CN112954965A - Modular cooling system for high performance computers - Google Patents
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- CN112954965A CN112954965A CN202110136526.2A CN202110136526A CN112954965A CN 112954965 A CN112954965 A CN 112954965A CN 202110136526 A CN202110136526 A CN 202110136526A CN 112954965 A CN112954965 A CN 112954965A
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- 238000001816 cooling Methods 0.000 title claims abstract description 127
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 230000008859 change Effects 0.000 claims abstract description 12
- 239000011555 saturated liquid Substances 0.000 claims abstract description 10
- 239000000110 cooling liquid Substances 0.000 claims description 31
- 239000002826 coolant Substances 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- -1 fluorocarbon compound Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the technical field of cooling, aims to solve the problem that the existing cooling device is not easy to be applied to cooling of a distributed heat source, and provides a modular cooling system for a high-performance computer, which comprises N cooling devices in close contact with a heating element, a primary temperature control device and a secondary temperature control device, wherein the primary temperature control device and the secondary temperature control device are communicated through a liquid return header pipe; outlets of the N cooling devices are communicated with the primary temperature control device through N gas collecting pipelines, and inlets of the N cooling devices are communicated with the secondary temperature control device through N liquid distributing pipelines; in the working state, the evaporative cooling working medium in the cooling device absorbs the heat in the heating element to generate phase change, the two-phase evaporative cooling working medium after the phase change enters the primary temperature control device along the gas collecting pipeline, is subjected to heat exchange with the secondary cooling working medium in the primary temperature control device, is condensed to be saturated liquid working medium, then enters the secondary temperature control device through the liquid return header pipe to be cooled, and the cooled working medium flows back to the cooling device through the liquid separation pipeline to perform heat exchange circulation of the next stage.
Description
Technical Field
The invention belongs to the technical field of cooling, and particularly relates to a modular cooling system for a high-performance computer.
Background
With the rapid development of high-performance computers, the computing speed and the data processing capacity of the high-performance computers are continuously improved, and correspondingly, the energy consumption is also continuously increased, however, if the temperature of core components such as chips is increased, the performance and the service life of the computers are affected to different degrees; therefore, high performance computer cooling is one of the key issues that needs to be addressed.
As a traditional cooling mode, the air cooling system has the advantages of simple principle, simple operation and good safety and reliability; at present, a cooling mode commonly adopted by a high-performance computer is air cooling, however, the cooling efficiency of an air cooling system is low, and in the face of high-performance computers with higher and higher integration level and complexity, the air cooling system is difficult to realize uniform temperature distribution in a complex system; moreover, in practical applications, the noise and the energy consumption of the cooling system itself are also problematic. The evaporative cooling technology utilizes latent heat of an evaporative cooling medium to realize cooling; compared with the traditional cooling mode which utilizes specific heat of working medium to absorb heat, the evaporative cooling technology has high cooling efficiency and good temperature distribution uniformity; the evaporative cooling working medium adopted by the technology has the characteristics of good insulativity, non-combustibility, non-explosion, safety, stability, no toxicity and environmental protection, and ensures the safe reliability of system operation; moreover, the self-circulation evaporative cooling system does not need to provide external power, has low operating pressure and self-adjusting and self-adapting capacity, and is easy to operate and maintain.
The surface-mounted evaporative cooling device for a high-performance computer disclosed in the prior art can be used together with a modular component of a computer system, but a condenser in the device needs to be installed at the top of a computer cabinet, the position setting is limited by the structure and installation of the condenser, the modular design and application are not easy to realize, the device is not convenient to be applied to a distributed heat source, the flexibility, expandability and interchangeability of a constructed system are reduced, and when the high-performance computer adopts a node-type computing operation mode, the condenser arranged in a centralized manner can bring inevitable influence on each parallel liquid path.
Disclosure of Invention
In order to solve the above problems in the prior art, that is, to solve the problem that the existing cooling device is not easily applied to the cooling of a distributed heat source, the present invention provides a modular cooling system for a high performance computer, wherein the system comprises a primary temperature control device, a secondary temperature control device and N cooling devices, and the primary temperature control device is communicated with the secondary temperature control device through a liquid return header pipe; n cooling devices are closely contacted with M heating elements; outlets of the N cooling devices are communicated with the primary temperature control device through N gas collecting pipelines, and inlets of the N cooling devices are communicated with the secondary temperature control device through N liquid distributing pipelines;
when the computer is in a working state, the evaporative cooling working medium in the cooling device absorbs heat in the heating element to generate phase change, the two-phase evaporative cooling working medium after the phase change enters the primary temperature control device along the N gas collecting pipelines, and is condensed to a saturated liquid working medium through heat exchange with a secondary cooling working medium in the primary temperature control device; and saturated liquid working media enter the secondary temperature control device through the liquid return header pipe for cooling, and the cooled working media flow back to the N cooling devices through the N liquid distribution pipelines to perform heat exchange circulation at the next stage.
In some preferred embodiments, the primary temperature control device is a condenser;
the secondary temperature control device is a cooler;
the cooling device is a cooling liquid box.
In some preferred embodiments, the system is disposed in a cabinet of a computer;
the condenser is arranged above the N cooling liquid boxes;
the cooler is arranged below the N cooling liquid boxes;
the cooling liquid box is a liquid tank with various special-shaped structures, and the liquid tank is matched with the heating element to be cooled.
In some preferred embodiments, a first one-way control device is arranged at the connection part of the gas collecting pipeline and the condenser to control the two-phase evaporation cooling working medium after phase change to flow into the condenser in one way; and a second one-way control device is arranged at the connecting part of the liquid distribution pipeline and the cooler so as to control the cooled working medium to flow into the cooling liquid box in one way.
In some preferred embodiments, the condenser, the cooler are any one of shell and tube, tube fin, plate fin, or tube bundle.
In some preferred embodiments, the material of the cooling liquid box is metal.
In some preferred embodiments, the interior of the coolant box is a smooth flat surface.
In some preferred embodiments, the cooling liquid box is internally provided with a heat exchange enhancement structure;
the heat exchange enhancement structure is a groove, a rib or a rib array.
In some preferred embodiments, N ≧ M.
In some preferred embodiments, the evaporative cooling working fluid is a fluorocarbon-based compound;
the boiling point temperature of the evaporative cooling working medium is h, and h belongs to [30 ℃ and 60 ℃).
1) The modular cooling system for the high-performance computer provided by the invention can be flexibly applied to the high-performance computer in layering and sub-computing unit nodes, can realize modular control and is matched with different working modes of the high-performance computer.
2) The modularized cooling system for the high-performance computer provided by the invention adopts fractional condensation cooling, the capacities of the condenser and the cooler are reduced, the integrated design can be realized, and the modularized cooling system can be compactly arranged near the cooling liquid box according to the actual situation; therefore, the path of the circulation loop is shortened, a condenser is not required to be arranged outside the cabinet body, and the unitization and modularization of the cooling device can be completely realized; therefore, the device has stronger applicability and flexibility, and not only can be realized by utilizing the combination of the module devices aiming at the whole cabinet, but also can be used as the supplementary distributed arrangement of other cooling modes.
3) The evaporative cooling working medium is a fluorocarbon compound which meets the environmental protection requirement and has good insulation, so even if leakage occurs, accidents similar to a water cooling system can not occur. And working media with proper boiling points are selected to ensure that the high-performance computer can operate at the optimal working temperature.
4) The modularized cooling system for the high-performance computer is a closed independent unit, so that a matched control system can realize node control; under different modes that a high-performance computer works in the state that the whole machine is started or is respectively started according to computing nodes, and the like, the cooling system can be synchronously controlled by controlling the modular super-computer surface-mounted evaporative cooling device to be started or closed; the invention can avoid the mutual influence among the cooling liquid boxes under different running states, ensure excellent cooling effect, and is beneficial to realizing energy conservation and consumption reduction in consideration of the consumption of the secondary cooling side.
5) The design and installation mode of the cooling liquid box in the invention are matched with the cooled object, and the cooling liquid box can be horizontally placed or vertically placed; the N coolant tanks constituting 1 cooling unit of the present invention may have a single structure, a single form, or a combination of a plurality of different structures and forms.
6) The invention is suitable for high-performance computers and is also suitable for modular cooling of other equipment or devices with high power density.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of one embodiment of the present invention.
Description of reference numerals: 1. a coolant box; 2. a condenser; 3. a cooler; 4. a gas collection pipeline; 5. a liquid return header pipe; 6. a liquid separation pipeline.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, and it will be understood by those skilled in the art that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of the present invention.
The invention provides a modular cooling system for a high-performance computer, which comprises a primary temperature control device, a secondary temperature control device and N cooling devices, wherein the primary temperature control device is communicated with the secondary temperature control device through a liquid return header pipe; the N cooling devices are closely contacted with the M heating elements; outlets of the N cooling devices are communicated with the primary temperature control device through N gas collecting pipelines, and inlets of the N cooling devices are communicated with the secondary temperature control device through N liquid distributing pipelines, wherein N is more than or equal to M; cooling device, one-level temperature control device, second grade temperature control device form a inclosed circulative cooling loop system through the circulation pipeline by gas collecting line, return liquid house steward, divide the liquid pipeline to constitute, and one-level temperature control device, second grade temperature control device are directly connected with a plurality of cooling device through a plurality of pipelines that correspond, and one-level temperature control device, second grade temperature control device's capacity reduces, effectively shortens circulation loop's route, realizes that cooling system integrates, the modularization, nimble activation sets up.
When the computer is in a working state, namely a main heating element of the high-performance computer is in a state of heating and needing cooling, the heat emitted by the heating element during working is firstly transferred to a corresponding cooling device, an evaporative cooling working medium in the corresponding cooling device absorbs heat, then the temperature rises, and when the temperature rises to a saturated boiling temperature, phase change occurs; the evaporative cooling working medium in a two-phase state enters the primary temperature control device along the corresponding gas collection pipeline; in the primary temperature control device, the two-phase evaporative cooling working medium and the secondary cooling working medium exchange heat, are condensed into saturated liquid, and then enter the secondary temperature control device along a liquid return header pipe; the saturated liquid working medium is subjected to heat exchange with a secondary cooling working medium again in a secondary temperature control device and is cooled to a proper temperature; under the action of static pressure head generated by density difference, the liquid working medium cooled to proper temperature flows into the cooling liquid boxes again along the liquid dividing pipelines to start to enter a new cycle; the circulation is repeated, so that a sustainable self-circulation is formed.
Further, the primary temperature control device is a condenser; the secondary temperature control device is a cooler; the cooling device is a cooling liquid box.
The invention is further described with reference to the following detailed description of embodiments with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram of an embodiment of the present invention, which provides a modular cooling system for a high-performance computer, including N coolant tanks 1, a condenser 2 and a cooler 3, the condenser and the cooler being communicated through a return liquid header pipe 5; the N cooling liquid boxes are arranged in parallel; the N cooling devices are closely contacted with the M heating elements, wherein N is more than or equal to M; outlets of the N cooling devices are communicated with the condenser through N gas collecting pipelines 4, and inlets of the N cooling devices are communicated with the cooler through N liquid distributing pipelines 6; the cooling liquid box, the condenser and the cooler form a closed circulating cooling loop system through a circulating pipeline consisting of a gas collecting pipeline, a liquid return header pipe and a liquid distributing pipeline.
The heat of each distributed heat source of the high-performance computer is transferred to the evaporative cooling working medium in the high-performance computer through the metal surface of the corresponding cooling liquid box, and the temperature of the liquid working medium rises until the saturated boiling point is reached, so that phase change occurs; the mixed two-phase working medium after phase change flows into a condenser through a corresponding gas collection pipeline, primary condensation is completed in the condenser, and the mixed two-phase working medium is condensed into a saturated liquid working medium; then the saturated liquid working medium flows into the cooler along the liquid return header pipe, the second-stage cooling is completed in the cooler, and the saturated liquid working medium is cooled to a proper temperature; the liquid working medium cooled to the proper temperature is driven by a static pressure head generated by the density difference of the liquid working medium and the gaseous working medium to return to the interior of the cooling liquid box through the corresponding liquid dividing pipeline, and a new cycle is started; therefore, an additional power device is not needed, and a closed self-circulation is formed.
The modularized cooling system for the high-performance computer is a closed independent unit, so that a matched control system can realize node control; under different modes that a high-performance computer works in the state that the whole machine is started or is respectively started according to computing nodes, and the like, the cooling system can be synchronously controlled by controlling the modular super-computer surface-mounted evaporative cooling device to be started or closed; the invention can avoid the mutual influence among the cooling liquid boxes under different running states, ensure excellent cooling effect, and is beneficial to realizing energy conservation and consumption reduction in consideration of the consumption of the secondary cooling side.
Preferably, the secondary cooling working medium in the condenser and the cooler can be water or air; even if the water is used, the secondary cooling side and the primary cooling side are isolated from each other, so that the hidden danger of water leakage can be avoided.
The system adopts the condenser and the cooler to realize distributed and graded condensation cooling, the capacity is reduced, and the volume is reduced; therefore, the condenser and the cooler in the system can be arranged nearby according to the cooling liquid box of the heat source; the condenser and the cooler in the system can be shell-and-tube type, tube fin type, plate fin type, tube bundle type and the like, and the compactness of the condenser and the cooler can also be improved through various ribbed surfaces, wire mesh materials and the like.
The modular surface-mounted evaporative cooling device can be flexibly applied to the layering and sub-computing unit nodes of the high-performance computer, can realize modular control and is matched with different working modes of the high-performance computer.
Preferably, the cooler is arranged at the lowest part of the N cooling liquid boxes, and the condenser is arranged at the highest part of the N cooling liquid boxes; the cooling liquid box is closely attached to heat source elements such as a blade calculating unit and a power supply unit of the high-performance computer. The system is arranged in a cabinet of a computer; the cooling liquid box is a liquid tank with various special-shaped structures, and the liquid tank is matched with the heating element to be cooled.
Preferably, a first one-way control device is arranged at the connecting part of the gas collecting pipeline and the condenser so as to control the two-phase evaporation cooling working medium after phase change to flow into the condenser in one way; the number of the first one-way control devices is N, the N first one-way control devices are arranged corresponding to the N gas collecting pipelines, and the N gas collecting pipelines are uniformly arranged at intervals; a second one-way control device is arranged at the connecting part of the liquid distribution pipeline and the cooler so as to control the cooled working medium to flow into the cooling liquid box in one way; the second one-way control device is N, and N second one-way control device corresponds the setting with N branch liquid pipeline, and N divides liquid pipeline even interval to set up.
Further, the first one-way control device and the second one-way control device can be one-way valves.
Preferably, the material of the cooling liquid box is metal.
Preferably, the inside of the coolant box is a smooth plane, or a heat exchange structure is arranged inside the coolant box, wherein the heat exchange structure may include grooves, ribs, or rib arrays or other reinforced heat exchange structures.
Further, the evaporation cooling working medium is a fluorocarbon compound; the evaporative cooling medium used by the system is a fluorocarbon compound meeting the requirement of environmental protection, has high insulating property, can not cause short circuit electric accidents like water cooling even if leakage occurs, can be selected according to the optimal working temperature of a cooled object, and preferably has the boiling temperature of h, which belongs to the field of 30 ℃ and 60 ℃.
While the invention has been described with reference to a preferred embodiment, various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, especially if structural conflict does not exist and the technical features mentioned in the various embodiments may be combined in any way; it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings, which are for convenience of description only, and do not indicate or imply that the devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The terms "comprises," "comprising," or any other similar term are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
Claims (10)
1. A modular cooling system for a high-performance computer is characterized by comprising a primary temperature control device, a secondary temperature control device and N cooling devices, wherein the primary temperature control device is communicated with the secondary temperature control device through a liquid return header pipe; n cooling devices are closely contacted with M heating elements; outlets of the N cooling devices are communicated with the primary temperature control device through N gas collecting pipelines, and inlets of the N cooling devices are communicated with the secondary temperature control device through N liquid distributing pipelines;
when the computer is in a working state, the evaporative cooling working medium in the cooling device absorbs heat in the heating element to generate phase change, the two-phase evaporative cooling working medium after the phase change enters the primary temperature control device along the N gas collecting pipelines, and is condensed to a saturated liquid working medium through heat exchange with a secondary cooling working medium in the primary temperature control device; and saturated liquid working media enter the secondary temperature control device through the liquid return header pipe for cooling, and the cooled working media flow back to the N cooling devices through the N liquid distribution pipelines to perform heat exchange circulation at the next stage.
2. The modular cooling system for high performance computers as claimed in claim 1 wherein the primary temperature control device is a condenser;
the secondary temperature control device is a cooler;
the cooling device is a cooling liquid box.
3. The modular cooling system for high performance computers of claim 2, wherein the system is disposed in a cabinet of computers;
the condenser is arranged above the N cooling liquid boxes;
the cooler is arranged below the N cooling liquid boxes;
the cooling liquid box is a liquid tank with various special-shaped structures, and the liquid tank is matched with the heating element to be cooled.
4. The modular cooling system for high-performance computers as claimed in claim 2, wherein the connection part of the gas collection pipeline and the condenser is provided with a first unidirectional control device to control the two-phase evaporative cooling working medium after phase change to flow into the condenser in one direction; and a second one-way control device is arranged at the connecting part of the liquid distribution pipeline and the cooler so as to control the cooled working medium to flow into the cooling liquid box in one way.
5. The modular cooling system for high performance computers as claimed in claim 2, wherein the condenser, the cooler are any one of shell and tube, tube fin, plate fin or tube bundle.
6. The modular cooling system for high performance computers as claimed in claim 2, wherein the coolant box is made of metal.
7. The modular cooling system for high performance computers of claim 6 wherein the interior of the coolant box is smooth flat.
8. The modular cooling system for high performance computers according to claim 6, wherein the inside of the cooling liquid box is provided with a heat-intensifying structure;
the heat exchange enhancement structure is a groove, a rib or a rib array.
9. The modular cooling system for high performance computers as claimed in claim 1, wherein N ≧ M.
10. The modular cooling system for high performance computers as claimed in any one of claims 1 to 9 wherein the evaporative cooling working fluid is a fluorocarbon-based compound;
the boiling point temperature of the evaporative cooling working medium is h, and h belongs to [30 ℃ and 60 ℃).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110136526.2A CN112954965A (en) | 2021-02-01 | 2021-02-01 | Modular cooling system for high performance computers |
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| CN202110136526.2A CN112954965A (en) | 2021-02-01 | 2021-02-01 | Modular cooling system for high performance computers |
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2021
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Application publication date: 20210611 |
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