CN113059250B - Wire bonding machine and bonding head structure thereof - Google Patents
Wire bonding machine and bonding head structure thereof Download PDFInfo
- Publication number
- CN113059250B CN113059250B CN202110606978.2A CN202110606978A CN113059250B CN 113059250 B CN113059250 B CN 113059250B CN 202110606978 A CN202110606978 A CN 202110606978A CN 113059250 B CN113059250 B CN 113059250B
- Authority
- CN
- China
- Prior art keywords
- bonding head
- voice coil
- coil motor
- head main
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78841—Means for moving parts of the pressing portion, e.g. tip or head
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110606978.2A CN113059250B (en) | 2021-06-01 | 2021-06-01 | Wire bonding machine and bonding head structure thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110606978.2A CN113059250B (en) | 2021-06-01 | 2021-06-01 | Wire bonding machine and bonding head structure thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113059250A CN113059250A (en) | 2021-07-02 |
CN113059250B true CN113059250B (en) | 2021-09-28 |
Family
ID=76568783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110606978.2A Active CN113059250B (en) | 2021-06-01 | 2021-06-01 | Wire bonding machine and bonding head structure thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113059250B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113814623B (en) * | 2021-11-23 | 2022-02-22 | 大族激光科技产业集团股份有限公司 | Welding force correction method and correction device |
CN117650087B (en) * | 2024-01-29 | 2024-05-28 | 深圳市泰达智能装备有限公司 | Welding machine head and bonding machine |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7135792B2 (en) * | 2004-05-12 | 2006-11-14 | Dexter Magnetic Technologies, Inc. | High field voice coil motor |
GB2489995A (en) * | 2011-04-15 | 2012-10-17 | Pss Belgium Nv | Magnetic circuit for a loudspeaker driver |
CN105789101B (en) * | 2014-12-25 | 2020-05-05 | 北京中电科电子装备有限公司 | Chip supply mechanism and chip bonding machine |
CN107453580B (en) * | 2016-05-31 | 2020-07-14 | 上海微电子装备(集团)股份有限公司 | Voice coil motor and manufacturing method thereof |
WO2017208876A1 (en) * | 2016-06-03 | 2017-12-07 | 富士フイルム株式会社 | Voice coil motor, lens moving device, and imaging device |
CN106160270A (en) * | 2016-07-25 | 2016-11-23 | 惠州市大亚湾永昶电子工业有限公司 | A kind of VCM motor Magnet of improvement |
CN209439591U (en) * | 2018-09-28 | 2019-09-27 | 广东阿达智能装备有限公司 | Bonding joint device and supersonic bonding machine |
CN112743264A (en) * | 2020-12-26 | 2021-05-04 | 东莞市凯格精机股份有限公司 | Welding head moving device and wire welding machine |
-
2021
- 2021-06-01 CN CN202110606978.2A patent/CN113059250B/en active Active
Also Published As
Publication number | Publication date |
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CN113059250A (en) | 2021-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Xinyang Inventor after: He Yunbo Inventor after: Luo Cheng Inventor after: Yan Yijun Inventor after: Liu Qingshan Inventor after: Guan Xiaoming Inventor before: Zhang Xinyang Inventor before: He Yunbo Inventor before: Luo Cheng Inventor before: Yan Yijun Inventor before: Liu Qingshan Inventor before: Guan Xiaoming |