CN112920588A - PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof - Google Patents
PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof Download PDFInfo
- Publication number
- CN112920588A CN112920588A CN202110048078.0A CN202110048078A CN112920588A CN 112920588 A CN112920588 A CN 112920588A CN 202110048078 A CN202110048078 A CN 202110048078A CN 112920588 A CN112920588 A CN 112920588A
- Authority
- CN
- China
- Prior art keywords
- low dielectric
- alloy
- paek
- dielectric constant
- dielectric loss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006260 polyaryletherketone Polymers 0.000 title claims abstract description 83
- 239000000956 alloy Substances 0.000 title claims abstract description 78
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000004417 polycarbonate Substances 0.000 claims abstract description 85
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 5
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 5
- 239000000314 lubricant Substances 0.000 claims abstract description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 23
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 21
- 229920002530 polyetherether ketone Polymers 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- 239000003063 flame retardant Substances 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 8
- 229910052582 BN Inorganic materials 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 7
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000011258 core-shell material Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011056 performance test Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229920000049 Carbon (fiber) Polymers 0.000 description 6
- 239000004917 carbon fiber Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- SXAMGRAIZSSWIH-UHFFFAOYSA-N 2-[3-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,2,4-oxadiazol-5-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NOC(=N1)CC(=O)N1CC2=C(CC1)NN=N2 SXAMGRAIZSSWIH-UHFFFAOYSA-N 0.000 description 1
- YJLUBHOZZTYQIP-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=N2 YJLUBHOZZTYQIP-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 description 1
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
- VNNCRTPIHMVYNT-UHFFFAOYSA-N OP(O)OP(O)O.C1=CC=C(C=C1)C1=CC=CC=C1.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O Chemical compound OP(O)OP(O)O.C1=CC=C(C=C1)C1=CC=CC=C1.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)O VNNCRTPIHMVYNT-UHFFFAOYSA-N 0.000 description 1
- TXQVDVNAKHFQPP-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CO)(CO)CO TXQVDVNAKHFQPP-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- 229920001657 poly(etheretherketoneketone) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The application relates to the field of special plastics, and particularly discloses a PC/PAEK alloy with low dielectric constant and low dielectric loss for a satellite antenna and a preparation method thereof. A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is prepared from polycarbonate (50-60 wt. portions), polyaryletherketone (15-20), compatibilizer (4-8), antioxidant (0.9-1.5) and lubricant (0.5-1); the preparation method comprises the following steps: premixing polycarbonate and polyaryletherketone to prepare a mixture A, premixing a compatilizer, an antioxidant and a lubricant to prepare a mixture B, melting and blending the mixture A and the mixture B in a double-screw stirrer, and extruding and granulating to prepare the PC/PAEK alloy. The PC/PAEK alloy has the advantages of low dielectric constant, low dielectric loss, high specific strength, high specific modulus, good impact resistance and good thermal stability.
Description
Technical Field
The application relates to the field of special plastics, in particular to a PC/PAEK alloy with low dielectric constant and low dielectric loss for a satellite antenna and a preparation method thereof.
Background
A satellite antenna is a transmission mode converter for converting radio waves propagating in free space into electrical signals transmitted in a transmission line. The development trend of the structural materials of the satellite antenna is high performance, multiple functions and low cost along with the development of aerospace technology.
When the satellite antenna structure material is used as a dielectric material, the following conditions need to be satisfied: firstly, the material needs to have good insulating property and microwave property in the aspect of electrical property, and can obtain better wave-transmitting property; secondly, the material has better flame retardance; third, materials are developed toward weight reduction, and cost reduction is possible.
At present, the satellite antenna structure material is mainly carbon fiber-polyetheretherketone alloy, but the carbon fiber is a conductive material with good conductivity, so that the dielectric property of the carbon fiber-polyetheretherketone alloy is poor, the dielectric constant of the carbon fiber-polyetheretherketone alloy is generally 2.73-3.00 under the test frequency of 1MHz, and the dielectric loss is generally 0.019-0.022.
Disclosure of Invention
In order to improve the dielectric property of the satellite antenna structure material, the application provides a PC/PAEK alloy with low dielectric constant and low dielectric loss for a satellite antenna and a preparation method thereof.
In a first aspect, the present application provides a PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antennas, which adopts the following technical scheme:
a PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antennas is prepared from the following raw materials in parts by weight:
by adopting the technical scheme, firstly, the polycarbonate and the polyaryletherketone are melted and blended under the action of the compatilizer, the content of the flexible chain segment in the molecular chain of the PC/PAEK alloy improves the free degree of the molecular chain conformation of the PC/PAEK alloy, so that the stacking density of the PC/PAEK alloy is reduced, the dielectric constant and the dielectric loss of the PC/PAEK alloy are reduced, and the PC/PAEK alloy has better dielectric property; secondly, after the polycarbonate and the polyaryletherketone are blended, the PC/PAEK alloy has good impact resistance and flame retardance; finally, the PC/PAEK alloy has a specific strength of 8.7X 104m2/s2The specific modulus is 8.2m, the material is light, and the cost of the PC/PAEK alloy is reduced because the price of the polycarbonate is far lower than that of the carbon fiber, so that the PC/PAEK alloy has great development potential.
Preferably, the polyaryletherketone is polyether ether ketone, and the number ratio of ether bonds to carbonyl groups in the polyether ether ketone is 1: (2-3).
By adopting the technical scheme, the polyether-ether-ketone has high ether bond content, low biphenyl content and good toughness, and in the proportion range of the ether bond and the carbonyl group, the larger the ether bond content is, the more the flexible chain segment of the PC/PAEK alloy is increased, the better the toughness is and the higher the impact strength is.
Preferably, the raw materials also comprise nano-scale ceramic fillers, and the weight portion of the nano-scale ceramic fillers is 20-30.
By adopting the technical scheme, the nano ceramic filler is an insulating material with larger volume resistivity, and can reduce the dielectric constant and dielectric loss of the PC/PAEK alloy under the combined action of the nano ceramic filler and the size effect.
Preferably, the mass ratio of the nanoscale ceramic filler to the polycarbonate is 1: 2.4.
by adopting the technical scheme, the doping amount of the nano-scale ceramic filler is increased, the dielectric property of the PC/PAEK alloy is better, but the rigidity of the PC/PAEK alloy is increased and the impact strength is reduced due to excessive doping amount of the nano-scale ceramic filler, so that the dielectric property and the impact strength of the PC/PAEK alloy are better in the mass ratio.
Preferably, the nanoscale ceramic filler comprises boron nitride and silicon carbide, and the mass ratio of the boron nitride to the silicon carbide is 1: (0.5-1.5).
By adopting the technical scheme, the insulation performance of the material can be improved by boron nitride, but the impact strength of the PC/PAEK alloy can be reduced by too high doping amount, the insulation performance of the PC/PAEK alloy can be improved by silicon carbide, but the insulation performance of the PC/PAEK alloy is poor by too high doping amount, and the impact strength and the dielectric performance of the material can be improved by compounding the boron nitride and the silicon carbide.
Preferably, the compatilizer is acrylate-organosilicon grafted polymethyl methacrylate core-shell copolymer.
By adopting the technical scheme, the core-shell compatilizer takes the acrylic ester and the organic silicon copolymer as the core, the grafted polymethyl methacrylate as the shell and the nano-scale ceramic filler have a synergistic effect, the dispersibility of the nano-scale ceramic filler in the PC/PAEK alloy is improved, the agglomeration phenomenon of the nano-scale ceramic filler is reduced, and the impact strength of the PC/PAEK alloy is obviously improved.
Preferably, the raw materials also comprise a compound flame retardant, the weight part of the compound flame retardant is 5.5-11 parts, and the compound flame retardant comprises hexaphenoxycyclotriphosphazene and polytetrafluoroethylene.
By adopting the technical scheme, the hexaphenoxy cyclotriphosphazene and the polytetrafluoroethylene are compounded to play a synergistic role on one hand, so that the dielectric property of the PC/PAEK alloy is obviously improved, and on the other hand, the hexaphenoxy cyclotriphosphazene and the polytetrafluoroethylene with low molecular weight are crosslinked to form a macromolecular network, so that the flame retardant and anti-dripping properties of the PC/PAEK alloy are ensured.
Preferably, the mass ratio of the hexaphenoxycyclotriphosphazene to the polytetrafluoroethylene is 1: 0.1.
By adopting the technical scheme, the PC/PAEK alloy has the optimal flame retardant effect in the mass ratio.
In a second aspect, the present application provides a method for preparing a PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antennas, which adopts the following technical scheme:
a preparation method of PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna comprises the following steps:
weighing the polycarbonate and the polyaryletherketone with the formula ratio, and stirring and blending in a high-speed stirrer to obtain a mixture A;
weighing the compatilizer, the antioxidant and the lubricant in the formula ratio, and stirring and blending in a high-speed stirrer to obtain a mixture B;
and putting the mixture A and the mixture B into a double-screw extruder, and fusing, extruding and granulating at the temperature of 300-310 ℃ to obtain the PC/PAEK alloy.
By adopting the technical scheme, the mixture A and the mixture B are respectively premixed and then are subjected to melting modification to prepare the PC/PAEK alloy which has good impact resistance, thermal stability, low dielectric constant and low dielectric loss performance.
In summary, the present application has the following beneficial effects:
1. because the polycarbonate and the polyaryletherketone are melted and blended under the action of the compatilizer, the degree of freedom of molecular chain conformation of the PC/PAEK alloy is improved, the stacking density of the PC/PAEK alloy is reduced, the dielectric constant and the dielectric loss of the PC/PAEK alloy are reduced, and the PC/PAEK alloy has better dielectric property; meanwhile, the PC/PAEK alloy has good impact resistance, good flame retardance, high specific strength and specific modulus and great development potential in the aspect of preparing satellite antennas;
2. in the application, boron nitride and silicon carbide are preferably compounded to be used as a nano-scale ceramic filling material, so that the impact strength and the dielectric property of the PC/PAEK alloy can be improved simultaneously;
3. in the application, hexaphenoxycyclotriphosphazene and polytetrafluoroethylene are preferably compounded, so that on one hand, a synergistic effect is achieved, the dielectric property of the PC/PAEK alloy is remarkably improved, on the other hand, the hexaphenoxycyclotriphosphazene and the polytetrafluoroethylene with low molecular weight are crosslinked to form a macromolecular network, and the flame-retardant anti-dripping property of the PC/PAEK alloy is ensured.
Examples
Unless otherwise specified, the starting materials used in the following examples and comparative examples are derived from the following table:
TABLE 1 sources of raw materials
Example 1
A low dielectric constant and low dielectric loss PC/PAEK alloy for satellite antenna, prepared by the following steps:
s1, weighing 50kg of PC-1100 and 15kg of PEEKK (the number ratio of ether bonds to carbonyl groups is 1:1), putting into an oven, drying at 60 ℃ for 4h, stirring and blending the dried polycarbonate and polyaryletherketone in a high-speed stirrer at the stirring speed of 7200r/h for 10min to obtain a mixture A;
s2, weighing 4kg of SEBS, 0.3g of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol stearate, 0.3kg of tetra (2, 4-di-tert-butylphenol) 4,4' -biphenyl diphosphite, 0.3kg of tri [2, 4-di-tert-butylphenyl ] phosphite and 0.5kg of montan wax, stirring and blending in a high-speed stirrer at the stirring speed of 7200r/h for 10min to obtain a mixture B;
feeding the mixture A and the mixture B into a double-screw extruder, and carrying out melt extrusion, wherein the temperature of each zone of a screw in the extruder is respectively set as follows: the temperature of the first zone is 300 ℃, the temperature of the second zone is 300 ℃, the temperature of the third zone is 305 ℃, the temperature of the fourth zone is 305 ℃, the temperature of the fifth zone is 310 ℃, the temperature of the sixth zone is 310 ℃, the temperature of the seventh zone is 310 ℃, the temperature of the eighth zone is 310 ℃, the temperature of the ninth zone is 3050 ℃, the temperature of the machine head is 310 ℃, the rotating speed of the main machine is 1200rpm, a 2# screw is used, the temperature of the water tank is 60 ℃, and the rotating speed of the granulator is 1000rpm, so that.
Examples 2 to 4
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is based on example 1 and is different from example 1 in that: the raw materials have different compositions, and the specific compositions are shown in the following table:
TABLE 2 composition of the raw materials
Examples 5 to 7
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is based on example 4 and is different from example 4 in that: the ether linkage to carbonyl ratio of the polyether ether ketone varied, and the specific values are shown in the following table:
TABLE 3 ratio of ether linkage to carbonyl group of polyetheretherketone
| Examples | Ether linkage to carbonyl ratio of polyether ether ketone |
| Example 5 | 1:2 |
| Example 6 | 1:2.5 |
| Example 7 | 1:3 |
Examples 8 to 12
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is based on example 4 and is different from example 4 in that: step S2 is added with nano-scale ceramic filler, and the specific composition is as shown in the following table:
TABLE 4 nanoscale ceramic Filler composition
Example 14
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna, based on example 12, is different from example 12 in that: SEBS is replaced by S-2001 with equal mass.
Examples 15 to 17
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna, based on example 14, is different from example 14 in that: step S2, adding a compound flame retardant, wherein the specific composition is shown in the following table:
TABLE 5 composition differences of compounded flame retardants
Comparative example
Comparative example 1
A10% carbon fiber reinforced polyetheretherketone alloy available from Longshida polymers Co., Ltd, Dongguan, under the designation 450ca 10.
Comparative example 2
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is based on example 4 and is different from example 4 in that: polycarbonate is replaced by polyether ether ketone with equal mass.
Comparative example 3
A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is based on example 4 and is different from example 4 in that: the polyether-ether-ketone is replaced by polycarbonate with equal mass.
Performance test
And (3) detecting the performance of the PC/PAEK alloy:
the result of the detection
The performance test data of examples 1-4 show the following specific test results in table 6:
TABLE 6 results of the measurement of the properties of examples 1 to 4
The performance test data of examples 5-7 show the following specific test results:
TABLE 7 results of the measurements of the properties of examples 5 to 7
The performance test data of examples 8-13 show the following specific test results in table 8:
TABLE 8 results of the measurement of the Properties of examples 8 to 13
The performance test data of examples 14-17, the specific test results are shown in table 9 below:
TABLE 9 test results of Properties of examples 14 to 17
The performance test data of comparative examples 1-3 show the following specific test results in table 9:
TABLE 10 Performance test results of comparative examples 1 to 3
By combining example 1 and comparative examples 1-3 and tables 6 and 10, it can be seen that after polycarbonate and polyaryletherketone are melt blended and modified under the action of SEBS, the dielectric constant and the dielectric loss of the prepared PC/PAEK alloy are remarkably reduced, the dielectric constant is reduced from 2.73 to 2.71, the dielectric loss is reduced from 0.022 to 0.013, and the dielectric properties are better; its notched impact strength is from 54KJ/m2Increased to 72KJ/m2The material has better shock resistance; the flame retardant grade is V-0E, and the flame retardant has a good flame retardant effect; the specific strength and the high specific modulus of the carbon fiber reinforced polyether-ether-ketone alloy are similar to those of 10 percent carbon fiber reinforced polyether-ether-ketone alloy, and the carbon fiber reinforced polyether-ether-ketone alloy can be used as a lightweight material.
As can be seen by combining examples 3-7 with tables 6-7, PEEK is superior to PEEK in improving notched impact strength of PC/PAEK alloys, and the higher the impact strength of PC/PAEK alloys as the ether linkage content in the PEEK is increased.
As can be seen from the combination of examples 7-10 and tables 7-8, the incorporation of the nano-sized ceramic filler significantly reduces the dielectric constant and dielectric loss of the PC/PAEK alloy, and the dielectric constant and dielectric loss of the PC/PAEK alloy decrease with the addition of the nano-sized ceramic filler.
Combining examples 10-13 and table 8, it can be seen that the compounding of boron nitride and silicon carbide can simultaneously improve the impact strength and dielectric properties of the material, and the optimal ratio of the two is 1: 1.
It can be seen from the combination of examples 14 to 17 and table 9 that the dielectric property of the PC/PAEK alloy can be significantly improved by compounding hexaphenoxycyclotriphosphazene and polytetrafluoroethylene, and the flame retardant and anti-dripping properties of the PC/PAEK alloy can be improved at the same time.
In summary, the best method for preparing the PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna is the method in example 16.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (9)
1. A PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antennas is characterized by being prepared from the following raw materials in parts by weight:
50-60 parts of polycarbonate
15-20 parts of polyaryletherketone
4-8 parts of compatilizer
0.9 to 1.5 portions of antioxidant
0.5-1 part of lubricant.
2. The PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna as claimed in claim 1, wherein the polyaryletherketone is Polyetheretherketone (PEEK) and the number ratio of ether bond to carbonyl group in PEEK is 1: (2-3).
3. The PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna as claimed in claim 2, wherein the raw material further comprises nano-ceramic filler in an amount of 20-30 parts by weight.
4. The low dielectric constant and low dielectric loss PC/PAEK alloy for satellite antenna according to claim 3, wherein the mass ratio of nano-scale ceramic filler to polycarbonate is 1: 2.4.
5. the low dielectric constant and low dielectric loss PC/PAEK alloy for satellite antennas of claim 4, wherein the nanoscale ceramic filler comprises boron nitride and silicon carbide in a mass ratio of 1: (0.5-1.5).
6. The PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna as claimed in claim 5, wherein the compatibilizer is acrylate-silicone grafted polymethyl methacrylate core-shell copolymer.
7. The PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antennas of claim 6, wherein the raw materials further comprise a compound flame retardant, the weight part of the compound flame retardant is 5.5-11 parts, and the compound flame retardant comprises hexaphenoxycyclotriphosphazene and polytetrafluoroethylene.
8. The PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna as claimed in claim 7, wherein the mass ratio of hexaphenoxycyclotriphosphazene to polytetrafluoroethylene is 1: 0.1.
9. The method of preparing a low dielectric constant and low dielectric loss PC/PAEK alloy for a satellite antenna according to any one of claims 1 to 8, comprising the steps of:
weighing the polycarbonate and the polyaryletherketone with the formula ratio, and stirring and blending in a high-speed stirrer to obtain a mixture A;
weighing the compatilizer, the antioxidant and the lubricant in the formula ratio, and stirring and blending in a high-speed stirrer to obtain a mixture B;
and putting the mixture A and the mixture B into a double-screw extruder, and fusing, extruding and granulating at the temperature of 300-310 ℃ to obtain the PC/PAEK alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110048078.0A CN112920588A (en) | 2021-01-14 | 2021-01-14 | PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110048078.0A CN112920588A (en) | 2021-01-14 | 2021-01-14 | PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112920588A true CN112920588A (en) | 2021-06-08 |
Family
ID=76163047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110048078.0A Pending CN112920588A (en) | 2021-01-14 | 2021-01-14 | PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112920588A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114957913A (en) * | 2022-05-20 | 2022-08-30 | 苏州聚泰新材料有限公司 | Wave-transparent material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080274360A1 (en) * | 2007-05-04 | 2008-11-06 | General Electric Company | Polyaryl ether ketone - polycarbonate copolymer blends |
| CN107004465A (en) * | 2014-09-09 | 2017-08-01 | 古河电气工业株式会社 | The manufacture method of insulated electric conductor, coil and electric/electronic and insulated electric conductor |
| CN107207852A (en) * | 2015-02-09 | 2017-09-26 | 株式会社有泽制作所 | Low dielectric resin composition |
-
2021
- 2021-01-14 CN CN202110048078.0A patent/CN112920588A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080274360A1 (en) * | 2007-05-04 | 2008-11-06 | General Electric Company | Polyaryl ether ketone - polycarbonate copolymer blends |
| CN101802092A (en) * | 2007-05-04 | 2010-08-11 | 沙伯基础创新塑料知识产权有限公司 | polyaryl ether ketone-polycarbonate copolymer blends |
| CN107004465A (en) * | 2014-09-09 | 2017-08-01 | 古河电气工业株式会社 | The manufacture method of insulated electric conductor, coil and electric/electronic and insulated electric conductor |
| CN107207852A (en) * | 2015-02-09 | 2017-09-26 | 株式会社有泽制作所 | Low dielectric resin composition |
Non-Patent Citations (5)
| Title |
|---|
| 刘瑞雪等: "《高分子材料（第1版）》", 30 September 2018, 河南大学出版社 * |
| 李建军主编: "《塑料配方设计（第三版）》", 30 September 2019, 中国轻工业出版社 * |
| 温变英主编: "《高分子材料加工（第2版）》", 30 June 2016, 中国轻工业出版社 * |
| 石安富等: "《工程塑料手册（第1版）》", 31 March 2003, 上海科学技术出版社 * |
| 郭金树主编: "《复合材料件可制造性技术（第1版）》", 30 June 2009, 航空工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114957913A (en) * | 2022-05-20 | 2022-08-30 | 苏州聚泰新材料有限公司 | Wave-transparent material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109370041B (en) | Polypropylene modified material with good rigidity and high elongation at break and preparation method thereof | |
| CN104559109B (en) | A kind of Merlon heat-conductive composite material and preparation method thereof | |
| CN113999498B (en) | Low-post-shrinkage high-toughness flame-retardant PBT/PC composition, and preparation method and application thereof | |
| CN104403258A (en) | Antiflaming reinforcing ABS composite material and preparation method thereof | |
| CN107541049B (en) | Graphene-continuous glass fiber reinforced halogen-free flame-retardant weather-resistant PPO/HIPS alloy material and preparation method thereof | |
| CN112143181A (en) | Highlight high glow wire reinforced flame-retardant PBT (polybutylene terephthalate) composite material as well as preparation method and application thereof | |
| CN112920588A (en) | PC/PAEK alloy with low dielectric constant and low dielectric loss for satellite antenna and preparation method thereof | |
| CN113321873B (en) | Low-shrinkage high-toughness modified polypropylene material and preparation method thereof | |
| CN111484731A (en) | High-modulus flame-retardant reinforced nylon composite material and preparation method thereof | |
| CN103059536B (en) | A kind of polycarbonate/polyethylene alloy heat-conductive composite material and preparation method thereof | |
| CN102775681A (en) | High-temperature precipitation-resistant halogen-free flame-retardant polypropylene composition and preparation method thereof | |
| CN114836011B (en) | Low-dielectric heat-conducting glass fiber reinforced PBT material and application thereof | |
| KR102428814B1 (en) | Thermoplastic resin composition having good low-dielectric property and molded article comprising the same | |
| CN114957862A (en) | Low-temperature-resistant 5G antenna housing material and preparation method thereof | |
| CN115612224A (en) | Polyvinyl chloride composite material and preparation method thereof | |
| WO2022110667A1 (en) | Kaolin-reinforced polyphenylene ether composition, preparation method thereof and use thereof | |
| CN112662050A (en) | Heat-conducting polypropylene material and preparation method thereof | |
| CN113789043A (en) | Heat-conducting junction box material and preparation method and application thereof | |
| CN104650560A (en) | PC/PBT blend alloy with excellent electric and heat conduction and flame retardance | |
| CN110684335A (en) | Natural-color antistatic PCABS composite material and preparation method thereof | |
| CN115612290B (en) | Low-temperature wear-resistant antistatic polyamide composite material and preparation method and application thereof | |
| JPS6154337B2 (en) | ||
| CN113897044B (en) | PC/EVA composition and preparation method thereof | |
| CN113061316B (en) | Graphite whisker filled ABS composition and preparation method thereof | |
| CN116948278A (en) | Ultra-high molecular weight polyethylene material and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210608 |
|
| RJ01 | Rejection of invention patent application after publication |