CN112908912A - Automatic circulation line and automatic circulation method in wafer processing process - Google Patents
Automatic circulation line and automatic circulation method in wafer processing process Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000012545 processing Methods 0.000 title claims abstract description 19
- 238000012546 transfer Methods 0.000 claims abstract description 146
- 235000012431 wafers Nutrition 0.000 claims description 111
- 238000005498 polishing Methods 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 13
- 230000032258 transport Effects 0.000 description 15
- 239000000428 dust Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
- B66B9/00—Kinds or types of lifts in, or associated with, buildings or other structures
- B66B9/16—Mobile or transportable lifts specially adapted to be shifted from one part of a building or other structure to another part or to another building or structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F9/00—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes
- B66F9/06—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes movable, with their loads, on wheels or the like, e.g. fork-lift trucks
- B66F9/063—Automatically guided
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F9/00—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes
- B66F9/06—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes movable, with their loads, on wheels or the like, e.g. fork-lift trucks
- B66F9/075—Constructional features or details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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Abstract
The invention provides an automatic transfer line and an automatic transfer method in a wafer processing process, wherein the automatic transfer line comprises a first working area, a second working area, a lifting mechanism and a tray, the lifting mechanism comprises a lifting machine and a transfer box, the lifting machine is provided with a space for accommodating the transfer box, and the lifting machine is used for carrying the transfer box to and fro between the first working area and the second working area; the first working area is provided with a first automatic picking and placing machine and a first transfer mechanism which are used for transferring the trays; the second working area is provided with a second automatic picking and placing machine and a second transfer mechanism which are used for transferring the trays; in the first working interval and the second working interval, the trays can move to and fro on the transfer box through the first transfer mechanism, the first automatic pick-and-place machine, the second automatic pick-and-place machine and the second transfer mechanism. The automatic material circulation line can realize automatic material circulation between different floors and different clean level process workshops, improves the wafer production efficiency, and realizes the automation of production circulation.
Description
Technical Field
The invention relates to the technical field of electronic industry and semiconductor material production and processing, in particular to an automatic circulation line and an automatic circulation method in a wafer processing process.
Background
Driven by 5G communication technology, new energy automobiles, photoelectric applications and the like, the market of semiconductor materials has been rapidly growing in recent years. In the power semiconductor industry chain, the links of single crystal materials, epitaxial materials, devices, modules and applications are mainly included. Among them, the single crystal material is the foundation of power semiconductor technology and industry, and depending on the use of devices, the single crystal polished wafer is required to have high surface quality, such as smooth surface, low surface roughness, no defect, no damage, excellent surface parameters of TTV, Warp, and the like. Otherwise, when the wafer surface has minute defects, the minute defects are also transferred to the epitaxial growth film and become fatal defects of the device. It is clear that excellent wafer processing technology is an important foundation and fundamental guarantee for device production.
Now, with the arrival of industry 4.0, the traditional wafer production circulation mode gradually shows the defects of low efficiency, unstable production quality, large manual demand and the like. Therefore, under the trend of rapid industrial development nowadays, how to realize the automation circulation of wafer production and improve the production efficiency and the product quality are of great significance for the future semiconductor material production and processing.
Disclosure of Invention
The invention mainly aims to provide an automatic transfer line and an automatic transfer method in a wafer processing process, wherein the automatic transfer line can realize automatic transfer of materials between different floors and different clean-level process workshops through arrangement of a transfer mechanism, a lifting mechanism and an automatic pick-and-place mechanism, improves the wafer production efficiency, realizes automation of production transfer, and solves the technical problems of low efficiency, unstable production quality and large manual demand of the traditional wafer production transfer line.
To achieve the above object, according to a first aspect of the present invention, an automated flow line in a wafer processing process is provided.
This automatic flow line in wafer course of working includes first work interval, second work interval, elevating system and tray, wherein:
the lifting mechanism comprises a lifting machine and a transfer box, the lifting machine is provided with a space for accommodating the transfer box, and the lifting machine is used for carrying the transfer box to and fro between the first working interval and the second working interval; the transfer box is used for bearing the tray, and the tray is used for bearing the wafer;
the first working area is provided with a first automatic picking and placing machine and a first transfer mechanism which are used for transferring the tray;
the second working area is provided with a second automatic picking and placing machine and a second transfer mechanism which are used for transferring the tray;
in the first working interval, the tray can pass through the first transfer mechanism and the first automatic pick-and-place machine in sequence to and fro on the transfer box;
in the second working interval, the tray can sequentially pass through the second automatic pick-and-place machine and the second transfer mechanism to and fro on the transfer box.
Further, the first transfer mechanism includes a first conveying rail and a first conveying vehicle that conveys the tray along the first conveying rail;
the second transfer mechanism includes a second conveying rail and a second conveyance cart that transports the tray along the second conveying rail.
Further, the first automatic pick and place machine is a robot forklift, and the tray is taken off from the transfer box and placed on the first transport vehicle by the first automatic pick and place machine, or the tray is taken off from the first transport vehicle and placed in the transfer box.
Further, the second automatic pick and place machine is a robot forklift, and the tray is taken off from the transfer cassette and placed on the second transport vehicle or taken off from the second transport vehicle and placed in the transfer cassette by the second automatic pick and place machine.
Further, the first working area is a polishing workshop, and the first working area is a conventional cleaning workshop and is used for polishing a wafer to be polished.
Further, the second working area is a wax removing and sticking workshop, and the second working area is a hundred-grade clean workshop and is used for performing wax removing operation on the polished wafer and performing wax sticking operation on the wafer to be polished.
Furthermore, an air shower system is further arranged in the first working interval and used for carrying out dust removal treatment on the transfer box and the tray.
To achieve the above object, according to a second aspect of the present invention, there is provided an automated flow-through method in a wafer processing process.
The automatic flow transfer method in the wafer processing process utilizes the automatic flow transfer line and comprises the following steps:
conveying the transfer box loaded with the tray from the second working area to the first working area by using the lifter; a first batch of wafers to be polished are loaded on the tray;
transferring the tray loaded with the first batch of wafers to be polished to a first transfer mechanism by using a first automatic picking and placing machine, and conveying the tray to a polishing operation line; after the polishing operation, obtaining a tray bearing a first batch of polished wafers, and conveying the tray by the first conveying mechanism;
transferring the tray loaded with the polished wafers of the first batch on the first transfer mechanism into the transfer cassette by using a first automatic pick-and-place machine;
transporting the transfer box loaded with the tray loaded with the polished wafers of the first batch from the first working area to the second working area by using an elevator;
transferring the tray loaded with the polished wafers of the first batch onto a second transfer mechanism by using a second automatic picking and placing machine, and conveying the tray to a wax dropping operation line; obtaining a first batch of polished wafers and trays after the wax removal operation; the tray is cleaned, then carries a second batch of wafers to be polished and is conveyed by the second transfer mechanism;
and transferring the tray loaded with the second batch of wafers to be polished on the second transfer mechanism into the transfer box by using a second automatic picking and placing machine, and repeating all the operations of the first batch of wafers to be polished.
Further, the tray is a ceramic tray; the second batch of wafers to be polished is fixedly attached to the tray by wax.
Furthermore, before the transfer box is transported from the first working area to the second working area, the transfer box needs to be dedusted by an air shower system.
Compared with the traditional wafer production circulation mode, the automatic circulation method has the following advantages:
firstly, in the ascending and descending process of the lifter, the tray carrying polished wafers is conveyed in the transfer box from the first working area to the second working area, and the tray carrying the wafers to be polished is conveyed in the transfer box from the second working area to the first working area. Therefore, the elevator runs fully during the whole running process of ascending and descending, and the efficient use of the elevator can be ensured.
And secondly, in the material circulation process at different floors, as the hoister is used, manual push-pull operation for going upstairs and downstairs can be omitted, so that the labor cost is greatly reduced, and the operation efficiency is improved.
And thirdly, in the elevator, due to the arrangement of the transfer box, the transport vehicles on different floors cannot cross the workshop for mixed use, and the situation that the transport vehicle in the first working area enters the second working area to cause environmental pollution can be avoided.
And fourthly, due to the use of the robot forklift, the ceramic disc (the ceramic disc is heavy, and each disc is about 8 kilograms) does not need manual carrying when being transferred to the conveying vehicle from the transfer box, so that a large amount of manpower can be saved, and the risk of falling fragments during manual carrying can be avoided.
The automatic circulation method in the wafer processing process can realize the automatic circulation of materials among different floors and different clean-level process workshops, and has important significance for the future production and processing of semiconductor materials.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic diagram of a circular trace layout of a first operating window according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a circular trace layout of a second operating interval according to an embodiment of the present invention.
In the figure:
1. a hoist; 2. a transfer box; 3. a first automatic pick and place machine; 4. a second automatic pick and place machine; 5. a first conveying rail; 6. a first conveyance vehicle; 7. a tray; 8. a second conveying track; 9. a second conveyance vehicle; 10. an air shower system.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The invention discloses an automatic transfer line in a wafer processing process, which is shown by combining a figure 1 and a figure 2 and comprises a first working area, a second working area, a lifting mechanism and a tray 7, wherein:
the lifting mechanism comprises a lifting machine 1 and a transfer box 2, the lifting machine 1 comprises an accommodating space with an opening, the transfer box 2 is positioned in the accommodating space, and the lifting machine 1 carries the transfer box 2 to and fro between a first working interval and a second working interval and is used for conveying the transfer box 2; the transfer case 2 is used for bearing a tray 7, and the tray 7 is used for bearing wafers, such as wafers to be polished or polished wafers;
a first automatic picking and placing machine 3 and a first transfer mechanism are arranged in the first working interval, and the first automatic picking and placing machine 3 and the first transfer mechanism are both used for transferring the trays 7; in a first working interval, the tray 7 can pass through the first transfer mechanism and the first automatic pick-and-place machine 3 in sequence to and fro on the transfer box 2;
a second automatic picking and placing machine 4 and a second transfer mechanism are arranged in the second working area, and the second automatic picking and placing machine 4 and the second transfer mechanism are both used for transferring the trays 7; in the second working interval, the tray 7 can pass through the second automatic pick-and-place machine 4 and the second transfer mechanism in turn to and fro on the transfer box 2.
In the above embodiment, first, after the elevator 1 reaches the first working area, the first automatic pick-and-place machine 3 takes down the tray 7 carrying the wafer to be polished in the transfer cassette 2 and places the tray on the first transfer mechanism, and the tray 7 carrying the wafer to be polished is transported to the polishing line by the first transfer mechanism, so as to perform polishing operation on the wafer to be polished; the tray 7 carrying the polished wafer is obtained after the polishing work, and the tray 7 carrying the polished wafer is also transported by the first transporting mechanism; subsequently, the first automatic pick and place machine 3 takes off the tray 7 carrying the polished wafer on the first transfer mechanism and places it in the transfer cassette 2; finally, the elevator 1 loads the transfer cassette 2 into the second working area, where the transfer cassette 2 loads the tray 7 with the polished wafers.
After the elevator 1 reaches the second working area from the first working area, the second automatic pick-and-place machine 4 takes down the tray 7 bearing the polished wafers in the transfer cassette 2 and places the tray on the second transfer mechanism, the tray 7 bearing the polished wafers is transported to a workshop through the second transfer mechanism to perform wax removal, cleaning and wax pasting operation of the next batch of wafers to be polished, namely the tray 7 can be recycled, the polished wafers and the tray 7 bearing the next batch of wafers to be polished are finally obtained, and the tray 7 bearing the next batch of wafers to be polished is still transported through the second transfer mechanism. Subsequently, the second automatic pick-and-place machine 4 takes down the tray 7 carrying the next batch of wafers to be polished on the second transfer mechanism and loads the tray into the transfer cassette 2; finally, the elevator 1 loads the transfer cassette 2 into the first working area, and then the tray 7 carrying the wafer to be polished of the next batch is loaded in the transfer cassette 2, and the wafer to be polished of the next batch is polished in the first working area.
As another embodiment of the present invention, the first transfer mechanism includes a first conveying rail 5 and a first conveying vehicle 6, and as shown in fig. 1, the first conveying vehicle 6 conveys the tray 7 along the first conveying rail 5.
As another embodiment of the present invention, the second transfer mechanism includes a second conveying rail 8 and a second conveyance car 9, and as shown in fig. 2, the second conveyance car 9 carries the tray 7 along the second conveying rail 8.
As another embodiment of the present invention, the first automatic pick and place machine 3 is a robot forklift, and as shown in fig. 1, the tray 7 is taken off from the transfer box 2 and placed on the first transport vehicle 6 by the robot forklift, or the tray 7 is taken off from the first transport vehicle 6 and placed in the transfer box 2.
In the embodiment of the present invention, the robot forklift places the tray 7 carrying the wafer to be polished on the first transport vehicle 6, or removes the tray 7 carrying the polished wafer from the first transport vehicle 6 and places it in the transfer cassette 2.
As another embodiment of the present invention, the second automatic pick and place machine 4 is a robot forklift, and as shown in fig. 2, the tray 7 is taken off from the transfer box 2 and placed on the second transport vehicle 9 by the robot forklift, or the tray 7 is taken off from the second transport vehicle 9 and placed in the transfer box 2.
In the embodiment of the present invention, the robot forklift places the tray 7 carrying the polished wafer on the second transport vehicle 9, or takes the tray 7 carrying the wafer to be polished off the second transport vehicle 9 and places it in the transfer cassette 2.
As another embodiment of the present invention, the first working space is a polishing shop, which is a conventional clean shop in which polishing work is mainly performed on wafers to be polished, as shown in fig. 1.
As another embodiment of the present invention, the second working area is a wax-down and wax-bonding workshop, as shown in fig. 2, and the second working area is a hundred-class clean workshop in which wax-down operation is mainly performed on a polished wafer and wax-bonding operation is mainly performed on a wafer to be polished.
As another embodiment of the present invention, an air shower system 10 is further disposed in the first working area, and the air shower system 10 is mainly used for performing dust removal processing on the transfer box 2 and the tray 7.
In the embodiment of the invention, the tray 7 carrying polished wafers in the first conveying vehicle 6 is taken down and loaded into the empty transfer box 2 by the robot forklift, and the transfer box 2 carrying the tray 7 carrying polished wafers is subjected to air showering dust removal by the air showering system 10 before entering the elevator 1, so that the tray 7 carrying polished wafers can be ensured to be clean when entering the second working area. Finally, the elevator 1 loads the transfer cassette 2 into the second working space, the transfer cassette 2 being loaded with the tray 7 carrying the polished wafers.
And because the cleanliness degree of the second working interval is higher than that of the first working interval, air shower dust removal is not needed when the tray 7 bearing the wafers to be polished in the second working interval enters the first working interval.
The invention also discloses an automatic transfer method in the wafer processing process, which utilizes the automatic transfer line and has the following specific operation flows:
conveying the transfer box loaded with the tray from the second working area to the first working area by using the lifter; wherein the tray carries a first batch of wafers to be polished.
Transferring the tray loaded with the first batch of wafers to be polished to a first transfer mechanism by using a first automatic pick-and-place machine, and conveying the tray to a polishing operation line; after the polishing operation, a tray carrying the first batch of polished wafers is obtained, and the tray carrying the first batch of polished wafers is also transported by the first transfer mechanism.
The tray carrying the polished wafers of the first lot on the first transfer mechanism is transferred to a transfer cassette by a first automatic pick and place machine.
Conveying the transfer box loaded with the tray from the first working area to the second working area by using the lifter; wherein the tray carries a first batch of polished wafers.
In this step, the transfer cassette needs to be dedusted by the air shower system before being transported from the first working area to the second working area, so as to ensure the cleanness of the trays carrying the first batch of polished wafers.
Transferring the tray loaded with the polished wafers of the first batch onto a second transfer mechanism by using a second automatic pick-and-place machine, and conveying the tray to a wax-dropping operation line; the first batch of polished wafers and trays were obtained after the wax removal operation.
In this step, the tray can be recycled, and after the tray is cleaned, the tray will carry a second batch of wafers to be polished, and the tray carrying the second batch of wafers to be polished will still be transported by the second transfer mechanism.
And transferring the tray loaded with the second batch of wafers to be polished on the second transfer mechanism into the transfer box by using a second automatic picking and placing machine, and repeating all the operations of the first batch of wafers to be polished.
In the embodiment of the invention, the wafer to be polished is attached to the tray one by wax, so as to obtain the tray bearing the wafer to be polished; after the wafer to be polished is polished by a machine, wax removal operation is required, namely the wafer to be polished is taken down from the tray to obtain the polished wafer and the tray, the tray can be recycled, and after the tray is cleaned, the wafer to be polished in the second batch is fixedly attached to the tray by wax to obtain the tray bearing the wafer to be polished in the second batch.
As another embodiment of the present invention, the tray may be a ceramic tray.
The automated flow-through method in wafer processing according to the present invention will be described in detail below with reference to specific embodiments.
Example 1:
as shown in fig. 1, the first floor of the plant is a polishing plant, which is clean on a regular basis. In the workshop, polishing operation is mainly carried out on the wafer which is pasted with wax and is to be polished, firstly, after a lifting machine reaches the first floor, an automatic robot forklift takes down a tray (which can be called as a disk to be polished) which is loaded with the wafer to be polished in a transfer box in an elevator and puts the tray on a trolley in a transfer track, and then the trolley filled with the disk to be polished moves leftwards to enter a polishing line for polishing operation. And then, the tray (called a wax tray to be removed) carrying polished wafers in the transfer track is taken down and loaded into an empty elevator transfer box by an automatic robot forklift, and the elevator transfer box filled with the wax tray is subjected to dust removal by an air spraying system before entering a hoisting machine, so that the cleanness of the transported products when entering a second floor can be ensured. And finally, the elevator is loaded with the elevator transfer box and enters a second floor workshop.
As shown in fig. 2, the second floor of the plant is a wax removal and sticking plant, and the cleaning standard is hundred grades of cleaning. In the workshop, wax removing operation and wax pasting operation are mainly carried out on polished wafers, when a hoist arrives at the second floor from the first floor, an automatic robot forklift takes down wax plates to be removed in an elevator transfer box and puts the wax plates onto a trolley in a transfer track, and the trolley filled with the wax plates to be removed moves leftwards to enter the workshop to carry out wax removing, cleaning and wax pasting operation. And then, the automatic robot forklift takes down the discs to be polished after being pasted with wax in the transfer track and loads the discs into an empty elevator transfer box. And finally, the elevator transfer box is loaded by the elevator to enter a first-floor workshop (the cleanliness of the second floor is higher than that of the first floor, so that air shower dust removal is not needed when the materials of the second floor enter the first floor).
In the whole process from the first floor to the second floor and then from the second floor to the first floor, the whole process can form a set of complete and efficient circulation operation.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides an automatic circulation line in wafer course of working which characterized in that, includes first work interval, second work interval, elevating system and tray (7), wherein:
the lifting mechanism comprises a lifting machine (1) and a transfer box (2), the lifting machine (1) is provided with a space for accommodating the transfer box (2), and the lifting machine (1) is used for carrying the transfer box (2) to and fro between the first working interval and the second working interval; the transfer box (2) is used for bearing the tray (7), and the tray (7) is used for bearing wafers;
the first working space is provided with a first automatic picking and placing machine (3) and a first transfer mechanism which are used for transferring the tray (7);
the second working space is provided with a second automatic picking and placing machine (4) and a second transfer mechanism which are used for transferring the tray (7);
in the first working interval, the tray (7) can pass through the first transfer mechanism and the first automatic pick-and-place machine (3) in sequence to and fro on the transfer box (2);
in the second working interval, the tray (7) can pass through the second automatic picking and placing machine (4) and the second transfer mechanism in sequence to and fro on the transfer box (2).
2. The automated flow line in wafer processing according to claim 1, characterized in that the first transfer mechanism comprises a first transport track (5) and a first transport cart (6), the first transport cart (6) transporting the trays (7) along the first transport track (5);
the second transfer mechanism comprises a second conveying track (8) and a second transport carriage (9), the second transport carriage (9) transporting the pallet (7) along the second conveying track (8).
3. The automated in-process wafer handling line of claim 2, characterized in that the first automated pick and place machine (3) is a robotic forklift and the trays (7) are taken from the transfer cassette (2) and placed on the first transport cart (6) or the trays (7) are taken from the first transport cart (6) and placed in the transfer cassette (2) by the first automated pick and place machine (3).
4. The automated in-process wafer handling line of claim 2, characterized in that the second automated pick and place machine (4) is a robotic forklift and the trays (7) are taken from the transfer cassette (2) and placed on the second transport cart (9) or the trays (7) are taken from the second transport cart (9) and placed in the transfer cassette (2) by the second automated pick and place machine (4).
5. The automated in-process flow line of claim 1, wherein the first work area is a polishing shop and is a conventional clean shop for performing polishing operations on wafers to be polished.
6. The automated in-process flow line of claim 5, wherein the second work area is a wax removal and wax attachment shop, and is a hundred-class clean shop for performing a wax removal operation on a polished wafer and a wax attachment operation on the wafer to be polished.
7. The automated flow line of claim 1, wherein a shower system (10) is further disposed in the first working area for dedusting the transfer cassette (2) and the tray (7).
8. An automated flow-through method in a wafer processing process, characterized in that, using the automated flow-through line of any of claims 1-7, comprising the steps of:
conveying the transfer box loaded with the tray from the second working area to the first working area by using the lifter; a first batch of wafers to be polished are loaded on the tray;
transferring the tray loaded with the first batch of wafers to be polished to a first transfer mechanism by using a first automatic picking and placing machine, and conveying the tray to a polishing operation line; after the polishing operation, obtaining a tray bearing a first batch of polished wafers, and conveying the tray by the first conveying mechanism;
transferring the tray loaded with the polished wafers of the first batch on the first transfer mechanism into the transfer cassette by using a first automatic pick-and-place machine;
transporting the transfer box loaded with the tray loaded with the polished wafers of the first batch from the first working area to the second working area by using an elevator;
transferring the tray loaded with the polished wafers of the first batch onto a second transfer mechanism by using a second automatic picking and placing machine, and conveying the tray to a wax dropping operation line; obtaining a first batch of polished wafers and trays after the wax removal operation; the tray is cleaned, then carries a second batch of wafers to be polished and is conveyed by the second transfer mechanism;
and transferring the tray loaded with the second batch of wafers to be polished on the second transfer mechanism into the transfer box by using a second automatic picking and placing machine, and repeating all the operations of the first batch of wafers to be polished.
9. The automated flow-through method of claim 8, wherein the tray is a ceramic disk; the second batch of wafers to be polished is fixedly attached to the tray by wax.
10. The method of claim 9, wherein the transfer cassette is dedusted by a fan system before being transported from the first station to the second station.
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| CN202110148594.0A CN112908912A (en) | 2021-02-02 | 2021-02-02 | Automatic circulation line and automatic circulation method in wafer processing process |
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| CN202110148594.0A CN112908912A (en) | 2021-02-02 | 2021-02-02 | Automatic circulation line and automatic circulation method in wafer processing process |
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