CN112911794B - Flexible circuit board, display screen and electronic equipment - Google Patents
Flexible circuit board, display screen and electronic equipment Download PDFInfo
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- CN112911794B CN112911794B CN202110080106.7A CN202110080106A CN112911794B CN 112911794 B CN112911794 B CN 112911794B CN 202110080106 A CN202110080106 A CN 202110080106A CN 112911794 B CN112911794 B CN 112911794B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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Abstract
The embodiment of the application provides a flexible circuit board, display screen and electronic equipment, relate to and show technical field, when the nation is decided, the ring shape pad district is heated the inflation, because the existence of through-hole, flexible circuit board can be towards the through-hole extrusion, release radial inflation pressure, so can weaken the ring shape pad district in the radial offset of pad, thereby can reduce the effective bonding area of flexible circuit board at the nation decides in-process and lose, ensure that the flexible circuit board has great effective bonding area after the nation decides. Can ensure that different flexible circuit boards have great drawing force and difficult separation after the nation decides, simultaneously because effective nation decides the area and loses the impedance increase of few nation back signal transmission passageway few, anti jamming capability is stronger in the signal transmission process, can avoid the increase by a wide margin of signal transmission anomaly or conveying consumption.
Description
Technical Field
The application relates to the technical field of display, in particular to a flexible circuit board, a display screen and electronic equipment.
Background
Along with the updating iteration of the electronic equipment, the functions of the electronic equipment are more and more, and the number of lines is also increased continuously. When different Flexible Printed Circuits (FPCs) are bonded, the number of pads to be bonded is increased, and the difficulty of bonding is correspondingly increased. The increase of the bonding difficulty can directly cause that different flexible circuit boards are easy to separate after being bonded or signals are easy to be interfered and other abnormalities. How to solve the above-mentioned abnormality is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
The embodiment of the application provides a flexible circuit board, a display screen and electronic equipment, and aims to solve the technical problems that the flexible circuit board is easy to separate after being bonded and signals are easy to interfere.
In a first aspect of the present application, there is provided a flexible circuit board including: the circuit board comprises a substrate layer and a plurality of welding pads positioned on the substrate layer;
the bonding pads are uniformly distributed in a circular bonding pad area on the substrate layer;
the substrate layer is provided with a through hole in the inner side area of the inner ring of the annular welding disc area.
In above-mentioned structure, when the nation is decided, the ring shape pad district is heated the inflation, because the existence of through-hole, the flexible circuit board can be towards the through-hole extrusion, releases radial expansion pressure, so can weaken the ring shape pad district in the pad at radial offset to can reduce the effective bonding area of flexible circuit board at the nation decides the in-process and lose, ensure that the flexible circuit board has great effective bonding area after the nation decides. Make different flexible circuit boards have great drawing force and difficult separation after the nation, simultaneously because effective nation area loses the impedance increase of few nation back signal transmission passageways less, anti interference ability is stronger in the signal transmission process, can avoid signal transmission unusual or the increase by a wide margin of conveying consumption.
In one possible embodiment of the present application, the shape of the through hole includes a circular shape or a concave polygon, and the geometric center of the through hole coincides with the center of the circular pad region.
In one possible embodiment of the present application, the pad includes a first side close to or coinciding with an outer ring of the circular pad region, a second side close to or coinciding with an inner ring of the circular pad region, and a third side and a fourth side respectively connected between the first side and the second side, where the first side and the second side do not intersect with each other, the third side and the fourth side do not intersect with each other, and the side lengths of the third side and the fourth side are both greater than the side lengths of the first side and the second side;
the pad is in an axial symmetry shape, and a symmetry axis intersecting the first edge and the second edge passes through the circle center of the annular pad area.
In one possible embodiment of the present application, the substrate layer is a flexible substrate including polyimide.
In a possible embodiment of the present application, the pad is rectangular, the first edge and the second edge of the pad are short edges of the rectangle, and the third edge and the fourth edge of the pad are long edges of the rectangle.
In a possible embodiment of this application, the shape of pad is fan ring shape, the first limit of pad and second limit be respectively with the outer loop of circle ring shape pad district and the arc limit of inner ring coincidence, the third limit and the fourth edge of pad are fan ring shape's side.
In one possible embodiment of the present application, the pad is shaped like a fan-shaped ring, the first edge or the second edge of the pad is an arc-shaped edge, and the other edges of the pad are linear edges.
In a possible embodiment of the present application, the shape of the pad is a trapezoid, the first edge of the pad is the bottom edge of the trapezoid, the second edge of the pad is the top edge of the trapezoid, and the third edge and the fourth edge of the pad are the side edges of the trapezoid.
In a second aspect of the present application, a display screen is further provided, where the display screen includes the flexible circuit board of the first aspect.
In a third aspect of the present application, an electronic device is further provided, where the electronic device includes the display screen of the second aspect.
Compared with the prior art, the flexible circuit board that this application embodiment provided, display screen and electronic equipment, when the nation is decided, the ring shape pad district is heated the inflation, flexible circuit board can be towards the through-hole extrusion, release radial expansion stress, so can weaken the ring shape pad district in the pad at radial offset, thereby can ensure that the flexible circuit board has great effective bonding area after the nation decides, different flexible circuit boards have great drawing force and difficult separation after the nation, effective bonding area is great simultaneously, anti interference ability is stronger in the signal transmission process, can avoid the problem of the increase by a wide margin of signal transmission abnormity or transmission consumption.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic diagram of bonding process of bonding pads in bonding pad regions of different flexible circuit boards;
fig. 2 is a schematic cross-sectional view of a part of a film layer of a flexible circuit board according to an embodiment of the present application;
fig. 3 is a schematic top view of a pad arrangement structure according to an embodiment of the present application;
fig. 4 is a schematic top view of a pad arrangement structure according to another embodiment of the present application;
fig. 5 is a schematic top view of a pad arrangement structure according to yet another embodiment of the present application;
fig. 6 is a schematic top view illustrating a pad arrangement structure according to still another embodiment of the present application;
fig. 7 is a schematic top view of a pad arrangement structure according to still another embodiment of the present application;
FIG. 8 is a graph comparing loss of effective bonding area for the same offset for a pad provided by an embodiment of the present application and a pad of the prior art.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," "fourth," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
The inventor researches and analyzes the abnormity that the bonded flexible circuit boards are easy to separate or signals are easy to interfere, and the like, and finds that the deviation of the bonding pads between different bonded flexible circuit boards is one of the main reasons for the abnormity.
The following description will be made by taking the bonding between a touch flexible circuit board (TP-FPC) and a display Driver flexible circuit board (Driver-FPC) in a display panel as an example. Referring to fig. 1, fig. 1 shows a schematic diagram of a bonding process of a pad 120a 'of a pad area 12 a' in a touch flexible circuit board and a pad 120b 'of a pad area 12 b' in a display driving flexible circuit board.
Before bonding the touch flexible circuit board and the display driving flexible circuit board, the pad area 12a 'of the touch flexible circuit board and the pad area 12 b' of the display driving flexible circuit board are precisely aligned. For example, the touch flexible circuit board may be fixed, the display driving flexible circuit board is grabbed by using grabbing equipment, the display driving flexible circuit board and the touch flexible circuit board are aligned by the grabbing equipment, and the display driving flexible circuit board is placed on the touch flexible circuit board after the alignment is successful.
Optionally, in the pad region 12a ' of the touch flexible circuit board, the pads 120a ' may include a regular pad 1201a ' having a normal shape (e.g., a rectangle) and a capture pad 1202a ' having a special shape (e.g., a T-shape), wherein the regular pads 121 ' are arranged in parallel, and the capture pads 122 ' may be located on two sides of the regular pads 121 '. Similarly, in the pad region 12b ' of the display driving flexible circuit board, the pad 120b ' may include a regular pad 1201b ' having a normal shape (e.g., a rectangle) and a capture pad 1202b ' having a special shape (e.g., a T-shape), wherein the regular pad 1201b ' is disposed in parallel, and the capture pad 1202b ' may be located at two sides of the regular pad 1201b '.
The pad region 12a 'of the touch flexible circuit board and the pad region 12 b' of the display driving flexible circuit board can be aligned by aligning the alignment pad 1202a 'of the touch flexible circuit board with the alignment pad 1202 b' of the display driving flexible circuit board. After the alignment is successful, the pad 120a 'in the touch flexible circuit board is overlapped with the pad 120 b' in the display driving flexible circuit board.
Before alignment, an Anisotropic Conductive Film (ACF) is coated on the pad region 12 a' of the touch flexible circuit board, and in a normal state, Conductive particles in the ACF Conductive Film are uniformly distributed in the adhesive and do not contact with each other, and the ACF Conductive Film is non-Conductive. When bonding is performed, the ACF conductive adhesive layer needs to be heated and pressed, which may cause the insulating film layer for preventing conductive particles from being broken, and the ACF conductive adhesive layer is pressed together at the overlapped part of the conventional bonding pads 1201b 'and 1201 a' to form conduction. Meanwhile, the adhesive in the ACF conductive adhesive layer adheres the pad area 12a 'of the touch flexible circuit board and the pad area 12 b' of the display driving flexible circuit board together after being bonded. Because there is the inflation difference in bonding in-process touch-control flexible circuit board and display driver flexible circuit board, lead to originally the pad of accurate counterpoint can appear the skew after bonding. As shown in fig. 1, the offset of the rectangular pad regions (12a ', 12 b') from the center to both sides results in the effective bonding area (black shaded portion in the figure) between the pad 120a 'and the pad 120 b' decreasing from the center to both sides. Because the adhesive is larger than the adhesive generated when the adhesive is used for bonding objects of the same material, when the bonding pads of the touch flexible circuit board and the display driving flexible circuit board are deviated, the adhesive between the two flexible circuit boards is reduced, so that the touch flexible circuit board and the display driving flexible circuit board are insufficient in drawing force, and the bonded touch flexible circuit board and the display driving flexible circuit board are easy to separate. After bonding, the pad area is deviated, so that the overlapped effective bonding area is lost more, the impedance of a signal transmission path is increased, and the problems of reduction of signal anti-interference capability or increase of power consumption and the like are caused.
In order to solve the technical problem, the inventor innovatively designs the following technical scheme, and by changing the layout structure of the bonding pad of the flexible circuit board, the loss of the effective bonding area of the bonding pad after bonding can be reduced, and the bonding pad is ensured to have a larger effective bonding area after bonding, so that the drawing force and the signal anti-interference capability among different flexible circuit boards are ensured. Specific implementations of the present application will be described in detail below with reference to the accompanying drawings.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic cross-sectional view illustrating a film layer structure of the flexible circuit board 10 according to an embodiment of the present disclosure, and fig. 3 is a schematic top view illustrating an arrangement structure of the pads 120 on the flexible circuit board 10 in fig. 2.
The flexible circuit board 10 provided in this embodiment may include a substrate layer 110 and a plurality of pads 120 located on the substrate layer 110. A plurality of pads 120 are uniformly distributed within the annular pad area 12 on a substrate layer 110. The substrate layer 110 is provided with a via 140 on an inner region of the ring 122 in the annular pad region.
Different from the arrangement mode of the bonding pads in the prior art, the flexible circuit board 10 provided in the embodiment of the present application, when bonding, the circular bonding pad region 12 is heated and expanded, because of the existence of the through hole 140, the flexible circuit board 10 can be extruded towards the through hole 140, and the radial expansion stress is released, so that the radial offset of the bonding pads 120 in the circular bonding pad region 12 can be reduced, the effective contact area of the flexible circuit board 120 in the bonding process is large, and the flexible circuit board 120 is ensured to have a large effective bonding area after bonding.
In the embodiment of the present application, referring to fig. 3 and 4, the through hole 140 may have a regular shape or an irregular shape. When the shape of the via hole 140 is a regular shape, the via hole 140 may be a circular via hole or a square via hole, and the geometric center of the circular via hole or the square via hole may coincide with the center of the circular ring-shaped pad region 12. When the shape of the through-hole 140 is irregular, the through-hole 140 may also be a concave polygon as shown in fig. 5, the concave polygon may include a plurality of convex portions, each convex portion points between adjacent pads 120, and the geometric center of the concave polygon may also coincide with the center of the circular pad region 12.
In the embodiment of the present application, the through hole 140 and the inner ring 122 have a certain distance therebetween, so as to prevent the substrate layer 110 from being damaged to the pad 120 when the through hole 140 is punched out. Optionally, the distance between the via 140 and the inner ring 122 is greater than the sum of the via punching precision and the pad fabrication precision. Optionally, the distance between the through hole 140 and the inner ring 122 is 0.2-1 mm.
In this embodiment, the substrate layer 110 may be a flexible substrate layer, and the flexible substrate may be made of Polyimide (PI) material. The substrate layer 110 is a flexible substrate layer, which can provide the flexible circuit board 10 with good bending resistance. Simultaneously, bonding process flexible substrate need be heated the pressurization to extrude the oppression with the conductive particle in the ACF and switch on bonding pad, flexible substrate can take place thermal expansion when being heated, and the embodiment that the application provided sets up through-hole 140 in the pad district, can in time release flexible substrate's expansion stress, avoids the pad on the base plate to appear the skew dislocation.
Further, referring to fig. 3 again, in the embodiment of the present application, the pad 120 includes a first side 1201, a second side 1202, a third side 1203, and a fourth side 1204, which form the pad 120, the first side 1201 is close to the outer ring 121 of the circular pad region or coincides with the outer ring 121 of the circular pad region, the second side 1202 is close to the inner ring 122 of the circular pad region or coincides with the inner ring 122 of the circular pad region, and the third side 1203 and the fourth side 1204 are respectively connected between the first side 1201 and the second side 1202. The first side 1201 and the second side 1202 do not intersect and the third side 1203 and the fourth side 1204 do not intersect, wherein the first side 1201 and the second side 1202 are short sides of the pad 120 and the third side 1203 and the fourth side 1204 are long sides of the pad 120.
In this embodiment, the side lengths of the first side 1201 and the second side 1202 may be equal or unequal, and when the side lengths are unequal, the side length of the first side 1201 is greater than the side length of the second side 1202. The third side 1203 and the fourth side 1204 have the same side length, and the third side 1203 and the fourth side 1204 have the side length larger than that of the first side 1201 and the second side 1202.
In the embodiment, the pad 120 has an axisymmetrical shape, and the symmetry axis 130 intersecting the first side 1201 and the second side 1202 passes through the center of the circular pad region 12.
In the structure of the flexible circuit board 10, the pads 120 are uniformly distributed in a circular pad area 12 on the substrate layer 110, the symmetry axis 130 intersecting with the two short sides (the first side 1201 and the second side 1202) passes through the center of the circular pad area 12, during the bonding process of the flexible circuit board 10, the pads 120 can be offset along the radial direction of the circular pad area 12 (i.e., the direction perpendicular to the two short sides), under the condition that the relative offset distance between different flexible circuit boards is fixed, the effective bonding area of the pads is less lost, and the effective area (electrical contact area) of the bonded pads is larger. Thus, the bonded flexible circuit board 120 can be ensured to be firm, the impedance of the signal transmission channel is small, the signal anti-interference capability is strong, and the power consumption of signal transmission is low.
Referring again to fig. 3 and 4, in an implementation manner of the embodiment of the present application, the pad 120 may have a rectangular shape, the first side 1201 is a straight side near the outer ring 121 of the circular pad region 12, the second side 1202 of the pad 120 is a straight side near the inner ring 122 of the circular pad region 12, and the first side 1201 and the second side 1202 of the pad 120 are short sides of the rectangle. The third side 1203 and the fourth side 1204 of the pad 120 are long sides of a rectangle. An axis of symmetry 130 perpendicular to the first side 1201 and the second side 1202 passes through the center of the circular ring shaped pad region 12. The pad area 12 is designed to be circular, and in the bonding heating process, when the pad 120 expands and deflects along the direction perpendicular to the shortest side of the pad 120, the loss of the effective bonding area of the flexible circuit board 10 caused by the deflection of the pad 120 in the bonding process can be reduced under the condition that the relative expansion offset between different flexible circuit boards is not changed.
Referring to fig. 5, in another implementation manner of the embodiment of the present application, the pad 120 may be shaped as a fan-ring, the first side 1201 of the pad 120 is an arc-shaped side coinciding with the outer ring 121 of the circular pad region 12, the second side 1202 of the pad 120 is an arc-shaped side coinciding with the inner ring 122 of the circular pad region 12, and the third side 1203 and the fourth side 1204 of the pad 120 are sides of the fan-ring. The pads 120 are designed to be fan-shaped, so that the number of the pads 120 on the ring-shaped pad region 12 can be increased, and the space utilization rate of the ring-shaped pad region 12 is improved. When the pad 120 is expanded and biased along the direction perpendicular to the arc-shaped edge (radial direction of the circular pad region 12), the loss of the effective bonding area of the flexible circuit board caused by the bias of the pad 120 in the bonding process can be reduced under the condition that the relative expansion offset between different flexible circuit boards is not changed.
Referring to fig. 6, in another implementation manner of the embodiment of the present application, the pad 120 may have a fan-like shape, wherein the fan-like shape is a shape that is composed of an arc-shaped side and three linear sides and is similar to the fan-like shape. Specifically, in this embodiment, the first side 1201 of the pad 120 may be an arc-shaped side coinciding with the outer ring 121 of the circular ring-shaped pad region 12, the second side 1202 of the pad 120 may be a straight side near the inner ring 122 of the circular ring-shaped pad region 12, and the third side 1203 and the fourth side 1204 of the pad 120 may be straight sides. Alternatively, the first side 1201 of the pad 120 is a straight side near the outer ring 121 of the circular ring shaped pad region 12, the second side 1202 of the pad 120 may be an arc side overlapping with the inner ring 122 of the circular ring shaped pad region 12, and the third side 1203 and the fourth side 1204 of the pad 120 are straight sides. As in the embodiment shown in fig. 5, when the pad 120 is expanded and biased in the direction perpendicular to the arc-shaped edge (radial direction of the annular pad region 12), the loss of the effective bonding area of the flexible circuit board due to the bias of the pad 120 during the bonding process can be reduced under the condition that the relative expansion offset between different flexible circuit boards is not changed.
Referring to fig. 7, in another implementation manner of the embodiment of the present application, the pad 120 may have an isosceles trapezoid shape, the first side 1201 of the pad 120 is a straight side near the outer ring 121 of the circular pad area 12, the second side 1202 of the pad 120 is a straight side near the inner ring 122 of the circular pad area 12, in this implementation manner, the first side 1201 is a top side of the isosceles trapezoid shape, the second side 1202 is a bottom side of the isosceles trapezoid shape, and the third side 1203 and the fourth side 1204 of the pad are side sides of the isosceles trapezoid shape. An axis of symmetry 130 perpendicular to the first side 1201 and the second side 1202 passes through the center of the circular pad region 12. When the bonding pad 120 is expanded and biased in a direction perpendicular to the first side 1201 and the second side 1202, under the condition that the relative expansion offset between different flexible circuit boards is not changed, the loss of the effective bonding area of the flexible circuit board 10 caused by the bias of the bonding pad 120 in the bonding process can also be reduced.
Referring to fig. 8, the following compares the loss of the bonded effective area according to the present application with the loss of the bonded effective area according to the prior art with reference to a specific example. Assuming that the shape of the pad 120 is rectangular, the ratio between the length a and the width b of the pad 120 is 10: 1, the relative offset between the pads that are originally aligned is c. In the prior art, a plurality of pads are arranged side by side at intervals in the width b direction, and after the pads 120 are bonded, the thermal expansion mainly expands from the center of the pad to two sides, that is, expands in the width direction, so that the lost effective bonding area S1 ═ a × c; after the bonding pad 120 of the present application is bonded, the thermal expansion is mainly caused by the expansion of the circular bonding pad region toward the through hole surrounded by the circular bonding pad region, that is, the expansion is caused along the radial direction of the circular bonding pad, and the lost effective bonding area is S2 ═ b × c. Therefore, the ratio of the lost effective bonding area S1 of the application to the lost effective bonding area S2 of the prior art is 1:10, namely the lost effective bonding area of the application is 1/10 of the lost effective bonding area of the prior art, so that the effective bonding area is greatly increased, the contact area between the bonding pads is ensured, and the pull-out force is increased.
The embodiment of the application can also provide a display screen, which can comprise a flexible circuit board, wherein the flexible circuit board can comprise a touch flexible circuit board and a display driving flexible circuit board which adopt the pad layout structure and are bonded with each other. Touch-control flexible circuit board and display driver flexible circuit board are when the nation is fixed, can reduce losing of the effective bonding area of pad, guarantee to have great effective bonding area between the pad after the nation, make touch-control flexible circuit board and display driver flexible circuit board be difficult for separating, and then make the impedance of the signal path that touch-control flexible circuit board and display driver flexible circuit board formed can not too big in order to ensure that the signal has stronger interference killing feature, avoid showing unusual or the too big technical problem of signal transmission consumption. It can be understood that the pad area structure provided by the above embodiment may also be a display screen bonding area pad arrangement structure, and the bonding area pad arrangement is consistent with the pad arrangement on the flexible circuit board, which is beneficial to accurate alignment and electrical conduction when the flexible circuit board is bonded with the display screen. For the flexible display screen, the inner ring of the annular bonding pad area of the bonding area is also provided with the through hole, namely the through hole is arranged in the bonding area which is not used for displaying, the pixel and the driving circuit arrangement of the display area cannot be influenced by the whole bonding area, and the stress caused by thermal expansion is effectively released.
The embodiment of the application can also provide an electronic device, and the electronic device adopts the display screen shown above. By adopting the electronic equipment with the display screen, the problems that the display is abnormal or the display power consumption is increased when the electronic equipment displays can be avoided.
The embodiment of the application provides a flexible circuit board, display screen and electronic equipment, when the nation is decided, the ring shape pad district is heated the inflation, because the existence of through-hole, flexible circuit board can be towards the through-hole extrusion, release radial expansion pressure, so can weaken the ring shape pad district in the pad radial offset to can reduce the effective nation decides the area of flexible circuit board at the nation decides in-process and lose, ensure that the nation decides the back flexible circuit board and have great effective nation decides the area. Can ensure that different flexible circuit boards have great drawing force and difficult separation after the nation decides, simultaneously because effective nation decides the area and loses the impedance increase of few nation back signal transmission passageway few, anti jamming capability is stronger in the signal transmission process, can avoid the increase by a wide margin of signal transmission anomaly or conveying consumption.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A flexible circuit board, comprising: the circuit board comprises a substrate layer and a plurality of welding pads positioned on the substrate layer;
the bonding pads are uniformly distributed in an annular bonding pad area on the substrate layer;
the substrate layer is provided with a through hole in the inner side area of the inner ring of the annular welding disc area;
the pad comprises a first edge close to or coincident with an outer ring of the circular pad area, a second edge close to or coincident with an inner ring of the circular pad area, and a third edge and a fourth edge which are respectively connected between the first edge and the second edge, wherein the first edge and the second edge are not intersected, the third edge and the fourth edge are not intersected, and the side lengths of the third edge and the fourth edge are both greater than those of the first edge and the second edge;
the pad is in an axial symmetry shape, and a symmetry axis intersecting the first edge and the second edge passes through the center of the circular pad area.
2. The flexible circuit board of claim 1, wherein the shape of the through hole comprises a circular or concave polygon, and the geometric center of the through hole coincides with the center of the circular pad region.
3. The flexible circuit board of claim 1, wherein the substrate layer is a flexible substrate comprising polyimide.
4. The flexible circuit board according to any one of claims 1 to 3, wherein the pad has a rectangular shape, the first and second sides of the pad are short sides of the rectangle, and the third and fourth sides of the pad are long sides of the rectangle.
5. The flexible circuit board according to any one of claims 1-3, wherein the shape of the pad is a sector ring, the first and second edges of the pad are arc-shaped edges coinciding with the outer and inner rings of the circular pad region, respectively, and the third and fourth edges of the pad are sides of the sector ring.
6. The flexible circuit board according to any one of claims 1 to 3, wherein the land has a fan-like annular shape, the first or second edge of the land is an arc-shaped edge, and the other edge of the land is a straight edge.
7. The flexible circuit board of any of claims 1-3, wherein the pad has a trapezoidal shape, the first side of the pad is a bottom side of the trapezoidal shape, the second side of the pad is a top side of the trapezoidal shape, and the third and fourth sides of the pad are side sides of the trapezoidal shape.
8. A display screen, characterized in that the display screen comprises a flexible circuit board according to any one of claims 1-7.
9. An electronic device characterized in that it comprises a display screen according to claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110080106.7A CN112911794B (en) | 2021-01-21 | 2021-01-21 | Flexible circuit board, display screen and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110080106.7A CN112911794B (en) | 2021-01-21 | 2021-01-21 | Flexible circuit board, display screen and electronic equipment |
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| CN112911794A CN112911794A (en) | 2021-06-04 |
| CN112911794B true CN112911794B (en) | 2022-06-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423170A (en) * | 2021-06-17 | 2021-09-21 | 北京京东方光电科技有限公司 | Circuit mother board and preparation method of circuit board |
| CN113411953B (en) * | 2021-06-17 | 2022-06-10 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
| CN114743464B (en) * | 2022-05-20 | 2023-11-28 | 昆山国显光电有限公司 | Driving module and display device |
| CN115171531B (en) * | 2022-06-30 | 2023-10-20 | 广州国显科技有限公司 | Bonding device and bonding method |
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