CN112920754B - High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof - Google Patents
High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof Download PDFInfo
- Publication number
- CN112920754B CN112920754B CN202110101317.4A CN202110101317A CN112920754B CN 112920754 B CN112920754 B CN 112920754B CN 202110101317 A CN202110101317 A CN 202110101317A CN 112920754 B CN112920754 B CN 112920754B
- Authority
- CN
- China
- Prior art keywords
- agent
- resin
- flexible circuit
- circuit board
- waterproof adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the technology of bonding materials, and particularly relates to a high-bonding-force high-molecular polymer waterproof adhesive for a flexible circuit board and application thereof. The agent A is composed of acrylic resin polymer, rosin resin, liquid terpene resin, aldehyde ketone resin, defoaming agent and solvent, and the agent B is composed of closed isocyanate curing agent, amine curing agent and solvent; and mixing the agent A with the agent B to obtain the high-adhesion high-molecular-weight polymer waterproof adhesive for the flexible circuit board. The invention develops the high-bonding-force waterproof adhesive with excellent waterproof performance for the flexible circuit board, reduces the curing temperature range from the viewpoint of energy conservation and environmental protection, and simultaneously enlarges the applicable temperature range; from the perspective of waterproof performance, the peeling force of the colloid is improved, the stability of the overall performance is improved at different temperatures, particularly under the condition of high-temperature baking, the surface peeling force and the pressure sensitivity are not greatly influenced, and the waterproof performance meets the requirement.
Description
Technical Field
The invention belongs to the technology of bonding materials, and particularly relates to a high-bonding-force high-molecular polymer waterproof adhesive for a flexible circuit board and application thereof.
Background
At present, the market is more and more paying attention to the waterproof performance of flexible circuit boards such as computer keyboards, membrane switches and the like. The most used agent A and agent B bi-component pressure-sensitive adhesive in the current market mainly adopts a closed isocyanate curing agent, and the use of the curing agent has the advantages of long construction time and stable performance in the use process; the disadvantage is that the deblocking must be carried out at a specific temperature and is susceptible to temperature fluctuations. Therefore, the curing temperature is usually higher than the theoretical temperature under the condition of ensuring curing and drying.
At present, the main construction process conditions in the market are as follows: adopts screen printing (100-200 mesh), the curing temperature is more than 120-150 ℃, and the curing is carried out
1-2 min between the two steps. The curing temperature is reduced from energy conservation and environmental protection and long-term use loss of equipment, so that the curing temperature is more consistent with market requirements; the product is more popular in the market due to stable waterproof performance and longer time.
The market requirements for the prior art mainly include: can bear the soaking in normal temperature water (25 ℃) for 2 hours and hot water (70 ℃) for 2 hours; a 180 DEG peel force on the PET substrate of up to 500 gf; at the same time under extreme conditions: no obvious change in high temperature and high humidity (70 ℃, 90% HR) within 240h, and no obvious thermal diffusion phenomenon of colloid after being baked at high temperature (150 ℃) for 30 min.
The existing client bi-component waterproof adhesive has the following defects:
firstly, a single curing type is adopted, and meanwhile, the curing temperature is high and the curing time is long.
Secondly, the performance difference is large under the fluctuation of curing conditions; the temperature is low, the curing and deblocking degree is not enough, the curing and drying are affected, and the colloid is easy to diffuse; the temperature is higher, the curing degree is high, the surface stripping force of the colloid is reduced, and the continuous stripping force performance is reduced.
The peeling force is low, and the phenomenon of glue failure is easy to occur when the die-cutting and tension force is applied, so that the waterproof performance is poor.
And fourthly, the pressure sensitivity is general, and under the condition of adopting cold pressing or slightly reducing the pressure, the sealing property is poor, so that the waterproof performance is poor.
Disclosure of Invention
In order to develop the high-adhesion waterproof adhesive with excellent waterproof performance for the flexible circuit board, the curing temperature range is reduced to 90-110 ℃ from the viewpoint of energy conservation and environmental protection, and meanwhile, the applicable temperature range is expanded; from the perspective of waterproof performance, the peeling force of the colloid is improved, the stability of the overall performance is improved at different temperatures, particularly under the condition of high-temperature baking, the surface peeling force and the pressure sensitivity are not greatly influenced, and the waterproof performance meets the requirement.
The invention adopts the following technical scheme:
a high-adhesion high-molecular polymer waterproof adhesive for flexible circuit boards is composed of an agent A and an agent B; the agent A comprises acrylic resin polymer, rosin resin, liquid terpene resin, aldehyde ketone resin and defoaming agent; the agent B comprises a blocked isocyanate curing agent and an amine curing agent.
Preferably, agent A comprises a solvent and agent B comprises a solvent, such as diethylene glycol ethyl ether acetate. Preferably, the agent A consists of acrylic resin polymer, rosin resin, liquid terpene resin, aldehyde ketone resin, a defoaming agent and a solvent, and the agent B consists of a blocked isocyanate curing agent, a blocked amine curing agent and a solvent.
Preferably, the formula of the agent A comprises the following components in parts by weight:
the formula of the agent B is as follows:
30-50 parts of blocked isocyanate
10-30 parts of enclosed amine curing agent
20-30 parts of diethylene glycol ethyl ether acetate.
In the invention, the weight ratio of the agent A to the agent B is 100: 5-7.
The acrylic resin polymer used in the invention has hydroxyl and carboxyl; the acid value (carboxyl content) of the acrylic resin polymer is 13-19mgKOH/g, the hydroxyl value (hydroxyl content) is 5-10mgKOH/g, so that enough crosslinking sites are provided during curing and crosslinking, the acrylic resin polymer is different from common hydroxyl curing and crosslinking, a certain amount of carboxyl is introduced into the acrylic resin polymer at the same time for carboxyl curing, and the two types of curing are matched with each other, so that the curing rate and the stability are improved.
The rosin resin used in the invention is one or more of rosin ester resin, hydrogenated rosin ester resin and polymerized rosin ester, such as Jinan Daihui chemical K803L or Guangzhou Songbao chemical SSR 100; as tackifying resin, the adhesive is matched with aldehyde ketone resin to improve the adhesive force; the invention uses aldehyde ketone resin to improve the stripping force, is different from the traditional pressure-sensitive adhesive tackifying resin, and improves the adhesive force of PET base material more obviously by using aldehyde ketone resin, such as Changsha advocate Tai industry KR-80F or Basff LP-A81.
The liquid terpene resin is used in the invention, on one hand, the liquid terpene resin is taken as a tackifying resin to be beneficial to improving the stripping force, and on the other hand, the pressure-sensitive performance after curing and drying is improved. The influence of curing temperature fluctuation is reduced by using the liquid terpene resin for curing and drying, particularly under the condition of higher temperature fluctuation, the curing degree is high, the adhesive force on the surface of a colloid is reduced, the pressing adhesion is poor, and the condition can be obviously improved by using the liquid terpene resin; the addition amount of the liquid terpene resin is not easy to be excessive, and the colloid is easy to diffuse under the condition of high-temperature environment due to excessive addition amount.
The invention adopts a mixed curing agent of blocked isocyanate and blocked carbodiimide, such as Kossichu BL-3370 or Asahi chemical MF-K60X, Guangzhou Yangsong trade FAC. Different from the addition of three types of traditional curing agents (epoxy, isocyanate and metal complex) and TMPTA (trimethylolpropane triacrylate) curing agents in the acrylate-based pressure-sensitive adhesive, the scheme introduces the enclosed amine curing agent, the enclosed isocyanate curing agent is mainly used for crosslinking and curing with-OH, the enclosed carbodiimide curing agent is mainly reacted with-COOH, the content of the matched resin is high, and the curing performance is good. The mixed curing agent can reduce the curing temperature requirement, has low deblocking temperature (80 ℃), has high reaction speed, can complement the curing effect of the isocyanate curing agent, and mainly has the following factors: 1. the amine curing agent is completely used, the requirement on the contained groups is higher, and the product is easily yellowed due to a high acid value for a long time; 2. the carboxyl has certain affinity to PET, and can retain partial groups to facilitate the attachment. Preferably, the closed carbodiimide is subjected to vacuum rotary evaporation, so that the existence of water is solved, the reaction of the water and isocyanate is avoided, and the long-term stability of the product is ensured; the invention takes diethylene glycol ethyl ether acetate as a solvent.
Compared with the prior art, the invention introduces the tackifying resin, the aldehyde ketone resin and the liquid terpene resin into the formula, so that the average stripping force is improved from 500gf/25mm to 800gf/25mm, and meanwhile, the pressure-sensitive performance is improved due to the existence of the liquid terpene resin; in the aspect of selecting the curing agent, the three types of traditional curing agents of traditional acrylic resin are broken through, the curing temperature is reduced by adopting a mixed curing agent form, the curing temperature range is reduced from 120-150 ℃ to 90-110 ℃, and the requirements of energy conservation and environmental protection are met.
Drawings
FIG. 1 is a graphical illustration of a screen printing of glue in accordance with the present invention;
fig. 2 is a display of a finished glue application product of the present invention.
Detailed Description
All the raw materials of the invention are commercial products, and the specific preparation operation and the test method are conventional in the field. The rosin resin is chemical K803L of Jinan Dahui; the liquid terpene resin is Guangzhou Songbao chemical engineering T33; the aldehyde ketone resin is Changsha advocate Tao Utility KR-80F; the acrylic resin polymer is Jiangyang force constant chemical SP-8061; the closed amine curing agent is the Korean pine trade FAC of Guangzhou city and closed carbodiimide; the blocked isocyanate curing agent is Kostechu BL-3370.
The invention relates to a high-adhesive-force high-molecular polymer waterproof adhesive for a flexible circuit board, which consists of an agent A and an agent B; the agent A consists of acrylic resin polymer, rosin resin, liquid terpene resin, aldehyde ketone resin, a defoaming agent and a solvent; the agent B consists of a blocked isocyanate curing agent, an amine curing agent and a solvent. The preparation method of the high-adhesion high-molecular polymer waterproof adhesive for the flexible circuit board comprises the steps of sequentially adding a rosin resin solution, a liquid terpene resin solution and an aldehyde ketone resin solution into an acrylic resin polymer, stirring, and then adding a defoaming agent and a solvent to obtain an agent A; mixing an amine curing agent, an isocyanate curing agent and a solvent to obtain an agent B; and mixing the agent A with the agent B to obtain the high-adhesion high-molecular-weight polymer waterproof adhesive for the flexible circuit board. The preparation method comprises the following steps:
mixing the rosin resin with diethylene glycol ethyl ether acetate, and stirring at the speed of 800-1000rpm for 3-4h to obtain a rosin resin solution;
adding the liquid terpene resin into diethylene glycol ethyl ether acetate, and dispersing for 0.5h at the speed of 300-500rpm to obtain a liquid terpene resin solution;
mixing aldehyde ketone resin with diethylene glycol ethyl ether acetate, and stirring at the speed of 800-;
sequentially adding a rosin resin solution, a liquid terpene resin solution and an aldehyde ketone resin solution into an acrylic resin polymer, stirring for 10min at the speed of 100rpm, adding a defoaming agent and a solvent, and stirring for 60min at the speed of 100rpm to obtain an agent A;
mixing and stirring the blocked amine curing agent, the isocyanate curing agent and the solvent at 100rpm for 30min to obtain a B agent;
the agent A and the agent B are mixed and stirred uniformly to obtain the high-adhesion high-molecular-weight polymer waterproof adhesive for the flexible circuit board.
Wherein, the blocked amine curing agent is subjected to water removal treatment before use, for example, a vacuum rotary evaporation mode is adopted, the heating temperature is 50 ℃, the contained water is removed, the evaporated liquid comprises a low-boiling solvent and water, and the rotary evaporation amount is 50% of the initial amount; other water removal means may also be employed.
Example one
The agent A comprises the following components in parts by weight:
the component formula of the agent B is as follows:
40 parts of blocked isocyanate
20 parts of blocked amine curing agent
Diethylene glycol monoethyl ether acetate 30 parts.
Mixing rosin resin with 20 parts of diethylene glycol ethyl ether acetate, and stirring at the speed of 1000rpm for 3 hours to obtain a rosin resin solution; adding the liquid terpene resin into 10 parts of diethylene glycol ethyl ether acetate, and dispersing for 0.5h at the speed of 500rpm to obtain a liquid terpene resin solution; mixing aldehyde ketone resin with 15 parts of diethylene glycol ethyl ether acetate, and stirring at the speed of 800rpm for 4 hours to obtain aldehyde ketone resin solution; sequentially adding the rosin resin solution, the liquid terpene resin solution and the aldehyde ketone resin solution into the acrylic resin polymer, stirring at the speed of 100rpm for 10min, adding a defoaming agent (modesty 6801) and the residual diethylene glycol ethyl ether acetate, and stirring at the speed of 100rpm for 60min to obtain an agent A;
mixing and stirring the blocked amine curing agent, the isocyanate curing agent and the solvent diethylene glycol ethyl ether acetate at 100rpm for 30min to obtain a B agent; wherein, the closed amine curing agent is subjected to dehydration treatment;
mixing the agent A and the agent B according to the weight ratio of 100: 6 to obtain the high-adhesion high-molecular polymer waterproof adhesive for the flexible circuit board, wherein PET is used as a base material, and the test results are as follows (100 ℃ curing time is 100 s):
the high-adhesion high-molecular-weight polymer waterproof adhesive for the flexible circuit board is subjected to conventional screen printing and applied to the surface of a plastic base material, the pattern is shown in figure 1, the product is shown in figure 2, and the phenomena of wire drawing and line flowing diffusion do not occur in the printing process.
The product of the invention is not only suitable for screen printing, has clear pattern, but also has low curing temperature, can be completely cured at 100 ℃ for 100s, and has excellent performance of cured products.
The water resistance at 25 ℃ is not sufficient after 100 seconds of curing of the glue representing the prior art level of the current commercial conventional industrial application, and the passing rate is 80%.
A single factor change was made on the basis of example one to give the following comparative examples.
Comparative example
The liquid terpene resin was omitted from the agent A, and the remaining amount was unchanged, and the obtained glue was tested in the same manner as in example, and had a 180 ℃ peel force of 616gf and insufficient water resistance at 25 ℃ and a passing rate of 87%.
The aldehyde-ketone resin was omitted from the agent A, and the remaining resin was unchanged, and the obtained glue was tested in the same manner as in example, and had a 180 ℃ peel force of 425 gf.
The agent A was obtained by omitting the rosin resin and leaving the same, and the resulting glue was tested in the same manner as in example, and had a 180 ℃ peel force of 516 gf.
The liquid terpene resin in the agent A is increased to 6 parts, the rest is unchanged, the obtained glue adopts the test same as the embodiment, the 180-degree stripping force is 752gf, the water resistance at 70 ℃ is not enough, and the passing rate is 78%.
The agent B replaces the blocked amine curing agent with blocked isocyanate, the rest is unchanged, the obtained glue adopts the same test of the embodiment, the 180-degree stripping force is 581gf, the water resistance at 25 ℃ is not enough, and the passing rate is 85 percent.
The agent B replaces the blocked amine curing agent with the substituted trimethylolpropane triacrylate, the rest is unchanged, the obtained glue is tested by the same example, the water resistance at 70 ℃ is not enough, and the passing rate is 69%.
Example two
The agent A comprises the following components in parts by weight:
the component formula of the agent B is as follows:
blocked isocyanate 30 parts
20 parts of blocked amine curing agent
Diethylene glycol monoethyl ether acetate 30 parts
Using the preparation process of example one, a glue was obtained which, using a test similar to that of example, had a 180 ℃ peel force of 809gf and a water resistance passing rate of 93% at 25 ℃.
EXAMPLE III
The agent A comprises the following components in parts by weight:
the component formula of the agent B is as follows:
40 parts of blocked isocyanate
10 parts of blocked amine curing agent
Diethylene glycol monoethyl ether acetate 30 parts
Using the preparation process of example one, a glue was obtained, which was tested in the same manner as in example, and had a 180 ℃ peel force of 817gf and a water resistance pass rate of 92% at 25 ℃.
Claims (7)
1. A high-adhesion high-molecular polymer waterproof adhesive for a flexible circuit board is characterized by consisting of an agent A and an agent B; the agent A comprises acrylic resin polymer, rosin resin, liquid terpene resin, aldehyde ketone resin and defoaming agent; the agent B comprises a closed isocyanate curing agent and a closed amine curing agent; the acid value of the acrylic resin polymer is 13-19mgKOH /g, and the hydroxyl value is 5-10mgKOH /g; the closed amine curing agent is closed carbodiimide; the agent A comprises the following components in parts by weight:
70-80 parts of acrylic resin polymer
5-10 parts of rosin resin
1-3 parts of liquid terpene resin
4-10 parts of aldehyde ketone resin
0.2 to 0.8 portion of defoaming agent
30-60 parts of solvent
The component formula of the agent B is as follows:
30-50 parts of blocked isocyanate
10-30 parts of enclosed amine curing agent
20-30 parts of a solvent.
2. The high-adhesion high-molecular polymer waterproof adhesive for the flexible circuit board as claimed in claim 1, wherein the agent A comprises an acrylic resin polymer, a rosin resin, a liquid terpene resin, an aldehyde ketone resin, a defoaming agent and a solvent, and the agent B comprises a blocked isocyanate curing agent, a blocked amine curing agent and a solvent.
3. The high-adhesion high-molecular polymer waterproof adhesive for the flexible circuit board as claimed in claim 1, wherein the agent A is obtained by sequentially adding a rosin resin solution, a liquid terpene resin solution and an aldehyde ketone resin solution into an acrylic resin polymer, stirring and then adding a defoaming agent and a solvent; mixing a closed isocyanate curing agent, a closed amine curing agent and a solvent to obtain a B agent; and mixing the agent A with the agent B to obtain the high-adhesion high-molecular-weight polymer waterproof adhesive for the flexible circuit board.
4. The high-adhesion high-molecular polymer waterproof adhesive for the flexible circuit board as claimed in claim 3, wherein the weight ratio of the agent A to the agent B is 100: 5-7.
5. The use of the high-adhesion high-molecular polymer waterproof adhesive for flexible printed circuit boards according to claim 1 for preparing waterproof adhesive.
6. The use of the high-adhesion high-molecular-weight polymer waterproof adhesive for flexible circuit boards according to claim 1 for preparing a waterproof adhesive layer on a plastic surface.
7. The application of the high-adhesion high-molecular polymer waterproof glue for the flexible circuit board as claimed in claim 5 or 6, wherein the curing temperature of the high-adhesion high-molecular polymer waterproof glue for the flexible circuit board is 90-110 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110101317.4A CN112920754B (en) | 2021-01-26 | 2021-01-26 | High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110101317.4A CN112920754B (en) | 2021-01-26 | 2021-01-26 | High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112920754A CN112920754A (en) | 2021-06-08 |
| CN112920754B true CN112920754B (en) | 2022-09-13 |
Family
ID=76166030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110101317.4A Active CN112920754B (en) | 2021-01-26 | 2021-01-26 | High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112920754B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800182B1 (en) * | 2005-11-08 | 2008-02-01 | 광 석 서 | Antismudge, water repellent, and antistatic pressure sensitive or adhesive tape for protection treated |
| CN103911088B (en) * | 2014-04-23 | 2015-10-28 | 深圳市美信电子有限公司 | A kind of acrylate pressure-sensitive adhesive band and preparation method thereof and lithium ion battery |
| CN110527464B (en) * | 2019-09-10 | 2021-07-13 | 江苏皇冠新材料科技有限公司 | High-viscosity yellowing-resistant anti-explosion film glue, adhesive tape and preparation method thereof |
| CN111777962B (en) * | 2020-07-22 | 2022-02-08 | 太仓斯迪克新材料科技有限公司 | Waterproof adhesive tape, preparation method thereof and electronic product |
-
2021
- 2021-01-26 CN CN202110101317.4A patent/CN112920754B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112920754A (en) | 2021-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110527464B (en) | High-viscosity yellowing-resistant anti-explosion film glue, adhesive tape and preparation method thereof | |
| US7488434B2 (en) | Conductive paste for conductive substrate or conductive film | |
| CN102549097B (en) | Thermoset bonding composition, thermoset adhesive sheet, its manufacture method and enhancing flexible printing wiring board | |
| CN110699019A (en) | High-temperature-resistant acrylate pressure-sensitive adhesive and double-sided adhesive without base material | |
| CN101613586A (en) | A kind of reaction type polyurethane hot-melt adhesive and preparation method thereof | |
| CN106554728A (en) | Pressure-sensitive Protection glue band of a kind of butyl rubber base and preparation method thereof | |
| CN112812713B (en) | Preparation method of high-adhesion high-molecular-weight polymer waterproof adhesive for flexible circuit board | |
| CN103474126A (en) | Electroconductive slurry capable of fast performing surface curing by utilizing UV and method using same for producing electroconductive film circuit | |
| CN114634780B (en) | Hot-melt type removable pressure-sensitive adhesive and preparation method thereof | |
| CN112920754B (en) | High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof | |
| CN107201204A (en) | A kind of metal film coated glue of universal one-component and its preparation method and application | |
| CN112980381A (en) | High-temperature-resistant water-based environment-friendly adhesive and preparation method thereof | |
| CN110232986B (en) | Conductive silver paste for flexible electronic paper and preparation method thereof | |
| CN109554149B (en) | Epoxy adhesive for flexible circuit board and preparation method and application thereof | |
| CN102101996A (en) | Pressure-sensitive adhesive used for cotton paper or non-woven fabrics and preparation method thereof | |
| CN115466584B (en) | High-surface tension waterproof adhesive with durable bonding strength | |
| CN101220248A (en) | Wood substance material adhesion agent manufactured with corn starch as main material and manufacturing method thereof | |
| CN107718916B (en) | Printing preparation process of pressure-sensitive adhesive applied to flexible circuit board | |
| CN114214009A (en) | High-temperature-resistant antistatic pressure-sensitive adhesive and application thereof | |
| CN102181237A (en) | Preparation method of pressure-sensitive structure adhesive tape for mobile phone key | |
| CN111978885A (en) | Method for manufacturing acid and alkali resistant adhesive reducing tape | |
| CN106147662A (en) | Adhesive, high temperature resistant conductive double-sided tape and preparation method | |
| CN114561174B (en) | UV (ultraviolet) curing pressure-sensitive adhesive and preparation method thereof | |
| CN111909624A (en) | Emulsion type insect-attracting board adhesive for PET (polyethylene terephthalate) base material and preparation method thereof | |
| CN103773286A (en) | Silk-screen printing waterproof adhesive for thin-film circuit and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |