CN112928579B - Efficient chip replacement plugging device for semiconductor test - Google Patents
Efficient chip replacement plugging device for semiconductor test Download PDFInfo
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- CN112928579B CN112928579B CN202110204669.2A CN202110204669A CN112928579B CN 112928579 B CN112928579 B CN 112928579B CN 202110204669 A CN202110204669 A CN 202110204669A CN 112928579 B CN112928579 B CN 112928579B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of testing of semiconductor chips, in particular to a high-efficiency chip replacement plugging device for semiconductor testing, which comprises a plugging mechanism, a first servo motor, a second motor and a blower, wherein a first transmission bin is arranged at the top end of the inside of a first shell, three groups of buffer mechanisms are arranged in a pushing block, a dust blowing mechanism is arranged in a clamping block, the dust blowing mechanism comprises an air cavity, and a second storage bin is arranged at the left end of the clamping block. The device can greatly reduce the time for the user to plug in the semiconductor chip main body, greatly improve the working efficiency of the user, has strong practicability, avoids the situation that the contact between the slot and the semiconductor chip main body is influenced by dust in the slot, further causes short circuit, improves the safety of the user during testing, and reduces the loss of the user.
Description
Technical Field
The invention relates to the technical field of testing of semiconductor chips, in particular to a high-efficiency replacement plug-in device for a chip for semiconductor testing.
Background
A semiconductor chip is a semiconductor device which is manufactured by etching and wiring a semiconductor sheet and which can realize a certain function. To meet the demand of mass production, the electrical properties of semiconductors must be predictable and stable, and therefore, the purity of dopants and the quality of semiconductor lattice structures must be critical, and common quality problems include dislocation, twinning or stacking faults of the lattice, which affect the properties of semiconductor materials.
When the semiconductor chip is tested, a user can plug the semiconductor chip on tested equipment, the plug of the existing part of semiconductor chips on the market is not very convenient, the working time of the user is wasted when the user plugs, and the production efficiency of the user is further affected.
Disclosure of Invention
The invention aims to provide a high-efficiency replacement plugging device for a chip for semiconductor test, which solves the problems that the plugging of the existing part of semiconductor chips on the market is not very convenient, and the working time of a user is wasted when the user is plugged, so that the production efficiency of the user is affected.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a high-efficient grafting device that changes of chip for semiconductor test, includes grafting mechanism, first servo motor, second motor and air-blower, grafting mechanism includes first shell, first transmission storehouse has been seted up on the inside top of first shell, first servo motor is installed to the right-hand member of first shell, and first servo motor's output passes the inside that first shell extended to first transmission storehouse, the second transmission storehouse has been seted up to the bottom of first shell, and the top and the bottom of first transmission storehouse of second transmission storehouse are linked together, first gear has been cup jointed to first servo motor's output, the inside of first transmission storehouse is connected with the second gear through embedded bearing, and second gear and first gear intermesh, the bottom of second transmission storehouse has been inserted and has been set up the internal thread bull stick, the top of internal thread bull stick has been inserted and has been set up the external thread bull stick, and the top of external thread bull stick extends to the inside of first transmission storehouse, the top fixedly connected with third gear, and the top and the first inner wall of first transmission storehouse of third gear have been seted up through embedded bearing, the left side end and the second inner wall of first transmission storehouse have been seted up, the left end and right side end and the second clamping piece have been seted up, the inside the second clamping piece has been seted up, the inside the connecting rod has been seted up, the left end of the rotary connecting rod is connected with the inner wall of the rotary bin through an embedded bearing, two groups of thread sleeves are sleeved on the surface of the rotary connecting rod, two groups of movable grooves are formed in the inner wall of the bottom end of the rotary bin, the bottom ends of the movable grooves are communicated with the chip clamping grooves, the bottom ends of the thread sleeves are fixedly connected with movable connecting plates, the bottom ends of the movable connecting plates are fixedly connected with pushing blocks, a semiconductor chip main body is arranged between the two groups of pushing blocks, the semiconductor chip main body is positioned in the chip clamping grooves, a test clamping plate is arranged at the bottom end of the clamping block, a slot is formed in the top end of the test clamping plate, three groups of buffer mechanisms are arranged in the pushing blocks, a dust blowing mechanism is arranged in the clamping block, the dust blowing mechanism comprises an air cavity, a second storage bin is arranged at the left end of the clamping block, an air blower is arranged in the second storage bin, a first connecting pipe is communicated with the right end of the air blower, the right end of the first connecting pipe is communicated with the air cavity, the left end and the right end of the air cavity are both communicated with the second connecting pipe, two groups of flow distribution bins are arranged at the bottom end of the inner part of the clamping block, one ends, far away from each other, of the second connecting pipes are both communicated with a third connecting pipe, the bottom ends of the third connecting pipes are both communicated with the flow distribution bins, seven groups of air holes are formed in the bottom ends of the flow distribution bins in a penetrating mode, the buffer mechanism comprises elastic grooves, connecting plates are inserted into one ends, close to each other, of the connecting plates are fixedly connected with pushing plates.
Preferably, the surface of the rotating connecting rod is provided with external threads, and the directions of the external threads are opposite.
Preferably, two groups of second sliding grooves are formed in the inner wall of the top end of the rotary bin, and the top ends of the threaded sleeves are fixedly connected with second sliding blocks.
Preferably, the connecting plates are fixedly connected with springs at the ends far away from each other, and the ends far away from each other of the springs are fixedly connected with the inner wall of the spring groove.
Preferably, the upper end and the lower end of the connecting plate are fixedly connected with third sliding blocks, and the inner walls of the upper end and the lower end of the spring groove are provided with third sliding grooves.
Preferably, rubber pads are glued to one ends of the pushing plates, which are close to each other, and one ends of the rubber pads, which are close to each other, are attached to the surface of the semiconductor chip main body.
Preferably, the front side and the rear side of the bottom end of the chip card slot are inclined planes, and the included angle between the inclined planes and the horizontal plane is thirty degrees.
Preferably, the longitudinal sections of the air holes are all inclined, and the bottom ends of the air holes are all directed to the slots.
Compared with the prior art, the invention has the beneficial effects that: the device can greatly reduce the time for a user to plug in the semiconductor chip main body, greatly improve the working efficiency of the user, has strong practicability, avoids the situation of short circuit caused by the influence of dust in the slot on the contact of the slot and the semiconductor chip main body, improves the safety of the user during testing, and reduces the loss of the user;
1. through being provided with grafting mechanism, when the user is using this device, after the user put into the inside of chip draw-in groove with the semiconductor chip main part, start the second motor and can fix the semiconductor chip main part in the inside of chip draw-in groove through rotating connecting rod, thread bush and ejector pad, then start first servo motor, can drive clamping piece through internal thread bull stick, external screw thread bull stick and connecting rod and remove, the clamping piece that removes can insert the semiconductor chip main part in the inside of slot, the user alright carry out the performance test with the semiconductor chip main part, avoid the user to waste a large amount of operating time when installing the semiconductor chip main part, the time of the semiconductor chip main part of reduction user that this device can be great has improved user's work efficiency greatly, have very strong practicality;
2. through being provided with dust blowing mechanism, when the user is when using this device, after the user finishes the semiconductor chip main part installation, when moving clamping piece downwardly, the air-blower can blow to the inside in air cavity, blow away the inside dust of slot through the gas pocket to the slot at last, avoid influencing the contact of slot and semiconductor chip main part because of the inside dust of slot, and then lead to the condition of short circuit to appear, the security when having improved the user test, the loss of user has been reduced, user test's accuracy has been improved, user's experience is felt has been strengthened.
Drawings
FIG. 1 is a schematic elevational view of the structure of the present invention;
FIG. 2 is a schematic elevational cross-sectional view of the structure of the present invention;
FIG. 3 is an enlarged schematic view of a portion of the structure of FIG. 2A in accordance with the present invention;
FIG. 4 is an enlarged schematic view of a portion of the structure of FIG. 3B in accordance with the present invention;
FIG. 5 is a schematic side cross-sectional view of the structure of the present invention incorporating the clamp block and air cavity;
FIG. 6 is a schematic side cross-sectional view of the structure of the diversion chamber, the third connecting pipe and the air hole in the invention;
FIG. 7 is a schematic side cross-sectional view of the structure of the threaded sleeve and the moving web of the present invention;
FIG. 8 is a schematic top view of a push block and spring slot structure of the present invention;
fig. 9 is a schematic side view of the structure of the present invention.
In the figure: 100. a plug-in mechanism; 110. a first housing; 111. a first drive bin; 112. a first servo motor; 113. a second transmission bin; 114. a first gear; 115. a second gear; 116. an internally threaded rotating rod; 117. an external thread rotating rod; 118. a third gear; 119. a first chute; 120. a first slider; 121. a connecting rod; 122. clamping blocks are arranged; 123. a chip card slot; 124. a first storage bin; 125. rotating the bin; 126. a second motor; 127. rotating the connecting rod; 128. a thread sleeve; 129. a second chute; 130. a second slider; 131. a moving groove; 132. moving the connecting plate; 133. a pushing block; 134. a semiconductor chip body; 135. a test card; 136. a slot; 140. a spring groove; 141. a connecting plate; 142. a spring; 143. a push plate; 144. a third chute; 145. a third slider; 200. a dust blowing mechanism; 210. an air cavity; 211. a second storage bin; 212. a blower; 213. a first connection pipe; 214. a second connection pipe; 215. a diversion bin; 216. a third connection pipe; 217. and (5) air holes.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, an embodiment of the present invention is provided:
the high-efficiency chip replacement plugging device for semiconductor test comprises a plugging mechanism 100, a first servo motor 112, a second motor 126 and a blower 212, wherein the plugging mechanism 100 comprises a first shell 110, a first transmission bin 111 is arranged at the top end of the inside of the first shell 110, the right end of the first shell 110 is provided with the first servo motor 112, the output end of the first servo motor 112 penetrates through the first shell 110 to extend to the inside of the first transmission bin 111, the bottom end of the first shell 110 is provided with a second transmission bin 113, the top end of the second transmission bin 113 is communicated with the bottom end of the first transmission bin 111, the output end of the first servo motor 112 is sleeved with a first gear 114, the inside of the first transmission bin 111 is connected with a second gear 115 through an embedded bearing, the second gear 115 is meshed with the first gear 114, the bottom end of the second transmission bin 113 is provided with an internal thread rotating rod 116 in an inserted manner, an external thread rotating rod 117 is inserted at the top end of the internal thread rotating rod 116, the top end of the external thread rotating rod 117 extends to the inside of the first transmission bin 111, a third gear 118 is fixedly connected at the top end of the external thread rotating rod 117, the top end of the third gear 118 is connected with the inner wall of the top end of the first transmission bin 111 through an embedded bearing, the third gear 118 is meshed with the second gear 115, first sliding grooves 119 are formed in the inner walls of the left end and the right end of the second transmission bin 113, a first sliding block 120 is fixedly connected at the left end and the right end of the internal thread rotating rod 116, a connecting rod 121 is fixedly connected at the bottom end of the internal thread rotating rod 116, a clamping block 122 is fixedly connected at the bottom end of the connecting rod 121, a chip clamping groove 123 is formed at the bottom end of the clamping block 122, a first storage bin 124 is formed at the right end of the clamping block 122, a rotating bin 125 is formed in the inner wall of the left end of the first storage bin 124, a second motor 126 is mounted inside the first storage bin 124, the output end of the second motor 126 is fixedly connected with a rotary connecting rod 127, the left end of the rotary connecting rod 127 is connected with the inner wall of a rotary bin 125 through an embedded bearing, the surface of the rotary connecting rod 127 is sleeved with two groups of thread sleeves 128, the inner wall of the bottom end of the rotary bin 125 is provided with two groups of movable grooves 131, the bottom ends of the movable grooves 131 are communicated with a chip clamping groove 123, the bottom ends of the thread sleeves 128 are fixedly connected with a movable connecting plate 132, the bottom ends of the movable connecting plate 132 are fixedly connected with pushing blocks 133, a semiconductor chip main body 134 is arranged between the two groups of pushing blocks 133, the semiconductor chip main body 134 is positioned in the chip clamping groove 123, the bottom end of the clamping block 122 is provided with a test clamping plate 135, the top end of the test clamping plate 135 is provided with a slot 136, three groups of buffer mechanisms are arranged in the pushing block 133, a dust blowing mechanism 200 is arranged in the clamping block 122, the dust blowing mechanism 200 comprises an air cavity 210, a second storage bin 211 is arranged at the left end of the clamping block 122, a blower 212 is arranged in the second storage bin 211, the right end of the blower 212 is communicated with a first connecting pipe 213, the right end of the first connecting pipe 213 is communicated with the air cavity 210, the left end and the right end of the air cavity 210 are communicated with a second connecting pipe 214, two groups of distribution bins 215 are arranged at the bottom end of the inner part of the clamping block 122, one ends, far away from each other, of the second connecting pipes 214 are communicated with a third connecting pipe 216, the bottom ends of the third connecting pipes 216 are communicated with the distribution bins 215, and seven groups of air holes 217 are formed through the bottom ends of the distribution bins 215;
further, the surface of the rotating connecting rod 127 is provided with external threads, and the directions of the external threads are opposite, the output end of the second motor 126 drives the rotating connecting rod 127 to rotate, and as the surface of the rotating connecting rod 127 is provided with external threads with opposite directions, the threaded sleeve 128 can move towards one end close to each other or move towards one end far away from each other at the same time;
further, two sets of second sliding grooves 129 are formed in the inner wall of the top end of the rotating bin 125, and the top ends of the threaded sleeves 128 are fixedly connected with second sliding blocks 130, so that the moving direction of the threaded sleeves 128 can be ensured, and the threaded sleeves 128 are prevented from rotating;
further, the buffer mechanism includes a spring slot 140, and connecting plates 141 are inserted at the ends of the spring slot 140 close to each other, and pushing plates 143 are fixedly connected to the ends of the connecting plates 141 close to each other, so that the pushing blocks 133 are prevented from directly extruding the semiconductor chip main body 134, and damage to the semiconductor chip main body 134 is avoided.
Further, the ends of the connecting plates 141 far away from each other are fixedly connected with springs 142, and the ends of the springs 142 far away from each other are fixedly connected with the inner wall of the spring groove 140, the moving pushing block 133 can compress the springs 142, when the moving pushing block 133 moves towards the ends far away from each other, the pushing plate 143 gradually reduces the extrusion force of the semiconductor chip main body 134 under the action of the resilience force of the springs 142;
further, the upper and lower ends of the connecting plate 141 are fixedly connected with the third sliding blocks 145, and the inner walls of the upper and lower ends of the spring groove 140 are provided with the third sliding grooves 144, so that the connecting plate 141 moved by a user is prevented from shaking or shifting, and the stable movement of the connecting plate 141 is ensured;
further, rubber pads are glued to the ends of the pushing plates 143, and the ends of the rubber pads, which are close to each other, are attached to the surface of the semiconductor chip main body 134, so that the ends of the pushing plates 143, which are close to each other, are prevented from directly contacting the semiconductor chip main body 134, and the surface of the semiconductor chip main body 134 is prevented from being damaged by the pushing plates 143;
further, both front and rear sides of the bottom end of the chip card slot 123 are inclined planes, and the inclined planes form an included angle of thirty degrees with the horizontal plane, so that a user can conveniently put the semiconductor chip body 134 into the chip card slot 123;
further, the longitudinal sections of the air holes 217 are inclined, and the bottom ends of the air holes 217 are directed to the slots 136, so that the air in the air holes 217 can be blown to the inside of the slots 136.
Working principle: firstly, a user firstly connects the control ends of a first servo motor 112, a second motor 126 and a blower 212 of an electrical appliance with the main control end of the device, then an external power supply is connected, when the user wants to use the device for plugging test, the user puts a semiconductor chip main body 134 into the chip clamping groove 123, then the user starts the second motor 126, the output end of the second motor 126 rotates, the output end of the second motor 126 drives a rotating connecting rod 127 to rotate, as the surface of the rotating connecting rod 127 is provided with external threads with opposite directions, a threaded sleeve 128 can enable the threaded sleeve 128 to move towards one end which is close to each other, the moving threaded sleeve 128 drives a second sliding block 130 to slide in the second sliding groove 129, meanwhile, the moving threaded sleeve 128 can drive a moving connecting plate 132 to move in a moving groove 131, the moving connecting plate 132 drives a pushing block 133 to move in the chip clamping groove 123, when one end of the pushing plate 143 close to each other is mutually attached to the semiconductor chip main body 134, and further enables the connecting plate 141 to not to move in the same way, and simultaneously the moving connecting rod 128 can enable the moving connecting plate 133 to move in the sliding block to move in the second sliding groove 129, and the third sliding block 133 to be slowly compressed, so that the sliding block 133 can be moved by the sliding sleeve 133 can be closed, and the moving connecting rod 133 can be moved in the sliding groove 133;
then, the user starts the first servo motor 112 and the blower 212 at the same time, the output end of the first servo motor 112 rotates, so that the first gear 114 is driven to rotate, the rotating first gear 114 drives the second gear 115 to rotate, the rotating second gear 115 drives the third gear 118 to rotate, the rotating third gear 118 drives the external thread rotating rod 117 to rotate, the rotating external thread rotating rod 117 rotates in the internal thread rotating rod 116, the internal thread rotating rod 116 can extend downwards, the downward moving internal thread rotating rod 116 drives the first sliding block 120 to move in the first sliding groove 119, the internal thread rotating rod 116 cannot rotate along with the external thread rotating rod 117 due to the fact that the first sliding block 120 collides with the first sliding groove 119, the internal thread rotating rod 116 can only move up and down, the moving internal thread rotating rod 116 drives the connecting rod 121 to move downwards, and the moving connecting rod 121 drives the clamping block 122 to move downwards;
then, wind force is generated at the right end of the blower 212 to blow air to the inside of the air cavity 210, the air in the air cavity 210 respectively enters the inside of the second connecting pipe 214, the air in the second connecting pipe 214 enters the inside of the third connecting pipe 216, the air in the third connecting pipe 216 enters the inside of the split cabin 215 through the two ends of the third connecting pipe 216, and finally the air in the split cabin 215 is blown to the inside of the slot 136 through seven groups of air holes 217, a large amount of air is continuously blown to the inside of the second motor 126 to blow away dust in the slot 136, static electricity generated by dust or powder in the inserting process is avoided, and the cleanliness in the inserting environment is improved;
finally, after the semiconductor chip main body 134 is inserted into the slot 136, the output end of the semiconductor chip main body 134 can be reversely rotated by a user through the second motor 126, the reversely rotated rotating connecting rod 127 can enable the threaded sleeve 128 to move towards one end far away from each other, the moving threaded sleeve 128 drives the second sliding block 130 to slide in the second sliding groove 129, meanwhile, the moving threaded sleeve 128 can drive the moving connecting plate 132 to move in the moving groove 131, the moving connecting plate 132 drives the pushing block 133 to move in the chip card slot 123, the moving pushing block 133 moves towards one end far away from each other, the pushing plate 143 gradually reduces the extrusion force of the semiconductor chip main body 134 under the action of the resilience of the spring 142, when the spring 142 is restored to the original state, the pushing block 133 can drive the pushing plate 143 to move, and at the moment, the semiconductor chip main body 134 is inserted completely, the user can perform performance test on the semiconductor chip main body 134, thereby realizing rapid insertion test on the semiconductor chip main body 134, the automation degree and accuracy of the semiconductor chip main body 134 test are improved, the uncertainty of manual operation is reduced, and the test efficiency is improved. After the user has finished testing, the user can remove the semiconductor chip body 134 in reverse of the above operations.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a high-efficient grafting device that changes of chip for semiconductor test, includes grafting mechanism (100), first servo motor (112), second motor (126) and air-blower (212), its characterized in that: the plug-in mechanism (100) comprises a first shell (110), a first transmission bin (111) is arranged at the top end of the inside of the first shell (110), a first servo motor (112) is arranged at the right end of the first shell (110), the output end of the first servo motor (112) penetrates through the first shell (110) and extends to the inside of the first transmission bin (111), a second transmission bin (113) is arranged at the bottom end of the first shell (110), the top end of the second transmission bin (113) is communicated with the bottom end of the first transmission bin (111), a first gear (114) is sleeved at the output end of the first servo motor (112), a second gear (115) is connected to the inside of the first transmission bin (111) through an embedded bearing, the second gear (115) is meshed with the first gear (114), an internal thread rotary rod (116) is inserted at the bottom end of the second transmission bin (113), an external thread rotary rod (117) is inserted at the top end of the first shell (117), the top end of the first transmission bin (111) is connected to the top end of a third gear (118) through a third embedded bearing, the third gear (118) is meshed with the top end of the third gear (111), the inner walls of the left end and the right end of the second transmission bin (113) are provided with first sliding grooves (119), the left end and the right end of the inner thread rotating rod (116) are fixedly connected with first sliding blocks (120), the bottom end of the inner thread rotating rod (116) is fixedly connected with connecting rods (121), the bottom end of each connecting rod (121) is fixedly connected with clamping blocks (122), the bottom ends of the clamping blocks (122) are provided with chip clamping grooves (123), the right end of each clamping block (122) is provided with first storage bins (124), the inner wall of the left end of each first storage bin (124) is provided with a rotating bin (125), the inner part of each first storage bin (124) is provided with a second motor (126), the output end of each second motor (126) is fixedly connected with a rotating connecting rod (127), the left end of each rotating connecting rod (127) is connected with the inner wall of each rotating bin (125) through a embedded bearing, the surfaces of the rotating connecting rods (127) are sleeved with two groups of threaded sleeves (128), the inner walls of the bottom ends of the rotating bins (125) are provided with two groups of moving grooves (125), the bottom ends of the moving blocks (131) are connected with the moving connecting plates (132), the semiconductor chip main body (134) is arranged between the two groups of pushing blocks (133), the semiconductor chip main body (134) is positioned in the chip clamping groove (123), the bottom end of the clamping block (122) is provided with the test clamping plate (135), the top end of the test clamping plate (135) is provided with the slot (136), the inside of the pushing block (133) is provided with three groups of buffer mechanisms, the inside of the clamping block (122) is provided with the dust blowing mechanism (200), the dust blowing mechanism (200) comprises the air cavity (210), the left end of the clamping block (122) is provided with the second storage bin (211), the inside of the second storage bin (211) is provided with the air blower (212), the right end of the air blower (212) is communicated with the first connecting pipe (213), the right end of the first connecting pipe (213) is communicated with the air cavity (210), the left end and the right end of the air cavity (210) are both communicated with the second connecting pipe (214), the bottom end of the inside of the clamping block (122) is provided with two groups of flow dividing bins (215), the second connecting pipe (214) is communicated with the third connecting pipe (216), the bottom end of the third connecting pipe (216) is communicated with the air cavity (215), the third connecting pipe (216) is communicated with the air cavity (140), connecting plates (141) are inserted into the ends, close to each other, of the elastic grooves (140), and pushing plates (143) are fixedly connected to the ends, close to each other, of the connecting plates (141).
2. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: external threads are formed on the surface of the rotary connecting rod (127), and the directions of the external threads are opposite.
3. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: two groups of second sliding grooves (129) are formed in the inner wall of the top end of the rotary bin (125), and second sliding blocks (130) are fixedly connected to the top ends of the threaded sleeves (128).
4. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: the connecting plates (141) are fixedly connected with springs (142) at the ends far away from each other, and the ends far away from each other of the springs (142) are fixedly connected with the inner wall of the elastic groove (140).
5. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: the upper end and the lower end of the connecting plate (141) are fixedly connected with third sliding blocks (145), and the inner walls of the upper end and the lower end of the spring groove (140) are provided with third sliding grooves (144).
6. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: rubber pads are glued to one ends of the pushing plates (143) close to each other, and one ends of the rubber pads close to each other are attached to the surface of the semiconductor chip main body (134).
7. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: the front side and the rear side of the bottom end of the chip clamping groove (123) are inclined planes, and the included angle between each inclined plane and the horizontal plane is thirty degrees.
8. The efficient replacement of a chip for semiconductor testing according to claim 1, wherein: the longitudinal sections of the air holes (217) are all inclined, and the bottom ends of the air holes (217) are all directed to the slots (136).
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| CN202110204669.2A CN112928579B (en) | 2021-02-24 | 2021-02-24 | Efficient chip replacement plugging device for semiconductor test |
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| CN202110204669.2A CN112928579B (en) | 2021-02-24 | 2021-02-24 | Efficient chip replacement plugging device for semiconductor test |
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| CN112928579A CN112928579A (en) | 2021-06-08 |
| CN112928579B true CN112928579B (en) | 2023-09-19 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016095272A (en) * | 2014-11-17 | 2016-05-26 | 三菱電機株式会社 | Semiconductor evaluation device, semiconductor evaluation method and test jig |
| CN209560016U (en) * | 2018-12-11 | 2019-10-29 | 沈阳兴华航空电器有限责任公司 | A kind of DC power supply plate connector detection system |
| CN110838663A (en) * | 2019-11-25 | 2020-02-25 | 东莞市邦泰自动化科技有限公司 | High-speed backplane connector assembling machine |
| CN210897213U (en) * | 2019-12-17 | 2020-06-30 | 苏州益顺华智能装备有限公司 | Chip packaging machine with shock-absorbing structure |
| CN111874599A (en) * | 2020-08-05 | 2020-11-03 | 深圳市汤诚科技有限公司 | Chip feeding mechanism for assembling USB chip module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964246A (en) * | 1995-08-30 | 1997-03-07 | Nec Corp | Socket for semiconductor chip evaluation |
| KR100613168B1 (en) * | 2004-10-01 | 2006-08-17 | 삼성전자주식회사 | Insert block for testing semiconductor device |
-
2021
- 2021-02-24 CN CN202110204669.2A patent/CN112928579B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016095272A (en) * | 2014-11-17 | 2016-05-26 | 三菱電機株式会社 | Semiconductor evaluation device, semiconductor evaluation method and test jig |
| CN209560016U (en) * | 2018-12-11 | 2019-10-29 | 沈阳兴华航空电器有限责任公司 | A kind of DC power supply plate connector detection system |
| CN110838663A (en) * | 2019-11-25 | 2020-02-25 | 东莞市邦泰自动化科技有限公司 | High-speed backplane connector assembling machine |
| CN210897213U (en) * | 2019-12-17 | 2020-06-30 | 苏州益顺华智能装备有限公司 | Chip packaging machine with shock-absorbing structure |
| CN111874599A (en) * | 2020-08-05 | 2020-11-03 | 深圳市汤诚科技有限公司 | Chip feeding mechanism for assembling USB chip module |
Non-Patent Citations (1)
| Title |
|---|
| 集成电路测试制造领域所用几种装置的探究;胡忠臣;;科技广场(第11期);全文 * |
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