CN112951743A - Semiconductor packaging equipment and packaging method - Google Patents
Semiconductor packaging equipment and packaging method Download PDFInfo
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- CN112951743A CN112951743A CN202110167313.6A CN202110167313A CN112951743A CN 112951743 A CN112951743 A CN 112951743A CN 202110167313 A CN202110167313 A CN 202110167313A CN 112951743 A CN112951743 A CN 112951743A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 113
- 235000012431 wafers Nutrition 0.000 claims description 137
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000428 dust Substances 0.000 claims description 39
- 239000007921 spray Substances 0.000 claims description 33
- 238000005507 spraying Methods 0.000 claims description 28
- 239000004519 grease Substances 0.000 claims description 13
- 238000003860 storage Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 5
- 238000009740 moulding (composite fabrication) Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a semiconductor packaging device and a packaging method, comprising an L-shaped table, a cutting mechanism, a taking-off mechanism and a mounting mechanism, wherein the L-shaped table is arranged on the existing working floor, the upper end of the left end of the L-shaped table is provided with the cutting mechanism, the upper end of the right end of the L-shaped table is provided with the taking-off mechanism, the right side of the taking-off mechanism is provided with the mounting mechanism, the mounting mechanism is arranged on the upper end surface of the right end of the L-shaped table, and the taking-off mechanism, the mounting mechanism and the cutting mechanism are vertical to each other. Thereby being beneficial to improving the forming quality of the subsequent semiconductor.
Description
Technical Field
The invention relates to the field of semiconductor processing, in particular to semiconductor packaging equipment and a packaging method.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor packaging refers to a process of processing a wafer passing a test according to product model and functional requirements to obtain an independent chip, the production flow mainly comprises wafer manufacturing, wafer testing, chip packaging and testing after packaging, a series of operations such as post-curing, bar cutting, forming, electroplating, printing and other processes are carried out after the wafer is subjected to plastic packaging, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power supply conversion and the like, for example, a diode is a device manufactured by the semiconductor, but the following problems can occur in the semiconductor packaging process:
(1) the conversion among the procedures of semiconductor packaging is mostly carried out in a manual mode, the time required by manual conversion is long, errors and other phenomena are easy to occur in the conversion process, meanwhile, the placement position of the wafer is easy to deviate, and the clamping degree of the substrate is easy to be in a low state;
(2) the size of the wafer cut into chips is fixed, so that the utilization rate of the whole cutting structure is low, the degree of full cutting of the wafer is low, and meanwhile, impurities generated in the wafer cutting process cannot be removed in time.
Disclosure of Invention
In order to make up for the deficiencies of the prior art, the invention provides a semiconductor packaging device and a packaging method.
The technical scheme adopted by the invention to solve the technical problem is as follows: the utility model provides a semiconductor packaging equipment, includes L type table, cutting mechanism, gets from mechanism and mounting mechanism, L type table install have work subaerial, the upper end of L type table left end is provided with cutting mechanism, the upper end of L type table right-hand member is installed and is got from the mechanism, gets to be provided with mounting mechanism from the mechanism directly right side, mounting mechanism installs in the up end of L type table right-hand member, gets from mechanism and mounting mechanism and cutting mechanism between equal mutually perpendicular.
The cutting mechanism comprises a rotating plate, a first limiting plate, a supporting plate, a disc, a blue film, a first cutting plate, a second cutting plate, a top plate, an inverted U-shaped plate, a first electric push rod, an inverted L-shaped frame and a jacking unit, wherein the rotating plate is arranged on the upper end surface of the left end of the L-shaped table, a first pin shaft is rotatably arranged at the rear end of the rotating plate, the lower end of the first pin shaft is arranged at the left end of the L-shaped table, a first limiting plate is arranged on the left side of the rotating plate, a first limiting plate is arranged at the upper end of the L-shaped table, the supporting plate is symmetrically arranged in front and at back of the front end surface of the upper end surface of the rotating plate, the disc is arranged between the upper ends of the supporting plates, the blue film is attached to the upper end surface of the disc, the first cutting plate is equidistantly arranged right from front to back above the blue film, a first groove is arranged on the left end surface of the first cutting plate at equal distance from left to right, the top plate is connected between the side ends of the second cutting plate, the middle part of the upper end face of the top plate is connected with the vertical section of the inverted U-shaped plate, the upper end face of the horizontal section of the inverted U-shaped plate is provided with an electric push rod at equal intervals from front to back, the upper end face of the electric push rod is connected with the lower end face of the horizontal section of the inverted L-shaped frame, the lower end face of the vertical section of the inverted L-shaped frame is connected with the upper end face of the L-shaped table, the middle part of the lower end of the disc is provided with a jacking unit, a wafer is placed on the upper end of a blue film in a manual mode, the blue film has certain adsorption force on the wafer, the wafer is in place at the moment, then the inverted U-shaped plate is pushed downwards through the electric push rod, the inverted U-shaped plate drives the top plate to move synchronously, the first cutting plate and the second cutting plate move synchronously.
The jacking unit comprises vertical plates, square plates, clamping plates and ejector rods, the vertical plates are symmetrically arranged on the lower end face of the disc in a front-back mode, the square plates are arranged between the vertical plates in a sliding fit mode, the clamping plates are symmetrically arranged at the front ends and the rear ends of the square plates in a sliding fit mode, the outer side ends of the clamping plates are connected with plate grooves in a sliding fit mode, the plate grooves are formed in the inner side end faces of the vertical plates, the ejector rods are equidistantly arranged from front to back at the upper end of the square plates, the ejector rods are equidistantly arranged from left to right, the upper ends of the ejector rods are connected with rod through grooves in a sliding fit mode, the rod through grooves are formed in the upper end of the disc, after a wafer is molded, the rotating plates are manually rotated and drive the disc to synchronously move through the supporting plates until the rotating plates are contacted with the second limiting plate, at the moment, the rotating plates are rotated by 90 degrees, the ejector rod pushes the wafer above the ejector rod through the blue film to enable the wafer to be gradually separated from the blue film until the clamping plate is right opposite to the plate groove, then the clamping plate slides into the plate groove manually, the square plate is fixed at the moment, and the wafer is completely separated from the blue film.
The taking-off mechanism comprises a first vertical frame, a suction machine, a hose, a middle plate, suction heads, handles, a hand frame and a second limiting plate, wherein the first vertical frame is arranged on the upper end face of the right end of the L-shaped table, the upper end of the first vertical frame is arranged on the suction machine, the middle part of the lower end face of the suction machine is arranged on the hose, the lower end of the hose is provided with the middle plate, the inner part of the middle plate is of a hollow structure, the middle plate is communicated with the hose, the lower end of the middle plate is provided with the suction heads at equal intervals from front to back, the suction heads are communicated with the inner part of the middle plate, the middle parts of the left end face and the right end face of the middle plate are symmetrically provided with the handles, the handle at the left end of the middle plate is connected with the second groove in a sliding fit mode, the second groove is arranged at the lower end of the hand frame, the upper end face of the hand frame is connected with the lower end face of, the handle is taken off from the hand rack through the manual mode, then the intermediate plate is moved through holding the handle, the intermediate plate drives the suction head to move synchronously, the hose is stretched synchronously until the suction head contacts with the wafer, then the suction head adsorbs the wafer through the suction machine, then the intermediate plate is moved to the direction of the pasting mechanism through holding the handle again, and the suction head adsorbs the wafer to move synchronously therewith.
The pasting mechanism comprises a second vertical frame, a first electric sliding block, a second electric push rod, a spraying machine, a spray head, a storage plate, a clamping plate and a middle column, wherein the second vertical frame is arranged on the upper end surface of the right end of the L-shaped table, the second vertical frame is of an inverted L-shaped structure, the lower end surface of the horizontal section of the second vertical frame is arranged on the first electric sliding block in a sliding fit mode, the second electric push rod is symmetrically arranged on the front and back of the lower end of the first electric sliding block, the lower end of the second electric push rod is connected with the upper end of the spraying machine, the lower end of the spraying machine is equidistantly arranged on the spray head from front to back, the storage plate is arranged under the spraying machine and is of a circular structure, the clamping plate is arranged on the upper end surface of the storage plate and is uniformly distributed along the circumferential direction of the storage plate and is vertical to the adjacent clamping plates, the middle part of the lower end surface of, the wafer is manually placed at the upper end of the blue film, the substrate is placed at the upper end of the object placing plate, the substrate is clamped by the clamping plate, and in the process of separating the wafer from the blue film, the sprayer is pushed downwards by a second electric push rod and drives the spray head to move synchronously until the spray head approaches the substrate, then, injecting sticky grease into the spray head through a spraying machine, spraying the sticky grease on the upper end surface of the substrate through the spray head, and simultaneously, the first electric slide block drives the second electric push rod to move rightwards, the spraying machine drives the spray head to move synchronously with the spray head, and the sprayer moves to the middle of the next spraying point, the spraying machine is in a stop working state, after the suction head sucks the wafer, the middle plate is moved by holding the handle by hand, the suction head adsorbs the wafer to synchronously move along with the wafer until the wafer is pasted with the substrate through sticky grease, then the suction head is immediately loosened from the wafer, and the operations are repeated to finish the pasting molding between all wafers and the substrate.
As a preferred technical scheme of the invention, the middle parts of the front end and the rear end of the disc are symmetrically provided with a third groove, a second electric sliding block is arranged in the third groove in a sliding fit mode, the outer side end of the second electric sliding block is provided with an L-shaped support plate, the vertical section of the L-shaped support plate is of a telescopic structure, a second pin shaft is arranged in the middle part of the upper end surface of the vertical section of the L-shaped support plate, the upper end of the second pin shaft is rotatably connected with a connecting plate, the inner side end of the connecting plate is provided with a V-shaped clamping plate, the connecting plate and the V-shaped clamping plate are both positioned above the blue membrane, the upper end surface of the disc is provided with scale marks, the scale marks are parallel to the connecting plate, the L-shaped support plate is driven by the second electric sliding block to move oppositely or oppositely, the L-shaped support plate drives the connecting plate to move synchronously, the connecting plate drives the V, the wafer is in butt joint with the center of the disc when being located between the V-shaped clamping plates, namely the V-shaped clamping plates can ensure that the wafer and the disc are always in butt joint, so that the degree of full cutting of the wafer is improved, the corresponding height of the connecting plate is upwards lifted through a manual mode before the wafer is cut, and then the V-shaped clamping plates are rotated towards the outer sides of the discs.
As a preferred technical scheme of the invention, a first groove at the lower end of a first cutting plate is connected with a second cutting plate in a sliding fit mode, third pin shafts are symmetrically arranged on the left and right of the upper end surface of the first cutting plate, a V-shaped plate is arranged between the front and back adjacent third pin shafts, the leftmost V-shaped plate of the second cutting plate is fixedly connected with the third pin shaft at the left end of the second cutting plate, other third pin shafts are rotatably connected with the V-shaped plate, the included angle end of the V-shaped plate faces an inverted U-shaped plate, an arc groove is symmetrically arranged on the left and right of the upper end surface of a top plate at the front end of the second cutting plate, an arc electric slide block is arranged in the arc groove in a sliding fit mode, a fourth pin shaft is arranged on the upper end surface of the arc electric slide block, a connecting plate is arranged on the upper end surface of the fourth pin shaft, the connecting plate is fixedly connected with the adjacent third pin shaft, extension plates are arranged in the middle parts of the upper end surfaces of the, the upper end of extension board links to each other through sliding fit mode between the board horizontal segment of falling U-shaped, drive four round pin axles through the electronic slider of circular arc and move to the outside along the circular arc recess, four round pin axles drive even the synchronization motion of the handle of me, even the board makes this three epaxial V templates of round pin carry out the rotational motion in step through the three round pin axles rather than fixed connection, then form synchronous chain rotation state between all V templates, a cutting plate moves corresponding distance forward under the drive of V template, the extension board is along with a cutting plate synchronization motion, it is total, the electronic slider of circular arc, cooperation can make the interval between a cutting plate be in the state that can regulate and control between even board and the V template, the wafer size of cooperation cutting degree between a cutting plate and No. two cutting plates changes along with it, and then the variety of cutting mechanism cutting shaping wafer has been richened.
As a preferred technical scheme of the invention, the lower end of the vertical section of the inverted L-shaped frame is symmetrically provided with rectangular through grooves in front and back, side plates are arranged in the rectangular through grooves in a sliding fit manner, a dust collector is arranged between the right ends of the side plates, the middle part of the right end of the dust collector is provided with a through pipe, the right end of the through pipe is provided with a dust collection head, the dust collection head is positioned above a blue membrane, and the dust absorption head is positioned at the left side of the disc, after the wafer is cut and molded, the first cutting plate and the second cutting plate are restored to the original height, then the side plate is pulled forwards in a manual mode, the side plate drives the dust collector to move synchronously, the dust collector drives the through pipe and the dust collection head to move synchronously, in the process, the dust collector is in a working state, impurities such as waste materials and the like generated in the process of cutting and forming the wafer by the dust collection head are absorbed, so as to improve the cleaning degree of the surface of the wafer and further be beneficial to improving the forming quality of the subsequent semiconductor.
As a preferred technical scheme of the invention, the dust collector is clamped with the side plate in a sliding fit mode, the dust collection head is arranged in a left-upward inclined mode, the dust collector is movably connected with the side plate, so that the dust collector can be conveniently detached in time to clean the whole dust collector, and the inclined arrangement of the dust collection head can enlarge the suction range of the dust collection head.
As a preferred technical scheme of the invention, the clamping plate is of an L-shaped structure, the lower end face of the clamping plate is provided with a third electric slider head, the included angle between the third electric slider head and the clamping plate is 45 degrees, the third electric slider is connected with the upper end of the object placing plate in a sliding fit mode, the third electric slider head drives the clamping plate to move towards the circular direction of the object placing plate, in the process, the overall size of the structure formed by the clamping plate is gradually reduced until the overall size of the structure is matched with the size of a substrate to be clamped, and the overall applicability of the mounting mechanism can be improved on the basis.
As a preferable technical scheme of the invention, a dimension line is carved on the right end face of the horizontal section of the inverted U-shaped plate, and the distance between the first cutting plates can be accurately adjusted at one time according to the molding dimension requirement of the wafer on the basis of the dimension line.
As a preferred technical solution of the present invention, the semiconductor packaging apparatus is used for performing a specific operation, and the specific packaging method includes the following steps:
s1, clamping a wafer and a substrate: the wafer is placed at the upper end of the blue film in a manual mode, the blue film has certain adsorption force on the wafer, the wafer is in place at the moment, meanwhile, the substrate is placed at the upper end of the object placing plate, and the substrate is clamped through the clamping plate;
s2, cutting a formed wafer: the inverted U-shaped plate is pushed downwards through the first electric push rod, the inverted U-shaped plate drives the top plate to move synchronously, the first cutting plate and the second cutting plate move synchronously along with the top plate until the first cutting plate and the second cutting plate cut through the wafer, and the wafer is cut into a plurality of chips;
s3, reversing and butting: after the wafer is formed, the rotating plate is manually rotated, the rotating plate drives the disc to synchronously move through the supporting plate until the rotating plate is contacted with the second limiting plate, and the disc is positioned right below the spraying machine;
s4, separation of the wafer: manually lifting the square plate upwards, driving the clamping plate and the ejector rod to synchronously move, ejecting the wafer above the ejector rod through the blue film to gradually separate the wafer from the blue film until the clamping plate is opposite to the plate groove, manually sliding the clamping plate into the plate groove to fix the square plate, and completely separating the wafer from the blue film;
s5, spraying viscous grease: the sprayer is pushed downwards through the second electric push rod, the sprayer drives the spray head to move synchronously until the spray head is close to the substrate, then sticky grease is injected into the spray head through the sprayer, the sticky grease is sprayed on the upper end face of the substrate, the second electric push rod is driven to move rightwards through the first electric slide block, the sprayer drives the spray head to move synchronously, the spray head moves to the middle of the next spraying point, and the sprayer does not work;
s6, adsorbing the wafer: manually taking down the handle from the hand rack, then holding the handle to move the middle plate, driving the suction head to move synchronously by the middle plate, synchronously stretching the hose until the suction head is contacted with the wafer, and then enabling the suction head to adsorb the wafer through a suction machine;
s7, mounting a wafer and a substrate: the middle plate is moved by holding the handle by hand, the suction head sucks the wafer and synchronously moves with the wafer until the wafer is pasted with the substrate through sticky grease, then the suction head is immediately loosened from the wafer, and the step S6 is repeated to finish the pasting molding between all wafers and the substrate;
s8, welding, forming and packaging: and S7, welding the bonding pads of the wafer and the substrate by using the wires, then carrying out plastic package on the independent wafer, and detecting after the plastic package, thus finishing the semiconductor molding.
Compared with the prior art, the invention has the following advantages:
1. according to the semiconductor packaging equipment and the packaging method provided by the invention, the semiconductor packaging is carried out by adopting the design concept of the linkage structure, the rapid semi-automatic conversion and matching among the cutting mechanism, the taking-off mechanism and the mounting mechanism can greatly improve the efficiency of the semiconductor packaging and reduce the probability of the existence of manual errors, and the structure with the function of absorbing and removing impurities generated by cutting is arranged to improve the cleaning degree of the surface of a wafer, so that the forming quality of the subsequent semiconductor is improved;
2. the arc electric sliding block, the connecting plate and the V-shaped plate are matched to enable the distance between the first cutting plate to be in an adjustable state, and the size of the wafer with the matched cutting degree between the first cutting plate and the second cutting plate is changed along with the adjustment of the distance between the first cutting plate and the second cutting plate, so that the diversity of the cutting mechanism for cutting the formed wafer is enriched;
3. the V-shaped clamping plate, the connecting plate, the L-shaped supporting plate and the second electric sliding block are matched to ensure that the wafer and the disc are always in butt joint, so that the full cutting degree of the wafer is improved;
4. according to the invention, the whole size of the structure formed by the clamping plates can be adaptively regulated and controlled according to the size of the substrate, so that the clamping plates can firmly clamp the substrate, and the whole application degree of the mounting mechanism is further improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a first cross-sectional view of the present invention;
FIG. 3 is a second cross-sectional view of the present invention;
FIG. 4 is a third cross-sectional view of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 1 according to the present invention;
FIG. 6 is an enlarged, fragmentary, schematic view taken in the direction of Y of FIG. 1 in accordance with the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 1 in the Z-direction of the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 1 from the direction M;
FIG. 9 is an enlarged partial structural view of FIG. 2 taken in the direction of N;
FIG. 10 is an enlarged view of a portion of FIG. 2 in the direction of R according to the present invention;
FIG. 11 is an enlarged view of a portion of the T-direction of FIG. 3 according to the present invention;
FIG. 12 is an enlarged partial view of the Q-direction of FIG. 4 in accordance with the present invention;
FIG. 13 is an enlarged view of a portion of the W direction of FIG. 4 according to the present invention;
FIG. 14 is a process flow diagram of the present invention.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further explained with reference to fig. 1 to 14.
The utility model provides a semiconductor packaging equipment, includes L type table 1, cutting mechanism 2, gets and leaves mechanism 3 and paste installation and construct 4, L type table 1 install and have had work subaerially, the upper end of 1 left end of L type table is provided with cutting mechanism 2, the upper end of 1 right-hand member of L type table is installed and is got and leave mechanism 3, get and be provided with paste installation mechanism 4 from mechanism 3 right side, paste installation and construct 4 and install in the up end of 1 right-hand member of L type table, get and leave mechanism 3 and paste installation and construct all mutually perpendicular between 4 and the cutting mechanism 2.
The cutting mechanism 2 comprises a rotating plate 20, a first limiting plate 21, a supporting plate 22, a disc 23, a blue film 24, a first cutting plate 25, a second cutting plate 26, a top plate 27, an inverted U-shaped plate 28, a first electric push rod 29, an inverted L-shaped frame 290 and a jacking unit 291, wherein the rotating plate 20 is arranged on the upper end surface of the left end of the L-shaped table 1, a first pin shaft is rotatably arranged at the rear end of the rotating plate 20, the lower end of the first pin shaft is arranged at the left end of the L-shaped table 1, the left side of the rotating plate 20 is provided with the first limiting plate 21, the first limiting plate 21 is arranged at the upper end of the L-shaped table 1, the supporting plates 22 are symmetrically arranged in the front and back of the front end surface of the upper end surface of the rotating plate 20, the disc 23 is arranged between the upper ends of the supporting plates 22, the blue film 24 is attached to the upper end surface of the disc 23, the first cutting plate 25 is arranged at equal intervals from front to back right over the blue film 24, a first groove is arranged at, the lower end face of the first cutting plate 25 is flush with the lower end face of the second cutting plate 26, a top plate 27 is connected between the side ends of the second cutting plate 26, the middle part of the upper end face of the top plate 27 is connected with the vertical section of the inverted U-shaped plate 28, a first electric push rod 29 is arranged on the upper end face of the horizontal section of the inverted U-shaped plate 28 in an equidistance from front to back, the upper end face of the first electric push rod 29 is connected with the lower end face of the horizontal section of the inverted L-shaped frame 290, the lower end face of the vertical section of the inverted L-shaped frame 290 is connected with the upper end face of the L-shaped table 1, a jacking unit 291 is arranged in the middle part of the lower end of the disc 23, a wafer is placed on the upper end of the blue film 24 in a manual mode, the blue film 24 has certain adsorption force on the wafer, the wafer is in position, then the inverted U-shaped plate 28 is pushed downwards by the first electric push rod 29, the, until both the first cutting plate 25 and the second cutting plate 26 cut through the wafer, the wafer is cut into a plurality of chips.
The jacking unit 291 comprises vertical plates 292, square plates 293, clamping plates 294 and ejector rods 295, the vertical plates 292 are symmetrically arranged on the lower end face of the disc 23 in a front-back manner, the square plates 293 are arranged between the vertical plates 292 in a sliding fit manner, the clamping plates 294 are symmetrically arranged on the front ends and the rear ends of the square plates 293 in a sliding fit manner, the outer ends of the clamping plates 294 are connected with plate grooves in a sliding fit manner, the plate grooves are formed in the inner side end faces of the vertical plates 292, the ejector rods 295 are equidistantly arranged from front to back at the upper ends of the square plates 293, the ejector rods 295 are equidistantly arranged from left to right, the upper ends of the ejector rods 295 are connected with rod through grooves in a sliding fit manner, the rod through grooves are formed in the upper ends of the disc 23, after a wafer is molded, the rotating plate 20 is manually rotated, the rotating plate 20 drives the disc 23 to synchronously move through the supporting plates 22 until the rotating plate 20 is, then, the square plate 293 is manually lifted upwards, the square plate 293 drives the clamping plate 294 and the ejector rod 295 to move synchronously, the ejector rod 295 pushes the wafer above the ejector rod through the blue film 24 to enable the wafer to be gradually separated from the blue film 24 until the clamping plate 294 is right opposite to the plate groove, then the clamping plate 294 slides into the plate groove manually, the square plate 293 is fixed at the moment, the wafer is completely separated from the blue film 24, and the rotating plate 20 can only rotate 90 degrees at each time through the matching between the first limiting plate 21 and the second limiting plate 37.
The middle parts of the front end and the rear end of the disc 23 are symmetrically provided with a third groove, a second electric slider 230 is arranged in the third groove in a sliding fit mode, an L-shaped support plate 231 is arranged at the outer side end of the second electric slider 230, the vertical section of the L-shaped support plate 231 is of a telescopic structure, a second pin shaft is arranged at the middle part of the upper end surface of the vertical section of the L-shaped support plate 231, the upper end of the second pin shaft is rotatably connected with a connecting plate 232, a V-shaped clamp plate 233 is arranged at the inner side end of the connecting plate 232, the connecting plate 232 and the V-shaped clamp plate 233 are both positioned above the blue membrane 24, the upper end surface of the disc 23 is provided with scale marks which are parallel to the connecting plate 232, the L-shaped support plates 231 are driven by the second electric slider 230 to move oppositely or oppositely, the L-shaped support plate 231 drives the connecting plate 232 to move synchronously, the connecting plate 232 drives the V-shaped clamp plate 233 to, so that the center of the wafer is in positive butt joint with the center of the disc 23 when the wafer is positioned between the V-shaped clamping plates 233, that is, the V-shaped clamping plates 233 can ensure that the wafer and the disc 23 are always in positive butt joint, so as to improve the degree of full cutting of the wafer, before the wafer is cut, the connecting plate 232 is lifted upwards in a manual mode by the corresponding height, and then the V-shaped clamping plates 233 are rotated to the outer side of the disc 23.
The first groove at the lower end of the first cutting plate 25 is connected with the second cutting plate 26 in a sliding fit mode, the upper end face of the first cutting plate 25 is provided with three pin shafts in a bilateral symmetry mode, a V-shaped plate 250 is arranged between the three pin shafts which are just adjacent in front and back, the V-shaped plate 250 at the leftmost side of the second cutting plate 26 is fixedly connected with the three pin shafts at the left end, other three pin shafts are rotatably connected with the V-shaped plate 250, the included angle end of the V-shaped plate 250 faces the inverted U-shaped plate 28, the upper end face of the top plate 27 at the front end of the second cutting plate 26 is provided with an arc groove in a bilateral symmetry mode, an arc electric sliding block 251 is arranged in the arc groove in a sliding fit mode, the upper end face of the arc electric sliding block 251 is provided with a fourth pin shaft, the upper end of the fourth pin shaft is provided with a connecting plate 252, the connecting plate 252 is fixedly connected with the three pin shafts adjacent to the connecting plate, and the middle parts of the upper end faces of the rest first cutting plates 25 except, the upper end of the extension plate 253 is connected with the horizontal section of the inverted U-shaped plate 28 in a sliding fit manner, drive four number round pin axles through circular arc electric slider 251 and move to the outside along the circular arc recess, four number round pin axles drive even the synchronization motion, even board 252 makes this three epaxial V template 250 of round pin synchronous rotational motion through three round pin axles rather than fixed connection, then form synchronous chain rotation state between all V templates 250, No. one cutting plate 25 is the corresponding distance of forward motion under the drive of V template 250, extension board 253 is along with a cutting plate 25 synchronization motion, summarizing, circular arc electric slider 251, even the cooperation can make the interval between the cutting plate 25 be in the state that can regulate and control between board 252 and the V template 250, the wafer size of cooperation cutting degree changes along with it between a cutting plate 25 and No. two cutting plates 26, and then the variety of cutting shaping wafer of cutting mechanism 2 has been richened.
The lower end of the vertical section of the inverted L-shaped frame 290 is symmetrically provided with a rectangular through groove in front and back, a side plate 29a is arranged in the rectangular through groove in a sliding fit mode, a dust collector 29b is arranged between the right ends of the side plates 29a, the middle part of the right end of the dust collector 29b is provided with a through pipe 29c, the right end of the through pipe 29c is provided with a dust collection head 29d, the dust collection head 29d is positioned above the blue film 24, the dust collection head 29d is positioned at the left side of the disc 23, after the wafer is cut and molded, the first cutting plate 25 and the second cutting plate 26 are restored to the original height, then the side plates 29a are pulled forwards in a manual mode, the side plates 29a drive the dust collector 29b to move synchronously, the dust collector 29b drive the through pipe 29c and the dust collection head 29d to move synchronously, in the process, the dust collector 29b is in a working state, impurities such as waste materials generated, so as to improve the cleaning degree of the surface of the wafer and further be beneficial to improving the forming quality of the subsequent semiconductor.
The dust collector 29b and the side plate 29a are clamped in a sliding fit mode, the dust collection head 29d is arranged in a left-upward inclined mode, the dust collector 29b can be conveniently and timely detached to be cleaned integrally through the movable connection between the dust collector 29b and the side plate 29a, and the inclined arrangement of the dust collection head 29d can enlarge the suction range of the dust collection head 29 d.
The right end face of the horizontal section of the inverted U-shaped plate 28 is carved with a dimension line, and on the basis of the dimension line, the distance between the first cutting plates 25 can be accurately adjusted at one time according to the forming dimension requirement of the wafer.
The taking and separating mechanism 3 comprises a first vertical frame 30, a suction machine 31, a hose 32, a middle plate 33, suction heads 34, handles 35, a hand frame 36 and a second limiting plate 37, wherein the first vertical frame 30 is arranged on the upper end face of the right end of the L-shaped table 1, the upper end of the first vertical frame 30 is arranged on the suction machine 31, the middle part of the lower end face of the suction machine 31 is arranged on the hose 32, the middle plate 33 is arranged at the lower end of the hose 32, the middle plate 33 is of a hollow structure, the middle plate 33 is communicated with the hose 32, the suction heads 34 are arranged at the lower end of the middle plate 33 at equal intervals from front to back, the suction heads 34 are communicated with the inside of the middle plate 33, the handles 35 are symmetrically arranged at the middles of the left end face and the right end face of the middle plate 33, the handle 35 at the left end of the middle plate 33 is connected with the second groove in a sliding fit mode, the lower end of the hand frame 36 is arranged, the second limiting plate 37 is installed on the upper end face of the L-shaped table 1, the second limiting plate 37 is right opposite to the suction machine 31, after the wafer and the blue film 24 are separated, the handle 35 is manually taken down from the hand frame 36, then the middle plate 33 is moved by holding the handle 35 with a hand, the suction head 34 is driven by the middle plate 33 to move synchronously, the hose 32 is synchronously stretched until the suction head 34 is contacted with the wafer, then the suction machine 31 enables the suction head 34 to suck the wafer, then the middle plate 33 is moved towards the attaching mechanism 4 direction by holding the handle 35 with a hand again, and the suction head 34 sucks the wafer to move synchronously.
The attaching mechanism 4 comprises a second vertical frame 40, a first electric sliding block 41, a second electric push rod 42, a spraying machine 43, a spray head 44, a storage plate 45, a clamping plate 46 and a middle column 47, wherein the second vertical frame 40 is arranged on the upper end face of the right end of the L-shaped table 1, the second vertical frame 40 is of an inverted L-shaped structure, the lower end face of the horizontal section of the second vertical frame 40 is arranged on the first electric sliding block 41 in a sliding fit mode, the second electric push rod 42 is symmetrically arranged on the front and back of the lower end of the first electric sliding block 41, the lower end of the second electric push rod 42 is connected with the upper end of the spraying machine 43, the lower end of the spraying machine 43 is arranged on the spray head 44 in an equidistance mode from front to back, the storage plate 45 is arranged under the spraying machine 43, the storage plate 45 is of a circular structure, the clamping plate 46 is arranged on the upper end face of the storage plate 45, the clamping plates 46 are uniformly arranged along the circumferential direction of the storage plate 45, the clamping plates 46 are arranged symmetrically left and right relative to the middle column 47, the wafer is placed at the upper end of the blue film 24 by a manual mode, the substrate is placed at the upper end of the object placing plate 45, the substrate is clamped by the clamping plates 46, the sprayer 43 is pushed downwards by the second electric push rod 42 in the process of separating the wafer from the blue film 24, the sprayer 43 drives the spray head 44 to move synchronously until the spray head 44 approaches the substrate, then the sprayer 43 injects viscous grease into the spray head 44, the viscous grease is sprayed on the upper end surface of the substrate by the spray head 44, the first electric slide block 41 drives the second electric push rod 42 to move rightwards during spraying, the sprayer 43 drives the spray head 44 to move synchronously, the spray head 44 moves to the middle of the next spraying point, the sprayer 43 is in a stop working state, the middle plate 33 is moved by the hand-holding handle 35 after the suction head 34 sucks the wafer, the suction head 34 sucks the wafer synchronously with the same, until the wafer is mounted on the substrate by the adhesive resin, immediately after the suction head 34 is loosened, the above operations are repeated to complete the mounting and molding between the whole wafer and the substrate.
Clamping plate 46 be L type structure, No. three electric sliding block heads 460 are installed to clamping plate 46's lower terminal surface, the contained angle between No. three electric sliding block heads 460 and clamping plate 46 is 45 degrees, No. three electric sliding block 460 links to each other with the upper end of putting thing board 45 through sliding fit, drive clamping plate 46 through No. three electric sliding block heads 460 and put thing board 45's circular direction motion, in this process, the whole size of the structure that clamping plate 46 constitutes reduces gradually until identical with the base plate size of the clamping of wanting, can improve the holistic application degree of subsides dress mechanism 4 on this basis.
The semiconductor packaging equipment is adopted for carrying out specific operation, and the specific packaging method comprises the following steps:
s1, clamping a wafer and a substrate: the wafer is placed at the upper end of the blue film 24 manually, the blue film 24 has certain adsorption force on the wafer, the wafer is in place at the moment, meanwhile, the substrate is placed at the upper end of the object placing plate 45, and the substrate is clamped through the clamping plate 46;
s2, cutting a formed wafer: the inverted U-shaped plate 28 is pushed downwards through the first electric push rod 29, the inverted U-shaped plate 28 drives the top plate 27 to move synchronously, the first cutting plate 25 and the second cutting plate 26 move synchronously along with the top plate 27 until the first cutting plate 25 and the second cutting plate 26 cut through the wafer, and at the moment, the wafer is cut into a plurality of chips;
s3, reversing and butting: after the wafer is formed, the rotating plate 20 is manually rotated, the rotating plate 20 drives the disc 23 to synchronously move through the supporting plate 22 until the rotating plate 20 is contacted with the second limiting plate 37, and the disc 23 is positioned right below the spraying machine 43 at the moment;
s4, separation of the wafer: the square plate 293 is manually lifted upwards, the square plate 293 drives the clamping plate 294 and the ejector rod 295 to move synchronously, the ejector rod 295 pushes the wafer above the ejector rod through the blue film 24 to enable the wafer to be gradually separated from the blue film 24 until the clamping plate 294 is right opposite to the plate groove, then the clamping plate 294 is manually slid into the plate groove to fix the square plate 293, and at the moment, the wafer is completely separated from the blue film 24;
s5, spraying viscous grease: the sprayer 43 is pushed downwards by the second electric push rod 42, the sprayer 43 drives the spray head 44 to move synchronously until the spray head 44 is close to the substrate, then sticky grease is injected into the spray head 44 by the sprayer 43 and is sprayed on the upper end surface of the substrate, meanwhile, the first electric slide block 41 drives the second electric push rod 42 to move rightwards, the sprayer 43 drives the spray head 44 to move synchronously, the spray head 44 moves to the middle of the next spraying point, and the sprayer 43 does not work;
s6, adsorbing the wafer: manually taking down the handle 35 from the hand rack 36, then holding the handle 35 by hand to move the middle plate 33, driving the suction head 34 to synchronously move by the middle plate 33, synchronously stretching the hose 32 until the suction head 34 is contacted with the wafer, and then enabling the suction head 34 to adsorb the wafer by the suction machine 31;
s7, mounting a wafer and a substrate: moving the middle plate 33 by holding the handle 35 with hands, enabling the suction head 34 to suck the wafer and move synchronously with the same until the wafer is mounted with the substrate through the viscose, then immediately loosening the suction head 34 from the wafer, and repeating the step S6 to complete the mounting and forming of all wafers and the substrate;
s8, welding, forming and packaging: and S7, welding the bonding pads of the wafer and the substrate by using the wires, then carrying out plastic package on the independent wafer, and detecting after the plastic package, thus finishing the semiconductor molding.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a semiconductor packaging equipment, includes L type table (1), cutting mechanism (2), takes off mechanism (3) and pastes dress mechanism (4), its characterized in that: the L-shaped table (1) is installed on the existing working ground, a cutting mechanism (2) is arranged at the upper end of the left end of the L-shaped table (1), a taking-off mechanism (3) is installed at the upper end of the right end of the L-shaped table (1), a mounting mechanism (4) is arranged right of the taking-off mechanism (3), the mounting mechanism (4) is installed on the upper end face of the right end of the L-shaped table (1), and the taking-off mechanism (3), the mounting mechanism (4) and the cutting mechanism (2) are perpendicular to each other;
the cutting mechanism (2) comprises a rotating plate (20), a first limiting plate (21), a supporting plate (22), a disc (23), a blue film (24), a first cutting plate (25), a second cutting plate (26), a top plate (27), an inverted U-shaped plate (28), a first electric push rod (29), an inverted L-shaped frame (290) and a jacking unit (291), wherein the rotating plate (20) is arranged on the upper end surface of the left end of the L-shaped table (1), a first pin shaft is rotatably arranged at the rear end of the rotating plate (20), the lower end of the first pin shaft is arranged at the left end of the L-shaped table (1), the first limiting plate (21) is arranged on the left side of the rotating plate (20), the supporting plate (22) is symmetrically arranged at the front and back of the front end surface of the upper end surface of the rotating plate (20), the disc (23) is arranged between the upper ends of the supporting plates (22), the blue film (24) is attached to the upper end surface of the disc (23), a first cutting plate (25) is arranged right above the blue film (24) from front to back at equal intervals, a first groove is formed in the left end face of the first cutting plate (25) from left to right at equal intervals, a second cutting plate (26) is arranged between the front and back opposite first grooves, the lower end face of the first cutting plate (25) is flush with the lower end face of the second cutting plate (26), a top plate (27) is connected between the side ends of the second cutting plate (26), the middle part of the upper end face of the top plate (27) is connected with the vertical section of the inverted U-shaped plate (28), a first electric push rod (29) is arranged on the upper end face of the horizontal section of the inverted U-shaped plate (28) from front to back at equal intervals, the upper end face of the first electric push rod (29) is connected with the lower end face of the horizontal section of the inverted L-shaped frame (290), the lower end face of the vertical section of the inverted L-shaped frame (290) is connected with the upper end face of the L-shaped table (1), and a;
the jacking unit (291) comprises vertical plates (292), square plates (293), clamping plates (294) and ejector rods (295), the vertical plates (292) are symmetrically arranged on the lower end face of the disc (23) in a front-back mode, the square plates (293) are arranged between the vertical plates (292) in a sliding fit mode, the clamping plates (294) are symmetrically arranged on the front end and the rear end of each square plate (293) in a sliding fit mode, the outer side ends of the clamping plates (294) are connected with plate grooves in a sliding fit mode, the plate grooves are formed in the inner side end faces of the vertical plates (292), the ejector rods (295) are arranged on the upper ends of the square plates (293) in an equidistance mode from front to back, the ejector rods (295) are arranged in an equidistance from left to right, the upper ends of the ejector rods (295) are connected with rod through grooves in a sliding;
the taking and separating mechanism (3) comprises a first vertical frame (30), a suction machine (31), a hose (32), a middle plate (33), suction heads (34), a handle (35), a hand frame (36) and a second limiting plate (37), wherein the first vertical frame (30) is installed on the upper end face of the right end of the L-shaped table (1), the upper end of the first vertical frame (30) is installed on the suction machine (31), the middle part of the lower end face of the suction machine (31) is installed on the hose (32), the middle plate (33) is installed at the lower end of the hose (32), the middle part of the middle plate (33) is of a hollow structure, the middle plate (33) is communicated with the hose (32), the suction heads (34) are installed at the lower end of the middle plate (33) at equal distance from the front to the back, the suction heads (34) are communicated with the inside of the middle plate (33), the handles (35) are symmetrically installed at the left end face and the right end face of the middle plate (33), the handle (35) at the left, the second groove is formed in the lower end of the hand frame (36), the upper end face of the hand frame (36) is connected with the lower end face of the first vertical frame (30) suction machine (31), the second limiting plate (37) is installed on the upper end face of the L-shaped table (1), and the second limiting plate (37) is right opposite to the suction machine (31);
the pasting mechanism (4) comprises a second vertical frame (40), a first electric sliding block (41), a second electric push rod (42), a spraying machine (43), a spray head (44), a storage plate (45), a clamping plate (46) and a middle column (47), wherein the second vertical frame (40) is arranged on the upper end face of the right end of the L-shaped table (1), the second vertical frame (40) is of an inverted L-shaped structure, the lower end face of the horizontal section of the second vertical frame (40) is arranged on the first electric sliding block (41) in a sliding fit mode, the second electric push rod (42) is symmetrically arranged at the front and back of the lower end of the first electric sliding block (41), the lower end of the second electric push rod (42) is connected with the upper end of the spraying machine (43), the lower end of the spraying machine (43) is arranged on the spray head (44) from front to back at equal intervals, the storage plate (45) is arranged under the spraying machine (43), and the storage plate (45), clamping plates (46) are arranged on the upper end faces of the object placing plates (45), the clamping plates (46) are evenly distributed along the circumferential direction of the object placing plates (45), the adjacent clamping plates (46) are perpendicular to each other, the middle of the lower end face of each object placing plate (45) is installed on a middle column (47), and the clamping plates (46) are arranged in a left-right symmetrical mode relative to the middle column (47).
2. The semiconductor package device of claim 1, wherein: disc (23) around both ends middle part symmetry seted up No. three recesses, install No. two electronic slider (230) through sliding fit in the No. three recesses, L type extension board (231) are installed to the outside end of No. two electronic slider (230), L type extension board (231) vertical section is extending structure, the up end mid-mounting of L type extension board (231) vertical section has No. two round pins, the upper end of No. two round pins is rotated and is connected with connecting plate (232), V type splint (233) are installed to the medial extremity of connecting plate (232), connecting plate (232) and V type splint (233) all are located the top of blue membrane (24), the up end of disc (23) is provided with the scale mark, the scale mark is parallel with connecting plate (232).
3. The semiconductor package device of claim 1, wherein: the first groove at the lower end of the first cutting plate (25) is connected with the second cutting plate (26) in a sliding fit mode, three pin shafts are symmetrically arranged on the left and right of the upper end surface of the first cutting plate (25), a V-shaped plate (250) is arranged between the front and back adjacent three pin shafts, the leftmost V-shaped plate (250) of the second cutting plate (26) is fixedly connected with the three pin shafts at the left end of the second cutting plate, other three pin shafts are rotatably connected with the V-shaped plate (250), the included angle end of the V-shaped plate (250) faces to the inverted U-shaped plate (28), an arc groove is symmetrically arranged on the upper end surface of the top plate (27) at the front end of the second cutting plate (26), an arc electric sliding block (251) is arranged in the arc groove in a sliding fit mode, a fourth pin shaft is arranged on the upper end surface of the arc electric sliding block (251), a connecting plate (252) is arranged on the upper end of the fourth pin shaft, and the connecting plate (252), an extension plate (253) is installed in the middle of the upper end face of the remaining cutting plate (25) except for the cutting plate (25) fixedly connected with the V-shaped plate (250) and the third pin shaft, and the upper end of the extension plate (253) is connected with the horizontal section of the inverted U-shaped plate (28) in a sliding fit mode.
4. The semiconductor package device of claim 1, wherein: the lower extreme of the vertical section of inverted L type frame (290) front and back symmetry seted up the rectangle and led to the groove, the rectangle is led to the inslot and is provided with curb plate (29a) through sliding fit, install dust catcher (29b) between the right-hand member of curb plate (29a), the right-hand member mid-mounting of dust catcher (29b) has siphunculus (29c), the right-hand member of siphunculus (29c) is provided with dust absorption head (29d), dust absorption head (29d) are located the top of blue membrane (24), and dust absorption head (29d) are located the left side of disc (23).
5. The semiconductor package device of claim 4, wherein: the dust collector (29b) is clamped with the side plate (29a) in a sliding fit mode, and the dust collection head (29d) is arranged in a left-upward inclined mode.
6. The semiconductor package device of claim 1, wherein: clamping plate (46) be L type structure, No. three electric sliding block heads (460) are installed to the lower terminal surface of clamping plate (46), the contained angle between No. three electric sliding block heads (460) and clamping plate (46) is 45 degrees, No. three electric sliding block (460) link to each other through sliding fit with the upper end of putting thing board (45).
7. The semiconductor package device of claim 1, wherein: the right end face of the horizontal section of the inverted U-shaped plate (28) is carved with a dimension line.
8. The semiconductor package device of claim 1, wherein: the semiconductor packaging equipment is adopted to carry out specific operation, and the specific packaging method comprises the following steps:
s1, clamping a wafer and a substrate: the wafer is placed at the upper end of the blue film (24) in a manual mode, the blue film (24) has certain adsorption force on the wafer, the wafer is placed in position, meanwhile, the substrate is placed at the upper end of the object placing plate (45), and the substrate is clamped through the clamping plate (46);
s2, cutting a formed wafer: the inverted U-shaped plate (28) is pushed downwards through the first electric push rod (29), the inverted U-shaped plate (28) drives the top plate (27) to move synchronously, the first cutting plate (25) and the second cutting plate (26) move synchronously along with the top plate (27) until the first cutting plate (25) and the second cutting plate (26) cut through the wafer, and the wafer is cut into a plurality of chips;
s3, reversing and butting: after the wafer is formed, the rotating plate (20) is rotated manually, the rotating plate (20) drives the disc (23) to move synchronously through the supporting plate (22) until the rotating plate (20) is contacted with the second limiting plate (37), and the disc (23) is positioned right below the spraying machine (43);
s4, separation of the wafer: the square plate (293) is lifted upwards manually, the square plate (293) drives the clamping plate (294) and the ejector rod (295) to move synchronously, the ejector rod (295) pushes the wafer above the blue film (24) through the blue film (24) to enable the wafer to be separated from the blue film (24) gradually until the clamping plate (294) is opposite to the plate groove, then the clamping plate (294) is slid into the plate groove manually to fix the square plate (293), and at the moment, the wafer is completely separated from the blue film (24);
s5, spraying viscous grease: the sprayer (43) is pushed downwards through the second electric push rod (42), the sprayer (43) drives the spray head (44) to move synchronously until the spray head (44) is close to the substrate, then sticky grease is injected into the spray head (44) through the sprayer (43) and is sprayed on the upper end face of the substrate, the first electric slide block (41) drives the second electric push rod (42) to move rightwards, the sprayer (43) drives the spray head (44) to move synchronously, the spray head (44) moves to the middle of the next spraying point, and the sprayer (43) does not work;
s6, adsorbing the wafer: the handle (35) is manually taken down from the hand rack (36), then the middle plate (33) is moved by holding the handle (35), the middle plate (33) drives the suction head (34) to move synchronously, the hose (32) is synchronously stretched until the suction head (34) is contacted with the wafer, and then the suction head (34) is enabled to adsorb the wafer through the suction machine (31);
s7, mounting a wafer and a substrate: the middle plate (33) is moved by holding the handle (35) by hand, the suction head (34) sucks the wafer and then synchronously moves until the wafer is mounted with the substrate through the viscose, then the suction head (34) is immediately released from the wafer, and the step S6 is repeated to finish mounting and forming between all wafers and the substrate;
s8, welding, forming and packaging: and S7, welding the bonding pads of the wafer and the substrate by using the wires, then carrying out plastic package on the independent wafer, and detecting after the plastic package, thus finishing the semiconductor molding.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113664917A (en) * | 2021-10-25 | 2021-11-19 | 江苏卓远半导体有限公司 | Packaging machine for semiconductor |
| CN115424958A (en) * | 2022-09-16 | 2022-12-02 | 浙江嘉辰半导体有限公司 | Double-sided heat dissipation semiconductor packaging structure and process thereof |
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| CN107611067A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Integral type encapsulates cutting machine |
| CN111185965A (en) * | 2020-01-07 | 2020-05-22 | 陈明亮 | Integral die-cutting processing method for producing polaroid for liquid crystal display |
| US20200185239A1 (en) * | 2018-12-11 | 2020-06-11 | Disco Corporation | Cutting apparatus |
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| CN107611067A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Integral type encapsulates cutting machine |
| US20200185239A1 (en) * | 2018-12-11 | 2020-06-11 | Disco Corporation | Cutting apparatus |
| CN111185965A (en) * | 2020-01-07 | 2020-05-22 | 陈明亮 | Integral die-cutting processing method for producing polaroid for liquid crystal display |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113664917A (en) * | 2021-10-25 | 2021-11-19 | 江苏卓远半导体有限公司 | Packaging machine for semiconductor |
| CN113664917B (en) * | 2021-10-25 | 2021-12-21 | 江苏卓远半导体有限公司 | Packaging machine for semiconductor |
| CN115424958A (en) * | 2022-09-16 | 2022-12-02 | 浙江嘉辰半导体有限公司 | Double-sided heat dissipation semiconductor packaging structure and process thereof |
| CN115424958B (en) * | 2022-09-16 | 2023-06-23 | 浙江嘉辰半导体有限公司 | Double-sided heat dissipation semiconductor packaging structure and process thereof |
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| CN112951743B (en) | 2021-11-30 |
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