CN113026066A - Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof - Google Patents
Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof Download PDFInfo
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- CN113026066A CN113026066A CN202110237753.4A CN202110237753A CN113026066A CN 113026066 A CN113026066 A CN 113026066A CN 202110237753 A CN202110237753 A CN 202110237753A CN 113026066 A CN113026066 A CN 113026066A
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- copper plating
- circuit board
- plating solution
- blind hole
- hole filling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a blind hole filling copper plating solution of a non-presoaking system and a copper plating process thereof, wherein the blind hole filling copper plating solution of the non-presoaking system comprises the following raw materials in concentration: copper sulfate pentahydrate: 180-270 g/L, sulfuric acid: 30-100 g/L, chloride ion: 30-100 ppm, accelerator: 0.1-10 ppm, carrier: 0.1-10 g/L, leveling agent: 0.1-10 g/L. Has the advantages that: the copper plating process does not contain a pre-dipping system, reduces the use cost of a client, is not influenced by equipment, and has the advantages of low filling leakage rate, high filling rate, compact and flat copper plating layer, no cavity, good ductility and better copper plating effect of the electroplating effect obtained by adopting the blind hole filling copper plating solution.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a blind hole filling copper plating solution of a non-presoaking system and a copper plating process thereof.
Background
Copper plating is a coating of copper metal on another material, usually another metal. The purpose of electroplating is to improve durability, strength or visual appeal, and in particular copper plating is commonly used to improve thermal and electrical conductivity. Copper plating is most commonly found in wiring and cookware. Sometimes, copper plating is used for decorative purposes to give the object a brass-like appearance. However, since copper has very good thermal conductivity, copper plating is more commonly used for the electric wire. In addition, many circuit boards are plated with copper.
With the continuous development of electronic products, some high-end electronic products are gradually developing towards the direction of high-frequency signal transmission, and the circuit board is used as a core component of the circuit board, and blind holes on a board body of the circuit board need to be plated and filled so as to be beneficial to the transmission of high-frequency signals. The conventional hole-filling copper plating generally requires a prepreg cylinder, and the main function of the conventional hole-filling copper plating is to enable the bottom of a blind hole to adsorb a large amount of accelerators in advance, so that the subsequent hole-filling copper plating is facilitated. It has two problems: 1. most of equipment does not contain a pre-immersion cylinder, so the equipment needs to be modified, and the use cost of a client is increased; 2. in the prepreg cylinder, the adsorption amount of the accelerator influences the effect of copper plating for subsequent hole filling, and the risk of filling leakage is high.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
Aiming at the problems in the related art, the invention provides a blind hole filling copper plating solution of a non-presoaking system and a copper plating process thereof, so as to overcome the technical problems in the prior related art.
Therefore, the invention adopts the following specific technical scheme:
according to one aspect of the invention, the blind hole filling copper plating solution of the non-presoaked system comprises the following raw materials in concentration:
copper sulfate pentahydrate: 180-270 g/L, sulfuric acid: 30-100 g/L, chloride ion: 30-100 ppm, accelerator: 0.1-10 ppm, carrier: 0.1-10 g/L, leveling agent: 0.1-10 g/L.
Further, the accelerator includes thioalkyl sulfonic acids and salts thereof or dithio organic compounds.
Further, the leveling agent is a dimethyldiallylammonium chloride-acrylamide copolymer.
According to another aspect of the invention, a copper plating process of a blind hole filling copper plating solution of a non-presoaked system is provided, and the copper plating process comprises the following steps:
PTH: carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
electroplating the board surface: carrying out secondary electroplating treatment on the circuit board by adopting a pre-prepared copper plating solution to obtain a thickened conductive layer;
acid oil removal: carrying out oil removal treatment on the board surface of the circuit board by adopting a pre-prepared acidic oil removal agent;
micro-etching: carrying out microetching treatment on the circuit board body after the oil removal treatment by adopting a prepared microetching solution to obtain a roughened conductive layer;
acid washing: carrying out acid washing treatment on the circuit board body after the microetching;
blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
Further, the thickness of the conducting layer is 0.45-0.55 um. Preferably, the thickness of the conductive layer is 0.50 um.
Furthermore, the plating time of the metallization treatment, the plate surface plating and the blind hole filling is 40-55 min. Preferably, the electroplating time is 45 min.
Further, the electroplating temperature is 20-30 ℃, and the current density during electroplating is 1.5-1.7 ASD. Preferably, the plating temperature is 25 degrees, and the current density at the time of plating is 1.6 ASD.
According to still another aspect of the present invention, there is provided a copper plating process of a blind via-filling copper plating solution of a non-prepreg system, the copper plating process comprising the steps of:
PTH: carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
acid oil removal: carrying out oil removal treatment on the board surface of the circuit board by adopting a pre-prepared acidic oil removal agent;
acid washing: carrying out acid washing treatment on the deoiled circuit board body;
blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
Further, the thickness of the conductive layer is 0.45-0.55 um. Preferably, the thickness of the conductive layer is 0.50 um.
Further, the electroplating time of the metallization treatment and the blind hole filling is 40-55min, the electroplating temperature is 20-30 ℃, the current density during electroplating is 1.5-1.7ASD, preferably, the electroplating time is 50min, the electroplating temperature is 25 ℃, and the current density during electroplating is 1.6 ASD.
The invention has the beneficial effects that: the copper plating process does not contain a preimpregnation system, so that the use cost of a client is reduced, the influence of equipment is avoided, and the electroplating effect is obtained by adopting the blind hole filling copper plating solution; the copper plating method has the advantages of low filling leakage rate, high hole filling rate, compact and flat copper plating layer, no cavity, good ductility and better copper plating effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a process flow diagram of copper plating of a blind via-filling copper plating solution of a non-prepreg system according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a circuit board after plating in a blind via-filling copper plating solution process of a non-presoaked system according to an embodiment of the present invention;
FIG. 3 is a second schematic diagram of a circuit board after plating in a blind via-filling copper plating solution process according to an embodiment of the invention.
Detailed Description
For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the invention, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.
According to the embodiment of the invention, the blind hole filling copper plating solution of the non-presoaking system and the copper plating process thereof are provided.
The invention will now be further described with reference to the accompanying drawings and specific embodiments, according to one aspect of the invention, there is provided a blind hole filling copper plating solution for a non-prepreg system, which comprises the following raw materials in concentration:
copper sulfate pentahydrate: 180-270 g/L, sulfuric acid: 30-100 g/L, chloride ion: 30-100 ppm, accelerator: 0.1-10 ppm, carrier: 0.1-10 g/L, leveling agent: 0.1-10 g/L.
Wherein, the accelerator is thioalkyl sulfonic acid and salt thereof, or disulfo organic compound, and the concrete examples are as follows:
thioalkyl sulfonic acids and salts thereof: HS-L1-SO3M；
Wherein L1 represents a saturated alkyl group having 1 to 6 carbon atoms, and M represents a hydrogen atom or an alkali metal;
bis-thio organic compounds: X1-L2-S-S-L3-Y1;
wherein X1 and Y1 represent a sulfate or a phosphate; l2 and L3 each represents a saturated alkyl group having 1 to 6 carbon atoms;
wherein the carrier agent is as follows:
wherein x and y represent an integer of 1 to 100;
wherein the leveling agent is a dimethyl diallyl ammonium chloride-acrylamide copolymer, and the general formula is as follows:
wherein x and y represent an integer of 1 to 100.
In order to clearly understand the technical scheme of the invention, the technical scheme of the invention is described in detail through specific examples.
Example one
The blind hole filling copper plating solution of the non-presoaking system comprises the following raw materials in concentration:
copper sulfate pentahydrate: 220g/L, sulfuric acid: 50g/L, chloride ion: 50ppm, sodium polydithio-dipropyl sulfonate: 1pmm, Sanyo 50-HB-660: 0.5g/L dimethyldiallylammonium chloride-acrylamide copolymer (X ═ Y ═ 50): 0.1 g/L;
wherein the electroplating parameters are as follows: the current density was 1.6ASD, the plating time was 45min, the temperature was 25 ℃, the stirring was AIR stirring, and the pore size/step was 110um/70 um.
Example two
The blind hole filling copper plating solution of the non-presoaking system comprises the following raw materials in concentration:
copper sulfate pentahydrate: 200g/L, sulfuric acid: 40g/L, chloride ion: 60ppm, sodium polydithio-dipropyl sulfonate: 1.5pmm, Sanyo 50-HB-660: 0.6g/L dimethyldiallylammonium chloride-acrylamide copolymer (X ═ 30, Y ═ 70): 0.1 g/L;
wherein the electroplating parameters are as follows: current density is 1.6ASD, electroplating time is 50min, temperature is 25 ℃, stirring mode is AIR stirring, aperture/level is 150um/70 um;
according to another aspect of the invention, a copper plating process of a blind hole filling copper plating solution of a non-presoaked system is provided, and the copper plating process comprises the following steps:
s1, PTH: carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
specifically, the thickness of the conductive layer is 0.45-0.55um (preferably 0.5 um);
s2, electroplating the board surface: carrying out secondary electroplating treatment on the circuit board by adopting a pre-prepared copper plating solution to obtain a thickened conductive layer;
s3, acid degreasing: carrying out oil removal treatment on the board surface of the circuit board by using a pre-prepared acidic oil removal agent to remove oil stains and slight finger print stains on the board surface;
s4, microetching: carrying out microetching treatment on the circuit board body after the oil removal treatment by adopting a prepared microetching solution to obtain a roughened conductive layer, so that the plating layer has better bonding force with the bottom copper;
s5, acid washing: carrying out acid washing treatment on the circuit board body after the microetching, and removing slight oxides on the copper surface;
s6, blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
specifically, the plating time of the metallization treatment, the board surface plating and the blind hole filling is 40-55min (preferably 45min), the plating temperature is 20-30 degrees (preferably 25 degrees), and the current density during the plating is 1.5-1.7ASD (preferably 1.6 ASD);
s7, drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
According to still another aspect of the present invention, there is provided a copper plating process of a blind via-filling copper plating solution of a non-prepreg system, the copper plating process comprising the steps of:
s1, PTH (Plated Through Hole): carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
specifically, the thickness of the conductive layer is 0.45-0.55um (preferably 0.5 um);
s2', acid degreasing: carrying out oil removal treatment on the board surface of the circuit board by using a pre-prepared acidic oil removal agent to remove oil stains and slight finger print stains on the board surface;
s3', acid washing: carrying out acid washing treatment on the circuit board body after oil removal to remove slight oxides on the copper surface;
s4', blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
specifically, the electroplating time of the metallization treatment and the blind hole filling is 40-55min (preferably 50min), the electroplating temperature is 20-30 degrees (preferably 25 degrees), and the current density during electroplating is 1.5-1.7ASD (preferably 1.6 ASD);
s5', drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
In order to better understand the technical scheme, the circuit board body after electroplating is tested as follows, and the test results are as follows:
as shown in fig. 2, it is one of the schematic diagrams of the slice after the circuit board is electroplated, and the slice can be obtained by: the blind hole copper plating process of the non-presoaking system has the advantages of high hole filling rate, no depression, no leakage filling and surface copper of about 16 microns.
As shown in fig. 3, a second schematic diagram of slicing the circuit board after electroplating is shown, through which the following can be obtained: the blind hole copper plating process of the non-presoaking system has the advantages of high hole filling rate, a double value of about 6 microns, no missing filling and surface copper of about 18 microns.
In summary, by means of the above technical scheme of the present invention, the copper plating process does not contain a pre-immersion system, so that the use cost of the client is reduced, and meanwhile, the copper plating process is not affected by equipment, and the electroplating effect obtained by using the blind hole filling copper plating solution is as follows: the copper plating method has the advantages of low filling leakage rate, high hole filling rate, compact and flat copper plating layer, no cavity, good ductility and better copper plating effect.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The blind hole filling copper plating solution of the non-presoaking system is characterized by comprising the following raw materials in concentration:
copper sulfate pentahydrate: 180-270 g/L, sulfuric acid: 30-100 g/L, chloride ion: 30-100 ppm, accelerator: 0.1-10 ppm, carrier: 0.1-10 g/L, leveling agent: 0.1-10 g/L.
2. A non-presoaking system blind via-filling coppering bath as claimed in claim 1, wherein said accelerator comprises thioalkyl sulfonic acids and salts thereof or bis-thio organic compounds.
3. The non-presoaked system blind via-filling copper plating solution according to claim 1, wherein the leveling agent is a dimethyldiallylammonium chloride-acrylamide copolymer.
4. A copper plating process of a blind hole filling copper plating solution of a non-prepreg system, which is used for the application of the blind hole filling copper plating solution of the non-prepreg system according to claim 1, and comprises the following steps:
PTH: carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
electroplating the board surface: carrying out secondary electroplating treatment on the circuit board by adopting a pre-prepared copper plating solution to obtain a thickened conductive layer;
acid oil removal: carrying out oil removal treatment on the board surface of the circuit board by adopting a pre-prepared acidic oil removal agent;
micro-etching: carrying out microetching treatment on the circuit board body after the oil removal treatment by adopting a prepared microetching solution to obtain a roughened conductive layer;
acid washing: carrying out acid washing treatment on the circuit board body after the microetching;
blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
5. The copper plating process of the blind hole filling copper plating solution of the non-presoaking system according to claim 4, wherein the thickness of the conductive layer is 0.45-0.55 um.
6. The copper plating process of the blind via-filling copper plating solution of the non-prepreg system as claimed in claim 4, wherein the plating time of the metallization treatment, the plating of the board surface and the plating of the blind via-filling are all 40-55 min.
7. The copper plating process of the blind hole filling copper plating solution of the non-presoaking system according to claim 6, wherein the plating temperature is 20-30 degrees, and the current density during the plating is 1.5-1.7 ASD.
8. A copper plating process of a blind hole filling copper plating solution of a non-prepreg system, which is used for the application of the blind hole filling copper plating solution of the non-prepreg system according to claim 1, and comprises the following steps:
PTH: carrying out in-hole metallization treatment on a plate body of the circuit board by adopting a pre-prepared copper plating solution, so that a conducting layer is deposited on an insulating base material in a blind hole of the circuit board;
acid oil removal: carrying out oil removal treatment on the board surface of the circuit board by adopting a pre-prepared acidic oil removal agent;
acid washing: carrying out acid washing treatment on the deoiled circuit board body;
blind hole filling: placing the circuit board body after acid washing in the copper plating solution for electroplating to realize blind hole filling treatment of the circuit board body;
drying: and drying the circuit board body after hole filling to realize the hole filling of the blind holes on the circuit board body.
9. The copper plating process of the blind hole filling copper plating solution of the non-presoaking system according to claim 8, wherein the thickness of the conductive layer is 0.45-0.55 um.
10. The copper plating process of the blind via-filling copper plating solution of the non-prepreg system as claimed in claim 8, wherein the plating time of the metallization treatment and the blind via-filling is 40-55min, the plating temperature is 20-30 degrees, and the current density during the plating is 1.5-1.7 ASD.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110237753.4A CN113026066A (en) | 2021-03-04 | 2021-03-04 | Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof |
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| CN202110237753.4A CN113026066A (en) | 2021-03-04 | 2021-03-04 | Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof |
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| CN106455366A (en) * | 2016-11-17 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for electroplating copper taphole in PCB |
| CN107268043A (en) * | 2017-07-04 | 2017-10-20 | 电子科技大学 | A kind of inhibitor and electrolytic copper plating bath that filling perforation is electroplated for copper-connection HDI |
| CN108728877A (en) * | 2017-04-20 | 2018-11-02 | 上村工业株式会社 | Copper electroplating bath and electro-coppering plating film |
| CN110938847A (en) * | 2019-10-30 | 2020-03-31 | 苏州清飙科技有限公司 | Copper electroplating leveling agent, preparation method thereof and electroplating solution |
| CN111020649A (en) * | 2019-12-17 | 2020-04-17 | 东莞市康迈克电子材料有限公司 | Leveling agent and preparation method thereof, electroplating solution and application thereof, electroplating method of circuit board and circuit board |
-
2021
- 2021-03-04 CN CN202110237753.4A patent/CN113026066A/en active Pending
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| CN106455366A (en) * | 2016-11-17 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for electroplating copper taphole in PCB |
| CN108728877A (en) * | 2017-04-20 | 2018-11-02 | 上村工业株式会社 | Copper electroplating bath and electro-coppering plating film |
| CN107268043A (en) * | 2017-07-04 | 2017-10-20 | 电子科技大学 | A kind of inhibitor and electrolytic copper plating bath that filling perforation is electroplated for copper-connection HDI |
| CN110938847A (en) * | 2019-10-30 | 2020-03-31 | 苏州清飙科技有限公司 | Copper electroplating leveling agent, preparation method thereof and electroplating solution |
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Inventor after: Shu Ping Inventor after: Sun Xin Inventor after: Li Hongbin Inventor before: Shu Ping Inventor before: Sun Xin |