CN113020080A - Directional linear double-fluid cleaning method and device - Google Patents
Directional linear double-fluid cleaning method and device Download PDFInfo
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- CN113020080A CN113020080A CN202110338102.4A CN202110338102A CN113020080A CN 113020080 A CN113020080 A CN 113020080A CN 202110338102 A CN202110338102 A CN 202110338102A CN 113020080 A CN113020080 A CN 113020080A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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Abstract
The invention discloses a directional linear double-fluid cleaning method and a device, wherein the method comprises the following steps: the directional double-fluid cleaning nozzle mechanism moves in a single direction relative to the workpiece and cleans the surface of the workpiece, and the directional double-fluid cleaning nozzle mechanism is provided with a double-fluid cleaning nozzle unit and a gas directional nozzle unit; the method for cleaning the surface of the workpiece by the directional double-fluid cleaning nozzle mechanism comprises the following steps: the double-fluid cleaning nozzle unit continuously sprays double fluids to an area to be cleaned of the workpiece to form an impact area, the gas directional nozzle unit continuously sprays directional gas jet flow, the directional gas jet flow is shot to one side edge of the impact area, and a boundary layer wrapping the one side edge is formed; the boundary layer and the double-fluid impact coupling capture splashed liquid, and the liquid is directionally transferred to a to-be-cleaned area; the directional linear double-fluid cleaning method and the directional linear double-fluid cleaning device can clean the workpiece, and have the advantages of high cleaning efficiency, high cleaning speed and better cleaning quality.
Description
Technical Field
The invention relates to the technical field of workpiece cleaning, in particular to a directional linear double-fluid cleaning method and a device.
Background
The two-fluid cleaning (two-fluid cleaning) can be widely applied to cleaning the pollutants on various precise surfaces of semiconductor wafers, light shields, photoelectric glass and the like; in general, two-fluid cleaning is mainly to spray to generate liquid drops with proper energy, and surface shock wave jet flow generated by the liquid drops is used for removing dirt such as particles, and meanwhile, the precision surface cannot be damaged.
In addition to having sufficient, suitable impact force to cause the soil to peel away from the surface, the efficient and immediate transfer of the peeled soil from the cleaning area is often a bottleneck to achieve very high dual fluid cleaning efficiency.
In two-fluid cleaning, the liquid is both the energy carrier and the dirt transfer carrier; however, in the conventional two-fluid cleaning technology, splashed liquid drops are generated after the mixture of the liquid drops and the gas is flushed to the surface of the workpiece, part of the carried dirty liquid drops are dripped to the cleaned surface of the workpiece again,
for example, in US patent No. US8037891B2, U.S. patent No. Two-fluid nozzle for cleaning substrates and substrate cleaning apparatus, as shown in fig. 9, after the mixture of liquid droplets and gas directly impacts the surface to be cleaned, part of the liquid splashes and disperses until the dirt is carried, and more seriously, part of the liquid splashes and disperses back to the cleaned area.
In order to solve the above problems, US patent No. US6708903B2, entitled "two-fluid cleaning jet nozzle, cleaning apparatus and method of manufacturing semiconductor device using the same", proposes to add a flow guide structure for guiding gas deflection at the outlet of the two-fluid nozzle as shown in fig. 10, that is, to form a gas flow isolation layer above the impact area, and to capture splashed liquid droplets by the gas flow and bring them out of the cleaned area; however, this solution is limited by the nozzles, the active area of the two-fluid cleaning is generally very small, on the order of a few square millimeters; therefore, if the area of the cleaning object is relatively large, the scanning coverage of the cleaning object needs to be realized by moving the two-fluid nozzle as shown in fig. 11, the right part in the figure is the cleaned area cleaned by the two-fluid cleaning nozzle, and the left part is the area to be cleaned which is not cleaned, although the diversion structure inhibits the splashing of the liquid into the two-fluid impact area, the surface liquid flow flowing from four sides cannot be prevented from bringing the dirt back to the cleaned area, and therefore, a method capable of solving the problem needs to be found.
Disclosure of Invention
In view of the above, there is a need to overcome at least one of the above-mentioned defects in the prior art, and the present invention provides a directional linear two-fluid cleaning method capable of cleaning stains (organic/inorganic stains) on a line to be cleaned on the surface of a workpiece (a workpiece having various precise surfaces such as a substrate, a semiconductor wafer, a photomask, a photoelectric glass, etc.) which is a virtual cleaning-required region set artificially on the workpiece, or the surface of a specific workpiece (a workpiece having various precise surfaces such as a substrate, a semiconductor wafer, a photomask, a photoelectric glass, etc.) which has a width smaller than the diameter of the two-fluid; the directional linear dual fluid cleaning method comprises the following steps: the directional double-fluid cleaning nozzle mechanism moves unidirectionally relative to a workpiece and cleans the surface of the workpiece, so that the line to be cleaned or the surface of a specific workpiece is divided into a cleaned area and a to-be-cleaned area, wherein the directional double-fluid cleaning nozzle mechanism is provided with a double-fluid cleaning nozzle unit and a gas directional nozzle unit fixedly connected with the double-fluid cleaning nozzle unit, the gas directional nozzle unit is positioned on the opposite direction side of the double-fluid cleaning nozzle unit, and the opposite direction side refers to the side with an included angle beta opposite to the movement direction of the directional double-fluid cleaning nozzle mechanism relative to the workpiece, and the included angle beta is-90 degrees & lt beta & lt 90 degrees; the method for cleaning the surface of the workpiece by the directional double-fluid cleaning nozzle mechanism comprises the following steps: the double-fluid cleaning nozzle unit continuously sprays double fluids to a to-be-cleaned area of a workpiece, the double fluids form an impact area on the to-be-cleaned area, the gas directional nozzle unit continuously sprays directional gas jet flow, the directional gas jet flow is jetted to one side edge of the impact area and forms a boundary layer wrapping the one side edge, and an included angle alpha is formed between the flow direction of the boundary layer and the movement direction of the directional double-fluid cleaning nozzle mechanism relative to the workpiece, wherein alpha is more than-90 degrees and less than 90 degrees; the boundary layer and the double-fluid impact coupling capture splashed liquid and transfer the liquid to the area to be cleaned directionally.
According to the background art of the patent, in the traditional two-fluid cleaning technology, after a mixture of liquid drops and gas is flushed to the surface of a workpiece, splashed liquid drops are generated, and part of the carried dirty liquid drops are dripped to the cleaned surface of the workpiece again; the invention discloses a directional linear two-fluid cleaning method, a directional two-fluid cleaning nozzle mechanism moves unidirectionally relative to a workpiece according to the extending direction of a line to be cleaned or the length direction of a specific workpiece, a cleaned area gradually covers the surface of the whole line to be cleaned or the specific workpiece along the moving direction of the directional two-fluid cleaning nozzle mechanism relative to the workpiece along with the cleaning, a two-fluid cleaning nozzle unit continuously sprays two fluids to the area to be cleaned of the workpiece while moving, a directional gas jet is continuously sprayed by the gas directional nozzle unit and a boundary layer is formed at the periphery of an impact area of the two fluids, the boundary layer is in impact coupling with the two fluids, liquid splashed around, particularly the liquid splashed in the impact area and the cleaned area can be collected, and the liquid is rapidly directionally transferred to the area to be cleaned, therefore, the directional two-fluid cleaning device can compress the tiny liquid flow generated by the impact area in eight directions to one side of the boundary layer (the side of the workpiece to be cleaned, namely, the gas-liquid two-phase area) strengthens the dirt transfer capacity in the impact area, can improve the cleaning speed by 5-10 times on the premise of the same cleaning efficiency, and has better cleaning quality.
In addition, the directional linear double-fluid cleaning method disclosed by the invention also has the following additional technical characteristics:
further, the droplet size of the two-fluid is 100-400 um; the jet velocity of the double fluids is more than or equal to 250 m/s.
Furthermore, the jet speed of the directional gas jet is more than or equal to 10 m/s.
Furthermore, liquid water is fed into the input end of the two-fluid cleaning nozzle unit, and the two fluids are a mixture of water vapor and liquid water.
Further, the distance from the ejection port of the two-fluid cleaning nozzle unit to the surface of the workpiece is 5 to 10 mm.
Further, the mixture forms micro-droplets containing micro-nano bubbles.
Furthermore, an included angle theta is formed between the ejection direction of the directional gas jet and the surface of the workpiece, and the theta is less than or equal to 60 degrees.
Furthermore, the boundary layer is composed of a first layer with an arc-shaped cross section and two second layers which are respectively connected with two ends of the first layer, the first layer wraps the side edge of the impact area, one ends of the two second layers, far away from the first layer, extend towards the direction far away from the cleaned area, and the impact area is located between the first layer and the two second layers.
Further, each of the second layers is inclined in a direction away from the other second layer in the flow direction of the boundary layer.
The cross section of the boundary layer is approximately parabolic, one end of the boundary layer is closed, the other end of the boundary layer is provided with an opening, the boundary layer is symmetrically arranged by taking the impact area as a center and extends to the direction far away from the cleaned area.
Further, the directed gas jet is a dry gas stream.
In the traditional two-fluid cleaning technology, after cleaning is finished, the cleaning surface of a workpiece needs to be air-dried through high-speed centrifugation and air drying; according to the directional double-fluid cleaning nozzle mechanism, the right side of the boundary layer is a pure gas phase area containing a cleaned area, the gas directional nozzle unit is used for achieving efficient cleaning, meanwhile, drying operation of the cleaned area is completed, efficiency is high, and cost is low.
Further, the thickness of the boundary layer is 1mm-20mm, and the thickness is the height of the boundary layer from top to bottom.
Further, the workpiece is static, and the directional double-fluid cleaning nozzle mechanism moves in a single direction.
Further, the workpiece moves in a single direction, and the directional double-fluid cleaning nozzle mechanism is static.
Further, the workpiece moves along a first direction, the directional dual-fluid cleaning nozzle mechanism moves along the first direction and the moving speed of the directional dual-fluid cleaning nozzle mechanism is not equal to that of the workpiece, or the workpiece moves along the first direction, and the directional dual-fluid cleaning nozzle mechanism moves along the reverse direction of the first direction.
According to another aspect of the present invention, there is also provided a directional linear dual fluid cleaning apparatus based on one of the above directional linear dual fluid cleaning methods, comprising: the carrier, directional two-fluid cleaning nozzle mechanism and be used for driving the carrier or/and the drive division of directional two-fluid cleaning nozzle mechanism linear motion, directional two-fluid cleaning nozzle mechanism includes: the dual fluid cleaning nozzle unit; and the gas directional nozzle unit is fixedly connected with the double-fluid cleaning nozzle unit and is used for spraying directional gas flow to one side edge of an impact area of the double-fluid cleaning nozzle unit.
Further, the two-fluid cleaning nozzle unit comprises a phase-change type two-fluid generator with an input end used for being connected with liquid water, an accelerating tube with an input end connected and communicated with an output end of the two-fluid generator, and a two-fluid nozzle connected with the accelerating tube.
Further, the two-fluid generator is used for connecting ultrapure water, wherein the ultrapure water is water with the resistivity not less than 18M omega.
The phase-change type double-fluid generator converts ultrapure water into a mixture of water vapor and liquid water to realize gas and liquid double-fluid; the gas-liquid double-fluid enters the double-fluid nozzle through the accelerating tube, the high-flow-speed steam airflow sufficiently accelerates liquid water through the accelerating tube, and then the steam airflow is sprayed out of the double-fluid nozzle to form high-speed liquid drop jet flow (namely the double-fluid) with the particle size of about 100-400 um and the speed of about 300 m/s.
The double-fluid cleaning nozzle unit is connected with liquid water, the output particle diameter is about 100-400 um, the high-speed liquid drop jet flow of the speed is about 300 m/s, the high-speed liquid drop jet flow is micro liquid drops containing micro-nano bubbles (water vapor), the double-fluid rushes to the surface of a workpiece, and the dirt on the surface of the workpiece is removed through the shock wave jet flow of the double-fluid on the surface of the workpiece, wherein the micro liquid drops form macroscopic impact on the surface of the workpiece, meanwhile, the micro-nano bubbles form microscopic impact on the surface of the workpiece, so that the organic dirt, the inorganic dirt and the like on the surface of the workpiece can be effectively cleaned, and meanwhile, the damage to the precise surface cannot be generated, and the double-fluid cleaning nozzle.
Further, the double-fluid generator, the accelerating tube and the double-fluid nozzle are coaxially connected in sequence.
Further, an included angle which is not less than thirty degrees and is an acute angle is formed between the spraying direction of the gas directional nozzle unit and the spraying direction of the two-fluid cleaning nozzle unit.
Further, the gas directional nozzle unit is fixedly connected with the two-fluid cleaning nozzle unit through a synchronous bracket.
Further, the spraying direction of the two-fluid cleaning nozzle unit is perpendicular to the bearing surface of the carrier; an included angle theta is formed between the spraying direction of the gas directional nozzle unit and the bearing surface of the carrier, and the theta is not more than 60 degrees.
Furthermore, the directional double-fluid cleaning device comprises a linear driving module and a carrier arranged on the output end of the linear driving module, wherein the carrier is used for bearing a workpiece; the phase-change type double-fluid generator is used for converting ultrapure water into a mixture of water vapor and liquid water, gas and liquid double-fluid is achieved, the gas and liquid double-fluid flows into the double-fluid nozzle through the accelerating tube, the accelerating tube is used for enabling high-flow-rate steam airflow to sufficiently accelerate liquid water, then the steam airflow is sprayed out of the double-fluid nozzle, high-speed liquid drop jet flow with the particle size of about 100-400 um and the speed of about 300 m/s is formed, and the effective diameter of the double-fluid nozzle is about 2 mm. A linear jet nozzle (namely, the gas directional nozzle unit) which is 14mm long, 1mm wide and forms an angle of 30 degrees with the bearing surface of the carrier is arranged on the same height (10 mm) with the two-fluid nozzle 9, the input end of the linear jet nozzle is connected with compressed air, and a directional gas jet with the flow velocity of about 100 m/s is emitted to the surface of the workpiece; the linear jet nozzle is connected with the double-fluid nozzle through the synchronous support, and the motion synchronization is realized.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a directional dual fluid cleaning nozzle mechanism in an embodiment of the present invention;
FIG. 2 is a top view of a boundary layer flow direction in an embodiment of the present invention;
FIG. 3 is a schematic structural view of a directional dual fluid cleaning apparatus in an embodiment of the present invention;
FIG. 4 is a schematic sectional view of an impinging jet formed on the surface of a workpiece when the workpiece is cleaned by the directional dual fluid cleaning apparatus in an embodiment of the present invention;
FIG. 5 is a schematic illustration of a comparison of a surface of a workpiece to be cleaned with a surface of the workpiece after a two fluid cleaning consisting of air and water;
FIG. 6 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece after a two-fluid cleaning by the two-fluid cleaning nozzle unit in an embodiment of the present invention;
FIG. 7 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece after being cleaned by a directional dual fluid cleaning apparatus (gas directional nozzle unit off) in an embodiment of the invention;
FIG. 8 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece cleaned by the directional dual fluid cleaning apparatus (gas directional nozzle unit turned on) in the embodiment of the present invention;
FIG. 9 is a schematic view of a prior art two-fluid nozzle;
FIG. 10 is a schematic view of another prior art two-fluid nozzle configuration; and
FIG. 11 is a schematic illustration of the cleaning of the dual fluid nozzle workpiece of FIG. 10.
The cleaning device comprises a cleaning area 1, a cleaning area 2, a two-fluid cleaning nozzle unit 3, a gas directional nozzle unit 4, a directional two-fluid cleaning nozzle mechanism 5, a boundary layer 6, a two-fluid generator 7, an accelerating tube 8, a two-fluid nozzle 9, a synchronous support 10, a carrier 11, a workpiece surface 12, a linear driving module 13, a gas-liquid two-phase area 14, a boundary layer 15, an impact area 16, a pure gas phase area 17, a workpiece 18, a dirty point a and a dirty line b.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout; the embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "lateral", "vertical", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, are used only for convenience in describing the present invention and for simplification of description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The invention provides a directional linear two-fluid cleaning method and a device, wherein a directional two-fluid cleaning nozzle mechanism moves unidirectionally relative to a workpiece according to the extending direction of a line to be cleaned or the length direction of a specific workpiece, a cleaned area gradually covers the whole line to be cleaned or the surface of the specific workpiece along the moving direction of the directional two-fluid cleaning nozzle mechanism relative to the workpiece along with the cleaning, a two-fluid cleaning nozzle unit continuously sprays two fluids to the area to be cleaned of the workpiece while moving, a directional gas jet is continuously sprayed by the gas directional nozzle unit and forms a boundary layer at the periphery of an impact area of the two fluids, the boundary layer is in impact coupling with the two fluids, the splashed liquids at four positions, particularly the liquids splashed in the impact area and to the cleaned area, and the liquids are rapidly directionally transferred to the area to be cleaned, therefore, the directional two-fluid cleaning device can be used for capturing the small liquid flows generated by the impact area in all directions The compressed cleaning agent is compressed to one side of a boundary layer (the side to be cleaned of a workpiece, namely, a gas-liquid two-phase area), the dirt transfer capacity in an impact area is enhanced, the cleaning speed can be improved by 5-10 times on the premise of the same cleaning efficiency, and the cleaning agent has better cleaning quality.
The directional linear dual fluid cleaning method and apparatus of the present invention will now be described with reference to the accompanying drawings, FIG. 1 is a schematic structural diagram of a directional dual fluid cleaning nozzle mechanism in an embodiment of the present invention; FIG. 2 is a top view of a boundary layer flow direction in an embodiment of the present invention; FIG. 3 is a schematic structural view of a directional dual fluid cleaning apparatus in an embodiment of the present invention; FIG. 4 is a schematic sectional view of an impinging jet formed on the surface of a workpiece when the workpiece is cleaned by the directional dual fluid cleaning apparatus in an embodiment of the present invention; FIG. 5 is a schematic illustration of a comparison of a surface of a workpiece to be cleaned with a surface of the workpiece after a two fluid cleaning consisting of air and water; FIG. 6 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece after a two-fluid cleaning by the two-fluid cleaning nozzle unit in an embodiment of the present invention; FIG. 7 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece after being cleaned by a directional dual fluid cleaning apparatus (gas directional nozzle unit off) in an embodiment of the invention; FIG. 8 is a schematic illustration comparing the surface of a workpiece to be cleaned with the surface of the workpiece cleaned by the directional dual fluid cleaning apparatus (gas directional nozzle unit turned on) in the embodiment of the present invention; FIG. 9 is a schematic view of a prior art two-fluid nozzle; FIG. 10 is a schematic view of another prior art two-fluid nozzle configuration; and FIG. 11 is a schematic illustration of the cleaning of the dual fluid nozzle workpiece of FIG. 10.
As shown in fig. 1 to 4, according to the directional linear two-fluid cleaning method of the embodiment of the present invention, it is possible to clean stains (organic stains/inorganic stains) on a line to be cleaned on a surface of a workpiece 18 (a workpiece 18 having various precise surfaces such as a substrate, a semiconductor wafer, a photomask, photoelectric glass, etc.), the line to be cleaned being a virtual region to be cleaned set artificially on the workpiece 18, or a surface of a specific workpiece 18 (a workpiece 18 having various precise surfaces such as a substrate, a semiconductor wafer, a photomask, photoelectric glass, etc.), the specific workpiece 18 being a workpiece 18 having a width smaller than a diameter of the two-fluid; the directional linear dual fluid cleaning method comprises the following steps: the directional double-fluid cleaning nozzle mechanism moves unidirectionally relative to a workpiece 18 and cleans the workpiece surface 12, so as to divide the line to be cleaned or the specific workpiece surface 12 into a cleaned area 1 and a to-be-cleaned area 2, wherein the directional double-fluid cleaning nozzle mechanism is provided with a double-fluid cleaning nozzle unit 3 and a gas directional nozzle unit 4 fixedly connected with the double-fluid cleaning nozzle unit 3, the gas directional nozzle unit 4 is positioned on the opposite side of the double-fluid cleaning nozzle unit 3, and the opposite side is the side with an included angle beta with the opposite direction 5 of the directional double-fluid cleaning nozzle mechanism relative to the movement direction of the workpiece 18, and-90 degrees < beta < 90 degrees; the method for cleaning the workpiece surface 12 by the directional double-fluid cleaning nozzle mechanism comprises the following steps: the two-fluid cleaning nozzle unit 3 continuously sprays two fluids to the area to be cleaned 2 of the workpiece 18, the two fluids form an impact area 16 on the area to be cleaned 2, the gas directional nozzle unit 4 continuously sprays a directional gas jet, the directional gas jet is jetted to one side edge of the impact area 16 and forms a boundary layer 15 wrapping the one side edge, and an included angle alpha is formed between the flow direction 6 of the boundary layer 15 and the movement direction of the directional two-fluid cleaning nozzle mechanism relative to the workpiece 18, wherein alpha is larger than 90 degrees and smaller than 90 degrees; the boundary layer 15 is coupled with the two-fluid impact to capture the splashed liquid and transfer the liquid directionally towards the area to be cleaned 2.
According to the prior art described in the background of the patent, in the conventional two-fluid cleaning technology, splashed liquid drops are generated after a mixture of liquid drops and gas is flushed to the surface 12 of the workpiece, and part of the carried dirty liquid drops are dripped to the cleaned surface of the workpiece 18 again; the invention discloses a directional linear two-fluid cleaning method, a directional two-fluid cleaning nozzle mechanism moves unidirectionally relative to a workpiece 18 according to the extending direction of a line to be cleaned or the length direction of a specific workpiece 18, a cleaned area 1 gradually covers the whole line to be cleaned or the surface of the specific workpiece 18 along the moving direction of the directional two-fluid cleaning nozzle mechanism relative to the workpiece 18 along with the cleaning, a two-fluid cleaning nozzle unit 3 continuously sprays two fluids to an area to be cleaned 2 of the workpiece 18 while moving, a directional gas jet is continuously sprayed by a gas directional nozzle unit 4 and a boundary layer 15 is formed at the periphery of an impact area 16 of the two fluids, the boundary layer 15 is in impact coupling with the two fluids, the liquid splashed around, particularly the liquid splashed in the impact area 16 and to the cleaned area 1 can be captured and rapidly directionally transferred to the area to be cleaned 2, therefore, the directional double-fluid cleaning device can compress the tiny fluid flow generated in the impact area 16 in all directions to one side of the boundary layer 15 (the side to be cleaned of the workpiece 18, namely, the gas-liquid two-phase area 14), the dirt transfer capacity in the impact area 16 is enhanced, the cleaning speed can be improved by 5-10 times on the premise of the same cleaning efficiency, and the directional double-fluid cleaning device has better cleaning quality.
In addition, the directional linear double-fluid cleaning method disclosed by the invention also has the following additional technical characteristics:
according to some embodiments of the invention, the droplet size of the dual fluid is 100-; the jet velocity of the double fluids is more than or equal to 250 m/s.
According to some embodiments of the invention, the jet velocity of the directed gas jet is ≧ 10 m/s.
According to some embodiments of the invention, the distance from the ejection port of the two-fluid cleaning nozzle unit to the surface of the workpiece is 5 to 10 mm.
According to some embodiments of the invention, the input of the two-fluid cleaning nozzle unit 3 is fed with liquid water, the two-fluid being a mixture of water vapor and liquid water.
According to some embodiments of the invention, the mixture forms micro droplets containing micro-nano bubbles.
When organic dirt is cleaned, in the traditional two-fluid cleaning technology, a cleaning agent needs to be added, the environment can be seriously polluted by the cleaning agent, the cleaning agent is harmful to human health and is not beneficial to sustainable development, in the scheme, the two-fluid cleaning nozzle unit 3 is connected with liquid water and outputs high-speed liquid droplet jet with the particle size of about 100-400 um and the speed of about 300 m/s, the high-speed liquid droplet jet is micro liquid droplet containing micro-nano bubbles, the two fluids are flushed to the surface 12 of the workpiece, the dirt on the surface 12 of the workpiece is removed through impact wave jet of the two fluids on the surface 12 of the workpiece, the micro liquid droplet forms macroscopic impact on the surface 12 of the workpiece, meanwhile, the micro-nano bubbles form microscopic impact on the surface 12 of the workpiece, and further, the organic dirt, the inorganic dirt and the like on the surface 12 of the workpiece can be effectively cleaned, and meanwhile, the precision surface cannot be damaged, green, simple structure and low cost.
According to some embodiments of the present invention, the directional gas jet is directed at an angle θ with respect to the workpiece surface 12, θ ≦ 60.
According to some embodiments of the invention, the boundary layer 15 is formed by a first layer having an arc-shaped cross section and two second layers connected to two ends of the first layer, the first layer covers the side edge of the impact zone 16, ends of the two second layers, which ends are away from the first layer, extend away from the cleaned area 1, respectively, and the impact zone 16 is located between the first layer and the two second layers.
According to some embodiments of the invention each of said second layers is inclined in the flow direction 6 of said boundary layer 15 away from the other one of said second layers, respectively.
The boundary layer 15 has an approximately parabolic cross-section, and the boundary layer 15 is closed at one end and open at the other end and is arranged symmetrically with respect to the impact zone 16 and extends away from the cleaned zone 1.
According to some embodiments of the invention, the directed gas jet is a dry gas stream.
In the conventional two-fluid cleaning technology, after cleaning, the cleaned surface of the workpiece 18 needs to be air-dried by high-speed centrifugation and air drying; in the directional double-fluid cleaning nozzle mechanism, the right side of the boundary layer 15 is the pure gas phase area 17 containing the cleaned area 1, and the drying operation of the cleaned area 1 is also completed while the efficient cleaning is realized through the gas directional nozzle unit 4, so that the efficiency is high, and the cost is low.
According to some embodiments of the present invention, the thickness of the boundary layer 15 is 1mm to 20mm, and the thickness is the height of the boundary layer 15 from top to bottom.
According to some embodiments of the invention, the workpiece 18 is stationary and the directional dual fluid cleaning nozzle mechanism moves in one direction.
According to some embodiments of the invention, the workpiece 18 is moved unidirectionally and the directional dual fluid cleaning nozzle mechanism is stationary.
According to some embodiments of the present invention, the workpiece 18 is moved in a first direction, the directional dual fluid cleaning nozzle mechanism is moved in the first direction at a speed that is not equal to the speed of movement of the workpiece 18, or the workpiece 18 is moved in the first direction, the directional dual fluid cleaning nozzle mechanism is moved in a direction opposite to the first direction.
According to another aspect of the present invention, there is also provided a directional linear dual fluid cleaning apparatus based on one of the above directional linear dual fluid cleaning methods, comprising: carrier 11, directional two-fluid cleaning nozzle mechanism and be used for driving carrier 11 or/and the drive division of directional two-fluid cleaning nozzle mechanism linear motion, directional two-fluid cleaning nozzle mechanism includes: the two-fluid washing nozzle unit 3; and the gas directional nozzle unit 4 fixedly connected with the two-fluid cleaning nozzle unit 3 and used for spraying directional gas flow to one side edge of the impact area 16 of the two-fluid cleaning nozzle unit 3.
According to some embodiments of the invention, the two-fluid cleaning nozzle unit 3 comprises a two-fluid generator 7 of the phase change type with an input end for tapping in liquid water, an acceleration tube 8 with an input end connected and communicating with the output end of the two-fluid generator 7, and a two-fluid nozzle 9 connected with the acceleration tube 8.
According to some embodiments of the present invention, the two-fluid generator 7 is used for receiving ultrapure water, wherein the ultrapure water is water with a resistivity not less than 18M Ω.
The phase-change type double-fluid generator 7 converts ultrapure water into a mixture of water vapor and liquid water to realize gas and liquid double-fluid; the gas-liquid two-fluid enters the two-fluid nozzle 9 through the accelerating tube 8, the high-flow-rate steam flow sufficiently accelerates the liquid water through the accelerating tube 8, and then the steam flow is sprayed out of the two-fluid nozzle 9 to form high-speed liquid droplet jet flow (namely the two-fluid) with the particle size of about 100-400 um and the speed of about 300 m/s.
According to some embodiments of the invention, the two-fluid generator 7, the acceleration tube 8, the two-fluid nozzle 9 are coaxially connected in sequence.
According to some embodiments of the present invention, the jetting direction of the gas directional nozzle unit 4 and the jetting direction of the two-fluid cleaning nozzle unit 3 have an included angle therebetween of not less than thirty degrees and being an acute angle.
According to some embodiments of the invention, the gas directional nozzle unit 4 is fixedly connected to the two-fluid cleaning nozzle unit 3 by a synchronizing bracket 10.
According to some embodiments of the present invention, the spraying direction of the two-fluid cleaning nozzle unit 3 is perpendicular to the carrying surface of the carrier 11; an included angle theta is formed between the spraying direction of the gas directional nozzle unit 4 and the bearing surface of the carrier 11, and the theta is not more than 60 degrees.
According to some embodiments of the present invention, the directional dual-fluid cleaning apparatus includes a linear driving module 13, a carrier 11 mounted on an output end of the linear driving module 13, the carrier 11 being used for carrying a workpiece 18; the phase-change type double-fluid generator 7 is used for converting ultrapure water into a mixture of water vapor and liquid water, gas and liquid double-fluid is achieved, the gas and liquid double-fluid flows into the double-fluid nozzle 9 through the accelerating tube 8, the accelerating tube 8 is used for enabling high-flow-rate steam airflow to sufficiently accelerate the liquid water and then is ejected out of the double-fluid nozzle 9, a high-speed liquid drop jet flow with the particle size of about 100-400 um and the speed of about 300 m/s is formed, and the effective diameter of the double-fluid nozzle 9 is about 2 mm. A linear jet nozzle (i.e., the gas directional nozzle unit 4) which is 14mm long, 1mm wide and forms an angle of 30 degrees with the bearing surface of the carrier 11 is installed on the same height (10 mm) of the two-fluid nozzle 9, compressed air is connected to the input end of the linear jet nozzle, and a directional gas jet with the flow velocity of about 100 m/s is emitted to the surface 12 of the workpiece; the linear jet nozzle is connected with the double-fluid nozzle 9 through a synchronous bracket 10 to realize motion synchronization.
As shown in fig. 5, where the left part of the drawing is a workpiece with a smudge a on the surface, and the right part of the drawing is the workpiece surface after two-fluid cleaning formed by air and water, when organic smudge such as a fingerprint of a point to be cleaned (i.e. the smudge a in the drawing) on the surface of the mobile phone glass back plate is cleaned by two fluids formed by air and liquid drops (water), it can be clearly seen that the mobile phone glass back plate still has a smudge mark; the double-fluid cleaning nozzle unit 3 is used for cleaning the surface of the glass backboard of the mobile phone, wherein the double-fluid cleaning nozzle unit 3 is communicated with liquid water, as shown in fig. 6, the left part of the drawing is a workpiece with dirty spots a on the surface, and the right part of the drawing is the surface of the workpiece cleaned by the double-fluid cleaning nozzle unit in the embodiment of the invention, and as can be seen from fig. 6, the double-fluid cleaning nozzle unit 3 in the embodiment of the invention can effectively clean organic dirty matters such as fingerprints of points to be cleaned on the surface of the glass backboard of the mobile phone; therefore, the two-fluid cleaning nozzle unit 3 of the present invention can effectively clean the stains including the organic stains on the workpiece 18.
The directional double-fluid cleaning device is used for cleaning lines to be cleaned on the surface of the glass backboard of the mobile phone, wherein the double-fluid cleaning nozzle unit 3 is communicated with liquid water, as shown in figure 7, the left part of the figure is a workpiece with a dirty line b on the surface, the right part of the figure is the surface of the workpiece cleaned by the directional double-fluid cleaning device (the gas directional nozzle unit is closed), and when the directional gas jet flow is closed, in the scanning and cleaning process, the dirty matters such as fingerprints and the like on the surface of the glass backboard of the mobile phone are randomly distributed; as shown in fig. 8, the left part of the drawing is a workpiece with a dirty line b on the surface, the right part of the drawing is the workpiece surface cleaned by the directional two-fluid cleaning device (the directional nozzle unit is turned on), when the directional gas jet is turned on, a clear boundary line between the cleaned area 11 and the uncleaned area appears, and the cleaned area 11 is dried while the efficient cleaning is realized, as can be seen from fig. 7 and 8, the directional two-fluid cleaning device of the present embodiment can compress the tiny liquid flow generated in the impact area 16 in all directions to one side of the boundary layer 15 (the side to be cleaned of the workpiece 18, i.e., the gas-liquid two-phase area 14), so that the dirt transfer capability in the impact area 16 is enhanced, and on the premise of the same cleaning efficiency, the cleaning speed can be increased by 5-10 times, and the cleaning quality is better, so that the efficient cleaning is realized.
Any reference to "one embodiment," "an embodiment," "example embodiment," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. This schematic representation in various places throughout this specification does not necessarily refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature, structure, or characteristic in connection with other ones of the embodiments.
While specific embodiments of the invention have been described in detail with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this invention; in particular, reasonable variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the foregoing disclosure, the drawings and the appended claims without departing from the spirit of the invention; except variations and modifications in the component parts and/or arrangements, the scope of which is defined by the appended claims and equivalents thereof.
Claims (10)
1. A directional linear dual fluid cleaning method for cleaning inorganic and/or organic stains on a workpiece, comprising the steps of:
the directional double-fluid cleaning nozzle mechanism moves unidirectionally relative to the workpiece and cleans the surface of the workpiece,
the directional double-fluid cleaning nozzle mechanism is provided with a double-fluid cleaning nozzle unit and a gas directional nozzle unit fixedly connected with the double-fluid cleaning nozzle unit; the method for cleaning the surface of the workpiece by the directional double-fluid cleaning nozzle mechanism comprises the following steps: the double-fluid cleaning nozzle unit continuously sprays double fluids to a to-be-cleaned area of a workpiece, the double fluids form an impact area on the to-be-cleaned area, the gas directional nozzle unit pointing to the to-be-cleaned area continuously sprays directional gas jet, the directional gas jet is jetted to one side edge of the impact area and forms a boundary layer wrapping the one side edge, and an included angle alpha is formed between the flow direction of the boundary layer and the reverse direction of the directional double-fluid cleaning nozzle mechanism relative to the movement direction of the workpiece, wherein alpha is larger than 90 degrees and smaller than 90 degrees; the boundary layer and the double-fluid impact coupling capture splashed liquid and transfer the liquid to the area to be cleaned directionally.
2. An oriented linear two-fluid cleaning method as claimed in claim 1, wherein the droplet size of said two-fluid is 100-; the jet velocity of the double fluids is more than or equal to 250 m/s.
3. An oriented linear dual fluid cleaning method as claimed in claim 1 or 2 wherein said dual fluid cleaning nozzle unit input is fed with liquid water, said dual fluid being a mixture of water vapor and liquid water.
4. A directional linear dual fluid cleaning method according to claim 1 or 2, characterized in that the jet velocity of said directional gas jet is 10 m/s or more.
5. A directional linear dual fluid cleaning method according to claim 4, characterized in that the emission direction of said directional gas jet is at an angle θ with the surface of the workpiece, θ ≦ 60 °.
6. An oriented linear dual fluid cleaning process according to claim 1 wherein said boundary layer is comprised of a first layer having an arcuate cross-section and two second layers connected to respective ends of said first layer, said first layer wrapping said one side edge of said impingement zone, respective ends of said two straight layers remote from said first layer extending away from said cleaned zone, and said impingement zone being located between said first layer and said two second layers.
7. A directional linear dual fluid cleaning method according to claim 1, wherein each of said second layers is inclined in a direction away from the other of said second layers, respectively, in the direction of flow of said boundary layer.
8. A directional linear dual fluid cleaning method according to claim 1, wherein said directional gas jet is a dry gas stream.
9. A directional linear dual fluid cleaning method according to claim 1, wherein said boundary layer has a thickness of 1mm to 20 mm.
10. An oriented linear dual fluid cleaning apparatus based on an oriented linear dual fluid cleaning method as claimed in any one of claims 1-9, comprising: the device comprises a carrier, the directional dual-fluid cleaning nozzle mechanism and a driving part for driving the carrier or/and the directional dual-fluid cleaning nozzle mechanism to move linearly.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439523A (en) * | 1994-02-14 | 1995-08-08 | Memc Electronic Materials, Inc. | Device for suppressing particle splash onto a semiconductor wafer |
| US20030089799A1 (en) * | 2001-11-14 | 2003-05-15 | Mitsubishi Denki Kabushiki Kaisha | Two-fluid cleaning jet nozzle, cleaning equipment and method of fabricating semiconductor device employing the same |
| CN1947871A (en) * | 2005-10-14 | 2007-04-18 | 大日本网目版制造株式会社 | Substrate treating apparatus |
| US20160027637A1 (en) * | 2014-07-25 | 2016-01-28 | Kyoungseob Kim | Apparatus and methods for manufacturing semiconductor devices and treating substrates |
| US20160271658A1 (en) * | 2013-10-23 | 2016-09-22 | Brooks Ccs Gmbh | Cleaning systems and methods for semiconductor substrate storage articles |
| CN106370484A (en) * | 2016-10-13 | 2017-02-01 | 苏州阿洛斯环境发生器有限公司 | Synthetic jet device, portable miniature particulate matter sampling apparatus and trapping method |
| US20190333771A1 (en) * | 2017-02-10 | 2019-10-31 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| CN111451190A (en) * | 2019-01-21 | 2020-07-28 | 宁波江丰电子材料股份有限公司 | Target cleaning method |
-
2021
- 2021-03-30 CN CN202110338102.4A patent/CN113020080A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439523A (en) * | 1994-02-14 | 1995-08-08 | Memc Electronic Materials, Inc. | Device for suppressing particle splash onto a semiconductor wafer |
| US20030089799A1 (en) * | 2001-11-14 | 2003-05-15 | Mitsubishi Denki Kabushiki Kaisha | Two-fluid cleaning jet nozzle, cleaning equipment and method of fabricating semiconductor device employing the same |
| CN1947871A (en) * | 2005-10-14 | 2007-04-18 | 大日本网目版制造株式会社 | Substrate treating apparatus |
| US20160271658A1 (en) * | 2013-10-23 | 2016-09-22 | Brooks Ccs Gmbh | Cleaning systems and methods for semiconductor substrate storage articles |
| US20160027637A1 (en) * | 2014-07-25 | 2016-01-28 | Kyoungseob Kim | Apparatus and methods for manufacturing semiconductor devices and treating substrates |
| CN106370484A (en) * | 2016-10-13 | 2017-02-01 | 苏州阿洛斯环境发生器有限公司 | Synthetic jet device, portable miniature particulate matter sampling apparatus and trapping method |
| US20190333771A1 (en) * | 2017-02-10 | 2019-10-31 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| CN111451190A (en) * | 2019-01-21 | 2020-07-28 | 宁波江丰电子材料股份有限公司 | Target cleaning method |
Non-Patent Citations (3)
| Title |
|---|
| （苏）别利亚宁，（苏）达尼洛夫著；: "《机械的工业清洁度》", 31 July 1987, 机械工业出版社 * |
| （英）A.H.勒菲沃，（英）D.R.鲍拉尔著: "《燃气涡轮发动机燃烧》", 30 June 2016, 北京航空工业出版社 * |
| 中国机械工程学会再制造工程分会编: "《再制造技术路线图》", 30 November 2016, 科学普及出版社 * |
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