and may be 20000, 22000, 25000, 27000, 30000, 33000, 35000, 37000, 40000, 42000, 46000, 48000, 50000, or the like.
The vinyl polyphenylene ether resin preferably has a number average molecular weight of 1500 to 3000, and may be 1500, 1800, 2000, 2200, 2400, 2500, 2700, 3000, or the like, for example.
Preferably, the crosslinking agent is selected from triallyl isocyanurate and/or trimethylolpropane trimethacrylate.
As a preferable technical scheme of the invention, the filler is modified spherical silicon micropowder.
Preferably, D of the spherical silicon micropowder50The particle size is 0.2 to 0.7 μm, and may be, for example, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm or 0.7 μm.
According to a preferable technical scheme of the invention, the raw materials for preparing the insulating adhesive film further comprise 15-20 parts of liquid epoxy resin, for example, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts or 20 parts.
Preferably, the liquid epoxy resin is selected from bisphenol F type epoxy resins and/or bisphenol a type epoxy resins.
The liquid epoxy resin preferably has a viscosity of 1000 to 5000 mPas, and may be, for example, 1000 mPas, 1500 mPas, 2000 mPas, 2500 mPas, 3000 mPas, 3500 mPas, 4000 mPas, 4500 mPas or 5000 mPas.
Preferably, the raw material for preparing the insulating adhesive film further comprises 0.1-0.8 part of catalyst, for example, 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part or 0.8 part.
Preferably, the catalyst is selected from 4-dimethylaminopyridine and/or N, N' -diisopropylcarbodiimide.
Preferably, the raw material for preparing the insulating adhesive film further comprises 0.1-0.5 part of an initiator, for example, 0.1 part, 0.2 part, 0.3 part, 0.4 part or 0.5 part.
Preferably, the initiator is selected from any one of 3,3,5,7, 7-pentamethyl-1, 2, 4-trioxepane, di-tert-butylperoxydiisopropylbenzene or 2, 5-bis (2-ethylhexanoylperoxy) -2, 5-dimethylhexane or a combination of at least two thereof.
As a preferable technical scheme of the invention, the raw material for preparing the insulating adhesive film further comprises 5-20 parts of a flame retardant, for example, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts or 20 parts.
Preferably, the flame retardant is a phosphorus-containing flame retardant.
Preferably, the flame retardant is selected from any one of or a combination of at least two of 10- (2, 5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, flame retardant SPB-100 or flame retardant PX-200.
Preferably, the raw material for preparing the insulating adhesive film further comprises 100-300 parts of an organic solvent, for example, 100 parts, 120 parts, 140 parts, 160 parts, 180 parts, 200 parts, 220 parts, 240 parts, 260 parts, 280 parts or 300 parts.
Preferably, the organic solvent is selected from any one of toluene, butanone or cyclohexanone or a combination of at least two thereof.
Preferably, the thickness of the insulating glue film is 10-100 μm, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.
In a second aspect, the present invention provides a method for preparing the insulating adhesive film according to the first aspect, the method comprising the following steps:
mixing multifunctional epoxy resin, active ester, phenoxy resin, vinyl polyphenyl ether resin, a cross-linking agent, a filler, a catalyst, an initiator, a solvent, optional liquid epoxy resin and a flame retardant, coating the mixture on a substrate, and drying to obtain the insulating adhesive film.
In a preferred embodiment of the present invention, the substrate is selected from a PET release film or a copper foil.
Preferably, the drying temperature is 80-130 ℃, for example, 80 ℃, 85 ℃, 90 ℃, 95 ℃, 100 ℃, 105 ℃, 110 ℃, 115 ℃, 120 ℃, 125 ℃ or 130 ℃.
Preferably, the drying time is 3-10 min, for example, 3min, 4min, 5min, 6min, 7min, 8min, 9min or 10 min.
Preferably, the drying step further comprises a post-treatment step.
Preferably, the method of post-treatment is removal of the substrate.
As a preferred technical scheme of the invention, the preparation method specifically comprises the following steps:
uniformly mixing multifunctional epoxy resin, active ester, phenoxy resin, vinyl polyphenyl ether resin, a cross-linking agent, a filler, a catalyst, an initiator, a solvent and optional liquid epoxy resin and a flame retardant, coating the mixture on a base material, drying the base material for 3-10 min at 80-130 ℃, and removing the base material to obtain an insulating adhesive film with the thickness of 10-100 mu m.
In a third aspect, the invention provides an application of the insulating glue film of the first aspect in preparing a PCB (printed circuit board) by a semi-additive method.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through the design of the raw material components for preparing the insulating adhesive film, a dual-curing system is adopted, so that the insulating adhesive film has a dual-curing interpenetrating network structure, the content of each component is controlled within a specific proportion range, the prepared insulating adhesive film has low dielectric loss, good film forming property and good mechanical property, the dielectric constant is 3.1-3.3, the dielectric loss is 0.0036-0.0042, the peeling strength is 1.0-1.3N/mm, the glass transition temperature is 145-152 ℃, the elongation at break is 2.9-3.4%, and the method is suitable for preparing a PCB circuit board by a semi-additive method.
Detailed Description
The technical solution of the present invention is further illustrated by the following specific examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Some of the component sources in the examples and comparative examples are as follows:
multifunctional epoxy resin: nippon Chemicals, NC-3000H; nippon DIC corporation, HP-9500;
active ester: nippon DIC corporation, HPC-8000;
phenoxy resin: mitsubishi chemical corporation, YX-8100, YX-6954;
vinyl polyphenylene ether resin: sabic, SA-9000;
liquid epoxy resin: ZX-1059, Nippon Tekken Co., Ltd;
modified spherical silica micropowder: admatechs, SOC 2.
Example 1
The embodiment provides an insulating adhesive film and a preparation method thereof, wherein the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 25 parts of multifunctional epoxy resin (NC-3000H), 35 parts of active ester, 15 parts of phenoxy resin (YX-8100), 18 parts of liquid epoxy resin, 18 parts of vinyl polyphenyl ether resin, 15 parts of triallyl isocyanurate, 200 parts of modified spherical silica powder, 0.5 part of 4-dimethylaminopyridine, 0.3 part of 3,3,5,7, 7-pentamethyl-1, 2, 4-trioxepane, 0.3 part of flame retardant SPB-10010 parts and 200 parts of toluene.
The preparation method of the insulating glue film comprises the following steps:
uniformly mixing the preparation raw materials of the insulating adhesive film, coating the mixture on a base material, drying the base material at 100 ℃ for 5min, and removing the base material to obtain the insulating adhesive film with the thickness of 80 mu m.
Example 2
The embodiment provides an insulating adhesive film and a preparation method thereof, wherein the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 20 parts of multifunctional epoxy resin (HP-9500), 37 parts of active ester, 20 parts of phenoxy resin (YX-6954), 15 parts of liquid epoxy resin, 15 parts of vinyl polyphenyl ether resin, 4 parts of triallyl isocyanurate, 180 parts of modified spherical silicon micropowder, 0.8 part of 4-dimethylaminopyridine, 0.1 part of di-tert-butylperoxydiisopropylbenzene, 20012 parts of high-heat-resistant phosphate flame retardant PX-and 150 parts of butanone.
The preparation method of the insulating glue film comprises the following steps:
uniformly mixing the preparation raw materials of the insulating adhesive film, coating the mixture on a base material, drying the base material at 80 ℃ for 10min, and removing the base material to obtain the insulating adhesive film with the thickness of 100 mu m.
Example 3
The embodiment provides an insulating adhesive film and a preparation method thereof, wherein the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 28 parts of multifunctional epoxy resin (NC-3000H), 38 parts of active ester, 10 parts of phenoxy resin (YX-8100), 20 parts of liquid epoxy resin, 20 parts of vinyl polyphenyl ether resin, 20 parts of cross-linking agent, 150 parts of modified spherical silica powder, 0.1 part of 4-dimethylaminopyridine, 0.2 part of di-tert-butylperoxydiisopropylbenzene, 5 parts of 10- (2, 5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide and 180 parts of cyclohexanone.
The preparation method of the insulating glue film comprises the following steps:
uniformly mixing the preparation raw materials of the insulating adhesive film, coating the mixture on a base material, drying the base material for 3min at 130 ℃, and removing the base material to obtain the insulating adhesive film with the thickness of 10-100 mu m.
Example 4
The embodiment provides an insulating adhesive film and a preparation method thereof, wherein the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 30 parts of multifunctional epoxy resin (NC-3000H), 30 parts of active ester, 18 parts of phenoxy resin (YX-8100), 16 parts of liquid epoxy resin, 17 parts of vinyl polyphenyl ether resin, 20 parts of cross-linking agent, 150 parts of modified spherical silica powder, 0.8 part of 4-dimethylaminopyridine, 0.4 part of di-tert-butylperoxydiisopropylbenzene, 20 parts of 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 100 parts of toluene.
The preparation method of the insulating glue film comprises the following steps:
uniformly mixing the preparation raw materials of the insulating adhesive film, coating the mixture on a substrate, drying the substrate at 100 ℃ for 7min, and removing the substrate to obtain the insulating adhesive film with the thickness of 10 mu m.
Example 5
The embodiment provides an insulating adhesive film and a preparation method thereof, wherein the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 22 parts of multifunctional epoxy resin (NC-3000H), 40 parts of active ester, 12 parts of phenoxy resin (YX-8100), 16 parts of vinyl polyphenyl ether resin, 25 parts of cross-linking agent, 240 parts of modified spherical silica powder, 0.6 part of 4-dimethylaminopyridine, 0.4 part of 3,3,5,7, 7-pentamethyl-1, 2, 4-trioxepane, 0.10 part of flame retardant SPB-10010 and 300 parts of toluene.
The preparation method of the insulating glue film comprises the following steps:
uniformly mixing the preparation raw materials of the insulating adhesive film, coating the mixture on a base material, drying the base material at 100 ℃ for 8min, and removing the base material to obtain the insulating adhesive film with the thickness of 50 mu m.
Example 6
The present example provides an insulating adhesive film and a preparation method thereof, which are different from example 1 only in that 15 parts by weight of vinyl polyphenylene ether resin is used as a raw material for preparing the insulating adhesive film, and other conditions are the same as example 1.
Example 7
This example provides an insulating adhesive film and a method for preparing the same, which are different from example 1 only in that the raw materials for preparing the insulating adhesive film comprise 20 parts by weight of vinyl polyphenylene ether resin, and the other conditions are the same as example 1.
Comparative example 1
The comparative example provides an insulating adhesive film and a preparation method thereof, and the insulating adhesive film is different from the insulating adhesive film in example 1 only in that the raw materials for preparing the insulating adhesive film comprise 10 parts by weight of vinyl polyphenylene ether resin, and other conditions are the same as those of example 1.
Comparative example 2
The comparative example provides an insulating adhesive film and a preparation method thereof, and the insulating adhesive film is different from the insulating adhesive film in example 1 only in that 25 parts by weight of vinyl polyphenylene ether resin is used as a raw material for preparing the insulating adhesive film, and other conditions are the same as those of example 1.
Comparative example 3
The comparative example provides an insulating adhesive film and a preparation method thereof, and the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 34 parts of multifunctional epoxy resin (NC-3000H), 48 parts of active ester, 20 parts of phenoxy resin (YX-8100), 24 parts of liquid epoxy resin, 200 parts of modified spherical silica powder, 0.8 part of 4-dimethylaminopyridine, 0.10010 part of flame retardant SPB-10010 and 200 parts of toluene;
other conditions were the same as in example 1.
Comparative example 4
The comparative example provides an insulating adhesive film and a preparation method thereof, and the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 69 parts of vinyl polyphenyl ether resin, 57 parts of triallyl isocyanurate, 0.8 part of 3,3,5,7, 7-pentamethyl-1, 2, 4-trioxepane, 200 parts of modified spherical silica micropowder, 100 parts of flame retardant SPB-10010 parts and 200 parts of toluene;
other conditions were the same as in example 1.
The performance of the insulating adhesive films provided in the above examples and comparative examples was tested according to the following test standards:
dielectric constant, dielectric loss: IPC-TM650 dielectric property test method;
peel strength: peeling strength test method in IPC-TM 650;
glass transition temperature: IPC-TM650 TMA test method;
elongation at break: IPC-TM650 DMA test method.
The above examples and comparative examples provide test standard results of the performance of the insulating adhesive films as shown in table 1:
TABLE 1
As shown in Table 1, the insulating adhesive film prepared by the invention has low dielectric loss, good film forming property and good mechanical property by designing the raw material components for preparing the insulating adhesive film and adopting a dual-curing system, and controlling the content of each component within a specific proportion range, and the insulating adhesive film has the advantages of low dielectric constant of 3.1-3.3, dielectric loss of 0.0036-0.0042, peeling strength of 1.0-1.3N/mm, glass transition temperature of 145-152 ℃, elongation at break of 2.9-3.4 percent and is suitable for preparing a PCB circuit board by a semi-additive method.
If the content of the vinylpolyphenylene ether resin is too small compared to example 1 (comparative example 1), the dielectric loss of the prepared insulating adhesive film is 0.005; if the content of the vinyl polyphenylene ether resin is too large (comparative example 2), the compatibility of the vinyl polyphenylene ether resin and other preparation raw materials of the insulating adhesive film is poor, and the elongation at break of the insulating adhesive film prepared further is less than 2.5%. Therefore, the insulating glue film prepared by controlling the content of the vinyl polyphenyl ether resin within a specific proportion range has lower dielectric loss and higher elongation at break.
Compared with the example 1, if the epoxy resin curing system is adopted to prepare the insulating glue film (comparative example 3), the dielectric loss of the prepared insulating glue film is higher than 0.006; if the vinylpolyphenylene ether resin curing system (comparative example 4) was used, no film was formed. Therefore, the insulating adhesive film has lower dielectric constant and better film forming property by designing the raw material components of the insulating adhesive film and further adopting a dual-curing system.
In conclusion, the insulating adhesive film prepared by the invention has the dual-curing interpenetrating network structure, lower dielectric loss, better film forming property and better mechanical property by designing the components of the raw materials for preparing the insulating adhesive film and controlling the content of each component within a specific proportion range.
The applicant states that the present invention is illustrated by the detailed process flow of the present invention through the above examples, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The insulating adhesive film is characterized in that the preparation raw materials of the insulating adhesive film comprise the following components in parts by weight: 20-30 parts of multifunctional epoxy resin, 30-40 parts of active ester, 10-20 parts of phenoxy resin, 15-20 parts of vinyl polyphenyl ether resin, 2-25 parts of cross-linking agent and 150-300 parts of filler.
2. The insulation adhesive film according to claim 1, wherein the multifunctional epoxy resin is selected from any one or a combination of at least two of dicyclopentadiene type novolac epoxy resin, aralkyl type novolac epoxy resin, biphenyl type novolac epoxy resin, aralkyl biphenyl type novolac epoxy resin, or naphthol type novolac epoxy resin;
preferably, the active ester is selected from any one of dicyclopentadiene type active ester, biphenyl type active ester or naphthalene type active ester or the combination of at least two of the dicyclopentadiene type active ester, the biphenyl type active ester or the naphthalene type active ester;
preferably, the molar ratio of the ester group in the active ester to the epoxy group of the multifunctional epoxy resin is (0.8-1): 1.
3. The insulating adhesive film according to claim 1 or 2, wherein the weight average molecular weight of the phenoxy resin is 20000 to 50000;
preferably, the vinyl polyphenylene ether resin has a number average molecular weight of 1500 to 3000;
preferably, the crosslinking agent is selected from triallyl isocyanurate and/or trimethylolpropane trimethacrylate.
4. The insulating glue film according to any one of claims 1 to 3, wherein the filler is modified spherical silica micropowder;
preferably, D of the modified spherical silica micropowder50The particle size is 0.2 to 0.7 μm.
5. The insulating adhesive film according to any one of claims 1 to 4, wherein the raw material for preparing the insulating adhesive film further comprises 15 to 20 parts of liquid epoxy resin;
preferably, the liquid epoxy resin is selected from bisphenol F type epoxy resin and/or bisphenol a type epoxy resin;
preferably, the viscosity of the liquid epoxy resin is 1000-5000 mPa & s;
preferably, the raw materials for preparing the insulating adhesive film further comprise 0.1-0.8 part of a catalyst;
preferably, the catalyst is selected from 4-dimethylaminopyridine and/or N, N' -diisopropylcarbodiimide;
preferably, the raw materials for preparing the insulating adhesive film further comprise 0.1-0.5 part of an initiator;
preferably, the initiator is selected from any one of 3,3,5,7, 7-pentamethyl-1, 2, 4-trioxepane, di-tert-butylperoxydiisopropylbenzene or 2, 5-bis (2-ethylhexanoylperoxy) -2, 5-dimethylhexane or a combination of at least two thereof.
6. The insulating adhesive film according to any one of claims 1 to 5, wherein the raw material for preparing the insulating adhesive film further comprises 5 to 20 parts of a flame retardant;
preferably, the flame retardant is a phosphorus-containing flame retardant;
preferably, the flame retardant is selected from any one of or a combination of at least two of 10- (2, 5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, flame retardant SPB-100 or flame retardant PX-200;
preferably, the raw materials for preparing the insulating adhesive film further comprise 100-300 parts of an organic solvent;
preferably, the organic solvent is selected from any one of toluene, butanone or cyclohexanone or a combination of at least two of the toluene, butanone or cyclohexanone;
preferably, the thickness of the insulating glue film is 10-100 μm.
7. A method for preparing an insulating adhesive film according to any one of claims 1 to 6, comprising the steps of:
mixing multifunctional epoxy resin, active ester, phenoxy resin, vinyl polyphenyl ether resin, a cross-linking agent, a filler, a catalyst, an initiator, a solvent, optional liquid epoxy resin and a flame retardant, coating the mixture on a substrate, and drying to obtain the insulating adhesive film.
8. The method according to claim 7, wherein the substrate is a PET release film or a copper foil;
preferably, the drying temperature is 80-130 ℃;
preferably, the drying time is 3-10 min;
preferably, the drying step further comprises a post-treatment step;
preferably, the method of post-treatment is removal of the substrate.
9. The method according to claim 7 or 8, comprising the following steps:
uniformly mixing multifunctional epoxy resin, active ester, phenoxy resin, vinyl polyphenyl ether resin, a cross-linking agent, a filler, a catalyst, an initiator, a solvent and optional liquid epoxy resin and a flame retardant, coating the mixture on a base material, drying the base material for 3-10 min at 80-130 ℃, and removing the base material to obtain an insulating adhesive film with the thickness of 10-100 mu m.
10. Use of the insulating film according to any one of claims 1 to 6 in the semi-additive process for the manufacture of PCB wiring boards.
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