CN113064306B - Manufacturing method of substrate structure, substrate structure and display panel - Google Patents
Manufacturing method of substrate structure, substrate structure and display panel Download PDFInfo
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- CN113064306B CN113064306B CN202110280115.0A CN202110280115A CN113064306B CN 113064306 B CN113064306 B CN 113064306B CN 202110280115 A CN202110280115 A CN 202110280115A CN 113064306 B CN113064306 B CN 113064306B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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Abstract
The embodiment of the invention provides a manufacturing method of a substrate structure, the substrate structure and a display panel, wherein the manufacturing method of the substrate structure comprises the following steps: providing a substrate; forming a metal layer over a substrate; the metal layer comprises a first area and a second area, and patterning processing is carried out on the metal layer of the first area at least; forming a protective layer on the metal layer, wherein the protective layer covers the metal layer; patterning the protective layer to remove the protective layer in the second area and expose the metal layer in the second area; and carrying out final patterning treatment on the metal layer in the second area. In the manufacturing method of the substrate structure, the substrate structure and the display panel provided by the embodiment of the invention, because the metal layer is etched twice, the metal layer in the second area keeps the original pattern when the protective layer is developed, the edge of the metal layer is not contacted by the developing solution, the undercut is avoided, an additional insulating layer is not required to be added, the cost is saved, and the thickness of the whole display panel can be thinner.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a method for manufacturing a substrate structure, and a display panel.
Background
In the field of liquid crystal display technology, Liquid Crystal Display (LCD) devices are widely used in tv, notebook computers, mobile phones, personal digital assistants and other products because of their advantages of thin and light profile, low power consumption and no radiation pollution.
The structure of the liquid crystal panel includes an array substrate (array substrate), a color filter substrate (color filter substrate), and a liquid crystal layer formed between the array substrate and the color filter substrate. The array substrate is formed by a photolithography process using a photomask process.
FIGS. 1a to 1f are schematic structural diagrams of steps of a method for fabricating a substrate structure; FIG. 1g is an enlarged view of a portion of FIG. 1f at I. Referring to fig. 1a to fig. 1g, a method for manufacturing a substrate structure includes the following steps: providing a substrate 91; forming a metal layer 93 on the substrate 91, the metal layer 93 including an aluminum layer 932 and a molybdenum layer 934, and the aluminum layer 932 being disposed between the molybdenum layer 934 and the substrate 91; etching the metal layer 93 to pattern the metal layer 93; forming a protective layer 95 on the etched metal layer 93; etching the protective layer 95 to expose a portion of the metal layer 93; an electrode layer 97 is formed on the protective layer 95 and the exposed metal layer 93. In the process of etching the protective layer 95, since the developing solution is alkaline, the aluminum at the edge of the exposed metal layer 93 is replaced by the alkaline solution, and molybdenum remains, so as to form a cavity 936, at this time, an undercut (undercut) phenomenon occurs after the electrode layer 97 is formed, and thus the signal of the electrode layer 97 is interrupted at the edge of the metal layer 93.
To solve the undercut problem, fig. 2 is a schematic structural diagram of another method for manufacturing a substrate structure. Referring to fig. 2, before forming the passivation layer 95, an insulating layer 99 may be formed on the metal layer 93, that is, the metal layer 93 is formed first, and the metal layer 93 is etched to pattern the metal layer 93; forming an insulating layer 99 on the metal layer 93, and etching the insulating layer 99; then, forming a protective layer 95, and etching the protective layer 95; then, the electrode layer 97 is formed; wherein, before the process of depositing the electrode layer, a hole is punched on the insulating layer 99 for subsequently bridging the metal layer 93 and the electrode layer 97; this protects the aluminum at the edge of metal layer 93 and prevents the formation of voids and undercuts. However, the formation of the insulating layer 99 increases a process of forming the insulating layer, increases manufacturing costs, and increases the thickness of the array substrate, thereby increasing the thickness of the entire display panel.
Disclosure of Invention
In order to overcome the disadvantages and shortcomings of the prior art, the present invention provides a method for manufacturing a substrate structure, a substrate structure and a display panel, which solves the undercut problem of a metal layer.
The purpose of the invention is realized by the following technical scheme:
the invention provides a manufacturing method of a substrate structure, which comprises the following steps:
providing a substrate;
forming a metal layer over the substrate;
the metal layer comprises a first area and a second area, and patterning processing is carried out on the metal layer of the first area at least;
forming a protective layer on the metal layer, wherein the protective layer covers the metal layer;
patterning the protective layer to remove the protective layer in the second area and expose the metal layer in the second area;
and carrying out final patterning treatment on the metal layer of the second area.
In one embodiment, the method for manufacturing the substrate structure further includes: and forming an electrode layer on the protective layer, wherein the electrode layer covers the protective layer of the first area and the metal layer of the second area.
In one embodiment, the method for manufacturing the substrate structure further includes: patterning the metal layer of the first area, and patterning the metal layer of the second area to form a pretreatment pattern in the second area; and in the process of carrying out final patterning treatment on the metal layer of the second area, carrying out patterning treatment on the pretreatment pattern to obtain a target pattern.
In one embodiment, the method for manufacturing the substrate structure further includes: and patterning the metal layer of the second area while patterning the metal layer of the first area, and forming an auxiliary pattern in the second area.
In one embodiment, the method for manufacturing the substrate structure further includes: the metal layer at least comprises a first metal layer and a second metal layer, the first metal layer is positioned between the substrate and the second metal layer, and the first metal layer and the second metal layer are made of different materials.
In one embodiment, the method for manufacturing the substrate structure further includes: the first metal layer is made of aluminum and the second metal layer is made of molybdenum.
In one embodiment, the method for manufacturing the substrate structure further includes: when the metal layer in the first area is subjected to patterning treatment, a first photomask is adopted to carry out first exposure on the metal layer; exposing the protective layer by adopting a second photomask when patterning the protective layer; and when the final patterning treatment is carried out on the metal layer in the second area, a third photomask is adopted to carry out secondary exposure on the metal layer.
In one embodiment, the method for manufacturing the substrate structure further includes: a first positioning pattern is arranged on the first photomask, and the first positioning pattern comprises a first part and a second part; a second positioning pattern is arranged on the second photomask; a third positioning pattern is arranged on the third photomask, and the third positioning pattern at least comprises a third part;
the second photomask is aligned with the pattern formed by the second positioning pattern corresponding to the first part of the first positioning pattern, and the third photomask is aligned with the pattern formed by the third part of the third positioning pattern corresponding to the second part of the first positioning pattern.
The invention also provides a substrate structure, which is manufactured by the manufacturing method of the substrate structure;
the substrate structure comprises a base material, a metal layer, a protective layer and an electrode layer which are sequentially overlapped, the metal layer comprises a first area and a second area, the protective layer covers the metal layer of the first area, the metal layer of the second area is exposed, a target pattern is formed on the metal layer in the second area, and no undercut is formed at the target pattern.
The invention also provides a display panel, which comprises an upper substrate and a lower substrate which are oppositely arranged, and a liquid crystal layer which is clamped between the upper substrate and the lower substrate, wherein the upper substrate or the lower substrate comprises the substrate structure.
In the manufacturing method of the substrate structure, the substrate structure and the display panel, the metal layer is etched twice, the metal layer in the second area keeps the original pattern when the protective layer is developed, the edge of the metal layer is not contacted with the developing solution, undercut (undercut) is avoided, an additional insulating layer is not needed, the cost is saved, and the thickness of the whole display panel is thinner.
Drawings
Fig. 1a to fig. 1f are schematic structural diagrams of a substrate structure in each step of a manufacturing method thereof.
FIG. 1g is an enlarged view of a portion I of FIG. 1 f.
FIG. 2 is a schematic diagram of another method for fabricating a substrate structure.
Fig. 3a to fig. 3f are schematic structural diagrams of the substrate structure manufacturing method according to the embodiment of the invention at each step.
Fig. 3g is a partial enlarged view at II in fig. 3 f.
Fig. 4a and 4b are schematic partial patterns of masks used in the method for manufacturing a substrate structure according to an embodiment of the invention.
Fig. 5a is a schematic structural diagram of a display panel according to an embodiment of the invention.
Fig. 5b is a partial enlarged view of fig. 5a at V.
Detailed Description
The following detailed description of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Fig. 3a to fig. 3f are schematic structural diagrams of the substrate structure manufacturing method according to the embodiment of the invention at each step. Fig. 3g is a partial enlarged view at II in fig. 3 f.
Specifically, the method for manufacturing a substrate structure according to an embodiment of the present invention includes the following steps:
s11, please refer to fig. 3a, providing the substrate 11. Specifically, the substrate 11 may be a transparent glass substrate or a plastic substrate. It is understood that the substrate 11 may also be other material layers, such as an insulating layer, a protective layer, etc., i.e. the substrate 11 is not limited to a substrate of a base plate structure.
S13, referring to fig. 3b, a metal layer 13 is formed on the substrate 11. Specifically, the metal layer 13 includes at least a first metal layer 132 and a second metal layer 134, the first metal layer 132 is located between the substrate 11 and the second metal layer 134, and the first metal layer 132 and the second metal layer 134 are different in material. More specifically, the first metal layer 132 may be made of aluminum, and the second metal layer 134 may be made of molybdenum. Of course, the first metal layer 132 and the second metal layer 134 may also be made of other materials, and in general, the material of the first metal layer 132 is more easily eroded by a developing solution (typically, an alkali solution) of a subsequent protection layer than the material of the second metal layer 134. In other embodiments, the metal layer 13 may be made of multiple layers of different metals, and is not limited herein.
S15, referring to fig. 3c, the metal layer 13 includes a first region and a second region, and at least the metal layer 13 in the first region is patterned. In this embodiment, the first region and the second region are not limited to a certain region of the substrate structure as long as there is a metal layer 13 corresponding to the region having the protective layer boundary. For example, the first region is a region having a resist pattern, and the second region is a region having no resist pattern. Specifically, when the metal layer 13 in the first region is subjected to patterning, the metal layer 13 having a pattern in the first region is obtained by performing exposure, development, and etching. That is, the metal layer 13 is first masked with a mask having a pattern, exposed to light, then developed in a developing solution, and finally etched to obtain a pattern.
Specifically, in step S15, the metal layer 13 in the second area is also subjected to a patterning process at the same time, and a pre-process pattern is formed in the second area. Specifically, for example, if the target pattern to be finally formed in the second area is a metal strip with a width of 1 μm, in step S15, a metal strip with a width of 5 μm (i.e., a pre-treatment pattern) is first formed in the second area; alternatively, if the target pattern to be finally formed in the second area is a cross pattern, in step S15, a rectangular block (i.e., a pre-processing pattern) is first formed in the second area. The pre-process pattern can protect the final target pattern and avoid forming undercuts (undercuts) on the final target pattern. It is to be understood that, in step S15 in other embodiments, the patterning process may be performed only on the metal layer 13 in the first region, and the patterning process is not performed on the metal layer 13 in the second region, that is, the pre-treatment pattern may not be formed, and the final target pattern may be formed on the metal layer 13 in the second region at one time in the subsequent step S21.
Specifically, in step S15, the metal layer 13 in the second area may be patterned to form a final auxiliary pattern, such as a cross pattern, in the second area. The auxiliary pattern formed at this time forms undercuts in the subsequent step S19, but such a pattern is generally used only as an aid for a mark or the like, and is not used as a pattern for circuit connection, and therefore has no influence on the performance of the substrate structure.
S17, please refer to fig. 3d, forming a protective layer 15 on the metal layer 13, wherein the protective layer 15 covers the metal layer 13 and the substrate 11 not covered by the metal layer 13. The protective layer 15 is an OC layer, and is made of an insulating material.
S19, please refer to fig. 3e, the passivation layer 15 is patterned to remove the passivation layer 15 in the second area, so as to expose the metal layer 13 in the second area, and leave the passivation layer 15 in the first area. Specifically, when the protective layer 15 is subjected to patterning, the protective layer 15 having a pattern is obtained by performing exposure, development, and etching.
S21, referring to fig. 3f and fig. 3g, the final patterning process is performed on the metal layer 13 in the second area, so that the metal layer 13 in the second area forms a final target pattern. When the metal layer 13 in the second region is subjected to the final patterning process, the metal layer having the final target pattern is obtained through exposure, development, and etching processes.
S23, forming an electrode layer 17 on the passivation layer 15, wherein the electrode layer 17 covers the passivation layer 15 in the first region, the metal layer 13 in the second region, and the substrate 11 in the second region not covered by the metal layer 13. Specifically, the electrode layer 17 may be an ITO layer, i.e., may be made of indium tin oxide or the like. The electrode layer 17 is electrically connected to the metal layer 13 in the second region.
In the manufacturing method of the substrate structure in this embodiment, since the metal layer is etched twice, the metal layer in the second region maintains the original pattern when the protective layer is developed, and the edge of the metal layer is not contacted by the developing solution, so that undercut (undercut) is avoided, and an additional insulating layer is not required, so that the cost is saved and the thickness of the entire substrate structure is reduced.
In this embodiment, the metal layer is disposed directly on the substrate. It is understood that in other embodiments, the metal layer may be disposed in other locations. The method of etching twice can also avoid the problem of undercut of the metal layer.
In this embodiment, in step S15, when the metal layer 13 in the first region is patterned, the metal layer 13 is exposed for the first time by using the first mask; in step S19, when the protective layer 15 is patterned, the protective layer 15 is exposed using the second mask; in step S21, when the final patterning process is performed on the metal layer 13 in the second region, the metal layer 13 is exposed for the second time using the third mask.
Fig. 4a and 4b are schematic partial patterns of masks used in the method for manufacturing a substrate structure according to an embodiment of the invention. Referring to fig. 4a and 4b, the first mask is provided with a first positioning pattern 31 shown by a solid line, the first positioning pattern 31 includes a first portion 312 and a second portion 314, the second mask is provided with a second positioning pattern 33 shown by a dotted line, the third mask is provided with a third positioning pattern 35 shown by a dotted line, and the third positioning pattern 35 at least includes a third portion 352. The second mask is aligned with the first mask by aligning the second alignment patterns 33 with the patterns formed corresponding to the first portions 312 of the first alignment patterns 31, and the third mask is aligned with the first mask by aligning the third portions 352 of the third alignment patterns 35 with the patterns formed corresponding to the second portions 314 of the first alignment patterns 31.
In this embodiment, the third positioning pattern 35 further includes a fourth portion 354. Subsequent masks may be aligned with the third mask through the fourth portion 354 of the third positioning pattern 35.
By manufacturing different positioning patterns on the first photomask, the second photomask and the third photomask, the positioning patterns can be respectively used as alignment references in the subsequent primary etching of the metal layer, the etching of the protective layer and the secondary etching of the metal layer, so that the manufactured patterns are prevented from deviating, and the positioning accuracy is improved.
The invention also provides a substrate structure which is manufactured by the manufacturing method of the substrate structure.
As shown in fig. 3a to 3f, the substrate structure includes a substrate 11, a metal layer 13, a protective layer 15, and an electrode layer 17 stacked in this order. The metal layer 13 includes a first region and a second region, and the protective layer 15 covers the metal layer 13 of the first region and exposes the metal layer 13 of the second region. In the second region, the metal layer 13 is formed with a target pattern and, at the target pattern, there is no undercut. In this embodiment, an auxiliary pattern may be further formed on the metal layer 13, and an undercut may exist at the auxiliary pattern.
In step S15, the metal layer 13 in the second region forms a pre-process pattern and an auxiliary pattern, respectively, in step S19, an undercut is formed at the auxiliary pattern, the pre-process pattern protects the metal layer, and no undercut is generated in the final target pattern formed in step S21. It should be noted that the undercut at the auxiliary pattern means that the edge of the second metal layer 134 of the metal layer 13 extends outward by a certain length relative to the edge of the first metal layer 132, and the non-undercut at the target pattern means that the edge of the second metal layer 134 of the metal layer 13 is flush with the edge of the first metal layer 132 or the edge of the first metal layer 132 extends outward by a certain length relative to the edge of the second metal layer 134.
FIG. 5a is a schematic structural diagram of a display panel according to an embodiment of the present invention; fig. 5b is a partial enlarged view of fig. 5a at V.
Specifically, referring to fig. 5a and 5b, the present embodiment further discloses a display panel, which includes an upper substrate and a lower substrate disposed opposite to each other, and a liquid crystal layer (not shown in the figure) sandwiched between the upper substrate and the lower substrate, wherein the lower substrate in the present embodiment includes the substrate structure as described above.
In the present embodiment, the display panel is, for example, a dimming box for realizing switching of a wide and a narrow viewing angle.
Specifically, the display panel includes a display area and a non-display area. The upper substrate of the display panel comprises a substrate 51, an electrode 52 and a conductive part 53, and the lower substrate of the display panel comprises a base material 11, a metal layer 13, a protective layer 15 and an electrode layer 17 which are sequentially stacked. The display area corresponds to a first area of the metal layer 13, and the non-display area corresponds to a second area of the metal layer 13.
The electrode 52 of the upper substrate is electrically connected to the conductive portion 53 through a transfer portion (transfer)55, and the electrode 52 is further electrically connected to the first pin 54, so as to transmit an electrical signal to the electrode 52 through the first pin 54.
The lower substrate of the display panel comprises a substrate 11, a metal layer 13, a protective layer 15 and an electrode layer 17 which are sequentially stacked. The electrode layer 17 of the lower substrate is electrically connected to the second pins 56, so as to transmit the electrical signal to the electrode layer 17 through the second pins 56. The electrode layer 17 and the electrode 52 may be formed as a whole surface, and a vertical electric field is formed therebetween to control liquid crystal molecules of the liquid crystal layer, thereby realizing a wide-narrow viewing angle switching function. Here, the lower substrate may be manufactured by the above-described manufacturing method of the substrate structure, so that the formation of an undercut at the dashed frame (i.e., at the edge of the metal layer 15) in fig. 5b may be avoided.
It is understood that the manufacturing method of the substrate structure can also be used for manufacturing an array substrate in a display panel for displaying pictures. The substrate structure can be manufactured by the manufacturing method of the substrate structure under the condition that the protective layer is partially covered and partially uncovered above the metal layer, so that the problem of undercut of the metal layer is avoided.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and include, for example, fixed and removable connections as well as integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", etc., indicate the orientation or weight relationship based on the orientation or weight relationship shown in the drawings, only for the sake of clarity and descriptive convenience of the technical solution, and thus should not be construed as limiting the present invention.
As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
As used herein, the meaning of "a plurality" or "a plurality" is two or more, unless otherwise specified.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (9)
1. A method for manufacturing a substrate structure, comprising:
providing a substrate (11);
forming a metal layer (13) over the substrate (11);
the metal layer (13) comprises a first area and a second area, and the metal layer (13) of the first area is subjected to patterning treatment at least;
forming a protective layer (15) on the metal layer (13), wherein the protective layer (15) covers the metal layer (13);
patterning the protective layer (15) to remove the protective layer (15) in the second area and expose the metal layer (13) in the second area;
-subjecting said metal layer (13) of said second region to a final patterning treatment;
the method for manufacturing the substrate structure further comprises the following steps:
forming an electrode layer (17) on the protective layer (15), wherein the electrode layer (17) covers the protective layer (15) of the first area and the metal layer (13) of the second area.
2. The method of claim 1, further comprising patterning the metal layer (13) in the second region while patterning the metal layer (13) in the first region to form a pre-treatment pattern in the second region; and in the process of carrying out final patterning treatment on the metal layer (13) of the second area, carrying out patterning treatment on the pretreatment pattern to obtain a target pattern.
3. The method of manufacturing a substrate structure according to claim 1, further comprising patterning the metal layer (13) in the second region while patterning the metal layer (13) in the first region, and forming an auxiliary pattern in the second region.
4. The method of manufacturing a substrate structure according to claim 1, wherein the metal layer (13) comprises at least a first metal layer (132) and a second metal layer (134), the first metal layer (132) being located between the base material (11) and the second metal layer (134), the first metal layer (132) and the second metal layer (134) being of different materials.
5. The method of manufacturing a substrate structure according to claim 4, wherein the first metal layer (132) is made of aluminum and the second metal layer (134) is made of molybdenum.
6. The method of manufacturing a substrate structure according to claim 1, wherein, when patterning the metal layer (13) in the first region, a first exposure is performed on the metal layer (13) using a first mask; when the protective layer (15) is subjected to patterning treatment, a second photomask is adopted to expose the protective layer (15); and when the final patterning treatment is carried out on the metal layer (13) in the second area, a third photomask is adopted to carry out second exposure on the metal layer (13).
7. The method of claim 6, wherein the first mask has a first positioning pattern (31), and the first positioning pattern (31) comprises a first portion (312) and a second portion (314); a second positioning pattern (33) is arranged on the second photomask; a third positioning pattern (35) is arranged on the third photomask, and the third positioning pattern (35) at least comprises a third part (352);
wherein the second mask is aligned with a pattern formed by the second positioning pattern (33) corresponding to the first portion (312) of the first positioning pattern (31), and the third mask is aligned with a pattern formed by the third portion (352) of the third positioning pattern (35) corresponding to the second portion (314) of the first positioning pattern (31).
8. A substrate structure, characterized in that the substrate structure is manufactured by the method for manufacturing a substrate structure according to any one of claims 1 to 7;
the base plate structure comprises a base material (11), a metal layer (13), a protection layer (15) and an electrode layer (17), wherein the base material, the metal layer (13), the protection layer (15) and the electrode layer (17) are sequentially stacked, the metal layer (13) comprises a first area and a second area, the protection layer (15) covers the metal layer (13) of the first area, the metal layer (13) of the second area is exposed, a target pattern is formed on the metal layer (13) of the second area, and no undercut is formed at the target pattern.
9. A display panel comprising an upper substrate and a lower substrate disposed opposite to each other, and a liquid crystal layer interposed between the upper substrate and the lower substrate, wherein the upper substrate or the lower substrate comprises the substrate structure according to claim 8.
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| CN101330062A (en) * | 2008-07-25 | 2008-12-24 | 友达光电股份有限公司 | Method for preparing thin-film transistor array substrate |
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