CN112925400A - Immersed heat dissipation system - Google Patents
Immersed heat dissipation system Download PDFInfo
- Publication number
- CN112925400A CN112925400A CN202110098082.8A CN202110098082A CN112925400A CN 112925400 A CN112925400 A CN 112925400A CN 202110098082 A CN202110098082 A CN 202110098082A CN 112925400 A CN112925400 A CN 112925400A
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- Prior art keywords
- cooling
- liquid
- box body
- liquid outlet
- pipeline
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 144
- 239000007788 liquid Substances 0.000 claims abstract description 82
- 239000000110 cooling liquid Substances 0.000 claims abstract description 43
- 210000001503 joint Anatomy 0.000 claims abstract description 19
- 238000004891 communication Methods 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 16
- 239000002826 coolant Substances 0.000 claims description 9
- 238000007654 immersion Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 241001075561 Fioria Species 0.000 claims 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 description 10
- 238000010992 reflux Methods 0.000 description 9
- 230000003139 buffering effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention discloses an immersed heat dissipation system which comprises a box body, wherein a cooling box body and a cooling device of the cooling liquid are arranged in the box body, a main board is fixed on the inner side wall of the cooling box body, a plurality of accessories which are arranged at intervals are vertically arranged on the main board, a buffer plate body is arranged on the side edge of the bottom end of each accessory, a flow guide hole is formed in the buffer plate body, a liquid outlet and a liquid inlet are formed in the cooling box body, and a liquid outlet pipeline is arranged on the liquid outlet; the liquid outlet port of the first spiral pipeline of the cooling liquid cooling device is in butt joint communication with the liquid inlet on the cooling box body. The computer mainframe can reduce the host computers of the immersed heat dissipation type, and meanwhile, the electricity consumption and the selling price of the host computers are greatly reduced, so that the computer popularization and the promotion of the immersed liquid cooling are facilitated.
Description
Technical Field
The invention relates to the technical field of cooling a computer host in a liquid cooling mode, in particular to an immersed heat dissipation system.
Background
Along with the development of science and technology and the improvement of application requirements, electronic products are continuously showing up new. Aiming at various machine types, most users pay attention to the experience of the performance of the whole machine, and the configuration is usually higher, so that the power of the whole machine is continuously improved; that is, the complete machine operation is higher that generates heat, consequently people have developed one kind and have adopted the liquid cooling mode to cool off the computer host computer, thereby all submerge the accessory on computer mainboard and the mainboard in the coolant liquid, thereby constantly carry out the heat transfer mode that circulates to the coolant liquid and reach and carry out the high efficiency cooling to the mainboard of computer and accessory, nevertheless cool off the coolant liquid at present and generally adopt the heat exchanger, however the heat exchanger includes the condenser pipe on the condenser, evaporimeter and compressor, thereby lead to the heat exchanger bulky, make the computer host computer bulky, simultaneously the power consumption of coolant liquid cooling heat transfer is also great, be unfavorable for energy-conservation, and make this type of computer host computer price expensive, can't be suitable for ordinary consumer, consequently, the computer to submergence formula liquid cooling popularizes and has caused great puzzlement.
Disclosure of Invention
The invention aims to solve the technical defects, and provides the computer host capable of reducing the immersion type heat dissipation, and meanwhile, the power consumption and the selling price of the computer host are greatly reduced, so that the immersion type heat dissipation system is favorable for popularization and promotion of the immersion type liquid-cooled computer.
The invention discloses an immersed heat dissipation system which comprises a box body, wherein a cooling box body and a cooling device of the cooling liquid are arranged in the box body, a main board is fixed on the inner side wall of the cooling box body, a plurality of accessories which are arranged at intervals are vertically arranged on the main board, a buffer plate body is arranged on the side edge of the bottom end of each accessory, a flow guide hole is formed in the buffer plate body, a liquid outlet and a liquid inlet are formed in the cooling box body, and a liquid outlet pipeline is arranged on the liquid outlet; the cooling liquid cooling device comprises a cooling shell, a rotary driving motor, a first spiral pipeline arranged in the cooling shell, a planetary gear set and a stirring frame, wherein the stirring frame comprises a top plate and a stirring rod arranged on the peripheral side of the top plate, the rotary driving motor is arranged at the upper port of the cooling shell, a rotor rotating shaft on the rotary driving motor is a pipe body, an upper pipe body of the first spiral pipeline penetrates through the pipe body and is in butt joint communication with a liquid outlet pipeline, the planetary gear set is positioned below the top plate, four through holes respectively corresponding to the positions of four driven gears of the planetary gear set are arranged on the top plate, a suction fan blade is fixedly sleeved on a rotating shaft at the lower end of two driven gears in the four driven gears of the planetary gear set, a blowing fan blade is fixedly sleeved on a rotating shaft at the lower end of the other two driven gears in the four driven gears, the center hole of the top plate is fixedly connected with a rotating shaft of the rotary driving motor in a sleeved mode, the center hole of a driving gear of the planetary gear set is fixedly connected with an upper pipe body of the first spiral pipeline in a sleeved mode, the bottom end of the stirring rod is close to the inner wall of the bottom of the inner cavity of the cooling shell, and the liquid outlet port of the first spiral pipeline is communicated with the liquid inlet of the cooling box in a butt joint mode.
Preferably, the cooling device further comprises a temperature sensor, an electromagnetic valve, a cooling container and a reflux pump, wherein the temperature sensor is arranged on the inner wall of the bottom of the cooling shell, a liquid inlet port of the electromagnetic valve is in butt joint communication with a liquid outlet port of the bottom of the cooling shell, a liquid outlet port of the electromagnetic valve is in butt joint communication with a liquid inlet port of the top of the cooling container through a second spiral pipeline, the cooling container is provided with a cooling mechanism and a reflux pipe body for cooling the cooling liquid inside the cooling container, the liquid outlet port of the reflux pump is in butt joint communication with the liquid inlet port of the top of the cooling shell through a pipeline, and the liquid inlet port.
Preferably, the cooling mechanism comprises a cooling fan, a fine-hole filter screen is installed at the top opening of the cooling container, and the cooling fan is located below the fine-hole filter screen and installed on the top opening of the cooling container.
Preferably, the liquid outlet pipeline comprises a U-shaped pipe body, and the U-shaped pipe body is positioned at the liquid outlet of the cooling box body.
Preferably, the cooling box further comprises a liquid inlet slow-flow pipe which is obliquely arranged, and two ends of the liquid inlet slow-flow pipe are respectively in butt joint communication with a liquid outlet port of the first spiral pipeline and a liquid inlet on the cooling box body.
Preferably, the cooling box body comprises a box body and a cover body, the cover body covers the opening at the upper end of the box body and is detachably and hermetically connected with the box body, and the liquid inlet is formed in the cover body.
Preferably, the cover body and the liquid inlet slow flow pipe are combined into an integral structure.
Preferably, the first spiral pipe and the cooling shell are both vertically arranged.
Preferably, the upper side surface and the lower side surface of the sealing ring are respectively provided with a sealing convex ring, the edge part of the cover body and the upper port edge surface of the box body are provided with a sealing ring groove, and the sealing convex rings are correspondingly embedded into the ring grooves.
The invention designs an immersed heat dissipation system, which utilizes blowing and heat absorption to discharge heat in a cooling shell to quickly cool cooling liquid in the cooling shell, thereby facilitating the cooling of a mainboard and accessories in a first spiral pipeline by the cooling liquid, simultaneously realizing the cooling of the cooling liquid in the first spiral pipeline in the blowing process, further reducing the volume of a computer mainframe by forming a cooling structure of the cooling liquid in the first spiral pipeline in such a way, cooling the cooling liquid in the first spiral pipeline by only driving a low-power motor when the cooling liquid is cooled, greatly reducing the electricity consumption, and simultaneously reducing the cost of parts adopted in a cooling liquid cooling device to greatly reduce the selling price of the immersed heat dissipation computer mainframe, the liquid cooling computer is extremely beneficial to popularization and promotion of the immersed liquid cooling computer.
Drawings
FIG. 1 is a schematic view of the overall structure;
FIG. 2 is an enlarged view of a portion at A;
FIG. 3 is a partial view (one);
fig. 4 is a partial view (two).
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Example (b):
as shown in the accompanying drawings, the immersed heat dissipation system described in this embodiment includes a box body main portion 1, a cooling box body 2 and a cooling device 5 for cooling the cooling liquid are configured in the box body main portion 1, a main board 3 is fixed on an inner side wall of the cooling box body 2, a plurality of accessories 31 arranged at intervals are vertically installed on the main board 3, a buffer plate body 32 is arranged on a side edge of a bottom end of the accessory 31, a flow guide hole 321 is arranged on the buffer plate body 32, a liquid outlet 211 and a liquid inlet 221 are arranged on the cooling box body 2, and a liquid outlet pipeline 4 is installed on the liquid outlet 211; the cooling liquid cooling device 5 comprises a cooling shell 51, a rotary driving motor 52, a first spiral pipeline 53, a planetary gear set (not marked in the figure) and a stirring frame 56, wherein the first spiral pipeline 53, the planetary gear set and the stirring frame 56 are arranged in the cooling shell 51, and the first spiral pipeline 53 and the cooling shell 51 are vertically arranged, so that the area occupied by the whole heat dissipation system is further reduced; the stirring frame 56 comprises a top plate 561 and a stirring rod 562 arranged on the periphery of the top plate 561, the rotary driving motor 52 is arranged at the upper port of the cooling housing 51 and is installed at the upper port of the cooling housing 51 through a hollow frame 50, the rotating shaft of the rotor on the rotary driving motor 52 is a pipe 521, the upper pipe 531 of the first spiral pipeline 53 penetrates through the pipe 521 and is in butt joint communication with the liquid outlet pipe 4, the planetary gear set is located below the top plate 561, four through holes 563 are arranged on the top plate 561 and correspond to the four driven gears 55 of the planetary gear set respectively, the lower rotating shafts of two driven gears 55 of the four driven gears 55 of the planetary gear set are fixedly connected with the suction fan blades 58 in a sleeved mode, the lower rotating shafts of the other two driven gears 55 of the four driven gears 55 of the planetary gear set are fixedly connected with the blowing fan blades 57 in a sleeved mode, the two through holes 563 with the suction fan blades 58 are provided with the air guide, a central hole of a driving gear 54 of the planetary gear set is fixedly sleeved on an upper pipe body 531 of a first spiral pipeline 53, the bottom end of a stirring rod 562 is close to the inner wall of the bottom of an inner cavity of a cooling shell 51, a liquid outlet port of the first spiral pipeline 51 is in butt joint communication with a liquid inlet 221 on the cooling box body 2, wherein the installation directions of a blowing fan blade 57 and an air suction fan blade 58 are opposite, so that the purposes of air suction by the air suction fan blade 58 and air blowing by the air blowing fan blade 57 are achieved when the two blades rotate in the same direction, the outer side wall of the cooling box body 2 is provided with a plurality of hanging buckles, and the inner wall of the box body is provided with a plurality of hooks, so that the; the four driven gears 55 are respectively mounted on the mounting frames 5631 in the four through holes 563 via the rotating shafts 5633 and the bearings 5632.
Based on the above structure, the cooling box 2 is filled with the cooling liquid, and the cooling liquid completely immerses the motherboard 3 and the accessories 31 on the motherboard 3, at this time, the cooling liquid absorbs the heat generated by the operation of the motherboard 3 and the accessories 31 on the motherboard 31, because the liquid outlet 211 is arranged at the bottom of the cooling box 2, the cooling liquid absorbing the heat flows from the liquid outlet 211 to the first spiral pipeline 53 of the cooling liquid cooling device 5 through the liquid outlet pipeline, at this time, the cooling liquid in the cooling shell 51 absorbs the heat of the cooling liquid in the first spiral pipeline 53 to reach the cooling liquid in the first spiral pipeline 53 to be cooled, after cooling, the cooling liquid in the first spiral pipeline 53 enters the cooling box 2 through the liquid inlet 221, because the liquid outlet 211 is in a normally open state, the cooling liquid at the top of the cooling box 2 continuously flows towards the liquid outlet 211, but flows through the motherboard 3 and the accessories 31 on the motherboard 3, since the bottom end of the fitting 31 is provided with the buffer plate 32 with the diversion hole 321, the flowing cooling liquid is buffered and blocked by the buffer plate 32, and a vortex is formed between the fittings, so as to slow down the speed of the cooling liquid in the cooling box 2 flowing to the liquid outlet, so that the cooling liquid can fully absorb the heat on the main board 3 and the fitting 31, thereby achieving the purpose of high-efficiency cooling, and the diversion hole 321 can divert the cooling liquid fully absorbing heat to the lower part of the fitting 31 and then flow to the liquid outlet 211 for discharging, wherein, when cooling the cooling liquid absorbing heat in the cooling shell 51, the rotary driving motor 52 is powered on to rotate the pipe body 521, the pipe body 521 rotates to drive the driving gear 54 and the top board 561 to rotate, because the four driven gears 55 are meshed with the driving gear 54, the driving gear 54 drives the four driven gears 55 to rotate in the same direction, and then the two suction fan blades 58 and the blowing fan blades 57 are also driven to rotate in the, the top plate 561 drives the stirring rod 562 to rotate to stir the cooling liquid absorbing heat in the cooling housing 51, so as to achieve the purpose of stirring and blowing air to cool the cooling liquid in the cooling housing, and the heat volatilized in the stirring process is rotated by the air suction fan blade 58 and is exhausted to the outside through the air guide pipe 59 after air suction, so as to achieve the purpose of rapidly cooling the cooling liquid in the cooling housing 51, and meanwhile, the cooling liquid in the first spiral pipeline 53 can be cooled during air blowing.
In this embodiment, the cooling device further comprises a temperature sensor 11, an electromagnetic valve 9, a cooling container 6 and a reflux pump 7, the temperature sensor 11 is disposed on the inner wall of the bottom of the cooling housing 51, a liquid inlet port of the electromagnetic valve 9 is in butt communication with a liquid outlet port of the bottom of the cooling housing 51, a liquid outlet port of the electromagnetic valve 9 is in butt communication with a liquid inlet port of the top of the cooling container 6 through a second spiral pipeline 8, the cooling container 6 is provided with a cooling mechanism 12 and a reflux pipe body 13 for cooling the internal cooling liquid, the liquid outlet port of the reflux pump 7 is in butt communication with the liquid inlet port of the top of the cooling housing 51 through a pipeline, the liquid inlet port of the reflux pump 7 is in butt communication with the reflux pipe body 13, the temperature sensor 11, the reflux pump 7 and the electromagnetic valve 9 are respectively connected with the single chip microcomputer, when the temperature of the cooling liquid in the cooling housing 51 detected, then, the cooling liquid with higher temperature (exceeding the limit value) in the cooling shell 51 is slowly discharged into the cooling container 6 through the first spiral pipe 53, and meanwhile, the cooling liquid with lower temperature in the cooling container 6 is pumped into the cooling shell 51, so that when the cooling device in the cooling shell 51 cannot rapidly cool the cooling liquid in the first spiral pipe 53, the device achieves the purpose of rapidly cooling the cooling liquid in the first spiral pipe 53 in the cooling shell through replacing the cooling liquid with higher temperature, and the use reliability of the cooling and heat dissipating system is further improved.
It is further preferable that the cooling mechanism 12 includes a cooling fan 122, a fine-mesh screen 121 is installed at the top opening 61 of the cooling container 6, the cooling fan 122 is located below the fine-mesh screen 121 and installed on the top opening 61 of the cooling container 6, the cooling fan is powered on to rapidly cool the cooling liquid in the cooling container, and the fine-mesh screen prevents dust and the like from entering the cooling container.
In this embodiment, the liquid outlet pipe 4 includes the U-shaped pipe body 41, and the U-shaped pipe body 41 is located the liquid outlet 211 of the cooling box 2, and the setting of its structure on the liquid outlet pipe 4 of the U-shaped pipe body 41 prevents that the coolant liquid that gets into in the cooling box 2 from discharging from the liquid outlet 211 fast, slow down the speed of coolant liquid to the liquid outlet 211 in the cooling box 2 through the buffering that blocks of U-shaped pipe body 41, so as to reach and discharge from the liquid outlet 211 after the coolant liquid in the cooling box 2 can fully absorb heat, further promote cooling efficiency.
In this embodiment, still including the feed liquor unhurried current pipe 10 that is the slope setting, the both ends of feed liquor unhurried current pipe 10 are the outlet port of first helical pipeline 53 respectively and the inlet 221 butt joint intercommunication on the cooling box 2, and the setting of feed liquor unhurried current pipe 10 makes the coolant liquid after the cooling get into behind the buffering can not make in the cooling box 2 produce the bubble etc. to promote cooling performance.
In this embodiment, the cooling box 2 includes a box body 21 and a cover 22, the cover 22 covers the upper opening of the box body 21 and is detachably connected to the box body in a sealing manner, the liquid inlet 221 is disposed on the cover 22, a sealing ring 23 is disposed between the bottom edge of the cover 22 and the upper edge of the box body 21, and the cover 22 is connected to the upper edge of the box body 21 by a bolt in a threaded manner, so as to achieve a sealing connection structure, preferably, the cover 22 and the liquid inlet slow flow pipe 10 are combined into an integral structure.
Furthermore, sealing convex rings 231 are respectively arranged on the upper side surface and the lower side surface of the sealing ring 23, a sealing ring groove 212 is arranged on the edge part of the cover body 22 and the upper end opening edge surface of the box body 21, and the sealing convex rings 231 are correspondingly embedded into the sealing ring groove 212. The structure of the box body improves the sealing performance of the box body.
The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by anyone in the light of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as those of the present application, fall within the protection scope of the present invention.
Claims (10)
1. An immersed heat dissipation system comprises a box body main part (1), and is characterized in that a cooling box body (2) and a cooling liquid cooling device (5) are arranged in the box body main part (1), a main board (3) is fixed on the side inner wall of the cooling box body (2), a plurality of accessories (31) which are arranged at intervals are vertically arranged on the main board (3), a buffer plate body (32) is arranged on the side edge of the bottom end of each accessory (31), a flow guide hole (321) is arranged on each buffer plate body (32), a liquid outlet (211) and a liquid inlet (221) are arranged on the cooling box body (2), and a liquid outlet pipeline (4) is arranged on each liquid outlet (211); the cooling liquid cooling device (5) comprises a cooling shell (51), a rotary driving motor (52), a first spiral pipeline (53) arranged in the cooling shell (51), a planetary gear set and a stirring frame (56), wherein the stirring frame (53) comprises a top plate (561) and a stirring rod (562) arranged on the peripheral side of the top plate (561), the rotary driving motor (52) is arranged at the upper port of the cooling shell (51), a rotor rotating shaft on the rotary driving motor (52) is a pipe body (521), an upper pipe body of the first spiral pipeline (53) penetrates through the pipe body (521) and is in butt joint communication with the liquid outlet pipeline (4), the planetary gear set is positioned below the top plate (561), four through holes (563) corresponding to the positions of four driven gears (55) of the planetary gear set are formed in the top plate (561), and fan suction blades (58) are fixedly sleeved on rotating shafts of two driven gears (55) in the four driven gears (55) of the planetary gear set, in four driven gear (55) of planetary gear set other two driven gear (55) lower extreme pivot cup joint and be fixed with blower fan leaf (57), two through-hole (563) departments that have suction fan leaf (58) install guide duct (59), roof (561) centre bore cup joints in the pivot of being fixed in rotary driving motor (52), driving gear (54) centre bore of planetary gear set cup joints on being fixed in upper tube body (531) of first helical pipeline (53), puddler (562) bottom is close to the inner chamber bottom inner wall of cooling housing (51), the play liquid port of first helical pipeline (53) and the inlet butt joint intercommunication on the cooling box (2).
2. An immersion radiator system according to claim 1, further comprising a temperature sensor (11), a solenoid valve (9), cooling container (6) and backwash pump (7), temperature sensor (11) set up on the bottom inner wall of cooling shell (51), the inlet port of solenoid valve (9) and the butt joint intercommunication of the bottom outlet port of cooling shell (51), the outlet port of solenoid valve (11) passes through second spiral pipeline (8) and the butt joint intercommunication of the top inlet port of cooling container (6), be provided with on cooling container (6) and carry out refrigerated cooling body (12) and backward flow body (13) to its inside coolant liquid, the outlet port department of backwash pump (7) carries out the butt joint intercommunication through the top inlet port of pipeline and cooling shell (51), the inlet port and the backward flow body (13) butt joint intercommunication of backwash pump (7).
3. An immersion heat sink system according to claim 2, wherein the cooling means (12) comprises a cooling fan (122), a fine mesh screen (121) is mounted at the top opening (61) of the cooling container (6), and the cooling fan (122) is located below the fine mesh screen (121) and mounted on the top opening (61) of the cooling container (6).
4. An immersed heat dissipation system as defined in claim 3, wherein the liquid outlet pipe (4) comprises a U-shaped pipe body (41), and the U-shaped pipe body (41) is located at the liquid outlet (211) of the cooling tank (2).
5. An immersed heat dissipation system as defined in claim 4, further comprising an inclined inlet buffer pipe (10), wherein two ends of the inlet buffer pipe (10) are respectively in butt joint communication with the outlet port of the first spiral pipeline (53) and the inlet port (221) of the cooling tank (2).
6. An immersed heat dissipation system as defined in claim 5, wherein the cooling tank (2) comprises a tank body (21) and a cover (22), the cover (22) covers the upper opening of the tank body (21) and is detachably and hermetically connected to each other, and the liquid inlet (221) is disposed on the cover (22).
7. An immersion heat sink system as claimed in claim 6, wherein a seal ring (23) is provided between the bottom surface edge of the cover body (22) and the upper port edge surface of the tank body (21), and the cover body (22) is screwed to the upper port edge surface of the tank body (21) by bolts.
8. A submerged heat dissipation system according to claim 6, wherein the cover (22) and the inlet buffer pipe (10) are integrated with each other.
9. An immersion heat dissipation system as claimed in claim 7, wherein the sealing ring (23) is provided with sealing protruding rings (231) on upper and lower sides thereof, the edge of the lid (22) and the upper opening edge of the tank body (21) are provided with sealing ring grooves (212), and the sealing protruding rings (231) are correspondingly inserted into the sealing ring grooves (212).
10. An immersion heat sink system according to any one of claims 1-9, characterised in that the first helical duct (53) and the cooling housing (51) are both vertically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110098082.8A CN112925400A (en) | 2021-01-25 | 2021-01-25 | Immersed heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110098082.8A CN112925400A (en) | 2021-01-25 | 2021-01-25 | Immersed heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112925400A true CN112925400A (en) | 2021-06-08 |
Family
ID=76167480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110098082.8A Pending CN112925400A (en) | 2021-01-25 | 2021-01-25 | Immersed heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112925400A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113849054A (en) * | 2021-08-31 | 2021-12-28 | 兰洋(宁波)科技有限公司 | Immersed liquid cooling heat dissipation system applied to data center |
| CN116400790A (en) * | 2023-06-06 | 2023-07-07 | 天津提尔科技有限公司 | Immersion liquid cooling workstation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110099547A (en) * | 2019-04-25 | 2019-08-06 | 南京佳力图机房环境技术股份有限公司 | Immersion liquid cooling cabinet |
| CN210892772U (en) * | 2019-08-26 | 2020-06-30 | 常州锐科特环保设备有限公司 | Cooling tower for industrial production |
| CN111949089A (en) * | 2020-09-10 | 2020-11-17 | 西安德创自动化工程有限公司 | Liquid cooling type industrial personal computer |
| CN212291301U (en) * | 2020-05-27 | 2021-01-05 | 辽宁兆利高新路面材料有限公司 | Emulsified asphalt heat abstractor |
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2021
- 2021-01-25 CN CN202110098082.8A patent/CN112925400A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110099547A (en) * | 2019-04-25 | 2019-08-06 | 南京佳力图机房环境技术股份有限公司 | Immersion liquid cooling cabinet |
| CN210892772U (en) * | 2019-08-26 | 2020-06-30 | 常州锐科特环保设备有限公司 | Cooling tower for industrial production |
| CN212291301U (en) * | 2020-05-27 | 2021-01-05 | 辽宁兆利高新路面材料有限公司 | Emulsified asphalt heat abstractor |
| CN111949089A (en) * | 2020-09-10 | 2020-11-17 | 西安德创自动化工程有限公司 | Liquid cooling type industrial personal computer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113849054A (en) * | 2021-08-31 | 2021-12-28 | 兰洋(宁波)科技有限公司 | Immersed liquid cooling heat dissipation system applied to data center |
| CN113849054B (en) * | 2021-08-31 | 2024-03-26 | 兰洋(宁波)科技有限公司 | Submerged liquid cooling heat dissipation system applied to data center |
| CN116400790A (en) * | 2023-06-06 | 2023-07-07 | 天津提尔科技有限公司 | Immersion liquid cooling workstation |
| CN116400790B (en) * | 2023-06-06 | 2023-08-15 | 天津提尔科技有限公司 | Immersion liquid cooling workstation |
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Application publication date: 20210608 |