CN113084350A - Ultrafast laser micro-nano machining interface positioning device and method - Google Patents
Ultrafast laser micro-nano machining interface positioning device and method Download PDFInfo
- Publication number
- CN113084350A CN113084350A CN202110378824.2A CN202110378824A CN113084350A CN 113084350 A CN113084350 A CN 113084350A CN 202110378824 A CN202110378824 A CN 202110378824A CN 113084350 A CN113084350 A CN 113084350A
- Authority
- CN
- China
- Prior art keywords
- processing
- light
- interface
- optical
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides an ultrafast laser micro-nano processing interface positioning device and a method, wherein the device comprises: the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects an optical contact image through an optical observation instrument; the observation image collector is electrically connected with the processor. The invention can realize the separation of the automatic interface determining process and the laser processing process, has simple structure and low cost, improves the automatic interface determining accuracy and ensures the continuity of the processing process. Therefore, the device and the method for automatically determining the processing interface can be well applied to determining the ultrafast laser micro-nano processing interface.
Description
Technical Field
The invention belongs to the technical field of ultrafast laser micro-nano machining, and particularly relates to an ultrafast laser micro-nano machining interface positioning device and method.
Background
Ultrafast laser micro-nano processing is a laser processing mode which focuses ultrafast laser on the interface of a processing material and a substrate material, so that a processed microstructure can be attached to the substrate material. The determination of the position of the laser processing interface is one of the important factors influencing the processing efficiency, and has strong practical application value for the accurate positioning of the laser processing interface. The existing methods for determining the ultrafast laser processing interface mainly comprise two methods: one is to realize automatic determination of a processing interface by automatically focusing a beam of ultrafast laser on the processing interface [ chinese patent: CN111390377A ], the method is to adjust the relative position between the microscope objective and the material to be processed along the optical axis direction, and detect the intensity of the reflected light in real time during the adjustment process, and determine the processing interface according to the position where the reflected light is strongest. The method uses the same beam of ultrafast laser to carry out automatic focusing as in the processing process, the processing material is easily damaged in the interface searching process, the subsequent processing quality is influenced, and the processing interface determined by the method has low precision and larger error. Another method is to add an additional set of optical equipment, and automatically determine the interface by the method of automatic focusing of the set of optical equipment [ chinese patent: CN111239047A ]. However, this method is costly and complicated in terms of optical path. Therefore, on the premise of not damaging the processing material and not influencing the processing quality, the method has the advantages of simple structure, low cost, accurate and quick determination of the position of the processing interface and guarantee of the continuity of the processing process, and is particularly important.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an ultrafast laser micro-nano processing interface positioning device and method to solve the technical problems.
The invention provides an ultrafast laser micro-nano processing interface positioning device, which comprises:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects optical contact images in a small area through an optical observation instrument; the observation image collector is electrically connected with the processor.
Further, the optical observation instrument includes:
the focusing objective lens is arranged right above the optical contact and is opposite to the optical contact; the beam splitter is arranged right above the focusing objective lens; the filter plate is arranged right above the beam splitter; the lens is arranged right above the filter plate.
Further, the detection light source includes:
the detection laser and the dichroic mirror are arranged on a light path of the processing light beam; the detection light beam emitted by the detection laser is reflected by the dichroic mirror and then is superposed with the light path of the processing light beam; the detection laser emits detection light having a wavelength different from a wavelength of the processing beam.
Furthermore, the observation image collector adopts a high-speed camera.
Further, the apparatus further comprises:
the machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor.
The invention also provides an ultrafast laser micro-nano processing interface positioning method, which comprises the following steps:
extracting a probe light focusing spot area in a small area from the optical contact image;
calculating and analyzing the change relation of the light intensity of the probe light focusing light spot area along with the interface position;
analyzing and calculating to obtain the actual height of the processing platform according to the actual light intensity of the light spot area and the change relation;
and adjusting the machining platform to a target height by using a mechanical motion module according to the actual height.
The beneficial effect of the invention is that,
the ultrafast laser micro-nano processing interface positioning device and the ultrafast laser micro-nano processing interface positioning method provided by the invention have the advantages that the structure is simple, the cost is low, the automatic interface determining process is separated from the laser processing process, the automatic interface determining accuracy is improved, and the continuity of the processing process is ensured. Therefore, the device and the method for automatically determining the processing interface can be well applied to determining the ultrafast laser micro-nano processing interface.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrafast laser micro-nano machining interface positioning device according to an embodiment of the present application;
the system comprises a detection laser 1, a processing light beam 21, a detection light beam 22, a right-side horizontal collimating light beam 23, a left-side horizontal collimating light beam 24, a lower vertical collimating light beam 25, an upper vertical collimating light beam 26, a 3-dichroic mirror, a 4-beam splitter, a 5-focusing objective lens, a 6-processing platform, a 7-processing sample, an 8-filter, a 9-lens and a 10-camera.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1
Referring to fig. 1, the present embodiment provides an ultrafast laser micro-nano processing interface positioning apparatus, including:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form a light contact; the observation image collector collects an optical contact image through an optical observation instrument; the observation image collector is electrically connected with the processor.
The detection light source includes: the detection laser device comprises a detection laser device 1 and a dichroic mirror 3, wherein the dichroic mirror 3 is arranged on a light path of a processing light beam; the detection light emitted by the laser is reflected by the dichroic mirror 3 and then coincides with the light path of the processing light beam. The 780nm detection laser 1 positioned on the optical platform emits a detection light beam 22, the detection light beam 22 is coaxial and in the same direction with the processing light beam 21 after being reflected by the short-wave-pass dichroic mirror 3, the detection light beam 22 is split by the beam splitter 4 and is divided into a left horizontal collimated light beam 24 along the negative direction of the X axis, a lower vertical collimated light beam 25 vertically downward along the Z axis and an upper vertical collimated light beam 26. The exit directions of the left horizontal collimated light beam 24 and the lower vertical collimated light beam 25 are perpendicular to each other. The upper vertical collimated beam 26 is directly captured by the camera 10 for calibrating the instrument angle.
The lower vertical collimated beam 25 is directed through the focusing module to the photoresist process sample interface. The lower vertical collimated light beam 25 is irradiated by the focusing objective 5 into the processing sample 7 on the processing platform 6, and forms signal light through optical action (which can be reflection) of the interface between the processing material (photoresist) and the substrate material (glass sheet, silicon wafer, etc.) in the processing sample 7.
The machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor. The mechanical motion module is used for adjusting the relative position of the processing sample interface and the microscope objective by adjusting the height of the processing sample (the mechanical motion module can adjust the height of the processing platform or the height of the sample placing area of the processing platform).
An optical observation instrument for observing signal light includes the following structure:
the microscope objective 5 is used for collecting the signal light reflected by the processing sample 7 and enabling the signal light to reach the optical signal acquisition module;
the filter 8 is used for filtering other signal lights with different wavelengths from the detection light;
the lens 9 is used for converging the signal light;
the camera 10 is used for collecting the signal light passing through the filter 8 and the lens 9.
And a processor electrically connected with the camera 10 for processing and analyzing the signal light pictures acquired by the camera 10.
And the mechanical motion module is controlled by processor processing control software to continuously adjust in a preset range, and when the relative position of the microscope objective and the interface of the photoresist processing sample is changed, the optical observation instrument acquires signal light at different positions.
Example 2
The embodiment provides an ultrafast laser micro-nano processing interface positioning method, which comprises the following steps:
the processor processes the signal light, only the area around the center of the signal light focusing light spot is reserved, analysis is carried out according to the signal light intensity of different positions (the light intensity analysis can be carried out according to the size of the light spot, pixels and the like), a fitting curve is obtained through light intensity fitting (Gaussian fitting), and finally the relation between the size and the position of the signal light intensity is obtained through an analysis result and the fitting curve.
The actual position of the processing sample interface can be determined according to the signal light intensity and the analyzed relationship between the light intensity and the position, the relative position of the microscope objective and the photoresist processing sample interface is adjusted to a target position by utilizing a mechanical motion module through monitoring the actual position in real time, and the automatic determination of the processing interface is realized.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides an ultrafast laser receives processing interface positioner a little which characterized in that, the device includes:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects optical contact images in a small area through an optical observation instrument; the observation image collector is electrically connected with the processor.
2. The apparatus of claim 1, wherein the optical scope comprises:
the focusing objective lens is arranged right above the optical contact and is opposite to the optical contact; the beam splitter is arranged right above the focusing objective lens; the filter plate is arranged right above the beam splitter; the lens is arranged right above the filter plate.
3. The apparatus of claim 1, wherein the probe light source comprises:
the detection laser and the dichroic mirror are arranged on a light path of the processing light beam; the detection light beam emitted by the detection laser is reflected by the dichroic mirror and then is superposed with the light path of the processing light beam; the detection laser emits detection light having a wavelength different from a wavelength of the processing beam.
4. The device of claim 1, wherein the observation image collector employs a high-speed camera.
5. The apparatus of claim 1, further comprising:
the machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor.
6. An ultrafast laser micro-nano processing interface positioning method is characterized by comprising the following steps:
extracting a probe light focusing spot area in a small area from the optical contact image;
calculating and analyzing the change relation of the light intensity of the probe light focusing light spot area along with the interface position;
analyzing and calculating to obtain the actual height of the processing platform according to the actual light intensity of the light spot area and the change relation;
and adjusting the machining platform to a target height by using a mechanical motion module according to the actual height.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110378824.2A CN113084350A (en) | 2021-04-08 | 2021-04-08 | Ultrafast laser micro-nano machining interface positioning device and method |
PCT/CN2022/000010 WO2022213684A1 (en) | 2021-04-08 | 2022-01-26 | Positioning apparatus and method for ultrafast laser micro-nano processing interface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110378824.2A CN113084350A (en) | 2021-04-08 | 2021-04-08 | Ultrafast laser micro-nano machining interface positioning device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113084350A true CN113084350A (en) | 2021-07-09 |
Family
ID=76675137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110378824.2A Pending CN113084350A (en) | 2021-04-08 | 2021-04-08 | Ultrafast laser micro-nano machining interface positioning device and method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113084350A (en) |
WO (1) | WO2022213684A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
WO2022213684A1 (en) * | 2021-04-08 | 2022-10-13 | 烟台魔技纳米科技有限公司 | Positioning apparatus and method for ultrafast laser micro-nano processing interface |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008029063A1 (en) * | 2008-06-18 | 2009-12-31 | Audi Ag | Method for applying an application structure such as welding seam or adhesive grub on a workpiece, by subjecting a processing head for subjecting the application structure along an application web and monitoring the application structure |
CN208289218U (en) * | 2018-04-28 | 2018-12-28 | 福州大学 | Laser Micro-Machining automatic focusing device based on image procossing |
CN109297940A (en) * | 2018-09-06 | 2019-02-01 | 中国科学院沈阳自动化研究所 | One kind laser defocusing amount self-checking device and its adjusting method under micro-meter scale |
CN109444109A (en) * | 2018-11-13 | 2019-03-08 | 北京理工大学 | The femtosecond laser processing monitoring fusion method and device of confocal Raman-LIBS spectrographic detection |
CN209279975U (en) * | 2018-12-21 | 2019-08-20 | 中国工程物理研究院激光聚变研究中心 | A kind of small scale focal spot positioning system for laser target range |
CN110524108A (en) * | 2019-09-12 | 2019-12-03 | 中南大学 | The method and light path system of positioning laser focus point based on second harmonic |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5361801B2 (en) * | 2010-05-24 | 2013-12-04 | 三菱電機株式会社 | Beam exit position adjusting apparatus and beam exit position adjusting method |
KR101659858B1 (en) * | 2014-06-26 | 2016-09-30 | 주식회사 이오테크닉스 | Laser measuring apparatus, laser processing system and laser measuring method |
CN108413867B (en) * | 2017-04-18 | 2020-08-04 | 北京理工大学 | Laser micro-nano processing pupil differential confocal online monitoring integrated method and device |
CN108971747B (en) * | 2018-08-29 | 2020-07-28 | 华中科技大学 | Ultrafast laser micro-nano machining device with online monitoring function |
CN113084350A (en) * | 2021-04-08 | 2021-07-09 | 烟台魔技纳米科技有限公司 | Ultrafast laser micro-nano machining interface positioning device and method |
-
2021
- 2021-04-08 CN CN202110378824.2A patent/CN113084350A/en active Pending
-
2022
- 2022-01-26 WO PCT/CN2022/000010 patent/WO2022213684A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008029063A1 (en) * | 2008-06-18 | 2009-12-31 | Audi Ag | Method for applying an application structure such as welding seam or adhesive grub on a workpiece, by subjecting a processing head for subjecting the application structure along an application web and monitoring the application structure |
CN208289218U (en) * | 2018-04-28 | 2018-12-28 | 福州大学 | Laser Micro-Machining automatic focusing device based on image procossing |
CN109297940A (en) * | 2018-09-06 | 2019-02-01 | 中国科学院沈阳自动化研究所 | One kind laser defocusing amount self-checking device and its adjusting method under micro-meter scale |
CN109444109A (en) * | 2018-11-13 | 2019-03-08 | 北京理工大学 | The femtosecond laser processing monitoring fusion method and device of confocal Raman-LIBS spectrographic detection |
CN209279975U (en) * | 2018-12-21 | 2019-08-20 | 中国工程物理研究院激光聚变研究中心 | A kind of small scale focal spot positioning system for laser target range |
CN110524108A (en) * | 2019-09-12 | 2019-12-03 | 中南大学 | The method and light path system of positioning laser focus point based on second harmonic |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022213684A1 (en) * | 2021-04-08 | 2022-10-13 | 烟台魔技纳米科技有限公司 | Positioning apparatus and method for ultrafast laser micro-nano processing interface |
CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2022213684A1 (en) | 2022-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109540004B (en) | Optical detection system and detection method thereof | |
WO2022213684A1 (en) | Positioning apparatus and method for ultrafast laser micro-nano processing interface | |
CN103674839B (en) | A kind of visual Sample location operating system based on spot detection and method | |
TWI797296B (en) | System and method for inspecting optical power and thickness of ophthalmic lenses immersed in a solution | |
US9683946B2 (en) | Method and device for detecting defects and method and device for observing defects | |
WO2018227975A1 (en) | Film thickness measuring system and method | |
JP2016020867A (en) | Defect review method and defect review device | |
CN113795778A (en) | Self-calibrating and directional focusing system and method for infinity corrected microscopes | |
JP2018018104A (en) | System, method, and device for determining focal position of objective lens in microscopy imaging system | |
CN109540005B (en) | Optical detection system and optical detection method | |
CN205562431U (en) | Wafer test equipment with auto focus function | |
CN114486910B (en) | Device and method for detecting surface defects of planar optical element | |
CN111239164B (en) | Defect detection device and method thereof | |
JP2016134412A (en) | Defect observation method and device | |
CN209086170U (en) | A kind of high reflection mirror beauty defects parameter characterization device | |
CN113740317A (en) | Laser focusing point position automatic positioning method and system based on spot area | |
CN110146898B (en) | Probe track monitoring and controlling method based on image shooting and image analysis | |
CN105842202A (en) | Multichannel optical element surface particle scattering measuring system and method | |
CN114112322A (en) | Microscope focus offset measurement method based on differential confocal | |
CN113740316A (en) | Laser focusing point position automatic positioning method and system based on light spot position | |
CN109297986A (en) | Laser gyro high reflection mirror beauty defects parameter characterization device and detection method | |
CN207675646U (en) | A kind of Focusing module for gene sequencer | |
CN114778514B (en) | Measuring device and method for nondestructive high aspect ratio structure based on Raman analysis | |
CN113639637B (en) | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof | |
CN109668906A (en) | It is a kind of for measuring the measurement method and device of optical film layer laser damage threshold |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |