CN113039870A - 电路载体、(电力)电子组件和电驱动装置 - Google Patents
电路载体、(电力)电子组件和电驱动装置 Download PDFInfo
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Abstract
本发明公开了一种用于为至少一个(电力)电子部件(500)建立机械和电连接的电路载体(20),其包括:载体板(100),其具有至少一个通道孔(200);至少一个导电且导热的***元件(300),其布置在通道孔(200)中,并且具有用于建立到部件(500)的电和热连接的第一接触表面(301)和用于建立到冷却体(600)的热连接的背离第一接触表面(301)的第二接触表面(302);其中,***元件(300)还形成贯通部(210)并且具有接触侧面(303),该接触侧面抵靠贯通部(210)并且被设计用于建立到电连接元件(710)的电和热连接。
Description
技术领域
本发明涉及一种电路载体,并且还涉及一种(电力)电子组件和一种电驱动装置,特别是用于混合动力电动车辆/电动车辆的电驱动装置,其具有所述类型的电路载体。
背景技术
电力电子组件和(相应地)电驱动装置(特别是用于混合动力电动车辆/电动车辆)具有电动部件,诸如电动元件和/或电机,在电力电子组件和(相应地)驱动装置的操作期间,由于功能原因,在这些电动部件之间流过电流强度大于10安培(甚至大于100安培)的高电流。由于功能原因,或者特别是由于高电流,电动部件还具有高功率损耗,并且因此释放出大量的废热,一旦产生废热,这些废热必须被部件迅速耗散。
这里的一般要求是以成本有效的方式生产电力电子组件和(相应地)电驱动装置。
因此,本申请的目的是提供一种可能的方式,其中(电力)电子组件和(相应地)电驱动装置能够以成本有效的方式生产。
发明内容
这个目的通过独立权利要求的主题来实现。从属权利要求涉及有利的改进。
根据本发明的第一方面,提供了一种用于为至少一个(电力)电子(或电(电动))部件建立机械和电连接的电路载体。
电路载体具有至少一个载体板,该载体板具有至少一个通道孔。电路载体具有布置在载体板的通道孔中的至少一个导电且导热的***元件。***元件具有用于建立到部件的(直接的,区域延伸的)电和热连接的第一接触表面,以及背离第一接触表面的第二接触表面,用于建立到冷却体的(同样直接的,区域延伸的)热连接。在这种情况下,***元件进一步形成衬套并且另外具有接触侧面,该接触侧面抵靠衬套定位并且被设计用于建立到电连接元件的(同样直接的、区域延伸的)电和热连接。
这里,电路载体和载体板是(电力)电子部件的载体。它们用于(电力)电子部件的机械紧固和电连接。
由于上述设计,***元件结合了两种功能,即传输电力和传递热量。借助于两个接触表面和接触侧面,***元件形成区域延伸的接触或传输区域,用于高效地传输电力,并且同时有效地传递热量。在这种情况下,载流电路部件,也就是说(电力)电子部件和电连接元件,可以经由***元件彼此电连接(直接且具有低阻抗)。本身产生大量废热或处于高热负荷下的电路部件还可以经由相同的***元件(直接地)热连接到散热器,即冷却体。在载流电路部件之间的电力传输和热量从这些电路部件到散热器的传递因此直接通过同一个***元件进行。在这种情况下,***元件不同于印刷电路板技术中通常已知的电镀通孔,特别是因为在***元件中,与上述电路部件和散热器的所有热接触和电接触都是直接并且经由延伸的接触表面和延伸的接触侧面建立的。在这种情况下,***元件可以在装配过程期间通过通常已知的装配机装配在载体板上,其他电气部件也在所述装配过程期间装配在载体板上。
这里,表述“直接”是指电和热连接(特别是仅)经由低阻抗且导热的直接连接(例如借助于软钎焊、焊接或粘合剂粘结)建立,特别是在没有或仅具有可忽略的低电阻或热阻的情况下。
由于使用了结合了两种功能(即传输电力和传递热量)的***元件,因此可以节省本来专门为了传输电力或专门为了传递热量而所需的部件。因此,降低了成本。
这提供了一种以成本有效的方式生产(电力)电子组件和(相应地)电驱动装置的可能方式。
例如,***元件具有用于建立到连接元件的电和热连接的至少一个接触部分,所述接触部分延伸超过第一和/或第二接触表面。在这种情况下,接触侧面至少部分地形成在接触部分上。
例如,衬套延伸穿过***元件。作为替代,衬套例如形成在***元件和载体板的侧面之间并且在通道孔内。
例如,电路载体还具有至少一个导体轨道,该导体轨道形成在载体板的两侧之间和/或载体板的至少一侧上,并且电连接和热连接到***元件。
根据本发明的第二方面,提供了一种(电力)电子组件。
电子组件具有至少一个上述电路载体和至少一个(电力)电子部件,该电子部件布置在***元件的第一接触表面上,并且电连接和热连接到第一接触表面和因此***元件。
例如,该部件被设计为功率半导体部件或功率半导体开关。
例如,电子组件还具有至少一个冷却体,该冷却体布置在***元件的第二接触表面上,并且热连接到第二接触表面和因此***元件。
例如,电子组件还具有至少一个电连接元件,该电连接元件至少部分地延伸穿过衬套,并且电连接和热连接到接触侧面和因此***元件。
例如,连接元件软钎焊或焊接到接触侧面上。
作为替代,连接元件可以被压接、压制或螺接到***元件。为此,接触部分可以被实施为管道横截面,但是也可以是U形。作为替代,可以在***元件中设置螺纹内孔,然后可以在连接元件中设置内孔。作为替代,“电缆帽”也可以附接到连接元件的端部。
例如,连接元件被设计为电机的马达相的连接。
根据本发明的第三方面,提供了一种电驱动装置,特别是用于混合动力电动车辆/电动车辆的电驱动装置。
该驱动装置具有至少一个上述电子组件和至少一个电机,其中电机具有至少一个连接元件作为马达相的连接,并且经由连接元件电连接和热连接到电子组件。
例如,驱动装置还具有逆变器,该逆变器具有上述电子组件作为部件。作为逆变器的替代或补充,驱动装置可以具有例如DC/DC转换器,其具有上述电子组件作为部件。
上述电路载体的有利改进也可以被视为(电力)电子组件和驱动装置的有利改进,只要它们能够以其他方式传递到上述(电力)电子组件和上述电驱动装置。
附图说明
下面将参照附图更详细地解释本发明的示例性实施例,在附图中:单个附图示出了根据本发明的示例性实施例的混合动力电动车辆/电动车辆的电驱动装置1的一部分的示意性横截面图示。
具体实施方式
电驱动装置1具有电机700和具有电力电子组件10的逆变器。
在该实施例中,电机700被设计为三相同步电机,并且具有三个马达相,并且相应地具有用于马达相的三个相电流连接710,电机700经由所述相电流连接电连接和热连接到电力电子组件10。
在该实施例中,电力电子组件10被设计为逆变器的功率输出级,并且具有电路载体20,该电路载体20具有载体板100和功率半导体开关500作为一些电子部件,并且还具有用于冷却电力电子组件10的冷却体600。在这种情况下,功率半导体开关500被设计为表面安装器件(SMD),并且经由接触表面表面安装在电路载体20或载体板100上。
载体板100具有用于为功率半导体开关500建立电连接的导体轨道110,导体轨道110形成在载体板100的两侧上或载体板100的两侧之间并且因此在载体板100中。
此外,载体板100具有三个通道孔200,在每个通道孔中布置有导电和导热的***元件300。
在这种情况下,***元件300由铜或铜合金形成,并且因此具有高的导电性和导热性。***元件300以类似的方式软钎焊、焊接或电连接和热连接到导体轨道110。***元件300各自具有第一接触表面301,用于建立到上述功率半导体开关500中的至少一个的电和热连接。在这种情况下,功率半导体开关500通过其接触表面搁置在相应的对应***元件300的第一接触表面301上,并且电连接和热连接到所述***元件。为此,功率半导体开关500例如软钎焊到相应的对应***元件300的第一接触表面301上。***元件300还各自具有第二接触表面302,该第二接触表面位于相应的***元件300的背离第一接触表面301的一侧上,并且用于建立到上述冷却体600的热连接。在这种情况下,冷却体600通过其接触表面搁置在相应的***元件300的第二接触表面302上,并且例如借助于电绝缘和导热的粘合剂层物理连接和热连接到***元件300。
***元件300还各自形成衬套210。在这种情况下,衬套210被设计成在相应的***元件300内的另外相对较小的通道孔的形式,该通道孔延伸穿过相应的***元件300,如图中左手侧的***元件300中的情况那样。作为替代,衬套210被设计成在相应的对应通道孔200内的相应的***元件300和载体板100的侧面101之间的间隙(或中间空间)的形式,如图中右手侧的***元件300中的情况那样。衬套210各自具有接触侧面303,该接触侧面抵靠衬套210定位。***元件300中的一些各自具有接触部分310,该接触部分延伸超过相应的对应***元件300的第一接触表面301,并且被设计用于建立到相电流连接710的电和热连接,如图中右手侧的***元件300中的情况那样。在这种情况下,***元件300中的一些的接触侧面303至少部分地形成在相应的对应***元件300的接触部分310上。
电机700的相电流连接710至少部分地被引导穿过衬套210,并且被软钎焊或焊接到相应的对应***元件300的接触侧面303或它们相应的接触部分310上。因此,相电流连接710和(相应地)电机700分别电连接到相应的对应功率半导体开关500,并且经由相应的***元件300热连接到冷却体KK。
***元件300结合了两种功能,即在相应的对应导体轨道110、相应的对应功率半导体开关500和相应的对应相电流连接710之间传输电力,以及从相应的对应导体轨道110、相应的对应功率半导体开关500和相应的对应相电流连接710并因此从电机700传递热量。
Claims (12)
1.一种用于为至少一个(电力)电子部件(500)建立机械和电连接的电路载体(20),其具有:
-载体板(100),其具有至少一个通道孔(200);
-至少一个导电且导热的***元件(300),其布置在所述通道孔(200)中,并且具有用于建立到所述部件(500)的电和热连接的第一接触表面(301)和用于建立到冷却体(600)的热连接的背离所述第一接触表面(301)的第二接触表面(302);
-其中,所述***元件(300)还形成衬套(210)并且具有接触侧面(303),所述接触侧面抵靠所述衬套(210)定位并且被设计用于建立到电连接元件(710)的电和热连接。
2.根据权利要求1所述的电路载体(20),其中,所述***元件(300)具有用于建立到所述连接元件(710)的所述电和热连接的至少一个接触部分(310),所述接触部分延伸超过所述第一接触表面(301)和/或所述第二接触表面(302),其中,所述接触侧面(303)至少部分地形成在所述接触部分(310)上。
3.根据权利要求1或2所述的电路载体(20),其中,所述衬套(210)延伸穿过所述***元件(300),或者在所述通道孔(200)内形成在所述***元件(300)和所述载体板(100)的侧面(101)之间。
4.根据前述权利要求中的一项所述的电路载体(20),还具有至少一个导体轨道(110),所述至少一个导体轨道(110)形成在所述载体板(100)的两侧之间和/或所述载体板(100)的至少一侧上,并且电连接和热连接到所述***元件(300)。
5.一种(电力)电子组件(10),具有:
-根据前述权利要求中的一项所述的至少一个电路载体(20);
-至少一个(电力)电子部件(500);
-其中,所述部件(500)布置在所述***元件(300)的所述第一接触表面(301)上,并且电连接和热连接到所述第一接触表面(301)。
6.根据权利要求5所述的电子组件(10),其中,所述部件(500)是功率半导体部件或功率半导体开关。
7.根据权利要求5或6所述的电子组件(10),还具有至少一个冷却体(600),所述至少一个冷却体(600)布置在所述***元件(300)的所述第二接触表面(302)上并且热连接到所述第二接触表面(302)。
8.根据权利要求5至7中任一项所述的电子组件(10),还具有至少一个电连接元件(710),所述至少一个电连接元件(710)至少部分地延伸穿过所述衬套(210),并且电连接和热连接到所述接触侧面(303)。
9.根据权利要求8所述的电子组件(10),其中,所述连接元件(710)软钎焊或焊接到所述接触侧面(303)上,或者被压接、压制或螺接到所述***元件(300)。
10.根据权利要求8或9所述的电子组件(10),其中,所述连接元件(710)是电机(700)的马达相的连接。
11.一种电驱动装置(1),具有:
-根据权利要求10所述的至少一个电子组件(10);
-至少一个电机(700),其具有至少一个连接元件(710)作为所述电机(700)的马达相的连接;
-其中,所述电机(700)经由所述连接元件(710)电连接和热连接到所述电子组件(10)。
12.根据权利要求11所述的驱动装置(1),其还具有逆变器,其中,所述电子组件(10)形成所述逆变器的一部分。
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DE102018219574.9A DE102018219574A1 (de) | 2018-11-15 | 2018-11-15 | Schaltungsträger, (Leistungs-)Elektronikanordnung und elektrische Antriebsvorrichtung |
PCT/EP2019/081131 WO2020099464A1 (de) | 2018-11-15 | 2019-11-13 | Schaltungsträger, (leistungs-)elektronikanordnung und elektrische antriebsvorrichtung |
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EP0489958A1 (de) * | 1990-12-12 | 1992-06-17 | Siemens Aktiengesellschaft | Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte |
US20140347821A1 (en) * | 2011-12-15 | 2014-11-27 | Valeo Systemes De Controle Moteur | Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator |
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CN107924892A (zh) * | 2015-08-21 | 2018-04-17 | 大陆汽车有限公司 | 电路载体、包括电路载体的功率电子安排 |
US20180201302A1 (en) * | 2015-09-18 | 2018-07-19 | Mitsubishi Electric Corporation | Integrated electric power steering apparatus |
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2018
- 2018-11-15 DE DE102018219574.9A patent/DE102018219574A1/de active Pending
-
2019
- 2019-11-13 CN CN201980075132.1A patent/CN113039870A/zh active Pending
- 2019-11-13 EP EP19813729.1A patent/EP3881652A1/de active Pending
- 2019-11-13 WO PCT/EP2019/081131 patent/WO2020099464A1/de unknown
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EP0489958A1 (de) * | 1990-12-12 | 1992-06-17 | Siemens Aktiengesellschaft | Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte |
US20140347821A1 (en) * | 2011-12-15 | 2014-11-27 | Valeo Systemes De Controle Moteur | Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator |
US20160347354A1 (en) * | 2014-03-26 | 2016-12-01 | Mitsubishi Electric Corporation | Electric power steering device |
US20180077792A1 (en) * | 2015-03-10 | 2018-03-15 | Omron Corporation | Reactor, connection member, board module, and electric device |
CN107924892A (zh) * | 2015-08-21 | 2018-04-17 | 大陆汽车有限公司 | 电路载体、包括电路载体的功率电子安排 |
US20180201302A1 (en) * | 2015-09-18 | 2018-07-19 | Mitsubishi Electric Corporation | Integrated electric power steering apparatus |
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US20210273533A1 (en) | 2021-09-02 |
DE102018219574A1 (de) | 2020-05-20 |
WO2020099464A1 (de) | 2020-05-22 |
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