CN112898936A - Rapidly-operable JQ-1 glue prepared by compounding and modifying organic and inorganic wastes - Google Patents

Abstract

The invention belongs to the technical field of polyurethane adhesives, and discloses a JQ-1 adhesive which can be quickly operated and is prepared by compounding and modifying organic and inorganic wastes. Under the condition of room temperature, the waste wood flour and the hollow microspheres are compounded and used for preparing the modified JQ-1 glue, and the obtained compounded modified JQ-1 glue has the characteristics of low cost, easiness in operation, excellent performance and contribution to actual production. Solves the problems of low curing speed and thin glue solution of the JQ-1 glue. The surface drying time of the compound modified JQ-1 adhesive is shortened, the curing speed is improved, the flow resistance is improved, the viscosity of the adhesive liquid is increased, the adhesive property is good, and the water resistance and the heat resistance are superior to those of the unmodified JQ-1 adhesive.

Description

Rapidly-operable JQ-1 glue prepared by compounding and modifying organic and inorganic wastes

Technical Field

The invention belongs to the technical field of polyurethane adhesives, and relates to a JQ-1 adhesive which can be quickly operated and is prepared by compounding and modifying organic and inorganic wastes. In particular to a JQ-1 adhesive which can be rapidly operated and is modified by organic and inorganic wastes.

Background

JQ-1 adhesive is one kind of isocyanate adhesive, has chemically active isocyanate group (-NCO), can effectively bond materials such as metal, rubber and the like due to the existence of the group, and is widely applied due to the characteristics of small adhesive application amount, normal-temperature curing, heating curing and the like. However, with the increasing application demand, the JQ-1 adhesive is limited in application due to the slow curing speed and the gradually exposed problems of the diluted adhesive solution, so that the selection of a proper method for solving the problems existing in the current stage of the JQ-1 adhesive has important significance in improving the performance of the JQ-1 adhesive. The JQ-1 adhesive has high production cost, and the solvent used at present is chlorobenzene with certain toxicity, so that the selection of nontoxic, environment-friendly and cheap raw materials is crucial when the JQ-1 adhesive is modified; in addition, considering the complexity of the JQ-1 glue production process, the process of modifying the JQ-1 glue is as simple as possible, and the increase of difficulty in the operation process and the increase of additional production cost or potential safety hazard caused by complex operation are avoided. In addition, currently, JQ-1 glue is often used as a cross-linking agent for preparing a novel adhesive, so that the comprehensive performance of the JQ-1 glue is improved, and the possibility of improving the performance of the novel adhesive prepared by using JQ-1 is also provided.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide the modified JQ-1 glue compounded by organic and inorganic wastes, which can be quickly operated, and the waste wood flour and the hollow microspheres are compounded for preparing the modified JQ-1 glue at room temperature, so that the obtained compounded modified JQ-1 glue has the characteristics of low cost, easiness in operation, excellent performance and contribution to actual production. Solves the problems of low curing speed and thin glue solution of the JQ-1 glue. The surface drying time of the compound modified JQ-1 adhesive is shortened, the curing speed is improved, the flow resistance is improved, the viscosity of the adhesive liquid is increased, the adhesive property is good, and the water resistance and the heat resistance are superior to those of the unmodified JQ-1 adhesive.

The above purpose of the invention is realized by the following technical scheme:

a rapidly-operated JQ-1 glue compounded and modified by organic and inorganic wastes; the compound modified JQ-1 adhesive is an adhesive; the adhesive is prepared from a filler and JQ-1 glue.

The filler is a compound filler of waste wood powder and hollow microspheres.

The filler is dried to constant weight.

The filler accounts for 6 percent of the total mass of the adhesive.

The mass of the waste wood powder accounts for 20-80% of the total mass of the filler.

The mass of the hollow microspheres accounts for 20-80% of the total mass of the filler.

The preparation method of the JQ-1 glue capable of being rapidly operated and modified by compounding organic and inorganic wastes comprises the following steps:

(1) respectively weighing 94 parts of JQ-1 glue solution, 1.2-4.8 parts of waste wood powder and 1.2-4.8 parts of hollow microspheres;

(2) mixing the waste wood powder weighed in the step (1) and the hollow microspheres according to different proportions to obtain a compound filler;

(3) and (3) adding the compound filler obtained in the step (2) into the weighed JQ-1 glue solution, and stirring at 25 ℃ for not less than 30min to obtain the compound modified JQ-1 glue.

China is rich in agriculture and forestry biomass resources, but a large amount of wastes such as wood chips, husks, shavings, sawdust and the like are generated in the process of processing forestry products. The accumulation of large amounts of waste not only takes up space, but also places a burden on the environment due to improper disposal methods. Therefore, the method can not only improve the resource utilization rate but also play a role in improving the added value of the waste by fully and effectively utilizing the waste biomass resources. The waste wood powder obtained by recycling and crushing has low price, wide source and convenient acquisition, and the production cost can be reduced when the waste wood powder is applied to JQ-1 glue; and the components of the wood material are not damaged in the recovery and crushing process, namely, the wood material contains a large amount of cellulose, hemicellulose and lignin, is rich in hydroxyl (-OH) and has active hydrogen atoms (-H) capable of performing a cross-linking reaction with-NCO, so that the feasibility of adding the waste wood powder into the JQ-1 adhesive to improve the curing speed and improve the bonding property of the adhesive is realized.

In addition to biomass raw materials, in order to better improve material performance, inorganic fillers are also widely applied in material modification research, and the characteristics of the inorganic fillers are usually combined to make a correct selection in the using process. The hollow microsphere mainly comprises SiO₂And Al₂O₃The adhesive also contains hydroxyl, and has the characteristics of low water absorption, fine particles, high temperature resistance, good chemical stability, good dispersibility and the like, so that the adhesive can also achieve the purpose of improving the performance of the JQ-1 adhesive when being used in the JQ-1 adhesive, and the adhesive has the advantages of hollow microspheres. At present, the hollow microspheres sold on the market are various in types, the coal ash hollow microspheres are more practical in consideration of the factor of cost in actual production, the hollow microspheres are products prepared by separating coal ash, the excellent performance of the hollow microspheres is reserved, the modification requirement can be met, and the hollow microspheres have the advantage of low price compared with artificial hollow microspheres.

Compared with the prior art, the invention has the beneficial effects that:

(1) the compound modified JQ-1 adhesive provided by the invention is obtained by compounding and preparing organic and inorganic wastes, and overcomes the defect of one-sided property existing in single filler modification.

(2) The used compound raw materials are all recovered products of wastes, so that the production cost is reduced, and the utilization rate of resources and the added value of recovered products are improved.

(3) The curing speed of the compound modified JQ-1 adhesive obtained by compound modification is improved, the flow resistance is improved, and the bonding property is improved.

(4) The compound modified JQ-1 adhesive has the function of improving the water resistance and the thermal stability of the adhesive.

(5) The process for compounding and modifying the JQ-1 adhesive is simple, the operation is convenient, the time consumption is short, no new organic solvent is introduced only under the room temperature condition, the environmental protection property is good, and the method is suitable for actual production.

The raw materials used in the invention are all recovered products of wastes, and have the characteristics of wide sources, low price, no toxicity, environmental protection and the like, wherein the waste wood powder is waste leftover materials generated in the manufacturing process of wood products and is obtained by recovering and crushing; the hollow microspheres are functional materials obtained by separating the fly ash and carrying out impurity removal and other processes, so that the production cost is reduced, and the utilization rate of resources and the added value of recovered substances are improved. The JQ-1 glue is modified by compounding by utilizing the excellent performances of the biomass organic filler and the inorganic filler, so that the defect of one-sidedness of a single filler is overcome; the problems that the JQ-1 glue is slow in curing speed, the glue solution is thin, and the glue layer is hard and brittle after curing are solved, the curing speed of the obtained compound modified JQ-1 glue is improved, namely the surface drying time is shortened, the maximum time is reduced by about 20h, and the problems that the time cost is caused by long-time storage due to too slow curing speed and the curing speed is too fast and the JQ-1 glue cannot be in sufficient contact with the surface of a bonded substrate are solved; the flow resistance of the JQ-1 adhesive is improved, so that the viscosity of the adhesive is increased, the adhesive is prevented from flowing out of a bonding surface due to the fact that the adhesive is too thin, and the curing performance is integrally improved; the anti-flowing performance is improved, the viscosity is increased, and the integral curing performance is improved; compared with the unmodified JQ-1 glue, the bonding performance is obviously improved, the intermetallic bonding effect is better, the maximum bonding effect can be improved by about 1.39 times, and the modification effect between metal and rubber is obvious, and the maximum bonding effect can be improved by about 1.85 times; the water resistance and the thermal stability of the adhesive are ensured, meanwhile, the compound filler can be uniformly dispersed in the JQ-1 adhesive, additional modification treatment is not needed, the complex operation process in chemical modification is simplified, new components or other toxic solvents are prevented from being added into the system, the operation is convenient, the time consumption is short, and the safety problem possibly caused by improper operation can be effectively avoided; the method can effectively reduce the additional production cost brought by a complex production process or avoid the safety problem possibly brought by improper operation. In addition, the optimization of the performance and the operation of the JQ-1 adhesive provides convenience for producing a novel adhesive by taking the JQ-1 adhesive as a raw material, and has important significance for expanding the application field of the JQ-1 adhesive.

Drawings

FIG. 1 is a thermal weight loss diagram of a glue layer of waste wood flour and hollow microspheres 1:1 in example 1 after curing modified JQ-1 glue and a glue layer of JQ-1 glue in comparative example 1 after curing.

FIG. 2 is a graph showing the weight loss rate of the cured adhesive layer of the waste wood powder and the hollow microsphere 1:1 compound modified JQ-1 adhesive in example 1 and the cured adhesive layer of the JQ-1 adhesive in comparative example 1.

FIG. 3 is an SEM image of a cross-section of a cured bondline of the JQ-1 glue of comparative example 1.

FIG. 4 is an SEM image of the cross section of the cured adhesive layer of the modified JQ-1 adhesive compounded and prepared by 1:1 waste wood powder and hollow microspheres in example 1.

Detailed Description

The invention is described in more detail below with reference to specific examples, without limiting the scope of the invention. Unless otherwise specified, the experimental methods adopted by the invention are all conventional methods, and experimental equipment, materials, reagents and the like used in the experimental method can be obtained from commercial sources.

Example 1

Drying the filler to constant weight under vacuum condition, respectively weighing 3 parts of waste wood powder and 3 parts of hollow microspheres, and mixing according to a proportion to obtain a compound filler; weighing 94 parts of JQ-1 glue solution, adding the obtained compound filler into the JQ-1 glue solution, and stirring for 30min at 25 ℃ to obtain the organic and inorganic waste compound modified JQ-1 glue which can be rapidly operated.

Example 2

Drying the filler under a vacuum condition to constant weight, respectively weighing 4.8 parts of waste wood powder and 1.2 parts of hollow microspheres, and mixing according to a proportion to obtain a compound filler; weighing 94 parts of JQ-1 glue solution, adding the obtained compound filler into the JQ-1 glue solution, and stirring for 30min at 25 ℃ to obtain the organic and inorganic waste compound modified JQ-1 glue which can be rapidly operated.

Example 3

Drying the filler under a vacuum condition to constant weight, respectively weighing 4 parts of waste wood powder and 2 parts of hollow microspheres, and mixing according to a proportion to obtain a compound filler; weighing 94 parts of JQ-1 glue solution, adding the obtained compound filler into the JQ-1 glue solution, and stirring for 30min at 25 ℃ to obtain the organic and inorganic waste compound modified JQ-1 glue which can be rapidly operated.

Example 4

Drying the filler under a vacuum condition to constant weight, respectively weighing 2 parts of waste wood powder and 4 parts of hollow microspheres, and mixing according to a proportion to obtain a compound filler; weighing 94 parts of JQ-1 glue solution, adding the obtained compound filler into the JQ-1 glue solution, and stirring for 30min at 25 ℃ to obtain the organic and inorganic waste compound modified JQ-1 glue which can be rapidly operated.

Example 5

Drying the filler under a vacuum condition to constant weight, respectively weighing 1.2 parts of waste wood powder and 4.8 parts of hollow microspheres, and mixing according to a proportion to obtain a compound filler; weighing 94 parts of JQ-1 glue solution, adding the obtained compound filler into the JQ-1 glue solution, and stirring for 30min at 25 ℃ to obtain the organic and inorganic waste compound modified JQ-1 glue which can be rapidly operated.

Comparative example 1

100 parts of JQ-1 glue is weighed for performance test.

Comparative example 2

And drying the filler under a vacuum condition to constant weight, respectively weighing 6 parts of waste wood powder and 94 parts of JQ-1 glue solution, and stirring for 30min at the temperature of 25 ℃ to obtain the modified JQ-1 glue.

Comparative example 3

And drying the filler under a vacuum condition to constant weight, respectively weighing 6 parts of hollow microspheres and 94 parts of JQ-1 glue, and stirring for 30min at 25 ℃ to obtain the modified JQ-1 glue.

The organic and inorganic waste compound modified JQ-1 adhesive which can be rapidly operated and prepared by the invention is used for testing the curing property, the bonding property, the water resistance, the micro-morphology and the thermal stability, and further illustrates the performance of the compound modified JQ-1 adhesive provided by the invention.

1. Curing Properties

The curing performance of the adhesive is reflected by the surface drying time and the flow resistance performance, and the specific test method comprises the following steps:

(1) surface drying time: carrying out surface drying time test according to a GB/T13477.5-2002 building sealing material test method; wherein, the shorter the surface drying time, the faster the curing speed.

(2) Flow resistance: weighing a proper amount of adhesive, injecting the adhesive into an iron frame (40mm multiplied by 10mm) fixed on a long plate, after the adhesive is filled into the iron frame, using a scraper to trowel the adhesive, quickly withdrawing the iron frame, placing the long plate at a certain angle, recording the sagging distance of the adhesive in unit time, and reflecting the anti-flowing performance of the adhesive; wherein, the smaller the sagging distance in unit time, the better the flow resistance of the adhesive.

2. Adhesive property

According to the invention, steel plates and rubber are selected as bonding base materials, materials are bonded according to a method for measuring the tensile shear strength of GB/T7124-.

3. Water resistance

According to the invention, the water resistance of the adhesive is reflected by saturated water absorption, and the cured adhesive layer is soaked in water for water resistance test by referring to GB/T1034-2008 plastic water absorption determination; wherein, the smaller the saturated water absorption rate, the better the water resistance of the adhesive.

4. Micro-morphology

According to the invention, the liquid nitrogen is used for brittle fracture of the adhesive layer formed after the adhesive is cured, and the JSM-6460 scanning electron microscope is used for section analysis.

5. Thermal stability:

the thermal stability analysis of the adhesive layer after the adhesive is cured is carried out through TGA.

The relevant performance tests of the inventive examples and comparative examples are shown in the tables, wherein table 1 is the curing performance results table, table 2 is the adhesive performance results table, table 3 is the water resistance performance results table, table 4 is the thermal stability performance results table:

table 1 results of curing Properties

The results of the open time, flow resistance test of the examples and comparative examples are shown in table 1.

The curing performance test is carried out, the comparative example 2 and the comparative example 3 are respectively modified JQ-1 glue prepared by independently adding waste wood flour and hollow microspheres, the surface drying time is shortened compared with that of the unmodified JQ-1 glue in the comparative example 1, and the effects of improving the curing speed and improving the flow resistance of two fillers are shown, so after the two fillers are compounded, the curing performance of the organic and inorganic waste compounded modified JQ-1 glue prepared by the invention is superior to that of the comparative example 1, wherein the surface drying time of the examples 2 and 3 is shortened most obviously, and is reduced to 68h from 88h of the unmodified JQ-1 glue in the comparative example 1, and about 20h is shortened; in addition, in the embodiment, the flowing speed is reduced, namely the flow resistance is improved after the waste wood flour and the hollow microspheres are compounded and modified, the viscosity of the JQ-1 glue is increased, and the problem that the glue solution is thinner in the unmodified JQ-1 glue in the comparative example 1 is solved. The modified JQ-1 adhesive in the range has adjustability, can be freely selected according to the area of a bonded substrate, and avoids the problem that the whole bonding surface cannot be fully contacted with the bonded substrate due to overlarge viscosity of the adhesive liquid during large-area bonding.

Table 2 adhesion results table

The results of the adhesive property test of the examples and comparative examples are shown in table 2.

The invention carries out the bonding performance test of metal-metal and metal-rubber, and the data comparison shows that the bonding performance of the organic and inorganic waste compound modified JQ-1 glue prepared by the invention is superior to that of a comparative example, wherein the compound ratio of 1:1 of the modified JQ-1 glue prepared by the invention in example 1 is the best, and the tensile shear strength reaches 6.91N/mm during the metal-metal bonding²The tensile shear strength is improved by about 1.39 times and reaches 1.37N/mm during metal-rubber bonding²The improvement is about 1.85 times.

TABLE 3 Water resistance results table

The results of the water resistance test of the examples and comparative examples are shown in table 3.

The invention carries out a water resistance test, reflects the water resistance of the adhesive by the saturated water absorption rate before and after the cured adhesive layer is soaked, and the smaller the saturated water absorption rate is, the more excellent the water resistance is. Comparative example 3 is the water-resistant condition of the JQ-1 glue independently modified by the cenospheres, the saturated water absorption of the adhesive is 7.63% after the cenospheres are added, and the water-resistant effect of the adhesive can be improved after the cenospheres used as inorganic fillers are added into the JQ-1 glue, compared with the saturated water absorption of the JQ-1 glue of comparative example 1 of which the saturated water absorption is 9.68% and the saturated water absorption of the JQ-1 glue of which the waste wood flour of comparative example 2 is independently modified, so that the water-resistant property of the JQ-1 glue prepared by compounding and modifying organic and inorganic wastes which can be rapidly operated can be obviously improved after the two fillers are compounded, and the water absorption of the JQ-1 glue prepared by compounding and modifying the waste wood flour of the example and the cenospheres is smaller than that of the JQ-1 glue prepared by independently modifying the waste wood flour of, and the water absorption rate of the modified JQ-1 adhesive is close to or even smaller than that of the modified JQ-1 adhesive in the comparative example 1, so that the problems of the water resistance reduction of the adhesive and the like caused by the self water absorption of the filler are relieved. The JQ-1 glue prepared by the invention can be quickly operated and modified by compounding organic and inorganic wastes, has excellent comprehensive performance by combining the curing performance and the bonding performance of the adhesive, and solves the problem that the adhesive has defects due to one-sided property in single filler modification.

TABLE 4 thermal stability results table

The thermal stability analysis is carried out, and the thermal stability analysis data of the JQ-1 adhesive layer which can be rapidly operated and is prepared by compounding and modifying organic and inorganic wastes in the example 1 are listed in a table 4. According to TG and DTG curves, in the initial decomposition stage, the decomposition temperature of the compound modified JQ-1 adhesive is 275.17 ℃ when the weight loss is 5%, and is improved by 21.06 ℃ compared with the unmodified JQ-1 adhesive; the smaller the decomposition rate is, the better the thermal stability is, comparing the decomposition rates of the two, the decomposition rate of the modified JQ-1 glue prepared by compounding and modifying the waste wood powder and the hollow microspheres in the example 1 is always smaller than that of the unmodified JQ-1 glue in the comparative example 1 when the temperature is raised to 1000 ℃, which shows that the thermal stability of the adhesive is not damaged by compounding and modifying, and the thermal stability is improved to a certain extent. Therefore, the JQ-1 adhesive which can be quickly operated and is modified by compounding organic and inorganic wastes improves the curing speed, improves the flow resistance, improves the curing performance of the adhesive, and simultaneously can improve the heat resistance and the thermal stability of the adhesive layer.

The invention has been carried out the microscopic morphology analysis, from the SEM photo figure 3 and figure 4, it can be known that: comparative example 1 the cured bond line was smooth and flat in cross section, exhibiting a typical brittle fracture. After compounding and modification, as shown in the SEM picture of figure example 1, the section of a cured adhesive layer is uneven, hollow microspheres are uniformly embedded in a JQ-1 adhesive matrix, wood flour fibers are pulled out, and fillers have good compatibility with the JQ-1 adhesive. The JQ-1 glue prepared by the invention, which can be rapidly operated and is prepared by compounding and modifying organic and inorganic wastes, simplifies the pretreatment process of the filler, avoids introducing other components into a system, solves the problems of long curing time, thin glue solution and the like of the JQ-1 glue, saves complicated operation steps, saves production time and reduces additional production cost.

The embodiments described above are merely preferred embodiments of the invention, rather than all possible embodiments of the invention. Any obvious modifications to the above would be obvious to those of ordinary skill in the art, but would not bring the invention so modified beyond the spirit and scope of the present invention.

Claims (6)

1. A rapidly-operable JQ-1 adhesive modified by compounding organic and inorganic wastes is characterized in that the adhesive is prepared from a filler and JQ-1 adhesive; the filler is a compound filler of waste wood powder and hollow microspheres.

2. The rapidly-operable JQ-1 glue compounded and modified by organic and inorganic wastes is characterized in that the fillers are fillers dried to constant weight.

3. The rapidly-operable JQ-1 glue compounded and modified by organic and inorganic wastes is characterized in that the mass of the filler accounts for 6 percent of the total mass of the adhesive.

4. The rapidly-operable JQ-1 glue compounded and modified by organic and inorganic wastes as claimed in claim 3, wherein the mass of the waste wood flour accounts for 20-80% of the total mass of the filler.

5. The rapidly-operated JQ-1 glue compounded and modified by organic and inorganic wastes as claimed in claim 4, wherein the mass of the cenospheres accounts for 20-80% of the total mass of the filler.

6. The preparation method of the JQ-1 glue capable of being rapidly operated and modified by compounding organic and inorganic wastes as claimed in any one of claims 1 to 5, which is characterized by comprising the following steps:

(1) respectively weighing 94 parts of JQ-1 glue solution, 1.2-4.8 parts of waste wood powder and 1.2-4.8 parts of hollow microspheres;

(2) mixing the waste wood powder weighed in the step (1) and the hollow microspheres according to different proportions to obtain a compound filler;

(3) and (3) adding the compound filler obtained in the step (2) into the weighed JQ-1 glue solution, and stirring at 25 ℃ for not less than 30min to obtain the compound modified JQ-1 glue.

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