CN113009649A

CN113009649A - Optical module

Info

Publication number: CN113009649A
Application number: CN201911330701.0A
Authority: CN
Inventors: 郑龙; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2021-06-22
Anticipated expiration: 2039-12-20
Also published as: CN113009649B

Abstract

The application provides an optical module, and particularly relates to an optical module, wherein a light source is arranged in a groove formed in a circuit board and is electrically connected with the circuit board through a routing or flexible circuit board; one end of the first optical fiber ribbon is connected with the light source, and the other end of the first optical fiber ribbon is optically connected with the optical port of the silicon optical chip; and the silicon optical chip is arranged on the circuit board, is electrically connected with the adapter plate and is used for carrying out signal modulation on the light output by the light source. According to the light source, the light source is arranged on the surface of the circuit board, and the light source is optically connected with the silicon optical chip through the optical fiber ribbon, so that heat generated in the working process of the light source can be diffused through the circuit board, and the problem that the heat generated by the light source is directly conducted to the silicon optical chip to increase the heat dissipation burden of the silicon optical chip due to the fact that the light source is directly contacted with the silicon optical chip is effectively avoided; in addition, the light source is directly arranged on the surface of the circuit board, and the thickness of the optical module is reduced.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

In new business and application modes such as cloud computing, mobile internet, video and the like, an optical communication technology can be used, and an optical module is a key device in optical communication equipment. The adoption of a silicon optical chip to realize a photoelectric conversion function has become a mainstream scheme adopted by a high-speed optical module.

In the silicon optical module, a silicon optical chip is usually attached to the surface of a circuit board; then, a light source is attached to the upper surface of the silicon optical chip to provide light which does not carry data for the silicon optical chip. Since the light source generates a large amount of heat during its operation, the heat generated by the light source needs to be diffused through the silicon microchip. However, in real products, the heat dissipation efficiency of the silicon optical chip is limited, so the heat dissipation burden of the silicon optical chip is increased by the diffusion of the silicon optical chip, especially for high-speed signal transmission products, and semiconductor materials such as the silicon optical chip are sensitive to heat, and if the heat is not conducted out in time, the performance of the silicon optical chip is obviously affected, thereby affecting the communication quality of the optical module.

Disclosure of Invention

The embodiment of the application provides an optical module to solve the problem that the heat dissipation burden of a silicon optical chip is increased due to the mode of attaching a light source to the silicon optical chip.

An optical module provided in an embodiment of the present application mainly includes:

the circuit board is used for providing a driving signal, and a groove is formed in the circuit board;

the light source is arranged in the groove and is electrically connected with the circuit board;

one end of the first optical fiber ribbon is connected with the light source, and the other end of the first optical fiber ribbon is connected with an optical port of the silicon optical chip in an optical mode and used for transmitting light output by the light source to the silicon optical chip;

the silicon optical chip is arranged on the circuit board, is electrically connected with the circuit board and is used for receiving light from the light source;

the optical fiber socket is optically connected with the silicon optical chip and is used for establishing connection between the silicon optical chip and an optical fiber outside an optical module;

the light source includes:

the shell is arranged in the groove and used for bearing a device;

the insulating substrate is arranged in the shell, and a first metal plate and a second metal plate are formed on the surface of the insulating substrate and used for providing electric connection for the laser chip;

the laser chip is arranged on the surface of the insulating substrate, the positive electrode on the first surface of the laser chip is electrically connected with the surface of the first metal plate, and the negative electrode on the second surface of the laser chip is electrically connected with the surface of the second metal plate;

and one part of the insulating substrate extends out of the shell and is electrically connected with the laser driving bonding pad on the circuit board through a routing.

Another optical module provided in an embodiment of the present application mainly includes:

the light source includes:

a housing for carrying a device;

and one end of the flexible circuit board extends into the shell and is electrically connected with the insulating substrate, and the other end of the flexible circuit board is positioned outside the shell and is electrically connected with the laser driving pad on the circuit board.

As can be seen from the above embodiments, in the optical module provided in the embodiments of the present application, a groove is formed in the surface of the circuit board, the light source is disposed in the groove and electrically connected to the circuit board through a routing or a flexible board, and an optical connection is established between the light source and the silicon optical chip through an optical fiber ribbon to provide light for the silicon optical chip. Through the arrangement, heat generated in the working process of the light source can be diffused through the circuit board, so that the problem that the heat generated by the light source is directly conducted to the silicon optical chip to aggravate the heat dissipation burden of the silicon optical chip due to the fact that the light source is directly contacted with the silicon optical chip is effectively solved; in addition, the light source is directly arranged on the surface of the circuit board, and the thickness of the optical module is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

FIG. 4 is an exploded view of an optical module according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of an assembly structure of a circuit board, a silicon optical chip, a light source and a fiber optic socket according to an embodiment of the present invention;

fig. 6 is a schematic partial structure diagram of a circuit board according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a first laser source according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of an assembly structure of the laser source and the circuit board in FIG. 7 according to an embodiment of the present invention;

FIG. 9 is a first schematic structural diagram of a second laser source according to an embodiment of the present invention;

FIG. 10 is a second schematic structural diagram of a second laser source according to an embodiment of the present invention;

FIG. 11 is a schematic diagram of an assembly structure of the laser source and the circuit board in FIG. 10 according to an embodiment of the present invention;

FIG. 12 is a first schematic view illustrating an assembly structure of a third laser source and a circuit board according to an embodiment of the present invention;

FIG. 13 is a second schematic view illustrating an assembly structure of a third laser source and a circuit board according to an embodiment of the present invention;

fig. 14 is a third schematic view of an assembly structure of a third laser source and a circuit board according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, the optical module 200 according to the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a silicon optical chip 403, a light source 500, an optical fiber socket 600, and a circuit adapter board 700.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with a silicon optical chip 403 inside the optical module; the photoelectric devices such as the circuit board 300, the silicon optical chip 403, the light source 500, the circuit adapter plate 700 and the like are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the silicon optical chip 403 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The silicon optical chip 403 is arranged on the circuit board 300 and electrically connected with the circuit board 300, and specifically can be wire bonding connection; the periphery of the silicon optical chip is connected to the circuit board 300 by a plurality of conductive wires, so the silicon optical chip 403 is generally disposed on the surface of the circuit board 300.

The silicon optical chip 403 receives light from the light source 500, and further modulates the light, specifically, loads a signal on the light; the silicon optical chip 403 receives light from the fiber optic receptacle 600 and converts the optical signal into an electrical signal.

Light source 500 is disposed on circuit board 300 and is optically connected to silicon optical chip 403 via first optical fiber ribbon 501. The monochromaticity based on laser is good, the light source 500 can adopt a laser light source, and the main electric device in the laser light source is a laser chip; the laser chip emits light which does not carry signals; the light source 500 is electrically connected to the circuit board 300, and the laser chip is electrically driven from the circuit board 300. A temperature adjusting electric device such as a semiconductor refrigerator may be provided in the light source 500 to realize temperature control for the laser chip, and the temperature adjusting electric device obtains power supply driving from the circuit board 300.

In the embodiment, the light source 500 is disposed on the circuit board 300, so that on one hand, the overall thickness of the optical module can be reduced compared with the case that the light source is integrated on the upper surface of the silicon optical chip 403; on the other hand, a large amount of heat is also generated in the working process of the light source 500, the heat generated by the light source 500 is not beneficial to being diffused through the silicon optical chip 403, in a real product, the heat dissipation efficiency of the silicon optical chip 403 is limited, the heat dissipation efficiency of the silicon optical chip 403 is difficult to be significantly improved through conventional structural design or material change, the heat dissipation burden of the silicon optical chip 403 is increased through the diffusion of the silicon optical chip 403, according to the heat dissipation capability of the silicon optical chip 403, in the relatively low-speed signal transmission process, the heat of the laser box is diffused through the silicon optical chip 403 by an optical module product, but for a high-speed signal transmission product, the design that the heat of the light source is diffused through the silicon optical chip 403 is not desirable, therefore, the light source 500 is arranged on the surface of the circuit board 300 or at a position other than the circuit board 300 in the embodiment, and the influence of.

The silicon optical chip 403 is optically connected to the optical fiber receptacle 600 through the second optical fiber ribbon 601, and the optical fiber receptacle 600 is optically connected to an optical fiber outside the optical module. The light modulated by the silicon optical chip 403 is transmitted to the optical fiber socket 600 through the second optical fiber ribbon 601 and transmitted to the external optical fiber through the optical fiber socket 600; light transmitted from the external optical fiber is transmitted to the second optical fiber ribbon 601 through the optical fiber socket 600 and transmitted to the silicon optical chip 403 through the second optical fiber ribbon 601; therefore, the silicon optical chip 403 outputs light carrying data to the optical module external optical fiber or receives light carrying data from the optical module external optical fiber.

Of course, instead of disposing the silicon optical chip 403 directly on the circuit board 300, the circuit interposer 700 may be disposed directly on both. Fig. 5 is a schematic view of an assembly structure of the circuit board, the silicon optical chip, the light source, and the fiber optic socket according to the embodiment of the present invention. As shown in fig. 5, the circuit adapter plate 700 is disposed on the circuit board 300 and electrically connected to the circuit board 300, and then the silicon optical chip 403 is disposed on the circuit adapter plate 700 and electrically connected to the circuit adapter plate 700, thereby electrically connecting the silicon optical chip 403 to the circuit board 300. In addition, the Driver chip (Driver)402 and the transimpedance amplifier 404 may be disposed on the circuit board 700, and the Driver chip 402 and the transimpedance amplifier 404 may be connected to the circuit board 300 by signal transfer of the circuit board 700.

The thermal expansion coefficient of the circuit adapter plate 700 is lower than that of the circuit board 300, for example, the circuit adapter plate 700 is made of materials such as optional aluminum nitride and aluminum oxide, and correspondingly, the thermal deformation of the circuit adapter plate 700 is smaller than that of the circuit board 300, that is, the thermal stability of the circuit adapter plate is better than that of the circuit board 300, so that in the working process of the optical module, the circuit adapter plate 700 can provide a more stable bearing surface for the silicon optical chip arranged on the circuit adapter plate, the stability of the relative position of the silicon optical chip 403 and the optical fiber ribbon is ensured, and the stability of the optical coupling efficiency between the silicon optical chip 403 and the optical fiber ribbon. In addition, the circuit adapter board 700 in this embodiment is configured to be a double-layer or multi-layer structure, and a circuit trace is disposed inside the circuit adapter board to electrically connect the silicon optical chip 403 and the circuit board 300, so that the silicon optical chip 403 modulates an optical signal based on the modulation signal from the driving chip 402, and the silicon optical chip 403 converts the optical signal from the outside into an electrical signal and outputs the electrical signal to the circuit board 300.

Fig. 6 is a schematic partial structure diagram of a circuit board according to an embodiment of the present invention. Since optical devices are usually disposed in the light source 500 to achieve collimation of the light path, and the like, which require high surface cleanliness, a sealed housing is usually disposed to protect the devices inside the laser source, and the devices in the light source 500 are disposed in the housing. In this embodiment, the silicon optical chip 403 is disposed on the circuit board 300 directly or through the circuit adapter board 700, so that a certain height difference exists between the light source 500 and the silicon optical chip 403, and the first optical fiber ribbon 501 optically connected to the silicon optical chip 403 needs to be connected to the light source 500 after the first optical fiber ribbon 501 is lifted by an extra supporting component.

Therefore, in order to facilitate the optical connection between the light source 500 and the silicon optical chip 403, as shown in fig. 6, the present embodiment provides a groove 301 on the circuit board 300, and the light source 500 is disposed in the groove 301. Wherein, based on the height difference between the light outlet of the light source 500 and the light outlet of the silicon optical chip 403, the depth of the groove 301 is set to be 100-150 um in this embodiment, which is not limited to this value range. The groove 301 is provided in this embodiment, so that the arrangement position of the light source 500 can be conveniently located in the optical module assembling process.

Further, according to the requirements of the layout of the circuit board, the application environment of the optical module, and the like, different electrical connection modes of the laser source 500 and the circuit board 300 are set in the present embodiment.

Fig. 7 is a schematic structural diagram of a first laser source according to an embodiment of the present invention. As shown in fig. 7, the laser source in this embodiment includes a housing 507, and it should be noted that the housing in fig. 7 is a schematic view after an upper cover is removed. To facilitate heat dissipation of the devices inside the laser source 500, the housing 507 may be made of a metal material, such as copper. The housing 507 is provided with an insulating substrate 502, a laser chip 503, a first lens group 5041, a second lens group 5042, and a spacer 505. In this embodiment, two sets of optical paths are provided in the housing 507 based on the optical power requirement, that is, the insulating substrate 502, the laser chip 503, the first lens group 5041, the second lens group 5042 and the isolator 505 are all provided as two sets.

Wherein the insulating substrate 502 is disposed at the bottom of the housing 507, and a portion of the insulating substrate 502 protrudes out of the housing 507. In order to make the insulating substrate 502 provide a more flat carrying surface for devices disposed thereon, the insulating substrate 502 in this embodiment may be made of materials suitable for high precision processing, such as aluminum nitride and aluminum oxide. The insulating substrate 502 has a first metal plate and a second metal plate formed independently on the surface thereof. The laser chip 503 is disposed on the surface of the insulating substrate 502, the positive electrode on the first surface of the laser chip 503 is electrically connected to the surface of the first metal plate, and the negative electrode on the second surface of the laser chip 503 is electrically connected to the surface of the second metal plate, wherein the first surface and the second surface of the laser chip 503 may be the upper surface and the lower surface of the laser chip, respectively, or the same surface on the laser chip 503. The first lens group 5041 and the second lens group 5042 are sequentially disposed on the light emitting side of the laser chip 503, and the laser beam emitted by the laser chip 503 is collimated by the first lens group 5041 and the second lens group 5042 to form a collimated laser beam, and then the collimated laser beam is transmitted to the isolator 505 and then transmitted to the first optical fiber ribbon 501 through the isolator 505.

To facilitate coupling of isolator 505 into first fiber optic ribbon 501, the present embodiment clamps a fiber optic ribbon splice 506 on first fiber optic ribbon 501, with one end of fiber optic ribbon splice 506 disposed outside of housing 507 and the other end disposed inside of housing 507 for making optical connection of laser chip 503 to first fiber optic ribbon 501. In this embodiment, the optical fiber ribbon connector 506 is clamped on the first optical fiber ribbon 501, and the optical fiber ribbon connector 506 is fixed on the housing 507, so that compared with a mode of directly coupling the first optical fiber ribbon 501 with the laser chip 503, the stability of the relative position between the first optical fiber ribbon 501 and the laser chip 503 can be ensured, and further the stability of the optical coupling efficiency between the first optical fiber ribbon 501 and the laser chip 503 can be ensured.

Fig. 8 is a schematic view of an assembly structure of the laser source and the circuit board in fig. 7 according to an embodiment of the present invention. As shown in fig. 9, the circuit board 300 is provided with a groove 301, and the light source 500 is disposed in the groove 301. The circuit board 300 is provided with a laser driving pad 302, and the insulating substrate 502 is electrically connected to the laser driving pad 302 on the circuit board 300 by a wire bonding, wherein the wire bonding may be a gold wire. Thus, the driving signal output from the circuit board 300 can be transmitted to the laser chip 503 through the insulating substrate 502, so that the laser chip 503 outputs a laser beam.

In addition, the housing 507 and the insulating substrate 502 based on the light source 500 have a certain thickness, so that after the insulating substrate 502 is disposed on the housing 507, the upper surface of the insulating substrate has a certain height difference compared with the laser driving pad 302 on the circuit board 300, and in the embodiment, the housing 507 is disposed in the groove 301 formed on the circuit board 300, so that the height difference between the upper surface of the insulating substrate 502 and the laser driving pad 302 can be reduced, and further, the length of a wire bonding for connecting the insulating substrate 502 and the laser driving pad 302 can be shortened, and the propagation path of the driving signal can be shortened.

Fig. 9 is a first schematic structural diagram of a second laser source provided in the embodiment of the present invention, and fig. 10 is a second schematic structural diagram of the second laser source provided in the embodiment of the present invention. As shown in fig. 9 and 10, the laser source in this embodiment includes a housing 507 composed of two parts, an upper housing 5072 and a lower housing 5071, and the upper housing 5072 is snap-fitted to the lower housing 5071. The lower case 5071 is provided with an insulating substrate 502, a laser chip 503, a first lens group 5041, a second lens group 5042, and a spacer 505. In this embodiment, two sets of optical paths are also provided in the housing 507, that is, the insulating substrate 502, the laser chip 503, the first lens group 5041, the second lens group 5042, and the spacer 505 are provided in two sets. In addition, in order to make the laser chip 503, the first lens group 5041, the second lens group 5042 and the separator 505 on the same optical axis, the upper surface of the lower housing 5071 has different relative heights to carry the above-mentioned devices.

Wherein the insulating substrate 502 is disposed at the bottom of the housing 507. The insulating substrate 502 has a first metal plate and a second metal plate formed independently on the surface thereof. The laser chip 503 is disposed on the surface of the insulating substrate 502, the positive electrode on the first surface of the laser chip 503 is electrically connected to the surface of the first metal plate, and the negative electrode on the second surface of the laser chip 503 is electrically connected to the surface of the second metal plate, wherein the first surface and the second surface of the laser chip 503 may be the upper surface and the lower surface of the laser chip, respectively, or the same surface on the laser chip 503. The first lens group 5041 and the second lens group 5042 are sequentially disposed on the light-emitting side of the laser chip 503, and a laser beam emitted by the laser chip 503 is sequentially collimated by the first lens group 5041 and the second lens group 5042 to form a collimated laser beam, and the collimated laser beam is transmitted to the isolator 505, and then transmitted to the first optical fiber ribbon 501 clamped by the optical fiber ribbon connector 506 through the isolator 505.

One end of the flexible circuit board 800 extends into the housing 507 and is electrically connected to the insulating substrate 502, and the other end is located outside the housing 507. In order to facilitate the electrical connection between the flexible circuit board 800 and the insulating substrate 502, a pad is disposed at an end of the flexible circuit board 800 extending into the housing 507, and the pad is electrically connected to the insulating substrate 502 by a wire.

Fig. 11 is a schematic view of an assembly structure of the laser source and the circuit board in fig. 10 according to an embodiment of the present invention. As shown in fig. 11, the light source 500 is disposed on the upper surface of the circuit board 300, and the laser driving pad is disposed on the lower surface of the circuit board 300. After being bent, the flexible circuit board 800 bypasses the circuit board 300 and is electrically connected with the laser driving pad, wherein the connection mode of the laser driving pad and the flexible circuit board 800 can be realized by welding through solder. Thus, the driving signal output by the circuit board 300 can be transmitted to the laser chip 503 through the flexible circuit board 800, so that the laser chip 503 outputs a laser beam.

Further, in order to facilitate the connection between the light source 500 and the circuit board 300, shorten the length of the traces in the flexible circuit board 800, and reduce the influence of the flexible circuit board 800 on other devices on the circuit board 300, the light source 500 is disposed at a position close to a corner of the long side of the circuit board 300.

Fig. 12 is a first schematic view of an assembly structure of a third laser source and a circuit board according to an embodiment of the present invention, and fig. 13 is a second schematic view of an assembly structure of a third laser source and a circuit board according to an embodiment of the present invention. As shown in fig. 12 and 13, the device provided in the laser light source in the present embodiment is mainly different from that in the above-described embodiment in that there is only one lens group 504 in the present embodiment.

Wherein the insulating substrate 502 is disposed at the bottom of the housing 507. The insulating substrate 502 is provided with a laser chip 503. The lens group 504 is disposed on the light emitting side of the laser chip 503, and the laser beam emitted by the laser chip 503 is collimated by the lens group 504 in sequence to form a collimated laser beam, and the collimated laser beam is transmitted to the isolator 505 and then transmitted to the first optical fiber ribbon 501 clamped by the optical fiber ribbon connector 506 through the isolator 505.

One end of the flexible circuit board 800 extends into the housing 507 and is electrically connected to the insulating substrate 502, and the other end is located outside the housing 507. In order to facilitate the electrical connection between the flexible circuit board 800 and the insulating substrate 502, a pad is disposed on the upper surface of one end of the flexible circuit board 800 extending into the housing 507, and the pad is electrically connected to the insulating substrate 502 by a wire.

The light source 500 is disposed on the upper surface of the circuit board 300, and at the same time, the laser driving pad is also disposed on the upper surface of the circuit board 300. The flexible circuit board 800 located outside the housing 507 is directly soldered on the laser driving pad. Thus, the driving signal outputted from the circuit board 300 can be transmitted to the laser chip 503 through the flexible circuit board 800, so that the laser chip 503 outputs the laser beam to the first optical fiber ribbon 501.

As shown in fig. 12 and 13, in the present embodiment, the laser driver pad on the circuit board 300 is disposed at the end, and on the circuit board 300, other components are disposed around the laser driver pad, so the light source 500 is disposed at the long side of the circuit board 300 and near the corner, then the flexible circuit board 800 is disposed in an L-shaped structure to electrically connect the light source 500 and the laser driver pad, in the present embodiment, the flexible circuit board 800 is used to connect the light source 500 and the circuit board 300, compared with the routing method, because the laser driver pad is disposed at the end, the routing is longer, the routing is usually thinner, and the firmness is poor, therefore, the flexible circuit board 800 is used in the present embodiment, which not only can more fully utilize the space of the circuit board 300, but also ensure the stability of the device.

In order to facilitate the soldering of the flexible circuit board 800 on the circuit board, a portion of the flexible circuit board 800 protrudes from the circuit board 300, and then the protruding portion may be cut off after the soldering is completed, so as to obtain an assembly structure diagram of the third laser source and the circuit board shown in fig. 14.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A light module, comprising:

the light source includes:

the shell is arranged in the groove and used for bearing a device;

2. The light module of claim 1, wherein the light source further comprises:

and the optical fiber band joint is used for clamping the first optical fiber band, one end of the optical fiber band joint is arranged outside the shell, and the other end of the optical fiber band joint is arranged inside the shell and used for realizing optical connection between the laser chip and the first optical fiber band.

3. A light module according to claim 1 or 2, characterized in that the light source is arranged at a position close to a corner on the long side of the circuit board.

4. The light module according to claim 1 or 2, characterized in that the depth of the groove is 100-150 um.

5. A light module, comprising:

the light source includes:

a housing for carrying a device;

6. The optical module of claim 5, wherein the housing is disposed on an upper surface of the circuit board, the laser driving pad is disposed on a lower surface of the circuit board, and the flexible circuit board is bent and electrically connected to the laser driving pad by bypassing the circuit board.

7. The optical module of claim 5, wherein the housing is disposed on an upper surface of the circuit board, the laser driving pad is disposed on an upper surface of the circuit board, and the flexible circuit board is soldered on the laser driving pad.

8. The optical module of any one of claims 5 to 7, wherein the laser driver pads are electrically connected to the flexible circuit board by wire bonding.

9. The light module of any of claims 5 to 7, wherein the light source further comprises:

10. The light module according to any one of claims 5 to 7, wherein the light source is disposed on a long side of the circuit board near a corner.