CN112977838A - Embedded atmospheric pressure sensor with low deicing power consumption and high reliability - Google Patents
Embedded atmospheric pressure sensor with low deicing power consumption and high reliability Download PDFInfo
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- CN112977838A CN112977838A CN202110210590.0A CN202110210590A CN112977838A CN 112977838 A CN112977838 A CN 112977838A CN 202110210590 A CN202110210590 A CN 202110210590A CN 112977838 A CN112977838 A CN 112977838A
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- measuring hole
- electronic component
- pressure
- skin
- pressure measuring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
- B64D15/12—De-icing or preventing icing on exterior surfaces of aircraft by electric heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D43/00—Arrangements or adaptations of instruments
Abstract
The invention discloses an embedded atmospheric pressure sensor with low deicing power consumption and high reliability, which comprises a pressure measuring hole skin at the lower part and an electronic component at the upper part, wherein a heat conduction blocking device is arranged between the pressure measuring hole skin and the electronic component, a heating device is fixed at the inner side of a pressure measuring hole of the pressure measuring hole skin, the heating device is a thermal resistance ring in a threaded pile, and electric power is supplied by a heating power supply to heat. The heat conduction blocking design adopted between the pressure measuring hole heating device and the electronic component improves the heat accumulation of the heating device at the pressure measuring hole, reduces the transfer of the heat to the electronic component, and reduces the required heating power under the condition of the same anti-icing performance compared with the traditional atmospheric pressure sensor; the gathering of the heating heat at the pressure measuring hole is effectively promoted, the transmission of the heating heat to the electronic component is reduced, and the electronic component is ensured to work at normal environmental temperature.
Description
Technical Field
The invention relates to the technical field of aerospace and aviation atmospheric data detection equipment, in particular to an embedded atmospheric pressure sensor with low deicing power consumption and high reliability.
Background
The atmospheric data detection system is used for measuring flight atmospheric parameters representing the correlation between the movement of the aircraft and the incoming flow air, and the information provided by the atmospheric data detection system, such as air pressure altitude, lifting speed, indicated airspeed, vacuum speed, Mach number and the like represents the flight state of the aircraft and is used for guiding the control operation of the aircraft.
Because the atmospheric pressure sensor is exposed at the outer side of the aircraft body, the air source is introduced in a mode of opening a hole on the surface of an exposed probe or opening a hole on the surface of a skin of a pressure measuring hole of the atmospheric pressure sensor, the sizes of the openings are small, and water vapor can be condensed into ice at the pressure measuring hole in the flight process of the aircraft.
Traditional probe formula atmospheric pressure sensor that exposes adopts arranges heliciform armor heater in tube head trompil position department, and because the liquid water content of mounted position is lower with the embedded atmospheric pressure sensor of the conformal installation of fuselage covering, does not have heating device in pressure cell trompil position department, causes the pressure cell to freeze when flight in abominable meteorological environment, and the measured pressure value is unreal, and the atmospheric parameter of atmospheric data detection system measurement can not reflect the true flight state of aircraft. In order to avoid icing at the pressure measuring hole, only a heating device is added to ensure that the position of the pressure measuring hole is difficult to reach the icing temperature in the flight process. However, as the stability of flight control and the real-time data requirement of the aircraft flight management system are improved, the pressure sensing part and the electronic calculating part need to be designed in an integrated mode. In order to ensure that enough heat is available at the pressure measuring hole to prevent icing in the flight process, the consumed power of the heating device is necessarily the larger, the better, but the working environment temperature of electronic components in the electronic calculating component is increased rapidly under the heat generated by the heating device, the service life of the electronic components is threatened, the failure process is accelerated, and the reliability of the electronic components is reduced. The contradiction between the two is a technical problem which needs to be solved urgently by the probe of the existing embedded atmospheric pressure sensor.
Disclosure of Invention
The invention aims to provide an embedded atmospheric pressure sensor with low deicing power consumption and high reliability, which aims at the defects that a proper heat insulation device is arranged between a probe and an electronic component of the existing embedded atmospheric pressure sensor which is arranged in a conformal way with a fuselage skin, and the existing atmospheric pressure sensor which is arranged in a conformal way with the fuselage skin has no heating device, has low deicing and deicing effects and has low reliability of electronic components, thereby effectively promoting the accumulation of heating heat at a pressure measuring hole, reducing the transmission of the heating heat to the electronic component and ensuring that the electronic components work in normal environmental temperature.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an embedded atmospheric pressure sensor with low deicing consumption and high reliability, includes pressure cell covering and electronic components, be provided with heat-conduction blocking device between pressure cell covering and the electronic components, the pressure cell inboard of pressure cell covering is fixed with heating device, heating device is for being the hot ring that hinders of screw thread form, provides electric power through heating power supply and generates heat.
The working principle of the technical scheme is that the electronic component senses the flying air pressure transmitted by a pressure measuring hole skin, and performs conversion and data calculation through an internal electronic component to output atmospheric parameter information meeting format requirements; the heating device generates heat to prevent the pressure measuring hole of the pressure measuring hole skin from being frozen. The heat conduction blocking design adopted between the pressure measuring hole heating device and the electronic component improves the heat accumulation of the heating device at the pressure measuring hole and reduces the heat transfer to the electronic component. Compared with the traditional atmospheric pressure sensor, the required heating power is reduced under the condition of the same deicing performance.
In order to better implement the present invention, further, the heat conduction blocking device includes a heat insulation plate and a pressing plate, the pressing plate is mounted on the heat insulation plate by a mounting screw, and the heat insulation plate is fixed above the heating device.
To better implement the present invention, further, the insulation board has a use temperature ranging from-50 ℃ to 450 ℃ and a thermal conductivity coefficient not greater than 0.02W/(m &).
In order to better implement the invention, further, the external dimension of the heat insulation plate is the same as the size of the inner cavity of the pressure measuring hole skin, and the external dimension of the pressure plate is smaller than the size of the inner cavity of the pressure measuring hole skin.
In order to better realize the invention, the material of the pressure plate is a metal material with high strength and low heat conduction system, and a gap of 0.2 mm-1 mm is reserved between the pressure plate and the electronic component.
In order to better implement the invention, the heating device is further fixed inside the pressure tap of the pressure tap skin by welding.
In order to better implement the invention, further, the heating power supply for supplying power to the heating device is an alternating current power supply of 115V/400Hz, or a DC28V direct current power supply or a DC270V direct current power supply.
In order to better implement the invention, the electronic components are further fastened to the struts of the pressure tap skin by means of fastening screws.
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) according to the invention, through the heat conduction blocking design adopted between the pressure measuring hole heating device and the electronic component, the heat accumulation of the heating device at the pressure measuring hole is promoted, and the heat transfer to the electronic component is reduced;
(2) compared with the traditional atmospheric pressure sensor, the embedded atmospheric pressure sensor provided by the invention has the advantages that the required heating power is reduced under the condition of the same anti-icing performance;
(3) the embedded atmospheric pressure sensor provided by the invention can effectively promote the aggregation of heating heat at the pressure measuring hole, reduce the transmission of the heating heat to the electronic component, ensure that the electronic component works in normal environmental temperature, has high deicing prevention and deicing efficiency and high reliability, and is suitable for wide popularization and application.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an exploded view of the structure of the present invention;
fig. 3 is a schematic diagram of the present invention with its internal structure broken away.
Wherein: 1-pressure measuring hole skin, 2-heat conduction blocking device, 3-electronic component, 4-heating device, 5-heat insulation plate, 6-pressing plate, 7-mounting screw and 8-fastening screw.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
the main structure of the embodiment, as shown in fig. 1 to 3, includes a pressure cell skin 1 and an electronic component 3, a thermal conduction blocking device 2 is disposed between the pressure cell skin 1 and the electronic component 3, a heating device 4 is fixed on the inner side of a pressure cell of the pressure cell skin 1, the heating device 4 is a threaded thermal resistance ring, and electric power is provided by a heating power supply to generate heat; the electronic component 3 senses the flying air pressure transmitted by the pressure measuring hole skin, and performs conversion and data calculation through internal electronic components, and outputs atmospheric parameter information meeting format requirements; the heating device 4 generates heat to prevent the pressure measuring holes of the pressure measuring hole skin 1 from being frozen.
Example 2:
the present embodiment further defines the structure of the heat conduction blocking device 2 on the basis of the above-mentioned embodiment, as shown in fig. 3, the heat conduction blocking device 2 includes a heat insulation plate 5 and a pressing plate 6, the pressing plate 6 is mounted on the heat insulation plate 5 by mounting screws 7, and the heat insulation plate 5 is fixed above the heating device 4. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 3:
in the present embodiment, the performance parameters of the thermal insulation board 5 are further defined on the basis of the above embodiment, and the thermal insulation board 5 has a use temperature range of-50 ℃ to 450 ℃ and a thermal conductivity coefficient not greater than 0.02W/(m & ltk & gt). Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 4:
in the embodiment, on the basis of the above embodiment, the size relationship between the thermal insulation board 5 and the pressure plate 6 and the cavity of the pressure tap skin 1 is further defined, as shown in fig. 2 and 3, the external dimension of the thermal insulation board 5 is the same as the size of the cavity of the pressure tap skin 1, and the external dimension of the pressure plate 6 is smaller than the size of the cavity of the pressure tap skin 1. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 5:
in the present embodiment, in addition to the above embodiments, the material of the pressing plate 6 and the positional relationship between the pressing plate 6 and the electronic component 3 are further defined, the material of the pressing plate 6 is a metal material with high strength and low thermal conductivity, and a gap of 0.2mm to 1mm is reserved between the pressing plate 6 and the electronic component 3. With this arrangement, the heat generated by the heat device 4 can be further reduced from being transferred to the electronic component 3, and the normal operation of the electronic component 3 can be ensured. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 6:
the present embodiment further defines a fixing manner of the heating device 1 to the inner side of the pressure tap skin 1 on the basis of the above-mentioned embodiments, and the heating device 1 is fixed to the inner side of the pressure tap skin 1 by welding. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 7:
the present embodiment further defines a heating power supply for supplying power to the heating device 4 on the basis of the above embodiments, wherein the heating power supply for supplying power to the heating device 4 is an ac power supply of 115V/400Hz, or a DC power supply of DC28V or a DC power supply of DC 270V. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 8:
the present embodiment further defines the connection relationship of the electronic component 3 and the load cell skin 1 on the basis of the above-described embodiment, and the electronic component 3 is fastened to the columns of the load cell skin 1 by the fastening screws 8 as shown in fig. 2. This arrangement can reduce the contact area between the pressure-measuring-hole skin 1 and the electronic component 3, and reduce the heat transfer between the pressure-measuring-hole skin 1 and the electronic component 3. Other parts of this embodiment are the same as those of the above embodiment, and are not described again.
Example 9:
for the embedded atmospheric pressure sensor provided in the above embodiment, a real atmospheric pressure sensor heating test is performed on the embedded atmospheric pressure sensor in an environment with an external environment temperature of-55 ℃, 25 ℃, 70 ℃, that is, a low temperature environment, a normal temperature environment, and a high temperature environment, that is, T1/° c skin surface T2/° c of the electronic component at different times and corresponding power are respectively tested.
The external environment was low temperature-55 ℃ as shown in table 1:
TABLE 1 Low temperature test (T ═ 55 ℃ C.)
At a low temperature of 25 ℃ in the external environment, as shown in table 2:
TABLE 2 Normal temperature test (T25 ℃)
| Time t/min | T1/° C internal to an electronic component | Skin surface T2/℃ | P/W |
| 0 | 25 | 25 | 75 |
| 5 | 31 | 206 | 55 |
| 10 | 42 | 223 | 55 |
| 15 | 53 | 231 | 54 |
| 20 | 59 | 237 | 54 |
| 25 | 61 | 241 | 54 |
| 30 | 67 | 243 | 54 |
The external environment was low temperature 70 ℃ as shown in table 3:
TABLE 3 high temperature test (T70 ℃)
| Time t/min | T1/° C internal to an electronic component | T2/° C of skin surface | P/W |
| 0 | 70 | 70 | 74 |
| 5 | 68 | 217 | 56 |
| 10 | 83 | 249 | 53 |
| 15 | 93 | 263 | 52 |
| 20 | 99 | 267 | 52 |
| 25 | 102 | 271 | 52 |
| 30 | 104 | 273 | 52 |
As can be seen from the data in tables 1, 2, and 3, the embedded atmospheric pressure sensor provided in the above embodiment can effectively improve the heat accumulation at the pressure measuring hole at various environmental temperatures, reduce the heat transfer to the electronic component, ensure that the electronic component operates at normal environmental temperature, and reduce the required heating power under the same anti-icing performance.
It is to be understood that the working principle and working process of the embedded atmospheric pressure sensor structure according to an embodiment of the present invention, such as the mounting screw 7 and the locking screw 8, are well known in the art and will not be described in detail herein.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. The embedded atmospheric pressure sensor with low deicing power consumption and high reliability is characterized by comprising a pressure measuring hole skin (1) and an electronic component (3), wherein a heat conduction blocking device (2) is arranged between the pressure measuring hole skin (1) and the electronic component (3), a heating device (4) is fixed on the inner side of a pressure measuring hole of the pressure measuring hole skin (1), the heating device (4) is a threaded heat resistance ring, and electric power is supplied by a heating power supply to generate heat; the electronic component (3) senses the flying air pressure transmitted by the pressure measuring hole skin, converts and calculates data through an internal electronic component, and outputs atmospheric parameter information meeting format requirements; the heating device (4) generates heat to prevent the pressure measuring hole of the pressure measuring hole skin (1) from being frozen.
2. An embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to claim 1, characterized in that the thermal conduction blocking device (2) comprises a thermal insulation plate (5) and a pressure plate (6), the pressure plate (6) is mounted on the thermal insulation plate (5) through mounting screws (7), and the thermal insulation plate (5) is fixed above the heating device (4).
3. Embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to claim 2, characterized in that the insulating plate (5) has a use temperature in the range-50 ℃ to 450 ℃ and a thermal conductivity no greater than 0.02W/(m &).
4. An embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to claim 3, characterized in that the external dimensions of the thermal insulation plate (5) are the same as the internal dimensions of the pressure tap skin (1), and the external dimensions of the pressure plate (6) are smaller than the internal dimensions of the pressure tap skin (1).
5. The embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to claim 4, characterized in that the material of the pressure plate (6) is a metal material with high strength and low heat conduction system, and a gap of 0.2 mm-1 mm is reserved between the pressure plate (6) and the electronic component (3).
6. Embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to one of claims 1 to 5, characterized in that the heating device (4) is fixed inside the pressure cell of the pressure cell skin (1) by means of welding.
7. An embedded barometric pressure sensor with low deicing power consumption and high reliability according to any one of claims 1 to 5, wherein a heating power supply for supplying power to the heating device (4) is 115V/400Hz AC power supply or DC28V DC power supply or DC270V DC power supply.
8. Embedded atmospheric pressure sensor with low deicing power consumption and high reliability according to one of claims 1 to 5, characterized in that the electronic components (3) are fastened to the struts of the pressure tap skin (1) by means of fastening screws (8).
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| CN202110210590.0A CN112977838A (en) | 2021-02-25 | 2021-02-25 | Embedded atmospheric pressure sensor with low deicing power consumption and high reliability |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117761264A (en) * | 2024-02-22 | 2024-03-26 | 成都凯天电子股份有限公司 | liquid water content detector and detection method based on total temperature measurement technology |
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Application publication date: 20210618 |