CN113084680B - Holding table - Google Patents

Holding table Download PDF

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Publication number
CN113084680B
CN113084680B CN202011448391.5A CN202011448391A CN113084680B CN 113084680 B CN113084680 B CN 113084680B CN 202011448391 A CN202011448391 A CN 202011448391A CN 113084680 B CN113084680 B CN 113084680B
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China
Prior art keywords
holding
holding plate
base
unit
recess
Prior art date
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Active
Application number
CN202011448391.5A
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Chinese (zh)
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CN113084680A (en
Inventor
佐胁悟志
加藤圭
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Disco Corp
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Disco Corp
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Filing date
Publication date
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Publication of CN113084680A publication Critical patent/CN113084680A/en
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Publication of CN113084680B publication Critical patent/CN113084680B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/0004—Joining sheets, plates or panels in abutting relationship
    • F16B5/0032—Joining sheets, plates or panels in abutting relationship by moving the sheets, plates, or panels or the interlocking key parallel to the abutting edge
    • F16B5/0036—Joining sheets, plates or panels in abutting relationship by moving the sheets, plates, or panels or the interlocking key parallel to the abutting edge and using hook and slot or keyhole-type connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B23Q2703/04—Work clamping means using fluid means or a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention provides a holding table which has a simple structure and can be automatically replaced by a device. The holding table includes: a holding plate having a holding surface for holding a workpiece; and a base that mounts the holding plate to be detachable. The base has a hook erected from an upper surface, and a recess engaged with the hook is provided on a lower surface of the holding plate, and the holding plate is fixed to the base by receiving the hook in the recess and rotating the holding plate and the base relatively about an axis from a state of being obliquely displaced in a plane direction to a position where the holding plate and the base overlap.

Description

Holding table
Technical Field
The present invention relates to a holding table for holding a workpiece.
Background
A cutting device for cutting a workpiece such as a package substrate with a cutting tool may hold the workpiece with a holding table including: a holding plate having a tool retracting groove corresponding to a predetermined dividing line of the package substrate and a suction port corresponding to each chip; and a base for supporting the holding plate in a detachable manner.
Since the positions of the tool withdrawal groove and the suction hole are different for each type of package substrate, the holding table may be changed to hold the board when the type of package substrate to be cut is changed. Conventionally, a method of fixing a holding plate to a base is mainly vacuum (for example, refer to patent document 1), screw fixing, or a pin tumbler lock (also referred to as a clip or a fastener).
Patent document 1: japanese patent application laid-open No. 2011-114145
However, as shown in patent document 1, in the method of fixing the holding plate by vacuum, a suction source is required for fixing the holding plate, and the entire structure of the base, that is, the holding table is complicated for transmitting negative pressure to the holding plate. In addition, in the method of fixing the holding plate by vacuum, it is difficult to set the cross-sectional area of the flow path for transmitting the negative pressure to the cross-sectional area required for sufficiently fixing the holding plate.
In addition, in the method of fixing the holding plate by screw fixation and cylinder lock, it is difficult to automatically replace the holding plate.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a holding table which has a simple structure and can be automatically replaced by a device.
According to the present invention, there is provided a holding table for holding a workpiece, the holding table comprising: a holding plate having a holding surface for holding a workpiece; and a base to which the holding plate is detachably attached, the base having a hook provided upright from an upper surface, the holding plate having a recess on a lower surface thereof to be engaged with the hook, the holding plate being accommodated in the recess and rotated relative to the base from a state of being obliquely displaced in a plane direction to a superposed positional relationship, whereby the recess is fitted with the hook to fix the holding plate to the base.
Preferably, the hook has: an upright portion erected from an upper surface of the base; and a locking portion extending in a direction intersecting the standing portion, the recess having a fitting portion to be fitted with the locking portion at one end in a plane direction parallel to an extending direction of the holding surface.
Preferably, the recess is formed in the following portion: this portion corresponds to the locus that the hook contacts when the holding plate is rotated relative to the base.
The invention has the following effects: the holding plate can be sufficiently fixed to the cutting device, and automatic replacement of the holding plate can be performed by the device.
Drawings
Fig. 1 is a perspective view showing a configuration example of a cutting device having a holding table according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing the structure of the holding table of the embodiment.
Fig. 3 is a perspective view showing the holding table shown in fig. 2 exploded.
Fig. 4 is a top view of the holding table shown in fig. 2.
Fig. 5 is a plan view schematically showing a holding plate of the holding table shown in fig. 2.
Fig. 6 is a sectional view taken along line VI-VI in fig. 5.
Fig. 7 is a side view showing the structure of a carrying unit of a holding plate replacement mechanism of the cutting device shown in fig. 1.
Fig. 8 is a side view showing a state in which one end portion of a recess of a workpiece held by a conveying unit of the cutting device shown in fig. 1 is positioned above a hook of a base in a vertical direction.
Fig. 9 is a top view showing the retaining plate and the base shown in fig. 8.
Fig. 10 is a side view showing a state in which the lower surface of the holding plate shown in fig. 8 is placed on the upper surface of the base.
Fig. 11 is a plan view showing a state in which the holding plate and the base shown in fig. 10 are positioned in a superposed positional relationship.
Fig. 12 is a cross-sectional view taken along line XII-XII in fig. 11.
Fig. 13 is a cross-sectional view of a main part of a holding table according to modification 1 of the embodiment.
Fig. 14 is a cross-sectional view of a main part of a holding table according to modification 2 of the embodiment.
Fig. 15 is a perspective view of a holding plate of a holding table according to modification 3 of the embodiment.
Fig. 16 is a cross-sectional view of a main portion of the retainer plate shown in fig. 15.
Description of the reference numerals
10: a holding table; 11: a holding surface; 12: a holding plate; 13: a base; 14: a hook; 17: a concave portion; 125: a lower surface; 131: an upper surface; 141: a standing part; 142: a locking part; 172: the other end (one end); 173: a fitting surface (fitting portion); 200: a processed object.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiments. The following components include substantially the same components that can be easily understood by those skilled in the art. The structures described below can be appropriately combined. Various omissions, substitutions and changes in the structure may be made without departing from the spirit of the invention.
[ embodiment ]
A holding table according to an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a configuration example of a cutting device having a holding table according to an embodiment. Fig. 2 is a cross-sectional view showing the structure of the holding table of the embodiment. Fig. 3 is a perspective view showing the holding table shown in fig. 2 exploded. Fig. 4 is a top view of the holding table shown in fig. 2. Fig. 5 is a plan view schematically showing a holding plate of the holding table shown in fig. 2. Fig. 6 is a sectional view taken along line VI-VI in fig. 5. Fig. 7 is a side view showing the structure of a carrying unit of a holding plate replacement mechanism of the cutting device shown in fig. 1.
The holding table 10 of the embodiment constitutes the cutting device 1 shown in fig. 1. The cutting device 1 is a device for cutting an object 200 to be machined. In the embodiment, the work 200 is a package substrate having a substrate, a plurality of device chips mounted on the substrate, and a molding resin covering the device chips. The planar shape of the workpiece 200 is formed in a rectangular flat plate shape. The workpiece 200 has: a device region 201 on which a device chip is mounted on a substrate; and an outer peripheral remaining region 202 which surrounds the device region 201 and on which no device chip is mounted. The device region 201 is formed by mounting a device chip on a region of the substrate divided by the predetermined dividing lines intersecting each other. The device chip is an integrated circuit such as an IC (Integrated Circuit: integrated circuit) or an LSI (Large Scale Integration: large scale integrated circuit).
In the embodiment, the work 200 is a so-called QFN (Quad Flat Non-leaded Package) substrate in which device chips mounted on the substrate are covered with a molding resin and divided into individual packaged device chips along a dividing line by cutting. In the embodiment, the workpiece 200 is a QFN substrate in the present invention, but the present invention is not limited thereto, and may be, for example, a CSP (Chip Scale Packaging: chip scale package) substrate or a BGA (Ball grid array). In the embodiment, if the product number (kind) or the like is different, the number of lines to be divided of the workpiece 200, the number of device chips, the interval between adjacent lines to be divided, or the like is different.
(cutting device)
The cutting device 1 shown in fig. 1 is a cutting device that holds a workpiece 200 by a holding table 10 and performs cutting (corresponding to machining) along a line to be divided by a cutting tool 21. As shown in fig. 1, the cutting device 1 includes: a holding table 10 for sucking and holding the workpiece 200 by the holding surface 11; a cutting unit 20 that cuts the workpiece 200 held by the holding table 10 with a cutting tool 21; a not-shown imaging unit that images the workpiece 200 held by the holding table 10; and a control unit 100.
As shown in fig. 1, the cutting device 1 includes a moving unit 30 that moves the holding table 10 and the cutting unit 20 relative to each other. The mobile unit 30 has at least: an X-axis moving unit 31 as a processing feeding unit that performs processing feeding of the holding table 10 in an X-axis direction parallel to the horizontal direction; a Y-axis moving unit 32 as an indexing-feed unit that performs indexing-feed of the cutting unit 20 in a Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction; a Z-axis moving unit 33 as an infeed unit for feeding the cutting unit 20 in a Z-axis direction parallel to a vertical direction perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 34 that rotates the holding table 10 around an axis parallel to the Z-axis direction.
The X-axis moving unit 31 moves the holding table 10 in the X-axis direction as the machining feed direction, thereby relatively performing machining feed of the holding table 10 and the cutting unit 20 in the X-axis direction. The Y-axis moving unit 32 moves the cutting unit 20 in the Y-axis direction as the indexing direction, thereby indexing the holding table 10 and the cutting unit 20 relatively in the Y-axis direction. The Z-axis moving unit 33 moves the cutting unit 20 in the Z-axis direction as the plunge feed direction, and thereby the holding table 10 and the cutting unit 20 are relatively plunged fed in the Z-axis direction. The rotary movement unit 34 supports the holding table 10, and moves in the X-axis direction together with the holding table 10 by the X-axis movement unit 31. The rotation moving means 34 rotates the base 13 shown in fig. 2 of the holding table 10 about the axis 136, and thereby rotates the holding plate 12 and the base 13 of the holding table 10 about the axes 126 and 136 relatively.
The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 have: a known ball screw rotatably provided around an axis; a known motor for rotating the ball screw around the shaft center; and a known guide rail for supporting the holding table 10 or the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.
The holding table 10 is provided so as to be movable in the X-axis direction in the machining area 2 below the cutting unit 20 and the carry-in/out area 3 separated from below the cutting unit 20 by the X-axis moving unit 31 and for carrying the workpiece 200 in/out, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by the rotary moving unit 34. The structure of the holding table 10 will be described later.
The cutting unit 20 is a cutting member to which a cutting tool 21 for cutting the workpiece 200 held by the holding table 10 is detachably attached. The cutting unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 32 and so as to be movable in the Z-axis direction by the Z-axis moving unit 33 with respect to the workpiece 200 held by the holding table 10.
As shown in fig. 1, the cutting unit 20 is provided on a support frame 5 erected from the apparatus main body 4 via a Y-axis moving unit 32, a Z-axis moving unit 33, and the like. The cutting unit 20 is capable of positioning the cutting tool 21 at an arbitrary position of the holding surface 11 of the holding table 10 by the Y-axis moving unit 32 and the Z-axis moving unit 33.
The cutting unit 20 has: a cutting tool 21; a spindle case 22 provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 32 and a Z-axis moving unit 33; and a spindle 23 rotatably provided to the spindle case 22 about an axis, rotated by a motor not shown, and mounted with the cutting tool 21 at a tip end.
The cutting tool 21 is an extremely thin cutting grinder having a substantially annular shape. In the embodiment, the cutting tool 21 is a so-called hub-shaped tool having an annular circular base and an annular cutting edge disposed on an outer peripheral edge of the circular base, and cuts the workpiece 200. The cutting edge is formed of abrasive grains such as diamond or CBN (Cubic Boron Nitride: cubic boron nitride) and a binder (bonding material) such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting tool 21 may be a so-called shim tool composed only of the cutting edge 212. The spindle 23 is rotated around the axis by a motor, and the cutting tool 21 is rotated. In addition, the axes of the cutting tool 21 and the spindle 23 of the cutting unit 20 are parallel to the Y-axis direction.
The photographing unit is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The imaging unit includes an imaging element that images a region to be divided of the workpiece 200 held by the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS: complementary metal oxide semiconductor) imaging element. The imaging unit captures an image of the workpiece 200 held by the holding table 10 to obtain an image for performing alignment, i.e., alignment of the workpiece 200 and the cutting tool 21, and outputs the obtained image to the control unit 100.
The cutting device 1 further includes: an X-axis direction position detecting means, not shown, for detecting the position of the holding table 10 in the X-axis direction; a Y-axis direction position detecting unit, not shown, for detecting the Y-axis direction position of the cutting unit 20; and a Z-axis direction position detection unit for detecting a Z-axis direction position of the cutting unit 20. The X-axis direction position detecting unit and the Y-axis direction position detecting unit can be constituted by a linear scale and a readhead parallel to the X-axis direction or the Y-axis direction. The Z-axis direction position detection unit detects the Z-axis direction position of the cutter unit 20 by the pulse of the motor. The X-axis direction position detecting means, the Y-axis direction position detecting means, and the Z-axis direction position detecting means output the position of the holding table 10 in the X-axis direction, the Y-axis direction, or the Z-axis direction of the cutting means 20 to the control means 100. In the embodiment, the positions in the X-axis direction, the Y-axis direction, and the Z-axis direction of each component of the cutting device 1 are determined by positions based on a predetermined reference position, not shown.
The control unit 100 controls the respective components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200. In addition, the control unit 100 is a computer, and the control unit 100 has: an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit: central processing unit); a storage device having a Memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory: random access Memory); and an input/output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to each component of the cutting device 1 via the input/output interface device.
The control unit 100 is connected to a display unit, not shown, which is configured by a liquid crystal display device or the like that displays a state of a machining operation, an image, or the like, and an input unit that is used when an operator registers machining content information or the like. The input unit is configured by at least one of a touch panel provided in the display unit and an external input device such as a keyboard.
(holding bench)
As shown in fig. 1 and 2, the holding table 10 is formed in a rectangular shape larger than the workpiece 200. As shown in fig. 1, 2 and 3, the holding table 10 includes: a holding plate 12 having a holding surface 11 for holding the workpiece 200; and a base 13 for attaching the holding plate 12 to be detachable.
The base 13 is formed in a flat plate shape having a rectangular planar shape and a large thickness, and is supported by the rotary movement unit 34. As shown in fig. 2, the upper surface 131 of the base 13 is formed flat parallel to the horizontal direction, and a suction recess 135 connected to the suction source 134 via a suction passage 132 and an opening/closing valve 133 is formed in the center of the upper surface 131. As shown in fig. 3, the base 13 has a hook 14 provided upright from the outer peripheral side of the suction recess 135 of the upper surface 131. The hooks 14 are provided at both ends in the longitudinal direction of the base 13, and two hooks 14 are provided on the base 13, but in the present invention, the positions and the number of the hooks 14 are not limited to those described in the embodiments. As shown in fig. 3, each hook 14 has an upright portion 141 and an engagement portion 142.
The standing portion 141 stands from the upper surface 131 of the base 13 in a direction perpendicular to the upper surface 131. The standing portion 141 is formed in a columnar shape standing from the upper surface 131. In the embodiment, the standing portion 141 is formed in a quadrangular prism shape, but the present invention is not limited to the quadrangular prism shape. The locking portion 142 extends from the upper end of the standing portion 141 in a direction intersecting the standing portion 141. The locking portions 142 of the two hooks 14 extend from the upper ends of the standing portions 141 in opposite directions along the short side direction of the base 13, and extend from the upper ends of the standing portions 141 in the same direction in the circumferential direction about the axial center 136 passing through the center of the upper surface 131 of the base 13 and perpendicular to the upper surface 131. In addition, the lower end surface 143 of the locking portion 142 is parallel to the upper surface 131, and in the embodiment, the thickness of the locking portion 142 is constant over the entire length of the extending direction from the upper end of the standing portion 141.
The holding plate 12 is formed in a flat plate shape having a rectangular shape of the same size as the flat shape of the base 13 and a constant thickness. The holding surface 11 is fixed to the upper surface 131 of the base 13. As shown in fig. 3, 4, and 5, the holding plate 12 has a central chip holding portion 121 and a frame-like portion 122 surrounding the chip holding portion 121, and forms a holding surface 11 for holding the workpiece 200. The holding plate 12 holds the workpiece 200 on the holding surface 11 by placing the workpiece 200 on the holding surface 11.
The holding plate 12 is provided with a relief groove 15 at a position on the holding surface 11 corresponding to a line for dividing the workpiece 200. In the present specification, the corresponding position refers to a position overlapping in the thickness direction. The clearance 15 is provided in the range of the chip holding portion 121 and the frame portion 122. The relief groove 15 is recessed from the holding surface 11 and formed along a line to divide the workpiece 200 held on the holding surface 11. The relief groove 15 is formed to have a width wider than the thickness of the cutting tool 21. The relief groove 15 is provided for the entry of a cutting tool 21 for cutting the workpiece 200 held by the holding surface 11 along a line to be divided.
The chip holding portion 121 is formed of an elastically deformable synthetic resin such as rubber, and is disposed at a position corresponding to the device region 201 of the workpiece 200 mounted on the holding surface 11. The chip holding portion 121 is provided with a suction hole 16 at a position on the upper surface 123, i.e., the holding surface 11, corresponding to the device chip of the workpiece 200. In the embodiment, one suction hole 16 is opened in the upper surface 123, i.e., the region of the holding surface 11 divided by the relief groove 15. The suction hole 16 penetrates the chip holding portion 121 of the holding plate 12 in the thickness direction. In fig. 3 and 5, the relief groove 15 and the suction hole 16 are omitted.
As shown in fig. 5 and 6, the lower surface 125 of the holding plate 12 has a recess 17 that engages with the hook 14. In the embodiment, the recess 17 is provided on the lower surface of the frame-like portion 122 in the lower surface 125 of the holding plate 12, and is formed recessed from the lower surface 125. In the embodiment, the concave portions 17 are provided at both ends in the longitudinal direction of the holding plate 12, and two concave portions 17 are provided on the holding plate 12, but in the present invention, the positions and the number of the concave portions 17 are not limited to those described in the embodiment.
The planar shape of the recess 17 is formed in an arc shape along a circumferential direction centered on an axial center 126 passing through the center of the lower surface 125 of the holding plate 12 and perpendicular to the lower surface 125. Thus, the planar shape of the concave portion 17 is formed in an arc shape along the circumferential direction around the axial center 126, and the concave portion 17 is formed in the following portion of the holding plate 12: this portion corresponds to the locus of contact of the hook 14 when the holding plate 12 and the base 13 are rotated relatively about the axes 126, 136.
In addition, in a state where the lower surface 125 of the holding plate 12 overlaps the upper surface 131 of the base 13 and the holding plate 12 and the base 13 are obliquely offset in the planar direction, the hook 14 enters the inside of the one end 171 of the recess 17. Here, the state in which the holding plate 12 and the base 13 are inclined and offset in the planar direction means a state in which the longitudinal direction of the base 13 intersects with the longitudinal direction of the holding plate 12.
When the lower surface 125 of the holding plate 12 is overlapped with the upper surface 131 of the base 13 and the holding plate 12 are rotated relatively about the axes 126 and 136 from a state where the holding plate 12 and the base 13 are obliquely offset in the planar direction to a superposed positional relationship, the hook 14 on the inner side of the one end 171 of the recess 17 moves toward the other end 172 of the recess 17. The superimposed positional relationship is a state in which the longitudinal direction of the base 13 is parallel to the longitudinal direction of the holding plate 12.
As shown in fig. 6, the other end 172 of the recess 17 of the holding plate 12 has an engagement surface 173 as an engagement portion parallel to the holding surface 11. When the lower surface 125 of the holding plate 12 overlaps the upper surface 131 of the base 13 and the holding plate 12 and the base 13 are positioned in a superposed positional relationship, the fitting surface 173 is brought into close contact with the lower end surface 143 of the locking portion 142 to be fitted with the locking portion 142. The other end 172 of the recess 17 of the holding plate 12 provided with the fitting surface 173 is one end of the recess 17 in the plane direction parallel to the extending direction of the holding surface 11.
According to the above configuration, in the holding table 10, the lower surface 125 of the holding plate 12 overlaps the upper surface 131 of the base 13, the rotation movement unit 34 accommodates the hook 14 in the one end 171 of the recess 17, and the base 13 and the holding plate 12 are relatively rotated about the axes 126, 136 from a state in which the holding plate 12 and the base 13 are obliquely displaced in the planar direction to a superposed positional relationship, whereby the fitting surface 173 of the recess 17 is fitted with the lower end surface 143 of the hook 14, and the holding plate 12 is fixed to the base 13 in a state in which the longitudinal directions are parallel to each other. The holding table 10 mounts the workpiece 200 on the holding surface 11, and the suction hole 16 is sucked by the suction source 134 via the suction passage 132 and the suction concave 135, thereby sucking and holding the workpiece 200 mounted on the holding surface 11. In the embodiment, the holding table 10 directly attracts and holds the workpiece 200 divided into the packaged device chips to the holding surface 11 by the cutting tool 21 inserted into the tool retracting groove 15 without using an adhesive tape.
The holding plate 12 of the holding table 10 according to the embodiment is provided with fitting recesses 18 at both ends in the longitudinal direction. The holding plate 12 of the holding table 10 corresponds to a line for dividing the workpiece 200 of the product number (type) held by the tool withdrawal groove 15, and the suction hole 16 corresponds to the device chip and corresponds to the workpiece 200. If the product number (kind) of the corresponding work piece 200 is different, the number of the relief grooves 15 of the holding plate 12 of the holding table 10, the number of the suction holes 16, the interval between adjacent relief grooves 15, and the like are different. The holding table 10 according to the embodiment is changed according to the product number of the workpiece 200 cut by the holding plate 12 fixed to the base 13.
The cutting device 1 shown in fig. 1 further includes a holding plate replacement mechanism 40 for changing the holding plate 12 fixed to the base 13. The holding plate replacement mechanism 40 replaces the holding plate 12 fixed to the base 13, and changes the holding plate 12 fixed to the base 13 according to the product number of the workpiece 200 cut by the cutting device 1. As shown in fig. 1, the holding plate replacing mechanism 40 includes a holding plate holding portion 41 and a conveying unit 42.
In the embodiment, the holding plate holding portion 41 is provided on the apparatus main body 4 of the cutting apparatus 1. In the embodiment, a plurality (two) of holding plate holding portions 41 are provided to hold the holding plates 12 corresponding to the workpieces 200 having different product numbers.
The carrying unit 42 carries the holding plate 12 between the holding plate holding portion 41 and the base 13 of the carry-in/out area 3, and attaches the holding plate 12 to and from the base 13. The conveyance unit 42 includes: a conveying unit body 44 having a plurality of engaging claws 43 at a lower end thereof; a lifting cylinder 45 for lifting the conveying unit body 44 in the Z-axis direction; and a Y-axis moving unit 46 that is supported by the 2 nd support frame 6 erected from the apparatus main body 4 and moves the lifting cylinder 45 in the Y-axis direction.
The conveying unit body 44 is provided with a plurality of (two in the embodiment) engaging claws 43 in the same number as the engaging recesses 18 provided in the holding plate 12. In the embodiment, the engagement claws 43 are provided at both ends of the conveying unit body 44 in the X-axis direction. As shown in fig. 7, the engaging claw 43 is provided at a lower end with a claw portion 431 capable of being fitted into the fitting recess 18. The conveying unit main body 44 includes a not-shown moving mechanism that moves the engaging claws 43 in a direction to approach and separate the claw portions 431 of the plurality of engaging claws 43 from each other.
The moving mechanism of the conveying unit main body 44 brings the claw portions 431 of the plurality of engaging claws 43 close to each other, and engages the claw portions 431 of the engaging claws 43 with the engaging recess 18, thereby holding the holding plate 12. The moving mechanism of the conveying unit main body 44 moves the claw portions 431 of the plurality of engaging claws 43 away from each other, and releases the engagement of the claw portions 431 of the engaging claws 43 with the engaging recess 18, thereby releasing the holding of the holding plate 12.
The conveying means 42 holds the holding plate 12 on the holding plate holding portion 41 by the conveying portion main body 44, and conveys the conveying portion main body 44 holding the holding plate 12 to the base 13 of the carry-in/out area 3 by the lifting cylinder 45 and the Y-axis moving means 46. After the holding plate 12 held by the conveying unit body 44 is fixed to the base 13, the conveying unit 42 releases the holding of the holding plate 12 by the conveying unit body 44, and conveys the holding plate 12 on the holding plate holding unit 41 to the base 13 of the carry-in/out area 3.
The carrying unit 42 holds the holding plate 12 on the base 13 of the carry-in/out area 3 by the carrying unit main body 44, and carries the carrying unit main body 44 holding the holding plate 12 to the holding plate holding unit 41 by the lifting cylinder 45 and the Y-axis moving unit 46. After the holding plate 12 held by the conveying unit body 44 is held by the holding plate holding unit 41, the conveying unit 42 releases the holding of the holding plate 12 by the conveying unit body 44, and conveys the holding plate 12 on the base 13 to the holding plate holding unit 41.
(machining action of cutting device)
In the cutting device 1, before the start of the machining operation, the operator places the holding plates 12 on the respective holding plate holding portions 41, and registers the machining content information in the control unit 100. The machining content information includes the product number of the workpiece 200 to be machined and the product number of the workpiece 200 corresponding to the holding plate 12 placed on each holding plate holding portion 41.
Then, the cutting device 1 starts the machining operation when receiving a start instruction of the machining operation from the operator. When the cutting device 1 starts the machining operation, the holding plate 12 corresponding to the product number of the workpiece 200 to be machined is attached to the base 13, and the workpiece 200 before the machining is placed on the holding surface 11 of the holding table 10 in the carry-in/out area 3. The cutting device 1 attracts and holds the workpiece 200 to the holding surface 11 of the holding table 10, the x-axis moving means 31 moves the holding table 10 toward the machining region 2, the imaging means images the workpiece 200, and alignment is performed based on the image captured by the imaging means.
The cutting device 1 cuts the cutting tool 21 along each line of division while relatively moving the workpiece 200 and the cutting unit 20 along the line of division until reaching the tool escape slot 15, thereby dividing the workpiece 200 into individual packaged device chips. The cutting device 1 moves the workpiece 200 divided into the individual packaged device chips toward the carry-in/out area 3, and releases the suction and holding of the holding surface 11 in the carry-in/out area 3, thereby ending the machining operation.
(action of mounting the retainer plate)
Next, the mounting operation of the holding plate 12 to the base 13 will be described. Fig. 8 is a side view showing a state in which one end portion of a recess of a workpiece held by a conveying unit of the cutting device shown in fig. 1 is positioned above a hook of a base in a vertical direction. Fig. 9 is a top view showing the retaining plate and the base shown in fig. 8. Fig. 10 is a side view showing a state in which the lower surface of the holding plate shown in fig. 8 is placed on the upper surface of the base. Fig. 11 is a plan view showing a state in which the holding plate and the base shown in fig. 10 are positioned in a superposed positional relationship. Fig. 12 is a cross-sectional view taken along line XII-XII in fig. 11.
In the embodiment, when the holding plate 12 corresponding to the product number of the workpiece 200 to be cut is attached to and fixed to the base 13, the control unit 100 first controls the Y-axis moving unit 46 of the conveying unit 42 of the holding plate changing mechanism 40 so that the conveying unit main body 44 positions the holding plate 12 corresponding to the product number of the workpiece 200 to be cut above the holding plate holding unit 41. After the control unit 100 of the cutting device 1 controls the lifting cylinder 45 and the like of the conveying unit 42 of the holding plate replacing mechanism 40 to lower the conveying unit main body 44, the holding plate 12 corresponding to the product number of the workpiece 200 to be cut is engaged and held by the engagement claw 43, and then the conveying unit main body 44 is raised.
As shown in fig. 8, the control unit 100 of the cutting device 1 controls the Y-axis moving unit 46 of the carrying unit 42 holding the board changing mechanism 40 to position the carrying unit body 44 above the base 13 of the carry-in/out area 3. At this time, in the embodiment, the control unit 100 of the cutting device 1 controls the rotation transfer unit 34, and as shown in fig. 9, positions the holding plate 12 held by the conveying unit body 44 and the base 13 of the carry-in/out area 3 in a state of being inclined and offset in the planar direction so that one end 171 of the recess 17 of the holding plate 12 held by the conveying unit body 44 is positioned above the hook 14. In fig. 9, the suction concave portion 135, the relief groove 15, and the suction hole 16 are omitted.
The control unit 100 of the cutting device 1 controls the lifting cylinder 45 of the carrying unit 42 of the holding plate replacing mechanism 40, lowers the carrying unit body 44, inserts the hooks 14 into the one end 171 of the recess 17 of the holding plate 12 held by the carrying unit body 44, and overlaps the lower surface 125 of the holding plate 12 with the upper surface 131 of the base 13 as shown in fig. 10. In the embodiment, the control unit 100 of the cutting device 1 controls the rotation movement unit 34 to rotate the base 13 around the axis 136 in a direction in which the hook 14 is directed toward the other end 172 of the recess 17. In the embodiment, the control unit 100 of the cutting device 1 controls the rotation movement unit 34, and as shown in fig. 11, stops the rotation of the rotation movement unit 34 when the holding plate 12 and the base 13 are positioned in a superimposed positional relationship from a state of being obliquely shifted. In fig. 11, the relief groove 15 and the suction hole 16 are omitted.
Then, as shown in fig. 12, the lower end surface 143 is brought into close contact with the fitting surface 173, and the lower end surface 143 is fitted to the fitting surface 173, whereby the recess 17 is fitted to the hook 14, and the holding plate 12 is fixed to the base 13. In addition, when the holding plate 12 is fixed to the base 13, the upper surface 131 of the base 13 of the holding table 10, the lower surface 125 of the holding plate 12, and the holding surface 11 are parallel to each other.
The control unit 100 of the cutting device 1 controls the movement mechanism of the conveying unit 42 of the holding plate changing mechanism 40, and after releasing the engagement of the engagement claws 43, controls the lifting cylinder 45 to raise the conveying unit main body 44, and ends the operation of attaching the holding plate 12 to the base 13. When the holding plate 12 is removed from the base 13 and the removed holding plate 12 is conveyed to the holding plate holding portion 41, the cutting device 1 performs an operation opposite to the operation of attaching and fixing the holding plate 12 to the base 13.
As described above, the holding table 10 according to the embodiment has the hooks 14 provided on the base 13 and the recesses 17 provided on the holding plate 12, and therefore has a simple structure and does not occupy an excessive space. In the holding table 10 according to the embodiment, the hook 14 is accommodated in the recess 17, and the holding plate 12 and the base 13 are relatively rotated from a state of being obliquely displaced in the planar direction to a superposed positional relationship, so that the recess 17 is fitted with the hook 14, and therefore, by the relative rotational operation of the holding plate 12 and the base 13, the holding plate 12 can be fixed to the base 13 and the holding plate 12 can be removed from the base 13, and therefore, automatic replacement of the holding plate 12 by the holding plate replacing mechanism 40 as a device is also facilitated.
As a result, the holding table 10 according to the embodiment has the following effects: the holding plate 12 can be sufficiently fixed to the cutting device 1, and the holding plate 12 can be automatically replaced by the holding plate replacing mechanism 40.
In the holding table 10 according to the embodiment, the hook 14 has the standing portion 141 and the locking portion 142, and the recess 17 has the fitting surface 173 to be fitted to the lower end surface 143 of the locking portion 142 at the other end portion, so that the holding plate 12 can be fixed to the base 13.
In the holding table 10 according to the embodiment, the concave portion 17 is formed in an arc shape along the circumferential direction of the hook 14 around the axis 126, and therefore, the holding plate 12 can be attached to and detached from the base 13 by rotating the base 13 and the holding plate 12 around the axes 126 and 136.
[ modification ]
A holding table according to a modification of the embodiment of the present invention will be described with reference to the drawings. Fig. 13 is a cross-sectional view of a main part of a holding table according to modification 1 of the embodiment. Fig. 14 is a cross-sectional view of a main part of a holding table according to modification 2 of the embodiment. Fig. 15 is a perspective view of a holding plate of a holding table according to modification 3 of the embodiment. Fig. 16 is a cross-sectional view of a main portion of the retainer plate shown in fig. 15. In fig. 13, 14, 15 and 16, the same parts as those in the embodiment are denoted by the same reference numerals, and description thereof is omitted.
In the holding table 10 of the present invention, as shown in fig. 13 and 14, the lower end surface 143 of the locking portion 142 of the hook 14 and the fitting surface 173 of the recess 17 that are fitted to each other are inclined with respect to the upper surface 131 of the base 13, the lower surface 125 of the holding plate 12, and the holding surface 11. In the example shown in fig. 13 and 14, the lower end surface 143 of the locking portion 142 of the hook 14 is inclined gradually in a direction away from the upper surface 131 of the base 13 as it is away from the standing portion 141, and the fitting surface 173 is inclined gradually in a direction approaching the lower surface 125 of the holding plate 12 as it is toward the one end 171 of the recess 17. In modification 1 shown in fig. 13, a vertical surface 144 perpendicular to the upper surface 131 of the base 13, the lower surface 125 of the holding plate 12, and the holding surface 11 is formed at the tip of the hook 14, and in modification 2 shown in fig. 14, no vertical surface 144 is formed at the tip of the hook 14, and an angle is formed.
In the holding table 10 of the present invention, as shown in fig. 15 and 16, the recess 17 may penetrate the frame-like portion 122 of the holding plate 12. In the modification 3 shown in fig. 15 and 16, the lower end surface 143 of the locking portion 142 of the hook 14 and the fitting surface 173 of the recess 17 to be fitted with each other may be inclined with respect to the upper surface 131 of the base 13, the lower surface 125 of the holding plate 12, and the holding surface 11, as in the modification 1 and modification 2. In fig. 15, the relief groove 15 and the suction hole 16 are omitted.
In the holding table 10 according to modification 1, modification 2, and modification 3, since the hook 14 is provided on the base 13, the recess 17 is provided on the holding plate 12, and the holding plate 12 and the base 13 are relatively rotated from a state of being obliquely displaced in the planar direction to a superimposed positional relationship while the hook 14 is accommodated in the recess 17, the recess 17 is fitted with the hook 14, and therefore, the following effects are obtained as in the embodiment: the holding plate 12 can be sufficiently fixed to the cutting device 1, and the holding plate 12 can be automatically replaced by the holding plate replacing mechanism 40.
The present invention is not limited to the above-described embodiments and modifications. That is, the present invention can be variously modified and implemented within a range not departing from the gist of the present invention. In the above embodiment, the base 13 is rotated only about the axis 136 to rotate the holding plate 12 and the base 13 relatively, but in the present invention, only the holding plate 12 may be rotated about the axis 126, or both the base 13 and the holding plate 12 may be rotated about the axes 126 and 136.

Claims (2)

1. A holding table for holding a workpiece, characterized in that,
the holding table has:
a holding plate having a holding surface for holding a workpiece; and
a base for mounting the holding plate to be detachable,
the base has hooks provided upright from an upper surface,
the hook has:
an upright portion erected from an upper surface of the base; and
a locking part extending along the direction crossing the vertical part,
the holding plate has a recess on a lower surface thereof to be engaged with the hook,
the recess has a fitting portion to be fitted with the locking portion at one end in a plane direction parallel to an extending direction of the holding surface,
the hook is accommodated in the recess, and the holding plate and the base are relatively rotated from a state of being obliquely displaced in a plane direction to a superposed positional relationship, and the engaging surface of the engaging portion is brought into close contact with the lower end surface of the locking portion to engage with the locking portion, so that the recess engages with the hook to fix the holding plate to the base.
2. The holding table according to claim 1, wherein,
the recess is formed in the following portion: this portion corresponds to the locus that the hook contacts when the holding plate is rotated relative to the base.
CN202011448391.5A 2019-12-19 2020-12-11 Holding table Active CN113084680B (en)

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JP2019229750A JP7361595B2 (en) 2019-12-19 2019-12-19 holding table
JP2019-229750 2019-12-19

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Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092913A (en) * 1996-09-18 1998-04-10 Sony Corp Semiconductor growing susceptor
CN2400818Y (en) * 1999-10-18 2000-10-11 神基科技股份有限公司 Rotary fixing structure
TWM272672U (en) * 2005-03-07 2005-08-11 Yi Yao Co Ltd Easy assembling and disassembling retractable type multi-color stamp pad
JP2006068862A (en) * 2004-09-03 2006-03-16 Disco Abrasive Syst Ltd Chuck table
CN1869498A (en) * 2005-05-24 2006-11-29 鸿富锦精密工业（深圳）有限公司 Retation support device and vertical device using the device
JP2011114145A (en) * 2009-11-26 2011-06-09 Disco Abrasive Syst Ltd Cutting device and cutting method
CN102536009A (en) * 2012-01-19 2012-07-04 中国新兴保信建设总公司 Multi-angle positioning device for vertical hinged door
CN202312031U (en) * 2011-11-04 2012-07-11 李声辉 Dismountable automatic-rotating dining turning plate with electric-heating heat preservation function
CN202419060U (en) * 2011-12-27 2012-09-05 东莞呈越电脑配件有限公司 Quick-release rotating base
TWM458272U (en) * 2013-01-11 2013-08-01 M & S Prec Machinery Co Ltd Automatic rotating-swinging device
JP3189461U (en) * 2013-12-27 2014-03-13 株式会社タテノ Workpiece placement / holding jig
CN105459282A (en) * 2016-01-06 2016-04-06 福建巨邦机械有限公司 Rotary table, positioning block, positioning method, processing device and processing method
CN106670830A (en) * 2016-03-10 2017-05-17 上海大侨誉远精密机械有限公司 Transversely-arranged workbench exchange frame
CN208409006U (en) * 2018-06-01 2019-01-22 福建庆翔机械有限公司 A kind of position rotating platform of auto parts and components trial-production fixture
CN109571053A (en) * 2018-12-29 2019-04-05 广东长盈精密技术有限公司 Five-axis machining apparatus and its workbench
CN109945808A (en) * 2017-12-20 2019-06-28 宁波奉化三湖电子厂 A kind of arc length and the automatic detecting tool of position degree of belt pulley arcuate socket
CN209272319U (en) * 2018-11-19 2019-08-20 南京华万机械配件有限公司 Discharging device on punching machine
CN209394310U (en) * 2018-12-28 2019-09-17 广州市威嘉机床有限公司 A kind of precise rotating platform positioning mechanism
CN110497270A (en) * 2018-05-18 2019-11-26 株式会社迪思科 Cutting apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197720A (en) 2001-12-25 2003-07-11 Hitachi Kokusai Electric Inc Substrate treatment unit
JP2003209162A (en) 2002-01-15 2003-07-25 Sumitomo Electric Ind Ltd Container for semiconductor wafer
JP4784931B2 (en) * 2006-02-09 2011-10-05 エスアイアイ・ナノテクノロジー株式会社 Sample holding mechanism and sample processing / observation device
US20180142497A1 (en) * 2016-11-21 2018-05-24 Hsiang-Chih Hung Door lock

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092913A (en) * 1996-09-18 1998-04-10 Sony Corp Semiconductor growing susceptor
CN2400818Y (en) * 1999-10-18 2000-10-11 神基科技股份有限公司 Rotary fixing structure
JP2006068862A (en) * 2004-09-03 2006-03-16 Disco Abrasive Syst Ltd Chuck table
TWM272672U (en) * 2005-03-07 2005-08-11 Yi Yao Co Ltd Easy assembling and disassembling retractable type multi-color stamp pad
CN1869498A (en) * 2005-05-24 2006-11-29 鸿富锦精密工业（深圳）有限公司 Retation support device and vertical device using the device
JP2011114145A (en) * 2009-11-26 2011-06-09 Disco Abrasive Syst Ltd Cutting device and cutting method
CN202312031U (en) * 2011-11-04 2012-07-11 李声辉 Dismountable automatic-rotating dining turning plate with electric-heating heat preservation function
CN202419060U (en) * 2011-12-27 2012-09-05 东莞呈越电脑配件有限公司 Quick-release rotating base
CN102536009A (en) * 2012-01-19 2012-07-04 中国新兴保信建设总公司 Multi-angle positioning device for vertical hinged door
TWM458272U (en) * 2013-01-11 2013-08-01 M & S Prec Machinery Co Ltd Automatic rotating-swinging device
JP3189461U (en) * 2013-12-27 2014-03-13 株式会社タテノ Workpiece placement / holding jig
CN105459282A (en) * 2016-01-06 2016-04-06 福建巨邦机械有限公司 Rotary table, positioning block, positioning method, processing device and processing method
CN106670830A (en) * 2016-03-10 2017-05-17 上海大侨誉远精密机械有限公司 Transversely-arranged workbench exchange frame
CN109945808A (en) * 2017-12-20 2019-06-28 宁波奉化三湖电子厂 A kind of arc length and the automatic detecting tool of position degree of belt pulley arcuate socket
CN110497270A (en) * 2018-05-18 2019-11-26 株式会社迪思科 Cutting apparatus
CN208409006U (en) * 2018-06-01 2019-01-22 福建庆翔机械有限公司 A kind of position rotating platform of auto parts and components trial-production fixture
CN209272319U (en) * 2018-11-19 2019-08-20 南京华万机械配件有限公司 Discharging device on punching machine
CN209394310U (en) * 2018-12-28 2019-09-17 广州市威嘉机床有限公司 A kind of precise rotating platform positioning mechanism
CN109571053A (en) * 2018-12-29 2019-04-05 广东长盈精密技术有限公司 Five-axis machining apparatus and its workbench

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KR20210079185A (en) 2021-06-29
TW202125686A (en) 2021-07-01
CN113084680A (en) 2021-07-09
JP7361595B2 (en) 2023-10-16
JP2021100015A (en) 2021-07-01

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