CN112949050B

CN112949050B - Method and device for determining acid etching parameters, computer equipment and storage medium

Info

Publication number: CN112949050B
Application number: CN202110181074.XA
Authority: CN
Inventors: 曾冀; 周长林; 张华礼; 彭钧亮; 李力; 王洋; 陈伟华; 刘飞; 何婷婷; 黄馨
Original assignee: Petrochina Co Ltd
Current assignee: Petrochina Co Ltd
Priority date: 2021-02-09
Filing date: 2021-02-09
Publication date: 2022-11-04
Anticipated expiration: 2041-02-09
Also published as: CN112949050A

Abstract

The application provides a method and a device for controlling acid-etched fractures, computer equipment and a storage medium, and belongs to the technical field of oil and gas field development. The method comprises the following steps: determining the porosity distribution of a reservoir to be subjected to acid fracturing; determining an acid fracturing fracture extension model of the reservoir based on the porosity distribution, wherein the acid fracturing fracture extension model is used for representing the length of a first fracture formed in the reservoir in the acid fracturing process of any acid displacement, and the acid displacement represents the flow of acid liquor required by the reservoir in the acid fracturing process; acquiring the closure stress of a reservoir, determining the width of a first fracture based on the closure stress, and determining the diversion parameter of the first fracture according to the width of the first fracture; and determining an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first crack, wherein the acid etching parameter is used for representing a value interval of acid discharge capacity in the acid fracturing process. The method and the device meet the actual conditions of the reservoir and the acid fracturing process, so that the accuracy of the determined acid erosion parameters is improved.

Description

Method and device for determining acid etching parameters, computer equipment and storage medium

Technical Field

The application relates to the technical field of oil and gas field development, in particular to a method and a device for determining acid etching parameters, computer equipment and a storage medium.

Background

At present, the acid fracturing reservoir modification technology is a key technology for increasing the reservoir yield. Wherein the reservoir production is related to the length of the acid fractures formed during the acid fracturing; the longer the length of the acid-etched fracture, the higher the reservoir production. In the acid fracturing process, the length of the acid fracturing crack is related to the acid fracturing parameters, and in order to control the length of the acid fracturing crack, the acid fracturing parameters need to be determined.

In the related art, the acid etching parameters include an acid flow rate and a total flow rate of the acid solution during the acid fracturing process. Determining the length of a target acid-etched fracture by computer equipment according to the reservoir yield requirement; determining the matrix porosity distribution of the reservoir according to the test data of the reservoir; and determining the flow rate of the acid liquor and the total flow of the acid liquor in the acid fracturing process according to the matrix porosity distribution of the reservoir and the length of the target acid-etched fracture through the corresponding relation among the matrix porosity distribution, the acid-etched parameters and the length of the acid-etched fracture.

However, when the reservoir is a carbonate reservoir, the accuracy of the acid etching parameter determined based on the matrix porosity distribution of the reservoir is low because the structure of the carbonate reservoir is complex, and the matrix porosity distribution of the reservoir can only partially represent the structure of the reservoir and cannot truly reflect the porosity distribution in the reservoir structure.

Disclosure of Invention

The embodiment of the application provides a method and a device for determining an acid etching parameter, computer equipment and a storage medium, which can improve the accuracy of determining the acid etching parameter. The technical scheme is as follows:

in one aspect, an embodiment of the present application provides a method for determining an acid etching parameter, where the method includes:

determining a porosity distribution of a reservoir to be subjected to acid fracturing, the reservoir comprising at least one of a matrix, natural fractures, and eroded caverns;

determining an acid fracturing fracture extension model of the reservoir based on the porosity distribution, wherein the acid fracturing fracture extension model is used for representing the length of a first fracture formed in the reservoir during acid fracturing of any acid displacement, and the acid displacement represents the flow rate of acid liquor required by the reservoir during acid fracturing;

acquiring the closing stress of the reservoir, determining the width of the first fracture based on the closing stress, and determining the diversion parameter of the first fracture according to the width of the first fracture;

and determining an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first fracture, wherein the acid etching parameter is used for representing a value interval of acid discharge capacity in the acid fracturing process.

In one possible implementation, the determining a porosity distribution of a reservoir to be subjected to acid fracturing includes:

determining a porosity of a matrix in the reservoir to be sour fractured and determining a density of natural fractures in the reservoir and a density of erosion cavities in the reservoir;

and superposing the porosity of the matrix, the density of the natural fracture and the density of the erosion holes to obtain the porosity distribution of the reservoir to be subjected to acid fracturing.

In another possible implementation, the determining an acid fracturing fracture propagation model of the reservoir based on the porosity distribution includes:

for any acid displacement, determining a matrix pressure within the reservoir and a pore pressure within the reservoir based on the porosity distribution and the acid displacement;

determining the width of an acid fracturing gap in the reservoir according to the matrix pressure and the gap pressure, and determining the position of a first crack with the width larger than a preset width;

and determining the length of a first fracture formed in the acid fracturing process of the reservoir in the acid displacement according to the position of the first fracture to obtain an acid fracturing fracture extension model of the reservoir.

In another possible implementation, the determining the width of the first fracture based on the closing stress includes:

determining a Poisson's ratio of the reservoir, a shear modulus of the reservoir, coordinates of the first fracture, and a length of a major axis of the first fracture;

determining the width of the first fracture according to the Poisson's ratio of the reservoir, the shear modulus of the reservoir, the coordinates of the first fracture, the length of the semi-major axis of the first fracture and the closing stress through the following formula I;

the formula I is as follows:

wherein v represents the Poisson's ratio, σ _c Represents the closure stress, G represents the shear modulus, a represents the length of the semi-major axis of the first fracture, x represents the coordinates of the first fracture, and Δ w represents the width of the first fracture.

In another possible implementation manner, the determining, according to the width of the first fracture, a diversion parameter of the first fracture includes:

determining a first flow rate of the acid liquid along a first direction of the first fracture and a second flow rate along a second direction of the first fracture according to the width of the first fracture, wherein the first direction is a direction in which the first fracture extends, and the second direction is perpendicular to the first direction;

determining the total flow rate of the acid liquid in the balance process according to the first flow rate and the second flow rate;

and obtaining the viscosity of the acid liquid, and determining the diversion parameter of the first fracture according to the total flow rate, the viscosity of the acid liquid, the width of the first fracture and the length of the first fracture.

In another possible implementation manner, the determining, according to the total flow rate, the viscosity of the acid solution, the width of the first fracture, and the length of the first fracture, a diversion parameter of the first fracture includes:

determining a pressure differential across the first fracture;

determining a diversion parameter of the first fracture according to the pressure difference, the total flow rate, the viscosity of the acid liquid, the width of the first fracture and the length of the first fracture by the following formula II;

the formula II is as follows:

wherein: x is the number of _f Represents the length of the first fracture, h _f Represents the width of the first fracture, Δ p represents the pressure differential, q represents the total flow rate, and u represents the viscosity of the acid fluid.

In another possible implementation manner, the determining an acid etching parameter of acid fracturing based on the diversion parameter and the length of the first fracture includes:

selecting a plurality of acid discharge volumes, selecting a second crack with a flow guide parameter larger than a preset flow guide parameter from the first cracks based on the flow guide parameter of the first crack for each acid discharge volume, and determining the lengths of the plurality of second cracks corresponding to the plurality of acid discharge volumes;

determining a difference value of lengths of second fractures corresponding to two adjacent acid displacement volumes in the plurality of acid displacement volumes, and selecting two adjacent target acid displacement volumes of which the difference value is smaller than a preset difference value from the plurality of acid displacement volumes;

and taking the value interval of the acid discharge capacity between the two adjacent target acid discharge capacities as the acid etching parameter of the acid fracturing.

In another aspect, an embodiment of the present application provides an apparatus for determining an acid etching parameter, where the apparatus includes:

a first determination module to determine a porosity distribution of a reservoir to be sour fractured, the reservoir comprising at least one of a matrix, natural fractures, and eroded cavities;

a second determination module, configured to determine, based on the porosity distribution, an acid fracturing fracture extension model of the reservoir, where the acid fracturing fracture extension model is used to represent lengths of first fractures corresponding to the reservoir at a plurality of acid displacements, and the acid displacements represent total flow of acid at a preset flow rate;

the third determining module is used for acquiring the closing stress of the reservoir, determining the width of the first fracture based on the closing stress, and determining the diversion parameter of the first fracture according to the width of the first fracture;

and the fourth determination module is used for determining an acid corrosion parameter of the acid fracturing based on the diversion parameter and the length of the first fracture, wherein the acid corrosion parameter is used for representing a value interval of acid displacement in the acid fracturing process.

In one possible implementation, the first determining module is to determine a porosity of a matrix in the reservoir to be sour fractured and to determine a density of natural fractures in the reservoir and a density of corrosion cavities in the reservoir; and superposing the porosity of the matrix, the density of the natural fracture and the density of the erosion holes to obtain the porosity distribution of the reservoir to be subjected to acid fracturing.

In another possible implementation, the second determination module is configured to determine, for any acid displacement, a matrix pressure within the reservoir and a pore pressure within the reservoir based on the porosity distribution and the acid displacement; determining the width of an acid fracturing gap in the reservoir according to the matrix pressure and the gap pressure, and determining the position of a first crack with the width larger than a preset width; and determining the length of a first fracture formed in the acid fracturing process of the reservoir in the acid displacement according to the position of the first fracture to obtain an acid fracturing fracture extension model of the reservoir.

In another possible implementation, the third determining module is configured to determine a poisson's ratio of the reservoir, a shear modulus of the reservoir, coordinates of the first fracture, and a length of a major axis of the first fracture; determining the width of the first fracture according to the Poisson's ratio of the reservoir, the shear modulus of the reservoir, the coordinates of the first fracture, the length of the semi-major axis of the first fracture and the closing stress through the following formula I;

the formula I is as follows:

In another possible implementation manner, the third determining module includes:

the first determining unit is used for determining a first flow rate of the acid liquid along a first direction of the first crack and a second flow rate along a second direction of the first crack according to the width of the first crack, wherein the first direction is a direction in which the first crack extends, and the second direction is perpendicular to the first direction;

a second determining unit, configured to determine a total flow rate of the acid solution at equilibrium according to the first flow rate and the second flow rate;

and the third determining unit is used for acquiring the viscosity of the acid liquor and determining the flow guide parameter of the first fracture according to the total flow rate, the viscosity of the acid liquor, the width of the first fracture and the length of the first fracture.

In another possible implementation manner, the third determining unit is configured to determine a pressure difference across the first fracture; determining a diversion parameter of the first fracture according to the pressure difference, the total flow rate, the viscosity of the acid liquor, the width of the first fracture and the length of the first fracture by the following formula II;

the formula II is as follows:

In another possible implementation manner, the fourth determining module is configured to select a plurality of acid discharge volumes, select, for each acid discharge volume, a second fracture with a flow guide parameter larger than a preset flow guide parameter from the first fracture based on the flow guide parameter of the first fracture, and determine lengths of a plurality of second fractures corresponding to the plurality of acid discharge volumes; determining a difference value of lengths of second fractures corresponding to two adjacent acid displacement volumes in the plurality of acid displacement volumes, and selecting two adjacent target acid displacement volumes of which the difference value is smaller than a preset difference value from the plurality of acid displacement volumes; and taking the value interval of the acid discharge capacity between the two adjacent target acid discharge capacities as the acid etching parameter of the acid fracturing.

In another aspect, an embodiment of the present application provides a computer device, where the computer device includes: a processor and a memory, the memory having stored therein at least one program code, the at least one program code being loaded by the processor and executed to implement the operations performed in the method for determining an erosion parameter as described in any of the possible implementations above.

In another aspect, an embodiment of the present application provides a computer-readable storage medium, where at least one program code is stored in the computer-readable storage medium, and the at least one program code is loaded by a processor and executed to implement the operations performed in the method for determining an acid etching parameter according to any of the foregoing possible implementation manners.

The technical scheme provided by the embodiment of the application has the beneficial effects that at least:

on one hand, the length of a first fracture formed in the acid fracturing process of a reservoir is determined through the porosity distribution of a matrix, the porosity distribution of natural fractures and the porosity distribution of corrosion cavities, and the porosity distribution of the matrix, the porosity distribution of the natural fractures and the porosity distribution of the corrosion cavities can represent the overall structure of the reservoir, so that the porosity distribution in the reservoir structure can be truly reflected, and the length of the first fracture obtained based on the porosity distribution of the reservoir better conforms to the actual condition of the reservoir; on the other hand, the first fracture is influenced by the closing stress of the reservoir after the acid fracturing is considered, the effectiveness of the length of the first fracture is verified through the diversion parameter of the first fracture, and the acid erosion parameter of the acid fracturing determined through the effective fracture length is more in line with the actual condition of the acid fracturing. Therefore, the method for determining the acid etching parameters in the embodiment of the application not only accords with the actual conditions of the reservoir, but also accords with the actual conditions of the acid fracturing process, so that the accuracy of the determined acid etching parameters is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a flowchart of a method for determining an acid etching parameter according to an embodiment of the present disclosure;

fig. 2 is a schematic illustration of a porosity distribution of a reservoir to be subjected to acid fracturing provided in accordance with an embodiment of the present application;

FIG. 3 is a schematic illustration of a preset flow rate versus wellhead pump pressure curve provided in accordance with an embodiment of the present application;

FIG. 4 is a schematic diagram of acid etching crack lengths corresponding to different types of acid solutions provided in accordance with an embodiment of the present disclosure;

fig. 5 is a schematic diagram of a value range for determining acid displacement according to an embodiment of the present application;

fig. 6 is a block diagram of an apparatus for determining an acid etching parameter according to an embodiment of the present application;

fig. 7 is a block diagram of a computer device according to an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Fig. 1 is a flowchart of a method for determining an acid etching parameter according to an embodiment of the present disclosure. Referring to fig. 1, the method includes:

101. a computer device determines a porosity distribution of a reservoir to be acid fractured.

In this step, the type of reservoir may be a carbonate reservoir. The carbonate reservoir includes at least one of a matrix, a natural fracture, and an erosion hole.

In one possible implementation, the carbonate reservoir includes a matrix, natural fractures, and erosion cavities. The porosity distribution of the reservoir is the superposition of the porosity distribution of the matrix, the porosity distribution of the natural fractures and the porosity distribution of the erosion cavities. Correspondingly, the computer equipment determines the porosity distribution of the reservoir to be subjected to acid fracturing by the following steps: the computer device determining a porosity of a matrix in the reservoir to be acid-fractured and determining a density of natural fractures in the reservoir and a density of erosion cavities in the reservoir; and superposing the porosity of the matrix, the density of the natural fractures and the density of the erosion holes to obtain the porosity distribution of the reservoir to be subjected to acid fracturing.

In one possible implementation, the computer device determines the porosity of the matrix in the reservoir by neutron porosity. Accordingly, the computer device determines the porosity of the matrix in the reservoir to be subjected to acid fracturing by: the computer equipment obtains the number of thermal neutrons in the storage layer through test equipment for testing neutron porosity; determining a size coefficient of the borehole and a test coefficient of the equipment; determining the porosity of a matrix in the reservoir through the following formula three according to the number of thermal neutrons, the size coefficient and the test coefficient;

the formula III is as follows: logN = a φ _m +b

Wherein phi is _m The porosity of the matrix in the reservoir is represented, N represents the number of thermal neutrons in the reservoir, a represents the dimensional coefficient of the wellbore, and b represents the test coefficient of the device.

In one possible implementation, the step of determining the density of natural fractures in the reservoir and the density of corrosion cavities in the reservoir is: counting natural fractures and corrosion cavities in a core corresponding to a reservoir to obtain a first number of the natural fractures and a second number of the corrosion cavities; the ratio of the first number to the length of the core is determined as a density of natural fractures in the reservoir and the ratio of the second number to the length of the core is determined as a density of erosion cavities in the reservoir.

For example, referring to fig. 2, reservoir a has a reservoir thickness of 21.8m, and a matrix porosity of 1.0% to 6.2%; the density of natural fractures in the reservoir A is 0.3/m, and the density of erosion holes in the reservoir A is 4.99/m; the computer device superposes the porosity of the matrix, the density of the natural fractures and the density of the erosion holes to obtain the porosity distribution of the reservoir to be subjected to acid fracturing as shown in fig. 2. Wherein the X axis represents the abscissa of the reservoir in meters; the Y-axis represents the ordinate of the reservoir in meters; representing the porosity distribution of the reservoir on the abscissa of-100 m to 100m and on the ordinate of-100 m to 100 m. Wherein different colors represent different porosities. Optionally, the correspondence between the gap degree and the color is: red indicates a porosity of 0.3, orange indicates a porosity of 0.2 and blue indicates a porosity of 0.1.

102. The computer device determines an acid fracturing fracture extension model of the reservoir based on the porosity distribution, wherein the acid fracturing fracture extension model is used for representing the length of a first fracture corresponding to the reservoir under a plurality of acid displacement, and the acid displacement represents the flow rate of acid liquid required by the reservoir in the acid fracturing process.

The acid displacement may be 100m ³ To 700m ³ Any value in between. The flow of the acid liquor is the product of the preset flow velocity and the acid fracturing time of the reservoir in the acid fracturing process. Wherein the preset flow rate may have a value of 3m ³ Min to 7m ³ Any value between/min, in the embodiment of the present application, the value of the acid discharge amount and the value of the preset flow rate are not particularly limited, and may be set and modified as needed.

It should be noted that the preset flow rate is related to the wellhead pumping pressure of the oil well in the reservoir and the acid absorption pressure gradient of the oil well, and when the acid absorption pressure gradient is fixed, the larger the wellhead pumping pressure is, the larger the preset flow rate is.

In one possible implementation mode, the computer equipment obtains a relation curve between the flow rate and the pumping pressure of the wellhead according to the acid absorption pressure gradient of the oil well; determining the maximum flow rate according to the maximum wellhead pumping pressure of the oil well and a relation curve between the flow rate and the wellhead pumping pressure; the maximum flow rate was taken as the preset flow rate.

For example, referring to FIG. 3, the oil well has acid absorption pressure gradients of 0.018MPa/m, 0.019MPa/m, and 0.020MPa/m, respectively; the maximum wellhead pump pressure of the oil well is 120MPa. The computer equipment obtains a relation curve between a preset flow rate and a wellhead pumping pressure according to the acid absorption pressure gradient of the oil well, and the relation curve is shown in figure 3; the computer equipment determines the maximum flow rate to be 5m according to the maximum wellhead pumping pressure of the oil well of 120MPa through a relation curve between the flow rate and the wellhead pumping pressure ³ Min; will be 5m ³ The/min is taken as the preset flow rate. Wherein, the curve 1 represents the relationship between the preset flow rate and the pumping pressure at the wellhead when the acid absorption pressure gradient of the oil well is 0.018 MPa/m; curve 2 represents the relationship between the preset flow rate and the pumping pressure at the wellhead when the acid absorption pressure gradient of the oil well is 0.019 MPa/m; curve 3 represents the relationship between the preset flow rate and the pump pressure at the wellhead when the acid absorption pressure gradient of the oil well is 0.020 MPa/m.

In one possible implementation, the effective crack can only be formed when the width of the crack is greater than a predetermined width. Correspondingly, the computer device determines an acid fracturing fracture extension model of the reservoir based on the porosity distribution by the steps of: the computer equipment determines the matrix pressure in the reservoir and the gap pressure in the reservoir according to the porosity distribution and the acid displacement for any acid displacement; determining the width of an acid fracturing gap in the storage layer according to the matrix pressure and the gap pressure, and determining the position of a first gap with the width larger than a preset width; and determining the length of the first fracture formed in the acid fracturing process of the reservoir under the acid displacement according to the position of the first fracture to obtain an acid fracturing fracture extension model of the reservoir.

The preset width may be any value between 0m and 0.1m, and in the embodiment of the present application, the value of the preset width is not specifically limited, and may be set and modified as needed. Optionally, the preset width is 0m, and the computer device determines the position of the first crack with the width greater than 0m to obtain a position coordinate of the first crack; and determining the length of the first crack according to the position coordinate of the first crack.

In one possible implementation, the computer device determines the matrix pressure within the reservoir and the pore pressure within the reservoir for any acid displacement based on the porosity distribution and the acid displacement by: the computer equipment determines the preset flow rate and the acid fracturing time of the reservoir in the acid fracturing process for any acid displacement; determining the matrix pressure in the reservoir according to the preset flow rate, the acid fracturing time and the porosity of the matrix, and determining the gap pressure in the reservoir according to the acid fracturing time and the porosity of the gap. Wherein, the porosity of the gap is the superposition of the density of the natural crack and the density of the erosion hole.

In one possible implementation, the reservoir and the acid fluid are both slightly compressible, and accordingly, the step of determining, by the computer device, the matrix pressure in the reservoir based on the preset flow rate, the acid fracturing time, and the porosity of the matrix is: the computer equipment acquires the compression coefficient of the matrix in the storage layer, the permeability of the matrix and the viscosity of the acid liquor, and determines the matrix pressure in the storage layer according to the compression coefficient of the matrix in the storage layer, the permeability of the matrix, the viscosity of the acid liquor, the preset flow rate, the acid fracturing time and the porosity of the matrix through the following formula IV;

the formula four is as follows:

wherein p is _m Indicating the pressure of the matrix, k, in the reservoir _m Denotes the permeability of the matrix, C _m Denotes the compression factor of the matrix,. Mu.denotes the viscosity of the acid solution, q _v Indicates a predetermined flow velocity, phi _m Denotes the porosity of the matrix and t denotes the acid fracturing time.

In one possible implementation manner, the step of determining, by the computer device, the gap pressure in the reservoir according to the acid fracturing time and the porosity of the gap is as follows: the computer equipment acquires the compression coefficient of the gap in the storage layer, the permeability of the gap and the viscosity of the acid liquid, and determines the pressure of the gap in the storage layer according to the compression coefficient of the gap in the storage layer, the permeability of the gap, the viscosity of the acid liquid, the acid fracturing time and the porosity of the gap through the following formula V;

the formula five is as follows:

wherein p is _f Indicating the gap pressure, k, in the reservoir _f Denotes the permeability of the gap, C _f Denotes the compression factor of the gap, mu denotes the viscosity of the acid solution,. Phi _f The porosity of the gap is shown and t represents the acid fracturing time.

In one possible implementation, the step of determining, by the computer device, a width of the acid fracturing fracture in the reservoir based on the matrix pressure and the fracture pressure is: the computer equipment determines the pressure distribution of the reservoir according to the matrix pressure and the gap pressure; determining the gradient of pressure change in the reservoir according to the pressure distribution; determining the width of an acid fracturing gap in the reservoir through the following formula VI according to the gradient of pressure change in the reservoir, the preset flow rate and the viscosity of the acid liquor;

the formula six:

wherein w represents the width of the acid fracturing gap in the reservoir, q _v Represents a preset flow rate, mu represents the viscosity of the acid solution,

a gradient representing a change in pressure within the reservoir.

It should be noted that the acid solution includes one of gelled acid, diverted acid, and regular acid. Different types of acid fluids have different viscosities and acid etching rates.

In one possible implementation, the computer device determines the optimal acid type before performing step 103. The method comprises the following steps that the computer equipment determines the type of the optimal acid liquid: determining the acid corrosion crack length of gelled acid, the acid corrosion crack length of diverted acid and the acid corrosion crack length of conventional acid by computer equipment under the condition of the same acid discharge capacity; and selecting the acid liquor with the largest acid etching crack length from the gelled acid, the diverting acid and the conventional acid as the optimal acid liquor.

In one possible implementation, the computer device determines the acid etch crack length of the gelled acid, the acid etch crack length of the diverted acid, and the acid etch crack length of the conventional acid for the same acid displacement by: for each acid liquid, the computer equipment acquires a first fracture generated in the acid fracturing process of the reservoir; determining the diversion parameters of the first cracks, and selecting the positions of second cracks with the diversion parameters larger than preset diversion parameters from the first cracks; and determining the effective length of the acid etching crack according to the position of the second crack.

For example, referring to fig. 4, the preset guide parameter is 0D · cm. Determining a corresponding relation curve A between the position coordinates of the acid-etched cracks of the gelled acid and the flow guide parameters by the computer equipment, determining the position of the acid-etched cracks with the flow guide parameters larger than 0 to be-40 m to 40m, and determining the effective length of the acid-etched cracks of the gelled acid to be 80m; and the computer equipment determines a corresponding relation curve B between the position coordinates of the acid-etched cracks of the diverting acid and the diversion parameters, determines the position of the acid-etched cracks with the diversion parameters larger than 0 to be-35 m to 35m, and determines the effective length of the acid-etched cracks of the gelled acid to be 70m. Determining a corresponding relation curve A between the position coordinates of the acid-etched cracks of the gelled acid and the flow guide parameters by the computer equipment, determining the position of the acid-etched cracks with the flow guide parameters larger than 0 to be-20 m to 20m, and determining the effective length of the acid-etched cracks of the gelled acid to be 40m; selecting the gelled acid with the largest acid etching crack length as the optimal acid liquid from the gelled acid, the diverting acid and the conventional acid.

103. The computer device obtains a closure stress of the reservoir, determines a width of the first fracture based on the closure stress, and determines a diversion parameter of the first fracture according to the width of the first fracture.

In one possible implementation, after the injection of acid into the reservoir is stopped, the fracture is subjected to a reduction in the closing stress width of the reservoir. The width of the first slit is the width after the slit is stabilized. Accordingly, the computer device determines the width of the first fracture based on the closure stress by: the computer device determines a poisson's ratio of the reservoir and a shear modulus of the reservoir; determining the width of a first fracture according to the Poisson's ratio of a reservoir, the shear modulus of the reservoir, the length of the first fracture formed in the acid fracturing process of any acid displacement of the reservoir and the closing stress by the following formula I;

the formula I is as follows:

wherein v represents the Poisson's ratio, σ _c Denotes the closure stress, G denotes the shear modulus, a denotes the length of the semi-major axis of the first fracture, x denotes the coordinates of the first fracture, and Δ w denotes the width of the first fracture.

In a possible implementation manner, the step of determining, by the computer device, the diversion parameter of the first fracture according to the width of the first fracture is: the computer device determines a first flow rate of the acid liquid along a first direction of the first fracture and a second flow rate along a second direction of the first fracture according to the width of the first fracture, wherein the first direction is a direction in which the first fracture extends, and the second direction is perpendicular to the first direction; determining the total flow rate of the acid liquid in the balancing process according to the first flow rate and the second flow rate; and determining the diversion parameter of the first fracture according to the total flow rate, the viscosity of the acid liquor, the width of the first fracture and the length of the first fracture.

In one possible implementation, the computer device divides the first fracture into a plurality of third fractures, determines the lengths and widths of the third fractures; determining a first flow rate of the acid liquid along the first direction of the first fracture according to the length of the first fracture and the length of the third fracture through a seventh formula, and determining a second flow rate of the acid liquid along the second direction of the first fracture according to the length of the first fracture and the width of the third fracture through an eighth formula;

the formula seven:

the formula eight:

wherein q is _x Denotes a first flow rate, q _y Represents the secondFlow velocity, Δ w represents the length of the first fracture, h _x Denotes the length of the third crack, h _y Represents the width of the third fracture, μ represents the viscosity of the acid, p represents the pressure within the reservoir, x represents the coordinates of the junction of the first fracture along the first direction, and y represents the coordinates of the junction of the first fracture along the second direction.

In a possible implementation, the first slit has an elliptical shape, the first direction is the direction of the major axis of the first slit, and the second direction is the direction of the minor axis of the first slit.

In a possible implementation manner, the computer device determines the diversion parameter of the fracture according to the total flow rate, the viscosity of the acid solution, the width of the first fracture and the length of the first fracture by: determining, by the computer device, a pressure differential across the first fracture; determining a diversion parameter of the first crack according to the pressure difference, the total flow rate, the viscosity of the acid liquid, the width of the first crack and the length of the first crack by the following formula II;

the formula II is as follows:

wherein: x is the number of _f Denotes the length of the first crack, h _f The width of the first fracture is indicated, Δ p the pressure difference, q the total flow rate, u the viscosity of the acid.

104. And the computer equipment determines an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first crack, wherein the acid etching parameter is used for representing a value interval of acid discharge capacity in the acid fracturing process.

In a possible implementation manner, the computer device determines the acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first fracture by: selecting a plurality of acid discharge volumes by computer equipment, selecting a second fracture with a flow guide parameter larger than a preset flow guide parameter from the first fracture based on the flow guide parameter of the first fracture for each acid discharge volume, and determining the lengths of a plurality of second fractures corresponding to the plurality of acid discharge volumes; determining the difference value of the lengths of second cracks corresponding to two adjacent acid discharge capacities in the plurality of acid discharge capacities, and selecting two adjacent target acid discharge capacities of which the difference value is smaller than a preset difference value from the plurality of acid discharge capacities; and taking the value interval of the acid discharge capacity between two adjacent target acid discharge capacities as an acid etching parameter of the acid fracturing.

Wherein, the preset difference value can be 5m ³ To 15m ³ Any value in between, e.g. 5m ³ 、8m ³ 、10m ³ (ii) a In the embodiment of the present application, the numerical value of the preset width is not specifically limited, and can be set and modified as needed.

For example, referring to FIG. 5, the predetermined difference is 8m ³ (ii) a The discharge capacity of a plurality of acids is 0m ³ 、100m ³ 、200m ³ 、300m ³ 、400m ³ 、500m ³ 、600m ³ 、700m ³ . The computer equipment selects a second crack with the diversion parameter larger than a preset diversion parameter from the first cracks based on the diversion parameter of the first cracks for each acid discharge capacity; determining lengths of a plurality of second fractures corresponding to the plurality of acid displacement volumes to be 0m, 33m, 41m, 47m, 50m, 53m, 55m, 56m; determining a relation curve a of the acid discharge capacity and the length of the second fracture, and determining a relation curve b of the acid discharge capacity and the length growth rate of the second fracture; selecting the acid displacement with the difference value less than 8m from the plurality of acid displacement according to the relation curve b ³ Two adjacent target acid discharge amounts of 300m ³ And 400m ³ The value interval of the acid discharge capacity is [300m ] ³ ，400m ³ ]As an acid etching parameter for acid fracturing.

On one hand, the length of a first fracture formed in the acid fracturing process of the reservoir is determined through the porosity distribution of the matrix, the porosity distribution of the natural fracture and the porosity distribution of the erosion holes, and the porosity distribution of the matrix, the porosity distribution of the natural fracture and the porosity distribution of the erosion holes can represent the integral structure of the reservoir, so that the porosity distribution in the reservoir structure can be truly reflected, and the length of the first fracture obtained based on the porosity distribution of the reservoir is more consistent with the actual situation of the reservoir; on the other hand, the first fracture is influenced by the closing stress of the reservoir after the acid fracturing is considered, the effectiveness of the length of the first fracture is verified through the diversion parameter of the first fracture, and the acid erosion parameter of the acid fracturing determined through the effective fracture length is more in line with the actual condition of the acid fracturing. Therefore, the method for determining the acid etching parameters in the embodiment of the application not only accords with the actual conditions of the reservoir, but also accords with the actual conditions of the acid fracturing process, so that the accuracy of the determined acid etching parameters is improved.

Fig. 6 is a block diagram of an apparatus for determining an acid etching parameter according to an embodiment of the present application. Referring to fig. 6, the apparatus includes:

a first determining module 601, configured to determine a porosity distribution of a reservoir to be subjected to acid fracturing, the reservoir including at least one of a matrix, a natural fracture, and an erosion hole;

a second determining module 602, configured to determine, based on the porosity distribution, an acid fracturing fracture extension model of the reservoir, where the acid fracturing fracture extension model is used to represent lengths of first fractures corresponding to the reservoir under multiple acid displacement quantities, and the acid displacement quantities represent total flow rates of acid solutions at preset flow rates;

the third determining module 603 is configured to obtain the closure stress of the reservoir, determine the width of the first fracture based on the closure stress, and determine the diversion parameter of the first fracture according to the width of the first fracture;

a fourth determining module 604, configured to determine an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first fracture, where the acid etching parameter is used to indicate a value interval of acid displacement in the acid fracturing process.

In one possible implementation, a first determining module 601 for determining a porosity of a matrix in a reservoir to be subjected to acid fracturing and determining a density of natural fractures in the reservoir and a density of corrosion cavities in the reservoir; and superposing the porosity of the matrix, the density of the natural fractures and the density of the erosion holes to obtain the porosity distribution of the reservoir to be subjected to acid fracturing.

In another possible implementation, the second determining module 602 is configured to determine a matrix pressure within the reservoir and a pore pressure within the reservoir for any acid displacement based on the porosity distribution and the acid displacement; determining the width of an acid fracturing gap in the storage layer according to the matrix pressure and the gap pressure, and determining the position of a first gap with the width larger than a preset width; and determining the length of the first fracture formed in the acid fracturing process of the reservoir in acid displacement according to the position of the first fracture to obtain an acid fracturing fracture extension model of the reservoir.

In another possible implementation, the third determining module 603 is configured to determine a poisson's ratio of the reservoir, a shear modulus of the reservoir, coordinates of the first fracture, and a length of a major-axis of the first fracture; determining the width of the first fracture according to the Poisson's ratio of the reservoir, the shear modulus of the reservoir, the coordinate of the first fracture, the length of the long half shaft of the first fracture and the closing stress by the following formula I;

the formula I is as follows:

wherein v represents the Poisson's ratio, σ _c Representing the closure stress, G the shear modulus, a the length of the major axis of the first fracture, x the coordinates of the first fracture, and aw the width of the first fracture.

In another possible implementation manner, the third determining module 603 includes:

the first determining unit is used for determining a first flow rate of the acid liquid along a first direction of the first fracture and a second flow rate of the acid liquid along a second direction of the first fracture according to the width of the first fracture, wherein the first direction is a direction in which the first fracture extends, and the second direction is perpendicular to the first direction;

the second determining unit is used for determining the total flow rate of the acid liquid in the balancing process according to the first flow rate and the second flow rate;

and the third determining unit is used for acquiring the viscosity of the acid liquid and determining the flow guide parameter of the first crack according to the total flow rate, the viscosity of the acid liquid, the width of the first crack and the length of the first crack.

In another possible implementation, a third determining unit is used for determining the pressure difference between two ends of the first crack; determining a diversion parameter of the first crack according to the pressure difference, the total flow rate, the viscosity of the acid liquid, the width of the first crack and the length of the first crack by the following formula II;

the formula II is as follows:

wherein: x is a radical of a fluorine atom _f Denotes the length of the first crack, h _f The width of the first fracture is indicated, Δ p the pressure difference, q the total flow rate, u the viscosity of the acid.

In another possible implementation manner, the fourth determining module 604 is configured to select a plurality of acid discharge volumes, select, for each acid discharge volume, a second fracture with a diversion parameter larger than a preset diversion parameter from the first fracture based on the diversion parameter of the first fracture, and determine lengths of a plurality of second fractures corresponding to the plurality of acid discharge volumes; determining the difference value of the lengths of second cracks corresponding to two adjacent acid discharge capacities in the plurality of acid discharge capacities, and selecting two adjacent target acid discharge capacities of which the difference value is smaller than a preset difference value from the plurality of acid discharge capacities; and taking the value interval of the acid discharge between two adjacent target acid discharge as an acid corrosion parameter of acid fracturing.

On one hand, the length of a first fracture formed in the acid fracturing process of the reservoir is determined through the porosity distribution of the matrix, the porosity distribution of the natural fracture and the porosity distribution of the erosion holes, and the porosity distribution of the matrix, the porosity distribution of the natural fracture and the porosity distribution of the erosion holes can represent the integral structure of the reservoir, so that the porosity distribution in the reservoir structure can be truly reflected, and the length of the first fracture obtained based on the porosity distribution of the reservoir is more consistent with the actual situation of the reservoir; on the other hand, the embodiment of the application also considers that the first fracture is influenced by the closing stress of the reservoir stratum after the acid fracturing, the effectiveness of the length of the first fracture is verified through the diversion parameter of the first fracture, and the acid corrosion parameter of the acid fracturing determined through the effective fracture length is more in line with the actual condition of the acid fracturing. Therefore, the device for determining the acid etching parameters in the embodiment of the application not only accords with the actual conditions of the reservoir, but also accords with the actual conditions of the acid fracturing process, so that the accuracy of the determined acid etching parameters is improved.

Fig. 7 shows a block diagram of a computer device 700 provided in an exemplary embodiment of the invention. The computer device 700 may be: a smart phone, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III, motion Picture Experts compression standard Audio Layer 3), an MP4 player (Moving Picture Experts Group Audio Layer IV, motion Picture Experts compression standard Audio Layer 4), a notebook computer, or a desktop computer. Computer device 700 may also be referred to by other names such as user device, portable computer device, laptop computer device, desktop computer device, and so forth.

Generally, the computer device 700 includes: a processor 701 and a memory 702.

The processor 701 may include one or more processing cores, such as a 4-core processor, an 8-core processor, and so on. The processor 701 may be implemented in at least one hardware form of a DSP (Digital Signal Processing), an FPGA (Field-Programmable Gate Array), and a PLA (Programmable Logic Array). The processor 701 may also include a main processor and a coprocessor, where the main processor is a processor for Processing data in an awake state, and is also called a Central Processing Unit (CPU); a coprocessor is a low power processor for processing data in a standby state. In some embodiments, the processor 701 may be integrated with a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content required to be displayed on the display screen. In some embodiments, the processor 701 may further include an AI (Artificial Intelligence) processor for processing computing operations related to machine learning.

Memory 702 may include one or more computer-readable storage media, which may be non-transitory. Memory 702 may also include high-speed random access memory, as well as non-volatile memory, such as one or more magnetic disk storage devices, flash memory storage devices. In some embodiments, a non-transitory computer readable storage medium in memory 702 is used to store at least one instruction for execution by processor 701 to implement the method of determining an erosion parameter provided by method embodiments herein.

In some embodiments, the computer device 700 may also optionally include: a peripheral interface 703 and at least one peripheral. The processor 701, the memory 702, and the peripheral interface 703 may be connected by buses or signal lines. Various peripheral devices may be connected to the peripheral interface 703 via a bus, signal line, or circuit board. Specifically, the peripheral device includes: at least one of a radio frequency circuit 704, a display screen 705, a camera 706, an audio circuit 707, a positioning component 708, and a power source 709.

The peripheral interface 703 may be used to connect at least one peripheral related to I/O (Input/Output) to the processor 701 and the memory 702. In some embodiments, processor 701, memory 702, and peripheral interface 703 are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor 701, the memory 702, and the peripheral interface 703 may be implemented on separate chips or circuit boards, which is not limited by the present embodiment.

The Radio Frequency circuit 704 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The radio frequency circuitry 704 communicates with communication networks and other communication devices via electromagnetic signals. The rf circuit 704 converts an electrical signal into an electromagnetic signal to transmit, or converts a received electromagnetic signal into an electrical signal. Optionally, the radio frequency circuit 704 comprises: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a subscriber identity module card, and so forth. The radio frequency circuitry 704 may communicate with other computer devices via at least one wireless communication protocol. The wireless communication protocols include, but are not limited to: metropolitan area networks, various generation mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and/or WiFi (Wireless Fidelity) networks. In some embodiments, the radio frequency circuit 704 may also include NFC (Near Field Communication) related circuits, which are not limited in this application.

The display screen 705 is used to display a UI (User Interface). The UI may include graphics, text, icons, video, and any combination thereof. When the display screen 705 is a touch display screen, the display screen 705 also has the ability to capture touch signals on or over the surface of the display screen 705. The touch signal may be input to the processor 701 as a control signal for processing. At this point, the display 705 may also be used to provide virtual buttons and/or a virtual keyboard, also referred to as soft buttons and/or a soft keyboard. In some embodiments, the display screen 705 may be one, providing the front panel of the computer device 700; in other embodiments, the display 705 can be at least two, respectively disposed on different surfaces of the computer device 700 or in a folded design; in still other embodiments, the display 705 may be a flexible display disposed on a curved surface or on a folded surface of the computer device 700. Even more, the display 705 may be arranged in a non-rectangular irregular pattern, i.e. a shaped screen. The Display 705 may be made of LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), or the like.

The camera assembly 706 is used to capture images or video. Optionally, camera assembly 706 includes a front camera and a rear camera. Generally, a front camera is disposed on a front panel of a computer apparatus, and a rear camera is disposed on a rear surface of the computer apparatus. In some embodiments, the number of the rear cameras is at least two, and each rear camera is any one of a main camera, a depth-of-field camera, a wide-angle camera and a telephoto camera, so that the main camera and the depth-of-field camera are fused to realize a background blurring function, the main camera and the wide-angle camera are fused to realize panoramic shooting and a VR (Virtual Reality) shooting function or other fusion shooting functions. In some embodiments, camera assembly 706 may also include a flash. The flash lamp can be a single-color temperature flash lamp or a double-color temperature flash lamp. The double-color-temperature flash lamp is a combination of a warm-light flash lamp and a cold-light flash lamp, and can be used for light compensation at different color temperatures.

The audio circuitry 707 may include a microphone and a speaker. The microphone is used for collecting sound waves of a user and the environment, converting the sound waves into electric signals, and inputting the electric signals to the processor 701 for processing or inputting the electric signals to the radio frequency circuit 704 to realize voice communication. The microphones may be provided in plural numbers, respectively, at different portions of the computer apparatus 700 for the purpose of stereo sound acquisition or noise reduction. The microphone may also be an array microphone or an omni-directional pick-up microphone. The speaker is used to convert electrical signals from the processor 701 or the radio frequency circuit 704 into sound waves. The loudspeaker can be a traditional film loudspeaker and can also be a piezoelectric ceramic loudspeaker. When the speaker is a piezoelectric ceramic speaker, the speaker can be used for purposes such as converting an electric signal into a sound wave audible to a human being, or converting an electric signal into a sound wave inaudible to a human being to measure a distance. In some embodiments, the audio circuitry 707 may also include a headphone jack.

The Location component 708 is used to locate the current geographic Location of the computer device 700 for navigation or LBS (Location Based Service). The Positioning component 708 can be a Positioning component based on the Global Positioning System (GPS) in the united states, the beidou System in china, the grignard System in russia, or the galileo System in the european union.

The power supply 709 is used to supply power to the various components of the computer device 700. The power source 709 may be alternating current, direct current, disposable batteries, or rechargeable batteries. When power source 709 includes a rechargeable battery, the rechargeable battery may support wired or wireless charging. The rechargeable battery may also be used to support fast charge technology.

In some embodiments, the computer device 700 also includes one or more sensors 710. The one or more sensors 710 include, but are not limited to: acceleration sensor 711, gyro sensor 712, pressure sensor 713, fingerprint sensor 714, optical sensor 715, and proximity sensor 716.

The acceleration sensor 711 can detect the magnitude of acceleration in three coordinate axes of a coordinate system established with the computer apparatus 700. For example, the acceleration sensor 711 may be used to detect components of the gravitational acceleration in three coordinate axes. The processor 701 may control the display screen 705 to display the user interface in a landscape view or a portrait view according to the gravitational acceleration signal collected by the acceleration sensor 711. The acceleration sensor 711 may also be used for acquisition of motion data of a game or a user.

The gyro sensor 712 may detect a body direction and a rotation angle of the computer device 700, and the gyro sensor 712 may cooperate with the acceleration sensor 711 to acquire a 3D motion of the user with respect to the computer device 700. From the data collected by the gyro sensor 712, the processor 701 may implement the following functions: motion sensing (such as changing the UI according to a user's tilting operation), image stabilization while shooting, game control, and inertial navigation.

Pressure sensors 713 may be disposed on a side bezel of computer device 700 and/or underneath display screen 705. When the pressure sensor 713 is disposed on a side frame of the computer device 700, a user's holding signal to the computer device 700 may be detected, and the processor 701 performs left-right hand recognition or shortcut operation according to the holding signal collected by the pressure sensor 713. When the pressure sensor 713 is disposed at the lower layer of the display screen 705, the processor 701 controls the operability control on the UI interface according to the pressure operation of the user on the display screen 705. The operability control comprises at least one of a button control, a scroll bar control, an icon control and a menu control.

The fingerprint sensor 714 is used for collecting a fingerprint of the user, and the processor 701 identifies the identity of the user according to the fingerprint collected by the fingerprint sensor 714, or the fingerprint sensor 714 identifies the identity of the user according to the collected fingerprint. When the user identity is identified as a trusted identity, the processor 701 authorizes the user to perform relevant sensitive operations, including unlocking a screen, viewing encrypted information, downloading software, paying, changing settings, and the like. The fingerprint sensor 714 may be disposed on the front, back, or side of the computer device 700. When a physical key or vendor Logo is provided on the computer device 700, the fingerprint sensor 714 may be integrated with the physical key or vendor Logo.

The optical sensor 715 is used to collect the ambient light intensity. In one embodiment, the processor 701 may control the display brightness of the display screen 705 based on the ambient light intensity collected by the optical sensor 715. Specifically, when the ambient light intensity is high, the display brightness of the display screen 705 is increased; when the ambient light intensity is low, the display brightness of the display screen 705 is adjusted down. In another embodiment, the processor 701 may also dynamically adjust the shooting parameters of the camera assembly 706 according to the ambient light intensity collected by the optical sensor 715.

A proximity sensor 716, also known as a distance sensor, is typically disposed on a front panel of the computer device 700. The proximity sensor 716 is used to capture the distance between the user and the front of the computer device 700. In one embodiment, the processor 701 controls the display screen 705 to switch from the bright screen state to the dark screen state when the proximity sensor 716 detects that the distance between the user and the front surface of the computer device 700 is gradually decreased; when the proximity sensor 716 detects that the distance between the user and the front of the computer device 700 is gradually increasing, the display screen 705 is controlled by the processor 701 to switch from a breath-screen state to a bright-screen state.

Those skilled in the art will appreciate that the architecture illustrated in FIG. 7 is not intended to be limiting of the computer device 700, and may include more or fewer components than those illustrated, or some components may be combined, or a different arrangement of components may be used.

The present embodiments also provide a computer-readable storage medium, where at least one program code is stored, and the at least one program code is loaded by a processor and executed to implement the operations performed by the method for determining an acid etching parameter in any one of the above-mentioned possible implementation manners.

The above description is intended only to illustrate the alternative embodiments of the present application, and should not be construed as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for determining an acid etching parameter, the method comprising:

determining a porosity distribution of a reservoir to be subjected to acid fracturing, the reservoir comprising at least one of a matrix, a natural fracture, and an erosion hole;

determining an acid fracturing fracture extension model of the reservoir based on the porosity distribution, wherein the acid fracturing fracture extension model is used for representing the length of a first fracture formed in the reservoir during acid fracturing at any acid displacement, and the acid displacement represents the flow rate of acid liquor required by the reservoir during acid fracturing;

determining an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first fracture, wherein the acid etching parameter is used for representing a value interval of acid discharge capacity in the acid fracturing process,

wherein said determining a width of the first fracture based on the closure stress comprises:

determining a poisson's ratio of the reservoir, a shear modulus of the reservoir, coordinates of the first fracture, and a length of a major-half axis of the first fracture;

the formula I is as follows:

wherein v represents the Poisson's ratio, σ _c Representing the closure stress, G the shear modulus, a the length of the semi-major axis of the first fracture, x the coordinates of the first fracture, Δ w the width of the first fracture;

wherein the determining the diversion parameter of the first fracture according to the width of the first fracture comprises:

determining a total flow rate of the acid solution at equilibrium according to the first flow rate and the second flow rate;

obtaining the viscosity of the acid liquor;

determining a pressure differential across the first fracture;

determining a diversion parameter of the first fracture according to the pressure difference, the total flow rate, the viscosity of the acid liquor, the width of the first fracture and the length of the first fracture by the following formula II;

the formula II is as follows:

wherein: x is a radical of a fluorine atom _f Represents the length of the first fracture, h _f Represents the width of the first fracture, Δ p represents the pressure differential, q represents the total flow rate, and u represents the viscosity of the acid fluid.

2. The method of determining according to claim 1, wherein determining the porosity distribution of the reservoir to be sour fractured comprises:

determining a porosity of a matrix in the reservoir to be sour fractured and determining a density of natural fractures in the reservoir and a density of eroded vugs in the reservoir;

3. The method of determining according to claim 1, wherein said determining an acid fracturing fracture propagation model of the reservoir based on the porosity distribution comprises:

4. The method of determining according to claim 1, wherein determining an acid erosion parameter for an acid fracturing based on the diversion parameter and the length of the first fracture comprises:

selecting a plurality of acid discharge volumes, selecting a second fracture with a flow guide parameter larger than a preset flow guide parameter from the first fracture based on the flow guide parameter of the first fracture for each acid discharge volume, and determining the lengths of the plurality of second fractures corresponding to the plurality of acid discharge volumes;

5. An apparatus for determining an acid etching parameter, the apparatus comprising:

a first determination module to determine a porosity distribution of a reservoir to be sour fractured, the reservoir comprising at least one of a matrix, a natural fracture, and an erosion hole;

a fourth determination module, configured to determine an acid etching parameter of the acid fracturing based on the diversion parameter and the length of the first fracture, where the acid etching parameter is used to indicate a value interval of acid displacement in the acid fracturing process,

the formula I is as follows:

obtaining the viscosity of the acid liquor;

determining a pressure differential across the first fracture;

the formula II is as follows:

wherein: x is a radical of a fluorine atom _f Represents the length of the first fracture, h _f Represents the width of the first fracture, Δ p represents the pressure difference, q represents the total flow rate, and u represents the viscosity of the acid liquid.

6. A computer device, characterized in that the computer device comprises:

a processor and a memory, the memory having stored therein at least one program code, the at least one program code being loaded and executed by the processor to carry out operations carried out in the method of determining an acid etching parameter of any of claims 1 to 4.

7. A computer-readable storage medium having stored therein at least one program code, the at least one program code being loaded into and executed by a processor to perform operations performed in the method for determining an acid etching parameter according to any one of claims 1 to 4.