CN112954897A - Multi-piece integrated circuit board and manufacturing method - Google Patents
Multi-piece integrated circuit board and manufacturing method Download PDFInfo
- Publication number
- CN112954897A CN112954897A CN201911333667.2A CN201911333667A CN112954897A CN 112954897 A CN112954897 A CN 112954897A CN 201911333667 A CN201911333667 A CN 201911333667A CN 112954897 A CN112954897 A CN 112954897A
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- Prior art keywords
- circuit board
- comb
- circuit
- boards
- circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a circuit board with multiple integrated sheets and a manufacturing method thereof, in particular to a copper-clad plate which is manufactured into a connected circuit board with multiple circuit boards by a conventional technology, wherein the sheets are seamlessly connected together at a zero interval, a die is manufactured, a punch punches the sheets to break the sheets so as to form two connected circuit boards with comb-shaped structures and containing the multiple circuit boards, the two connected circuit boards with comb-shaped structures are assembled together to form a seamed connected circuit board containing the multiple circuit boards, seams are formed between the sheet sheets of the connected circuit board, and the circuit boards with zero interval are arranged between the sheets, although the circuit boards are an integral board, actually two plates with comb-shaped structures, and the circuit boards are mutually and tightly clamped together.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board with multiple integrated sheets and a manufacturing method thereof.
Background
Rigid circuit boards (PCBs) have been in the past for centuries since their invention, and large boards (panels) have been produced by joining together small boards (PCS) in order to produce boards more efficiently. And then subdivided into individual Platelets (PCS) for use, or pre-subdivided into a plurality of connected Platelets (PCS) that are still partially connected, the method of subdivision being as follows:
1. the milling machine (milling machine) is used for milling a knife, the method is low in efficiency, and the path taken by the milling knife can be milled to a large part, so that waste is caused.
2. Die cutting designed by the traditional technology, when the die is used for cutting, the distance between small plates, namely between PCS plates, is required to be designed to be more than 1mm, so that the small plates can be cut, and the distance causes waste
3. The V-CUT machine is used for cutting, although the V-CUT machine realizes zero-spacing jointed boards among small boards, the waste is small, when the V-CUT machine is used for cutting, two thirds of the jointed boards are generally CUT, one third of the jointed boards are kept not to be CUT, one piece after welding elements is needed to be CUT once, and the V-CUT machine is also used for cutting straight lines once, so that the efficiency is low, and curves cannot be CUT.
4. Laser cutting can be performed at a zero interval, but the efficiency is low, the equipment is expensive, and the use cost is high.
In the past, how to cut a rigid circuit board by using a mold, dividing a large board into small boards and cutting the small boards after splicing at a zero interval is an unsolved problem in nearly a hundred years, and naturally, the cutting mold is divided into two types according to the principle: one type is a cutting die designed and manufactured according to the principle of kitchen knife cutting, and the die can only cut a very thin flexible circuit board obviously; the other type is a shearing die designed according to the principle of 'scissors', and the die can cut the rigid circuit board.
In order to overcome the defects and shortcomings, the invention designs a novel shearing die based on the 'scissors' principle, when a small board is spliced into a large board, the circuit board manufactured by the shearing die realizes zero-spacing splicing production, reduces waste and reduces cost, and the manufactured and cut circuit board is a circuit board which is obtained by cutting one large board into two 'comb' -shaped structures, so that the efficiency is high, the cost is low, and the circuit board with various different structures can be manufactured.
Disclosure of Invention
The invention relates to a circuit board with multiple integrated sheets and a manufacturing method thereof, in particular to a copper-clad plate which is manufactured into a connected circuit board with multiple circuit boards by a conventional technology, wherein the sheets are seamlessly connected together at a zero interval, a die is manufactured, a punch punches the sheets to break the sheets so as to form two connected circuit boards with comb-shaped structures and containing the multiple circuit boards, the two connected circuit boards with comb-shaped structures are assembled together to form a seamed connected circuit board containing the multiple circuit boards, seams are formed between the sheet sheets of the connected circuit board, and the circuit boards with zero interval are arranged between the sheets, although the circuit boards are an integral board, actually two plates with comb-shaped structures, and the circuit boards are mutually and tightly clamped together.
The invention provides a method for manufacturing a multi-chip integrated circuit board, which specifically comprises the steps of manufacturing a connected circuit board containing a plurality of circuit boards by using a copper-clad plate through a conventional circuit board process technology, wherein the chips are seamlessly and completely connected together at zero space, manufacturing a die, wherein an upper die comprises a plurality of punching upper cutters with a connected comb-shaped structure, a lower die comprises a plurality of punching lower cutters with a comb-shaped structure, the upper cutters and the lower cutters are staggered and opposite, the die is arranged on a punching machine, when the upper cutters are punched downwards, the edge blades of the upper cutters and the edge blades of the lower cutters form matched scissors-type shearing, the circuit boards are oppositely arranged on the die on the punching machine for punching, so that adjacent circuit board sheets are punched and separated to form two connected circuit boards with the comb-shaped structure and containing the plurality of circuit boards, and the two connected circuit boards with the comb-shaped structure are independently used, or two 'comb' structure connected circuit boards are assembled together to form a connected circuit board containing a plurality of circuit boards, and the assembled circuit board is a connected circuit board with zero space between adjacent boards, although the circuit board is an integrated board, actually two 'comb' structure boards are mutually and tightly clamped to form an integrated board.
According to the present invention, there is also provided a multi-piece integrated circuit board, comprising: the method is characterized by comprising the following steps: the circuit board of the single-layer circuit, or the circuit board of the double-layer circuit, or the circuit board of the multilayer circuit; the circuit board is characterized in that the circuit board is a rigid circuit board or a flexible circuit board, the circuit board is a connected circuit board with a comb-shaped structure and comprises a plurality of circuit boards, or the connected circuit board is formed by assembling two circuit boards with connected comb-shaped structures and comprises a plurality of circuit boards, a zero-space circuit board is arranged between every two adjacent circuit boards, the circuit board with the comb-shaped structure is formed by punching and cutting a shearing die similar to the principle of scissors and is divided into two circuit boards with the comb-shaped structures, the two circuit boards with the comb-shaped structures generated by punching are assembled, and then the circuit board with the zero-space circuit boards is formed.
According to a preferred embodiment of the present invention, the integrated circuit board with multiple integrated pieces is characterized in that the connection body connecting the pieces and the relation between the pieces are in a vertical relation or an approximately vertical relation, the connection body is a connection body containing a functional circuit or a connection body without a functional circuit, and when the circuit board is used for manufacturing electronic products, the connection body can be cut and divided into single pieces for use, or the connection body can be connected into a comb-shaped structure for use.
According to a preferred embodiment of the present invention, the multi-piece integrated circuit board is characterized in that the comb-shaped structure is an image expression of a structural product, and can be called a tooth-shaped structure.
According to a preferred embodiment of the present invention, the multi-piece integrated circuit board is characterized in that the single-piece circuit board in the comb-shaped circuit board is a circuit board with a rectangular or square structure, or a circuit board with a special-shaped structure.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic diagram of a product engineering data design plane.
Fig. 2 is a schematic plan view of the edge of the "comb" shaped die cutter of the upper die.
Figure 3 is a schematic plan view of the edge of the die's "comb" shaped die cutter.
FIG. 4 is a schematic cross-sectional view of the upper and lower die blades in a "scissors" cutting relationship with the product.
FIG. 5 is a plan view of a one-piece, unshaped, rigid wiring board.
Fig. 6 is a schematic plan view of the connected rigid circuit board with a comb-shaped structure.
Fig. 7 is a schematic plan view of the connected rigid circuit board with a comb-shaped structure.
Fig. 8 is a schematic plan view of rigid circuit boards clamped to each other as a unitary body.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1. Design and manufacture of production data
1.1 product engineering data design
The width of the raw material used is 125MM, the widest part of the product is 8.0MM, and the number of impositions is 20 (shown in FIG. 1).
1.2 design of product forming mold data
The die for designing the circuit board with the comb-shaped structure is characterized in that the circuit board die is designed into an upper die and a lower die, punching knives of the upper die and the lower die are of the comb-shaped structure which is connected into a whole, edges of the comb-shaped punching knives of the upper die are continuous and connected into a curve knife edge 1.1 (shown in figure 2), edges of the comb-shaped punching knives of the lower die are also continuous and connected into a curve knife edge, the upper knives and the lower knives are in staggered alignment, so that the upper knife 2.1, the lower knife 2.2 and a product 2.3 form a scissors-type shearing relation (shown in figures 3 and 4).
2. Production of rigid circuit board
According to the design information production method that the width of the rigid circuit board is 125MM, the widest part of the product is 8.0MM, and the number of the pieces of makeup is 20, the rigid copper-clad plate with the width of 125MM, the circuit is printed by silk, etched, solder-welded and OSP (organic solderability preservative) are used for processing welding spots to manufacture the connected unformed connected rigid circuit board (shown in figure 5) for standby.
3. Slitting
The connected rigid circuit board is punched into two connected rigid circuit boards (shown in fig. 6 and 7) with comb-shaped structures after being positioned by a positioning pin 3.1.
4. Assembly
The two connected rigid circuit boards with the comb-shaped structures, which are cut from the same rigid circuit board, are assembled back and combined into a whole, the two connected rigid circuit boards are mutually clamped into the whole connected rigid circuit board, and the two comb-shaped structures are actually and completely disconnected (shown in figure 8).
The present invention has been described in detail with reference to the accompanying drawings, which illustrate a multi-piece integrated circuit board and a method for manufacturing the same. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (5)
1. A method for manufacturing a multi-piece integrated circuit board specifically comprises the steps of manufacturing a connected circuit board containing a plurality of circuit boards by using a copper-clad plate through a conventional circuit board process technology, wherein the chips are seamlessly and completely connected together at zero intervals, manufacturing a die, wherein an upper die comprises a plurality of punching upper cutters with connected comb-shaped structures, a lower die comprises a plurality of punching lower cutters with connected comb-shaped structures, the upper cutters and the lower cutters are staggered and opposite, the die is arranged on a punching machine, when the upper cutters are punched downwards, the edge blades of the upper cutters and the edge blades of the lower cutters form matched scissors, the circuit boards are aligned and placed on the die on the punching machine for punching, so that adjacent circuit boards are punched and separated from each other, the two connected circuit boards with the comb-shaped structures and containing the plurality of circuit boards are formed, and the two connected circuit boards with the comb-shaped structures are independently used, or two 'comb' structure connected circuit boards are assembled together to form a connected circuit board containing a plurality of circuit boards, and the assembled circuit board is a connected circuit board with zero space between adjacent boards, although the circuit board is an integrated board, actually two 'comb' structure boards are mutually and tightly clamped to form an integrated board.
2. A multichip integrated circuit board comprising:
the circuit board of the single-layer circuit, or the circuit board of the double-layer circuit, or the circuit board of the multilayer circuit;
the circuit board is characterized in that the circuit board is a rigid circuit board or a flexible circuit board, the circuit board is a connected circuit board with a comb-shaped structure and comprises a plurality of circuit boards, or the connected circuit board is formed by assembling two circuit boards with connected comb-shaped structures and comprises a plurality of circuit boards, a zero-space circuit board is arranged between every two adjacent circuit boards, the circuit board with the comb-shaped structure is formed by punching and cutting a shearing die similar to the principle of scissors and is divided into two circuit boards with the comb-shaped structures, the two circuit boards with the comb-shaped structures generated by punching are assembled, and then the circuit board with the zero-space circuit boards is formed.
3. The circuit board according to claim 1 or 2, wherein the connection body of the comb-like structure connects the sheets and the relationship between the sheets, is a vertical relationship or an approximately vertical relationship, and the connection body is a connection body containing a functional circuit or a connection body without a functional circuit, and when the circuit board is used for manufacturing electronic products, the connection body can be cut and divided into single pieces, or the connection body can be connected into a comb-like structure for use.
4. The circuit board of claim 1 or 2, wherein the comb-like structure is a visual representation of a structural product, also called a "tooth" structure.
5. The circuit board of claim 1 or 2, wherein the single circuit board in the comb-shaped circuit board is a rectangular or square circuit board or a circuit board with a special-shaped structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911333667.2A CN112954897A (en) | 2019-12-11 | 2019-12-11 | Multi-piece integrated circuit board and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911333667.2A CN112954897A (en) | 2019-12-11 | 2019-12-11 | Multi-piece integrated circuit board and manufacturing method |
Publications (1)
Publication Number | Publication Date |
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CN112954897A true CN112954897A (en) | 2021-06-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911333667.2A Pending CN112954897A (en) | 2019-12-11 | 2019-12-11 | Multi-piece integrated circuit board and manufacturing method |
Country Status (1)
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CN (1) | CN112954897A (en) |
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2019
- 2019-12-11 CN CN201911333667.2A patent/CN112954897A/en active Pending
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