CN112899761A

CN112899761A - Integrated circuit electroplating equipment

Info

Publication number: CN112899761A
Application number: CN202110056702.1A
Authority: CN
Inventors: 高明
Original assignee: Peixian Kelu New Energy Technology Service Center
Current assignee: Shenzhen Zhongming Electronics Co ltd
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-06-04
Anticipated expiration: 2041-01-15
Also published as: CN112899761B

Abstract

The invention provides an integrated circuit electroplating device, which relates to the technical field of circuit electroplating and solves the problems that in the practical application process of the existing circuit electroplating device, a special clamp is needed to clamp when electroplating is carried out due to inconsistent shapes of circuit boards, so that resource waste is caused by the need of using the special clamp every time, and the circuit boards are not effectively cleaned before processing, and are easy to be damaged when electroplating due to impurities on the surfaces of the circuit boards, and the integrated circuit electroplating device comprises a clamping mechanism which is arranged at the left side position of the top end surface of a bearing mechanism, in the invention, a bidirectional screw rod is driven to rotate by the rotation of a bevel gear set, every two limiting plates are driven to clamp chips by the meshing transmission of the bidirectional screw rod and a sliding block fixedly connected to the bottom end surfaces of the limiting plates, and through grooves are arranged in the limiting plates, therefore, the chip can be clamped without influencing the normal electroplating of the chip.

Description

Integrated circuit electroplating equipment

Technical Field

The invention belongs to the technical field of circuit electroplating, and particularly relates to integrated circuit electroplating equipment.

Background

The integrated circuit is a miniature electronic device or component, and adopts a certain process to interconnect the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and the wiring together, and make them on a small piece or several small pieces of semiconductor wafer or medium substrate, then package them in a tube shell to form the miniature structure with required circuit function; all the elements are integrated in structure, so that the electronic element is miniaturized, low in power consumption, intelligent and high in reliability, and its circuit is indicated by using letter "IC", and the electroplating process is a process for plating a thin layer of other metal or alloy on the surface of some metal by utilizing electrolysis principle, and is a process for making the surface of metal or other material product be attached with a layer of metal film by utilizing electrolysis action so as to obtain the functions of preventing metal oxidation (corrosion), raising wear resistance, conductivity, reflection resistance and corrosion resistance (copper sulfate, etc.) and raising beautiful appearance,

for example, application No.: CN201910563288.6 the invention discloses an electroplating device for manufacturing a flexible circuit board, which comprises a mounting bracket, a U-shaped embedded card, an anode bar, a shell, an inner cavity and a cathode electrode structure, wherein the inner space of the shell is an inner cavity, electrolyte is filled in the inner cavity when the inner cavity is electroplated, the inner cavity is internally provided with the cathode electrode structure and the anode bar, the electrode structure and the anode bar are symmetrically distributed around the central line of the inner cavity, copper ions are gathered in a single direction and are not easy to cross in the process of electrolytic copper plating, the top end of the anode bar is fixed by the mounting bracket and the U-shaped embedded card, the invention mainly utilizes the cooperation of an adjusting structure and a placing splint to realize the elastic fixation of the flexible circuit board during electroplating and after electroplating on the one hand, and adjusts the angle of the placing splint to ensure that the electrolyte automatically slides down after being flattened and unfolded without generating liquid accumulation on the other hand, prevent the discoloration caused by the chemical reaction when contacting with air and the like in the later period.

Based on the above patent search, and the discovery of the equipment in the prior art, the above equipment can perform the electroplating operation on the circuit board when in use, but in the practical application process, the circuit board is not consistent in shape, so that a special clamp is required to clamp when electroplating processing is performed, so that resource waste is caused by the need of clamping by using the special clamp every time, and in addition, the circuit board is not effectively cleaned before processing, and the circuit board is easily damaged when electroplating due to impurities on the surface of the circuit board.

Disclosure of Invention

In order to solve the above technical problems, the present invention provides an integrated circuit electroplating apparatus, which solves the problems that in the actual application process of the existing circuit electroplating apparatus, a special clamp is required to clamp a circuit board during electroplating due to inconsistent shapes of the circuit board, so that a resource waste is caused by the need of clamping with the special clamp every time, and the circuit board is not effectively cleaned before being processed, and the circuit board is easily damaged during electroplating due to impurities on the surface of the circuit board.

The invention relates to an integrated circuit electroplating device, which is achieved by the following specific technical means:

an integrated circuit electroplating device comprises a clamping mechanism, a sliding mechanism and a cleaning mechanism, wherein the clamping mechanism is arranged at the left side position of the top end face of a bearing mechanism; the sliding mechanisms are arranged at two positions, and the two sliding mechanisms are respectively inserted at the left side and the right side of the rear end of the driving mechanism; the cleaning mechanism is arranged at the inner side position of the driving mechanism; clean mechanism is including pivot, change, clamping jaw and cleaning roller, the change is installed to the left end of pivot, the clamping jaw is equipped with everywhere altogether, and the clamping jaw of everywhere is the inboard position at the change of annular array installation to the inboard clamp of everywhere clamping jaw has the cleaning roller, and two pivot difference fixed connection are in the inside left and right sides position of the bracket of U-shaped under the installation state.

Furthermore, the bearing mechanism comprises a support and a guide rail, a sliding groove is formed in the guide rail, guide grooves are formed in the left side and the right side of the guide rail, the guide rail is provided with two positions, and the two guide rails are fixedly connected to the left side and the right side of the front end surface of the support respectively;

furthermore, the bearing mechanism also comprises limiting plates, sliding blocks and fixing plates, eight limiting plates are arranged, wherein every two limiting plates are in one group, the four groups of limiting plates are connected to the inner side of the support in a longitudinal array sliding mode, the sliding blocks are fixedly connected to the left side and the right side of the bottom end face of each limiting plate, and the fixing plates are screwed to the right side of the support through bolts;

furthermore, the clamping mechanism comprises a motor A, gears A and chains, wherein the gears A are provided with five positions, the gear A at the uppermost side is arranged at the left end position of the motor A, the five gears A are arranged in a longitudinal array, and the chains are meshed and driven at the outer sides of the five gears A;

furthermore, the clamping mechanism also comprises a bevel gear set and a bidirectional screw rod, the bevel gear set is provided with five positions, the five bevel gear sets are respectively installed at the right side positions of the five gears A, the bidirectional screw rod is installed inside the five bevel gear sets, and the bidirectional screw rod is in meshing transmission with the sliding block in the installation state;

furthermore, the driving mechanism comprises a bracket, a motor B, a gear B and a chain B, the bracket is designed in a U-shaped structure, the motor B is arranged on the left side of the front end of the bracket, the gear B is provided with two positions, the chains B are meshed and driven on the outer sides of the two positions of the gear B, and the gear B positioned on the rear side in the installation state is arranged at the left side position of the motor B;

furthermore, slide mechanism is including bedplate, curb plate and pulley, the curb plate is equipped with two altogether, and two curb plates fixed connection respectively in the rear end face left and right sides position of bedplate to the inboard of two curb plates is vertical array and installs the pulley of two equidimensions, and the pulley that is located the upside under the installation state is connected with gear B looks axle.

Compared with the prior art, the invention has the following beneficial effects:

in the invention, after the integrated circuit is inserted, the fixing plate is inserted into the groove position at the right end of the bracket through the bolt, then the motor A in the clamping mechanism is started, the other four gears A are driven to synchronously rotate through the meshing transmission between the gear A arranged at the left end of the motor A and the chain, further the bidirectional screw rod is driven to rotate through the rotation of the bevel gear set, every two limiting plates are driven to clamp the chip through the meshing transmission of the bidirectional screw rod and the sliding block fixedly connected with the bottom end surface of the limiting plate, and the through groove is arranged in the limiting plates, so that the normal electroplating of the chip can not be influenced while the chip is clamped, on the other hand, the pulley can slide along the sliding groove arranged at the front end of the guide rail through the guide grooves arranged at the left side and the right side of the guide rail through the side plate, and further the cleaning roller in the cleaning mechanism is carried by the bracket to clean the chip clamped at the inner side of, thereby avoiding the condition of poor electroplating effect caused by dust attached to the surface of the circuit.

Drawings

Fig. 1 is a right side view schematically showing the structure of the present invention in a half-section state.

Fig. 2 is a schematic bottom side view of the present invention in a half-section state.

Fig. 3 is a schematic front view of the present invention in a half-section state.

Fig. 4 is a schematic top view of the present invention in a half-section state.

Fig. 5 is a schematic rear side view of the present invention in a half-section state.

Fig. 6 is an enlarged schematic view of the structure at a in fig. 4 according to the present invention.

Fig. 7 is an enlarged view of the structure of fig. 5B according to the present invention.

Fig. 8 is an enlarged view of the structure of fig. 4 at C according to the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a carrying mechanism; 101. a support; 102. a guide rail; 103. a limiting plate; 104. a slider; 105. a fixing plate; 2. a clamping mechanism; 201. a motor A; 202. a gear A; 203. a chain; 204. a bevel gear set; 205. a bidirectional screw rod; 3. a drive mechanism; 301. a bracket; 302. a motor B; 303. a gear B; 304. a chain B; 4. a sliding mechanism; 401. a seat plate; 402. a side plate; 403. a pulley; 5. a cleaning mechanism; 501. a rotating shaft; 502. rotating the ring; 503. a clamping jaw; 504. and cleaning the roller.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 8:

the invention provides an integrated circuit electroplating device, comprising: the device comprises a clamping mechanism 2, a sliding mechanism 4 and a cleaning mechanism 5, wherein the clamping mechanism 2 is arranged at the left side position of the top end face of a bearing mechanism 1; the sliding mechanisms 4 are arranged at two positions, and the two sliding mechanisms 4 are respectively inserted at the left side and the right side of the rear end of the driving mechanism 3; the cleaning mechanism 5 is arranged at the inner side position of the driving mechanism 3; the cleaning mechanism 5 comprises a rotating shaft 501, a rotating ring 502, clamping jaws 503 and a cleaning roller 504, wherein the rotating ring 502 is installed at the left end of the rotating shaft 501, the clamping jaws 503 are arranged at four positions, the four clamping jaws 503 are installed at the inner side position of the rotating ring 502 in an annular array mode, the cleaning roller 504 is clamped at the inner sides of the four clamping jaws 503, and the two rotating shafts 501 are fixedly connected to the left side position and the right side position inside the U-shaped bracket 301 respectively in the installation state.

The bearing mechanism 1 includes a support 101 and a guide rail 102, a sliding groove is provided in the guide rail 102, guide grooves are provided on both sides of the guide rail 102, the guide rail 102 has two positions, and the two guide rails 102 are respectively and fixedly connected to the left and right sides of the front end surface of the support 101.

Wherein, load-bearing mechanism 1 still includes limiting plate 103, slider 104 and fixed plate 105, and limiting plate 103 is equipped with eight altogether, and wherein per two limiting plates 103 is a set of, and four sets of limiting plates 103 are vertical array sliding connection in the inboard position of support 101 to the equal fixedly connected with slider 104 in both sides about the bottom face of every limiting plate 103, and fixed plate 105 passes through the bolt and connects the right side position at support 101.

The clamping mechanism 2 comprises a motor A201, gears A202 and a chain 203, the gears A202 are provided with five positions, wherein the gear A202 at the uppermost side is installed at the left end position of the motor A201, the five gears A202 are arranged in a longitudinal array, and the chains 203 are meshed and driven at the outer sides of the five gears A202.

The clamping mechanism 2 further comprises a bevel gear set 204 and a bidirectional screw 205, the bevel gear set 204 is provided with five positions, the five bevel gear sets 204 are respectively installed at the right side positions of the five gears A202, the bidirectional screw 205 is installed inside the five bevel gear sets 204, and the bidirectional screw 205 is in meshing transmission with the slider 104 in the installation state.

Wherein, actuating mechanism 3 is including bracket 301, motor B302, gear B303 and chain B304, bracket 301 is the design of U-shaped structure, and motor B302 is installed on the front end left side of bracket 301, gear B303 is equipped with two places altogether, and the outside meshing transmission of two places gear B303 has chain B304, gear B303 that is located the rear side under the installation state installs the left side position at motor B302, carry cleaning roller 504 among the cleaning mechanism 5 through bracket 301 and carry out the cleaning operation to the chip of pressing from both sides the clamp in the limiting plate 103 inboard, and then can avoid causing the poor condition of electroplating effect to appear because of the dust is adhered to on the circuit surface.

The sliding mechanism 4 includes a seat plate 401, side plates 402 and pulleys 403, the side plates 402 are provided with two positions, the two side plates 402 are respectively and fixedly connected to the left and right sides of the rear end surface of the seat plate 401, the pulleys 403 with the same size are longitudinally arranged inside the two side plates 402, and the pulleys 403 on the upper side are axially connected with the gear B303 in the mounted state.

When in use: firstly, batch integrated circuits to be processed are inserted into the inner side position of the bracket 101 in batch through a slot arranged at the right end of the bracket 101 in the bearing mechanism 1, when the ic is inserted into the slot at the right end of the bracket 101, the fixing plate 105 is inserted into the slot by bolts, then, by starting the motor A201 in the clamping mechanism 2, the other four gears A202 are driven to synchronously rotate through the meshing transmission between the gear A202 arranged at the left end of the motor A201 and the chain 203, then the bidirectional screw rod 205 is driven to rotate by the rotation of the bevel gear set 204, every two position limiting plates 103 are driven to clamp the chip by the meshing transmission of the bidirectional screw rod 205 and the slide block 104 fixedly connected with the bottom end surface of the limiting plate 103, moreover, as the through groove is formed in the limiting plate 103, the chip can be clamped and normal electroplating of the chip can not be affected;

on the other hand, the gear B303 is driven by starting the motor B302 fixedly connected to the front end of the bracket 301 in the driving mechanism 3, and then the pulley 403 axially connected to the inner side of the side plate 402 in the sliding mechanism 4 is driven by the meshing transmission between the gear B303 and the chain B304, and the pulley 403 can slide along the sliding groove formed in the front end of the guide rail 102 through the guide grooves formed in the left side and the right side of the guide rail 102 by the side plate 402, and then the cleaning roller 504 in the cleaning mechanism 5 is carried by the bracket 301 to clean the chip clamped in the inner side of the limit plate 103, so that the poor electroplating effect caused by the dust attached to the surface of the circuit can be avoided.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. An integrated circuit plating apparatus, characterized by: the cleaning device comprises a clamping mechanism (2), a sliding mechanism (4) and a cleaning mechanism (5), wherein the clamping mechanism (2) is arranged at the left side position of the top end face of a bearing mechanism (1); the sliding mechanisms (4) are arranged at two positions, and the two sliding mechanisms (4) are respectively inserted at the left side and the right side of the rear end of the driving mechanism (3); the cleaning mechanism (5) is arranged at the inner side position of the driving mechanism (3); cleaning mechanism (5) is including pivot (501), swivel (502), clamping jaw (503) and cleaning roller (504), swivel (502) are installed to the left end of pivot (501), clamping jaw (503) are equipped with everywhere altogether, and everywhere clamping jaw (503) are the inboard position at swivel (502) of annular array installation to the inboard clamp of everywhere clamping jaw (503) has cleaning roller (504), and two pivot (501) difference fixed connection are in the inside left and right sides position of U-shaped bracket (301) under the installation state.

2. An integrated circuit plating apparatus as recited in claim 1, wherein: the bearing mechanism (1) comprises a support (101) and a guide rail (102), a sliding groove is formed in the guide rail (102), guide grooves are formed in the left side and the right side of the guide rail (102), the guide rail (102) is provided with two positions, and the two guide rails (102) are respectively and fixedly connected to the left side and the right side of the front end face of the support (101).

3. An integrated circuit plating apparatus as recited in claim 2, wherein: bearing mechanism (1) still includes limiting plate (103), slider (104) and fixed plate (105), limiting plate (103) are equipped with eight departments altogether, and wherein per two limiting plate (103) are a set of, and four sets of limiting plate (103) are the inboard position of longitudinal array sliding connection at support (101) to the equal fixedly connected with slider (104) of the bottom face left and right sides of per limiting plate (103), fixed plate (105) are twisted through the bolt and are connect the right side position at support (101).

4. An integrated circuit plating apparatus as recited in claim 1, wherein: the clamping mechanism (2) comprises a motor A (201), a gear A (202) and a chain (203), the gear A (202) is provided with five positions, the gear A (202) on the uppermost side is installed at the left end position of the motor A (201), the five gears A (202) are arranged in a longitudinal array mode, and the chain (203) is meshed and driven on the outer sides of the five gears A (202).

5. An integrated circuit plating apparatus as recited in claim 4, wherein: the clamping mechanism (2) further comprises a bevel gear set (204) and a bidirectional screw rod (205), the bevel gear set (204) is provided with five positions, the five bevel gear sets (204) are respectively installed at the right side positions of the five gears A (202), the bidirectional screw rod (205) is installed inside the five bevel gear sets (204), and the bidirectional screw rod (205) and the sliding block (104) are in meshed transmission in the installation state.

6. An integrated circuit plating apparatus as recited in claim 1, wherein: actuating mechanism (3) are including bracket (301), motor B (302), gear B (303) and chain B (304), bracket (301) are the design of U-shaped structure, and install motor B (302) on the left of the front end of bracket (301), gear B (303) are equipped with two places altogether, and the outside meshing transmission of two places gear B (303) has chain B (304), and the left side position at motor B (302) is installed in gear B (303) that are located the rear side under the installation state.

7. An integrated circuit plating apparatus as recited in claim 1, wherein: the sliding mechanism (4) comprises a seat plate (401), side plates (402) and pulleys (403), wherein the side plates (402) are arranged at two positions, the two side plates (402) are fixedly connected to the left side and the right side of the rear end face of the seat plate (401) respectively, the pulleys (403) with the same size at the two positions are longitudinally arranged on the inner sides of the two side plates (402), and the pulleys (403) positioned on the upper side in the installation state are in shaft connection with a gear B (303).