CN113084350A - Ultrafast laser micro-nano machining interface positioning device and method - Google Patents
Ultrafast laser micro-nano machining interface positioning device and method Download PDFInfo
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- CN113084350A CN113084350A CN202110378824.2A CN202110378824A CN113084350A CN 113084350 A CN113084350 A CN 113084350A CN 202110378824 A CN202110378824 A CN 202110378824A CN 113084350 A CN113084350 A CN 113084350A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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Abstract
The invention provides an ultrafast laser micro-nano processing interface positioning device and a method, wherein the device comprises: the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects an optical contact image through an optical observation instrument; the observation image collector is electrically connected with the processor. The invention can realize the separation of the automatic interface determining process and the laser processing process, has simple structure and low cost, improves the automatic interface determining accuracy and ensures the continuity of the processing process. Therefore, the device and the method for automatically determining the processing interface can be well applied to determining the ultrafast laser micro-nano processing interface.
Description
Technical Field
The invention belongs to the technical field of ultrafast laser micro-nano machining, and particularly relates to an ultrafast laser micro-nano machining interface positioning device and method.
Background
Ultrafast laser micro-nano processing is a laser processing mode which focuses ultrafast laser on the interface of a processing material and a substrate material, so that a processed microstructure can be attached to the substrate material. The determination of the position of the laser processing interface is one of the important factors influencing the processing efficiency, and has strong practical application value for the accurate positioning of the laser processing interface. The existing methods for determining the ultrafast laser processing interface mainly comprise two methods: one is to realize automatic determination of a processing interface by automatically focusing a beam of ultrafast laser on the processing interface [ chinese patent: CN111390377A ], the method is to adjust the relative position between the microscope objective and the material to be processed along the optical axis direction, and detect the intensity of the reflected light in real time during the adjustment process, and determine the processing interface according to the position where the reflected light is strongest. The method uses the same beam of ultrafast laser to carry out automatic focusing as in the processing process, the processing material is easily damaged in the interface searching process, the subsequent processing quality is influenced, and the processing interface determined by the method has low precision and larger error. Another method is to add an additional set of optical equipment, and automatically determine the interface by the method of automatic focusing of the set of optical equipment [ chinese patent: CN111239047A ]. However, this method is costly and complicated in terms of optical path. Therefore, on the premise of not damaging the processing material and not influencing the processing quality, the method has the advantages of simple structure, low cost, accurate and quick determination of the position of the processing interface and guarantee of the continuity of the processing process, and is particularly important.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an ultrafast laser micro-nano processing interface positioning device and method to solve the technical problems.
The invention provides an ultrafast laser micro-nano processing interface positioning device, which comprises:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects optical contact images in a small area through an optical observation instrument; the observation image collector is electrically connected with the processor.
Further, the optical observation instrument includes:
the focusing objective lens is arranged right above the optical contact and is opposite to the optical contact; the beam splitter is arranged right above the focusing objective lens; the filter plate is arranged right above the beam splitter; the lens is arranged right above the filter plate.
Further, the detection light source includes:
the detection laser and the dichroic mirror are arranged on a light path of the processing light beam; the detection light beam emitted by the detection laser is reflected by the dichroic mirror and then is superposed with the light path of the processing light beam; the detection laser emits detection light having a wavelength different from a wavelength of the processing beam.
Furthermore, the observation image collector adopts a high-speed camera.
Further, the apparatus further comprises:
the machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor.
The invention also provides an ultrafast laser micro-nano processing interface positioning method, which comprises the following steps:
extracting a probe light focusing spot area in a small area from the optical contact image;
calculating and analyzing the change relation of the light intensity of the probe light focusing light spot area along with the interface position;
analyzing and calculating to obtain the actual height of the processing platform according to the actual light intensity of the light spot area and the change relation;
and adjusting the machining platform to a target height by using a mechanical motion module according to the actual height.
The beneficial effect of the invention is that,
the ultrafast laser micro-nano processing interface positioning device and the ultrafast laser micro-nano processing interface positioning method provided by the invention have the advantages that the structure is simple, the cost is low, the automatic interface determining process is separated from the laser processing process, the automatic interface determining accuracy is improved, and the continuity of the processing process is ensured. Therefore, the device and the method for automatically determining the processing interface can be well applied to determining the ultrafast laser micro-nano processing interface.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrafast laser micro-nano machining interface positioning device according to an embodiment of the present application;
the system comprises a detection laser 1, a processing light beam 21, a detection light beam 22, a right-side horizontal collimating light beam 23, a left-side horizontal collimating light beam 24, a lower vertical collimating light beam 25, an upper vertical collimating light beam 26, a 3-dichroic mirror, a 4-beam splitter, a 5-focusing objective lens, a 6-processing platform, a 7-processing sample, an 8-filter, a 9-lens and a 10-camera.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1
Referring to fig. 1, the present embodiment provides an ultrafast laser micro-nano processing interface positioning apparatus, including:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form a light contact; the observation image collector collects an optical contact image through an optical observation instrument; the observation image collector is electrically connected with the processor.
The detection light source includes: the detection laser device comprises a detection laser device 1 and a dichroic mirror 3, wherein the dichroic mirror 3 is arranged on a light path of a processing light beam; the detection light emitted by the laser is reflected by the dichroic mirror 3 and then coincides with the light path of the processing light beam. The 780nm detection laser 1 positioned on the optical platform emits a detection light beam 22, the detection light beam 22 is coaxial and in the same direction with the processing light beam 21 after being reflected by the short-wave-pass dichroic mirror 3, the detection light beam 22 is split by the beam splitter 4 and is divided into a left horizontal collimated light beam 24 along the negative direction of the X axis, a lower vertical collimated light beam 25 vertically downward along the Z axis and an upper vertical collimated light beam 26. The exit directions of the left horizontal collimated light beam 24 and the lower vertical collimated light beam 25 are perpendicular to each other. The upper vertical collimated beam 26 is directly captured by the camera 10 for calibrating the instrument angle.
The lower vertical collimated beam 25 is directed through the focusing module to the photoresist process sample interface. The lower vertical collimated light beam 25 is irradiated by the focusing objective 5 into the processing sample 7 on the processing platform 6, and forms signal light through optical action (which can be reflection) of the interface between the processing material (photoresist) and the substrate material (glass sheet, silicon wafer, etc.) in the processing sample 7.
The machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor. The mechanical motion module is used for adjusting the relative position of the processing sample interface and the microscope objective by adjusting the height of the processing sample (the mechanical motion module can adjust the height of the processing platform or the height of the sample placing area of the processing platform).
An optical observation instrument for observing signal light includes the following structure:
the microscope objective 5 is used for collecting the signal light reflected by the processing sample 7 and enabling the signal light to reach the optical signal acquisition module;
the filter 8 is used for filtering other signal lights with different wavelengths from the detection light;
the lens 9 is used for converging the signal light;
the camera 10 is used for collecting the signal light passing through the filter 8 and the lens 9.
And a processor electrically connected with the camera 10 for processing and analyzing the signal light pictures acquired by the camera 10.
And the mechanical motion module is controlled by processor processing control software to continuously adjust in a preset range, and when the relative position of the microscope objective and the interface of the photoresist processing sample is changed, the optical observation instrument acquires signal light at different positions.
Example 2
The embodiment provides an ultrafast laser micro-nano processing interface positioning method, which comprises the following steps:
the processor processes the signal light, only the area around the center of the signal light focusing light spot is reserved, analysis is carried out according to the signal light intensity of different positions (the light intensity analysis can be carried out according to the size of the light spot, pixels and the like), a fitting curve is obtained through light intensity fitting (Gaussian fitting), and finally the relation between the size and the position of the signal light intensity is obtained through an analysis result and the fitting curve.
The actual position of the processing sample interface can be determined according to the signal light intensity and the analyzed relationship between the light intensity and the position, the relative position of the microscope objective and the photoresist processing sample interface is adjusted to a target position by utilizing a mechanical motion module through monitoring the actual position in real time, and the automatic determination of the processing interface is realized.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides an ultrafast laser receives processing interface positioner a little which characterized in that, the device includes:
the device comprises a detection light source, an optical observation instrument, an observation image collector and a processor, wherein the position of the detection light source is fixed, and a detection light beam emitted by the detection light source irradiates a processing interface to form an optical contact; the observation image collector collects optical contact images in a small area through an optical observation instrument; the observation image collector is electrically connected with the processor.
2. The apparatus of claim 1, wherein the optical scope comprises:
the focusing objective lens is arranged right above the optical contact and is opposite to the optical contact; the beam splitter is arranged right above the focusing objective lens; the filter plate is arranged right above the beam splitter; the lens is arranged right above the filter plate.
3. The apparatus of claim 1, wherein the probe light source comprises:
the detection laser and the dichroic mirror are arranged on a light path of the processing light beam; the detection light beam emitted by the detection laser is reflected by the dichroic mirror and then is superposed with the light path of the processing light beam; the detection laser emits detection light having a wavelength different from a wavelength of the processing beam.
4. The device of claim 1, wherein the observation image collector employs a high-speed camera.
5. The apparatus of claim 1, further comprising:
the machining platform is arranged on a pushing structure of the mechanical motion module; a sample placing area is arranged on the table top of the processing platform; the mechanical motion module is electrically connected with the processor.
6. An ultrafast laser micro-nano processing interface positioning method is characterized by comprising the following steps:
extracting a probe light focusing spot area in a small area from the optical contact image;
calculating and analyzing the change relation of the light intensity of the probe light focusing light spot area along with the interface position;
analyzing and calculating to obtain the actual height of the processing platform according to the actual light intensity of the light spot area and the change relation;
and adjusting the machining platform to a target height by using a mechanical motion module according to the actual height.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110378824.2A CN113084350A (en) | 2021-04-08 | 2021-04-08 | Ultrafast laser micro-nano machining interface positioning device and method |
| PCT/CN2022/000010 WO2022213684A1 (en) | 2021-04-08 | 2022-01-26 | Positioning apparatus and method for ultrafast laser micro-nano processing interface |
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| CN202110378824.2A CN113084350A (en) | 2021-04-08 | 2021-04-08 | Ultrafast laser micro-nano machining interface positioning device and method |
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| CN113084350A true CN113084350A (en) | 2021-07-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
| WO2022213684A1 (en) * | 2021-04-08 | 2022-10-13 | 烟台魔技纳米科技有限公司 | Positioning apparatus and method for ultrafast laser micro-nano processing interface |
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2021
- 2021-04-08 CN CN202110378824.2A patent/CN113084350A/en active Pending
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- 2022-01-26 WO PCT/CN2022/000010 patent/WO2022213684A1/en active Application Filing
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| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
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