CN113054765A - Novel semiconductor refrigeration motor - Google Patents
Novel semiconductor refrigeration motor Download PDFInfo
- Publication number
- CN113054765A CN113054765A CN202110473536.5A CN202110473536A CN113054765A CN 113054765 A CN113054765 A CN 113054765A CN 202110473536 A CN202110473536 A CN 202110473536A CN 113054765 A CN113054765 A CN 113054765A
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- China
- Prior art keywords
- motor
- winding
- refrigeration
- material layer
- semiconductor material
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/12—Stationary parts of the magnetic circuit
- H02K1/16—Stator cores with slots for windings
- H02K1/165—Shape, form or location of the slots
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/32—Windings characterised by the shape, form or construction of the insulation
- H02K3/34—Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
- H02K3/345—Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation between conductor and core, e.g. slot insulation
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Abstract
The invention discloses a novel semiconductor refrigeration motor which comprises a stator core and a motor rotor matched with the stator core, wherein a plurality of winding slots are formed in the inner wall of the stator core, motor windings are arranged in the winding slots, semiconductor refrigeration parts are arranged in the winding slots, and the semiconductor refrigeration parts are positioned between the motor windings and the inner wall of the winding slots and isolate the motor windings from the inner wall of the winding slots in an insulating manner. Has the advantages that: the quick heat dissipation is realized, the heat dissipation efficiency of the motor is improved, and the phenomenon of motor burnout caused by overheating of a motor winding is avoided; the heat conducting direction of the semiconductor refrigerating part is from the winding slot to the stator core, so that the heat transferred from the motor winding to the motor rotor is greatly reduced, the demagnetization caused by the temperature rise of the permanent magnet of the motor rotor is prevented, and the running efficiency of the motor is ensured.
Description
Technical Field
The invention relates to the technical field of motors, in particular to a novel semiconductor refrigeration motor.
Background
The traditional slot inner structure of the motor stator comprises a motor stator iron core, insulation materials between the stator iron core and a winding, a motor winding and inter-winding paint. The heating parts of the motor are the motor winding and the motor stator and rotor core when the motor works, and for a low-speed large-torque or high-power-density motor, the heating parts are mainly concentrated on the motor winding. The heat of the motor winding is transferred to the stator core of the motor through the paint between the windings and the insulating material between the stator core and the windings, and then is radiated outwards through the stator core of the motor and the shell. The heat dissipation mode has low efficiency, the temperature of the motor winding is quickly raised, and after the motor winding reaches a certain temperature, paint between the motor windings and insulating materials between the stator core and the winding are easily damaged, so that the motor is burnt; meanwhile, the heat of the winding can be transferred to the motor rotor through the air gap of the stator and rotor pieces of the motor, and the motor rotor can generate a demagnetization phenomenon at high temperature, so that the rotation efficiency of the motor is reduced. Based on this, the applicant proposes a semiconductor refrigeration motor with good heat dissipation performance.
Disclosure of Invention
The present invention is directed to a novel semiconductor refrigeration motor for solving the above problems, and a preferred embodiment of the present invention includes: through setting up semiconductor refrigeration structure, can derive the heat that produces on the motor winding fast during with the motor operation to guarantee the running state of motor, technical effect such as the rotation efficiency of stable motor, see the explanation below for details.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a novel semiconductor refrigeration motor, which comprises a stator core and a motor rotor matched with the stator core, wherein a plurality of winding slots are formed in the inner wall of the stator core, motor windings are arranged in the winding slots, and semiconductor refrigeration parts are arranged in the winding slots, are positioned between the motor windings and the inner wall of the winding slots and insulate and isolate the motor windings from the inner wall of the winding slots;
the semiconductor refrigeration part comprises a semiconductor material layer, the semiconductor material layer is a refrigeration part cold surface of a contact surface of the motor winding, the contact surface of the inner wall of the winding groove is a refrigeration part hot surface, and a power connection part connected with a direct-current power supply is further arranged on the semiconductor material layer.
Preferably, the motor windings in the same winding slot are connected in an insulated mode through inter-winding paint, and the motor windings are in close contact with the cold surface of the refrigerating portion through the insulating paint.
Preferably, the semiconductor material layer and the winding slot have the same inner shape, two side edges extend to the opening of the winding slot, and the hot surface of the refrigeration part is tightly attached to the inner wall of the winding slot.
Preferably, an inward flanging is formed at the opening of the winding slot, and a folded edge structure is formed on the semiconductor material layer corresponding to the inward flanging, so that the edge of the semiconductor material layer is completely located inside the winding slot.
Preferably, the electric connection part comprises a refrigeration control anode and a refrigeration control cathode which are respectively connected with the edges of the two sides of the semiconductor material layer.
In conclusion, the beneficial effects of the invention are as follows: 1. the semiconductor refrigerating part is arranged in the winding slot, so that heat generated by a motor winding in the running process of the motor can be quickly led out to the stator core and then led out through the shell of the motor, quick heat dissipation is realized, the heat dissipation efficiency of the motor is improved, and the phenomenon that the motor is burnt due to overheating of the motor winding is avoided;
2. the heat conducting direction of the semiconductor refrigerating part is from the winding slot to the stator core, so that the heat transferred from the motor winding to the motor rotor is greatly reduced, the demagnetization caused by the temperature rise of the permanent magnet of the motor rotor is prevented, and the running efficiency of the motor is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is an enlarged schematic view of a portion a in fig. 1.
The reference numerals are explained below:
1. a stator core; 2. a semiconductor refrigerating section; 21. a hot side of the refrigerating part; 22. a layer of semiconductor material; 23. a refrigerating part for refrigerating the noodles; 24. a refrigeration control cathode; 25. a refrigeration control positive electrode; 3. a winding slot; 4. and (4) motor windings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Referring to fig. 1-2, the invention provides a novel semiconductor refrigeration motor, which comprises a stator core 1 and a motor rotor matched with the stator core 1, wherein a plurality of winding slots 3 are formed in the inner wall of the stator core 1, a motor winding 4 is arranged in each winding slot 3, a semiconductor refrigeration part 2 is arranged in each winding slot 3, and each semiconductor refrigeration part 2 is positioned between each motor winding 4 and the inner wall of each winding slot 3 and insulates and isolates the motor winding 4 from the inner wall of each winding slot 3;
the semiconductor refrigerating part 2 comprises a semiconductor material layer 22, the contact surface of the semiconductor material layer 22 and the motor winding 4 is a refrigerating part cold surface 23, the motor winding 4 in the same winding groove 3 is in insulated connection through inter-winding paint, and the motor winding 4 is in close contact with the refrigerating part cold surface 23 through insulating paint; the contact surface of the semiconductor material layer 22 and the inner wall of the winding slot 3 is a refrigerating part hot surface 21, the shape of the semiconductor material layer is consistent with that of the inner part of the winding slot 3, two side edges extend to the opening part of the winding slot 3, and the refrigerating part hot surface 21 is tightly attached to the inner wall of the winding slot 3; and the semiconductor material layer 22 is also provided with an electric connection part connected with a direct current power supply, the electric connection part comprises a refrigeration control anode 25 and a refrigeration control cathode 24 which are respectively connected with the two side edges of the semiconductor material layer 22, and the electric connection part can be used for controlling the current input in the electric connection part and adjusting the current, namely, the temperature difference between the hot surface 21 of the refrigerating part and the cold surface 23 of the refrigerating part can be adjusted, aiming at a low-speed large-torque or high-power density motor, the electric density is high, the motor winding 4 heats seriously, the heat loss of the motor is mainly concentrated on the motor winding 4, the semiconductor material layer 22 adopts semiconductor refrigeration materials, the temperature of the cold and hot surfaces can be adjusted by adjusting the input current, and the cold surface 23 of the refrigerating part can instantly absorb the winding heat loss of the motor winding 4 under the working conditions of high current and high power density, so that the winding temperature is reduced, and the reliability of the motor winding 4 is improved; the hot face 21 of portion that refrigerates simultaneously contacts with stator core 1, can conduct the heat to stator core 1 fast to transmit to motor housing fast, increased the difference in temperature of motor housing with the contact air, and then realize dispelling the heat fast.
The principle of semiconductor refrigeration is as follows: semiconductor cooling fins are a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts of the two types are equal, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset. The temperature of the cold and hot ends will not change continuously. In order to reach lower temperature, the temperature of the hot end can be reduced by adopting a heat dissipation mode and the like. When an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, and the current flows to the joint of the P-type element from the N-type element to absorb heat to form a cold end; the junction from the P-type element to the N-type element releases heat to become the hot end. The amount of heat absorption and heat release is determined by the amount of current and the number of pairs of elements of semiconductor material N, P, and thus, by adjusting the amount of current input into semiconductor material layer 22, the heat dissipation efficiency can be adjusted.
In order to better limit the position of the semiconductor material layer 22, an inward flange is formed at the opening of the winding slot 3, and the semiconductor material layer 22 is formed with a folded edge structure corresponding to the inward flange, so that the edge of the semiconductor material layer 22 is completely positioned inside the winding slot 3, thereby completely avoiding the contact between the semiconductor material layer 22 and the motor rotor, increasing the contact area between the hot surface 21 of the refrigerating part and the inner wall of the winding slot 3, and further improving the heat dissipation efficiency.
The semiconductor refrigerating part 2 is arranged in the winding slot 3, so that heat generated by the motor winding 4 in the running process of the motor can be quickly led out to the stator core 1 and then led out through the shell of the motor, quick heat dissipation is realized, the heat dissipation efficiency of the motor is improved, and the phenomenon that the motor is burnt out due to overheating of the motor winding 4 is avoided; because the heat conduction direction of the semiconductor refrigerating part 2 is from the winding slot 3 to the stator core 1, the heat transferred to the motor rotor by the motor winding 4 can be greatly reduced, thereby preventing the demagnetization caused by the temperature rise of the permanent magnet of the motor rotor and ensuring the operating efficiency of the motor.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (5)
1. The novel semiconductor refrigeration motor is characterized by comprising a stator core (1) and a motor rotor matched with the stator core (1), wherein a plurality of winding slots (3) are formed in the inner wall of the stator core (1), a motor winding (4) is arranged in each winding slot (3), a semiconductor refrigeration part (2) is arranged in each winding slot (3), and each semiconductor refrigeration part (2) is positioned between each motor winding (4) and the inner wall of each winding slot (3) and insulates and isolates the motor winding (4) from the inner wall of each winding slot (3);
semiconductor refrigeration portion (2) include semiconductor material layer (22), semiconductor material layer (22) with the contact surface of motor winding (4) is refrigeration portion cold side (23), with the contact surface of winding groove (3) inner wall is refrigeration portion hot side (21), just still be provided with the portion of connecting with power of connecting DC power supply on semiconductor material layer (22).
2. The novel semiconductor refrigeration motor according to claim 1, characterized in that: the motor winding (4) in the same winding groove (3) is connected in an insulating mode through inter-winding paint, and the motor winding (4) is in close contact with the cold surface (23) of the refrigerating portion through the insulating paint.
3. The novel semiconductor refrigeration motor according to claim 1, characterized in that: the semiconductor material layer (22) and the winding groove (3) are consistent in internal shape, two side edges extend to the opening of the winding groove (3), and the hot surface (21) of the refrigerating portion is tightly attached to the inner wall of the winding groove (3).
4. The novel semiconductor refrigeration motor according to claim 1, characterized in that: an inward flanging is formed at the opening part of the winding groove (3), and a folded edge structure is formed on the semiconductor material layer (22) corresponding to the inward flanging, so that the edge of the semiconductor material layer (22) is completely positioned in the winding groove (3).
5. The novel semiconductor refrigeration motor according to claim 1, characterized in that: the electric connection part comprises a refrigeration control anode (25) and a refrigeration control cathode (24) which are respectively connected to the two side edges of the semiconductor material layer (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110473536.5A CN113054765A (en) | 2021-04-29 | 2021-04-29 | Novel semiconductor refrigeration motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110473536.5A CN113054765A (en) | 2021-04-29 | 2021-04-29 | Novel semiconductor refrigeration motor |
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| Publication Number | Publication Date |
|---|---|
| CN113054765A true CN113054765A (en) | 2021-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110473536.5A Pending CN113054765A (en) | 2021-04-29 | 2021-04-29 | Novel semiconductor refrigeration motor |
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| CN (1) | CN113054765A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008206302A (en) * | 2007-02-20 | 2008-09-04 | Sumitomo Electric Ind Ltd | Stator |
| CN102364825A (en) * | 2011-11-23 | 2012-02-29 | 哈尔滨电机厂有限责任公司 | High thermal conductivity groove fixing structure of large-scale air cooling generator stator bar |
| CN205039665U (en) * | 2015-10-12 | 2016-02-17 | 台州百格拉机电有限公司 | Novel servomotor |
| WO2018096596A1 (en) * | 2016-11-22 | 2018-05-31 | 三菱電機株式会社 | Rotary electric motor |
| CN211830480U (en) * | 2020-05-18 | 2020-10-30 | 佛山市威灵洗涤电机制造有限公司 | Motor assembly |
| CN112039252A (en) * | 2020-09-18 | 2020-12-04 | 中国科学院宁波材料技术与工程研究所 | Water-cooled motor stator and motor based on semiconductor refrigeration piece |
-
2021
- 2021-04-29 CN CN202110473536.5A patent/CN113054765A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008206302A (en) * | 2007-02-20 | 2008-09-04 | Sumitomo Electric Ind Ltd | Stator |
| CN102364825A (en) * | 2011-11-23 | 2012-02-29 | 哈尔滨电机厂有限责任公司 | High thermal conductivity groove fixing structure of large-scale air cooling generator stator bar |
| CN205039665U (en) * | 2015-10-12 | 2016-02-17 | 台州百格拉机电有限公司 | Novel servomotor |
| WO2018096596A1 (en) * | 2016-11-22 | 2018-05-31 | 三菱電機株式会社 | Rotary electric motor |
| CN211830480U (en) * | 2020-05-18 | 2020-10-30 | 佛山市威灵洗涤电机制造有限公司 | Motor assembly |
| CN112039252A (en) * | 2020-09-18 | 2020-12-04 | 中国科学院宁波材料技术与工程研究所 | Water-cooled motor stator and motor based on semiconductor refrigeration piece |
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Application publication date: 20210629 |
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| RJ01 | Rejection of invention patent application after publication |