CN112894505A - Semiconductor silicon wafer processing and forming method - Google Patents
Semiconductor silicon wafer processing and forming method Download PDFInfo
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- CN112894505A CN112894505A CN202110066798.XA CN202110066798A CN112894505A CN 112894505 A CN112894505 A CN 112894505A CN 202110066798 A CN202110066798 A CN 202110066798A CN 112894505 A CN112894505 A CN 112894505A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/50—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/35—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/04—Production of homogeneous polycrystalline material with defined structure from liquids
- C30B28/10—Production of homogeneous polycrystalline material with defined structure from liquids by pulling from a melt
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to a semiconductor silicon wafer processing and forming method, which uses a polishing device, the polishing device comprises a I-shaped frame, a placing cylinder, a stretching device, a guiding device and a polishing device, wherein the I-shaped sliding blocks at two sides of a pulling plate are driven to move upwards in an I-shaped chute when a regulating screw rod rotates forwards, so that two arc-shaped guiding frames are driven to approach when two direction regulating plates approach each other, thereby guiding pulled silicon crystal bars with different diameters, the bottom of the suspended upward silicon crystal bar is not deviated during polishing, two sliding plates are driven to slide oppositely on the I-shaped frame by rotating a bidirectional screw rod forwards, the two sliding plates drive the two polishing frames to move oppositely when approaching each other, the pulled silicon crystal plates are fixed and polished by the fixed silicon crystal plates after being pulled, the silicon crystal bars are stretched and polished simultaneously, the polishing sponge is placed in the placing groove, the rotating sponge can be contacted with the polishing sponge, thereby in time clean the grinding roller, avoid influencing and continue to polish to the silicon crystal stick.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor silicon wafer processing and forming method.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor material applications;
silicon is a semiconductor material that is not very conductive in itself and its resistivity is precisely controlled by the addition of appropriate dopants. Most silicon wafers are processed by a czochralski method, and are produced by processing a silicon ingot, and the surface of the silicon ingot needs to be polished to be smooth after the silicon ingot is formed.
The following problem exists at the during operation of current equipment of polishing:
(1) when a silicon crystal bar stretching upwards is polished, the lower end of the silicon crystal bar is unstable, so that the polished lower part needs to be guided, the lower end of the silicon crystal bar is prevented from deviating during polishing, and the existing device cannot realize the guiding during polishing of the silicon crystal bar stretching upwards;
(2) the surface of the silicon crystal bar needs to be polished after stretching forming, and the existing device cannot realize polishing while stretching forming the silicon crystal bar;
(3) when polishing silicon crystal stick shaping position, because the silicon crystal stick lasts tensile upwards, fixed grinding device current device can't realize in time clearing up the impurity that produces after polishing the silicon crystal stick to and dismantle with the polishing piece of the long-time contact wear of silicon crystal stick.
Disclosure of Invention
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a semiconductor silicon wafer processing and forming method uses a polishing device, the polishing device comprises a tool frame, a placing cylinder, a stretching device, a guiding device and a polishing device, and the semiconductor silicon wafer processing and forming method by adopting the polishing device comprises the following steps:
s1, stretching a silicon crystal bar: putting the molten polycrystalline silicon into a placing cylinder, starting a stretching device to stretch a silicon crystal plate to a certain height, and stopping, so that subsequent silicon crystal rods can be guided and polished conveniently;
s2, guiding a silicon crystal bar: the silicon crystal bar is fixed through the guide device before polishing, so that the bottom of the silicon crystal plate is prevented from deviating during suspension stretching;
s3, polishing the silicon crystal bar: polishing the silicon dip rod which is continuously stretched upwards by a polishing device;
the middle part of the upper surface of the I-shaped frame is provided with a placing cylinder, the rear side of the upper surface of the I-shaped frame is provided with a stretching device, two sides of the placing cylinder are provided with guide devices connected with the I-shaped frame, and the upper side of each guide device is provided with a polishing device fixedly connected with the I-shaped frame;
the stretching device comprises lifting screws, lifting motors, stirring screws, belt wheels, belts, lifting plates, L-shaped plates, a rotating motor, a central rotating shaft, a stretching circular plate, a lifting rod and a stabilizing unit, wherein the lifting screws are rotatably arranged on two sides of the upper surface of the I-shaped frame through bearings, the left lifting screw penetrates through the inner cavity of the I-shaped frame and is rotatably connected with the lower surface of the inner cavity of the I-shaped frame, the lifting motor is fixedly arranged on the right side of the inner cavity of the I-shaped frame through the motor plate, the right lifting screw penetrates through the inner cavity of the I-shaped frame and is fixedly connected with the output end of the lifting motor, the stirring screws rotatably connected with the lower surface of the inner cavity of the I-shaped frame are arranged on the front parts of the opposite sides of the two lifting screws, the tops of the stirring screws are fixedly connected with a placing barrel, the lower side of the L-shaped plate is fixedly provided with a rotating motor through a motor plate, the output end of the rotating motor is fixedly provided with a central rotating shaft penetrating through the lifting plate, one end of the central rotating shaft, far away from the rotating motor, is fixedly provided with a stretching circular plate, the middle part of the lower surface of the stretching circular plate is fixedly provided with a stabilizing unit, the lifting motor is started to rotate positively, the output end of the lifting motor drives a lifting screw to rotate positively, the lifting screw drives a stirring screw to rotate through a belt wheel and a belt, and the lifting plate is driven to move upwards when the two lifting screws rotate positively, so that the rotating;
the guiding device comprises an adjusting screw rod, a direction adjusting plate, I-shaped chutes, I-shaped sliding blocks, pulling plates, a synchronizing rod, a fixing block, an arc-shaped guiding frame and a reset spring, wherein the adjusting screw rod penetrating through the I-shaped frame is arranged in an inner cavity of the I-shaped frame and is in threaded connection with the I-shaped frame, the direction adjusting plates are symmetrically hinged to two sides of the upper surface of the I-shaped frame, the I-shaped chutes are symmetrically formed in the front sides of two opposite sides of the two direction adjusting plates, the I-shaped sliding blocks are slidably mounted in the two groups of I-shaped chutes on the front side, the pulling plates are fixedly mounted on the opposite sides of the two groups of I-shaped sliding blocks on the front; the synchronous rods are fixedly arranged on the left side and the right side between the front pulling plate and the rear pulling plate, the fixed blocks are fixedly arranged on the upper parts of the opposite sides of the two direction adjusting plates, the arc-shaped guide frames are fixedly arranged on the front parts of the two fixed blocks, the reset springs fixedly connected with the direction adjusting plates are arranged on the upper parts of one sides of the arc-shaped guide frames, when the silicon crystal bars with different diameters after stretching forming are fixedly guided before polishing, the adjusting screw rods are rotated clockwise, the I-shaped sliding blocks on the two sides of the pulling plates are driven to move upwards in the I-shaped sliding grooves when the adjusting screw rods rotate forwards, the two arc-shaped guide frames are driven to approach when the two direction adjusting plates approach each other, so that the silicon crystal bars with different diameters are guided, the bottom of the suspended upwards silicon;
the polishing device comprises polishing support plates, a bidirectional screw rod, sliding plates, polishing frames and cleaning units, wherein the polishing support plates are fixedly arranged on two sides of the rear portion of an I-shaped frame, the bidirectional screw rod is rotatably arranged between the two polishing support plates, the two sides of the bidirectional screw rod are respectively provided with the sliding plates in threaded connection with the I-shaped frame in a sliding mode, the polishing frames are fixedly arranged on opposite sides of the two sliding plates, the cleaning units are arranged in inner cavities of the two polishing frames, the two sliding plates are driven to slide on the I-shaped frame in opposite directions by rotating the bidirectional screw rod in the forward direction, the two sliding plates are driven to move in opposite directions when being close to each other, the two polishing frames are used for fixing and polishing the shaped silicon.
Preferably, the stabilizing unit comprises an annular T-shaped groove and a plurality of T-shaped rods, the annular T-shaped groove is formed in the lower surface of the stretching circular plate, the T-shaped rods are arranged in the annular T-shaped groove in a sliding mode, one end, far away from the T-shaped rods, of the annular T-shaped groove is fixedly connected with the lower surface of the lifting plate, and the stretching circular plate is more stable when the silicon crystal rod stretched below the stretching circular plate is lifted upwards through rotation of the T-shaped rods in the annular T-shaped groove.
Preferably, the cleaning unit comprises a groove, a fixing frame, a clamping port, L-shaped clamping rods, a clamping spring, a baffle, a polishing roller, a placing groove and a cleaning sponge, wherein the groove is formed in the inner cavity of the polishing frame, the groove is arc-shaped, the fixing frame is placed in the groove, the clamping port is formed in the fixing frame at the upper part and the lower part close to one side of the groove, the L-shaped clamping rods are slidably mounted in the inner cavity of the polishing frame, the clamping spring is fixedly mounted between the two L-shaped clamping rods, the baffle is fixedly mounted at the upper part and the lower part of the two sides of the groove, the polishing roller is rotatably mounted in the inner side of the polishing frame and is provided with a plurality of polishing rollers, the arc-shaped polishing rollers are arranged among the plurality of polishing rollers, the placing groove formed in the inner cavity at the top of the polishing frame is arranged at the rear side of the polishing roller, when the grinding roller carries out the limit and beats the edging clean, put into the standing groove through wiping the sponge in, the grinding roller can realize rotating the back and clean the sponge contact when rotating to silicon crystal stick and polish to in time clean the grinding roller, avoid influencing the polishing of continuation to silicon crystal stick.
Preferably, the equal fixed mounting in arc leading truck both sides has the locking plate, and the check lock is installed to right side locking plate internal thread, and the check lock rotates to the left side locking inboard in to the realization is polished the frame and is more stable when polishing the silicon crystal bar, and the effect of polishing is better.
Preferably, when the lifting plate rises, the rotation direction of the placing cylinder is opposite to the steering direction of the lifting rod, the threads on the two lifting screws are arranged oppositely, and the steering direction of the placing cylinder is opposite to the steering direction of the lifting rod, so that the solution in the placing cylinder and the surface lines of the silicon crystal rod are more uniform when the silicon crystal rod is lifted.
Preferably, the rotating speed of the central rotating shaft is accurately adjusted through the rotating motor, the diameter of the silicon crystal bar is adjusted through the rotating speed of the central rotating shaft, and the diameter of the stretched silicon crystal bar is accurately controlled through adjusting the rotating motor.
The invention has the beneficial effects that:
according to the guiding device adopted by the invention, the adjusting screw rod drives the I-shaped sliding blocks on the two sides of the pulling plate to move upwards in the I-shaped sliding groove when rotating forwards, so that the two arc-shaped guiding frames are driven to approach when the two direction adjusting plates approach to each other, thereby guiding the pulled silicon crystal rods with different diameters, and the bottom of the suspended upward silicon crystal rod is not deviated when being polished;
according to the polishing device adopted by the invention, the two sliding plates are driven to slide oppositely on the I-shaped frame by positively rotating the bidirectional screw rod, when the two sliding plates are close to each other, the two polishing frames are driven to move oppositely to fixedly polish the silicon crystal plate which is shaped after being pulled up, and the silicon crystal bar is stretched and polished simultaneously;
the cleaning unit is arranged in the placing groove through the wiping sponge, and the polishing roller can be contacted with the wiping sponge after rotating, so that the polishing roller is cleaned in time, and the silicon crystal bar is prevented from being continuously polished.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a schematic front perspective view of the sanding apparatus of the present invention;
FIG. 3 is a schematic view of the D-D top view of FIG. 2 of the present invention;
FIG. 4 is an enlarged view of section A of the grinding apparatus of FIG. 2 of the present invention;
FIG. 5 is an enlarged view of portion B of the grinding apparatus of FIG. 2 of the present invention;
FIG. 6 is an enlarged view of section C of the grinding apparatus of the present invention shown in FIG. 2;
FIG. 7 is a schematic front cross-sectional view of a stabilization unit of the sanding apparatus of the present invention;
FIG. 8 is a schematic side sectional view of a cleaning unit of the sanding apparatus of the present invention;
fig. 9 is a partial structural schematic view of the sanding apparatus of the present invention.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 1 to 9, a semiconductor silicon wafer processing and forming method uses a polishing apparatus comprising a jig 1, a placing cylinder 2, a stretching device 3, a guiding device 4, and a polishing device 5, and comprises the following steps:
s1, stretching a silicon crystal bar: putting the molten polycrystalline silicon into the placing cylinder 2, starting the stretching device 3 to stretch the silicon crystal plate to a certain height, and stopping the stretching device, so that the subsequent silicon crystal bar is guided and polished conveniently;
s2, guiding a silicon crystal bar: the silicon crystal bar is fixed by the guide device 4 before polishing, so that the bottom of the silicon crystal plate is prevented from deviating during suspension stretching;
s3, polishing the silicon crystal bar: the silicon dip rod which is continuously stretched upwards is polished by a polishing device 5;
a placing cylinder 2 is arranged in the middle of the upper surface of the I-shaped frame 1, a stretching device 3 is arranged on the rear side of the upper surface of the I-shaped frame 1, guide devices 4 connected with the I-shaped frame 1 are arranged on two sides of the placing cylinder 2, and a polishing device 5 fixedly connected with the I-shaped frame 1 is arranged on the upper side of each guide device 4;
the stretching device 3 comprises a lifting screw 31, a lifting motor 32, a stirring screw 33, a belt wheel 34, a belt 35, a lifting plate 36, an L-shaped plate 37, a rotating motor 38, a central rotating shaft 39, a stretching circular plate 390, a lifting rod 391 and a stabilizing unit 6, wherein the lifting screw 31 is rotatably arranged at two sides of the upper surface of the I-shaped frame 1 through a bearing, the lifting screw 31 at the left side is rotatably connected with the lower surface of the inner cavity of the I-shaped frame 1 through the inner cavity of the I-shaped frame 1, the lifting motor 32 is fixedly arranged at the right side of the inner cavity of the I-shaped frame 1 through a motor plate, the lifting screw 31 at the right side is fixedly connected with the output end of the lifting motor 32 through the inner cavity of the I-shaped frame 1, the stirring screw 33 rotatably connected with the lower surface of the inner cavity of the I-shaped frame 1 is arranged at the front, a belt 35 is arranged between the belt wheels 34 for transmission, a lifting plate 36 is arranged on the upper part of the two lifting screws 31 through threads, an L-shaped plate is fixedly arranged in the middle of the upper surface of the lifting plate 36, a rotating motor 38 is fixedly arranged on the lower side of the L-shaped plate through a motor plate, a central rotating shaft 39 penetrating through the lifting plate 36 is fixedly arranged at the output end of the rotating motor 38, the end of the central rotating shaft 39 far away from the rotating motor 38 is fixedly arranged, a stretching circular plate 390 is fixedly arranged at the middle of the lower surface of the stretching circular plate 390, a stabilizing unit 6 is fixedly arranged in the middle of the lower surface of the stretching circular plate 390, the rotating motor 38 is started, the output end of the rotating motor 38 drives the central rotating shaft 39 to rotate, the central rotating shaft 39 drives the stretching circular plate 390 to rotate, the lifting rod 391 below, when the silicon crystal bar is stretched, the lifting motor 32 is started to rotate positively, the output end of the lifting motor 32 drives the lifting screw 31 to rotate positively, the lifting screw 31 drives the stirring screw 33 to rotate through the belt wheel 34 and the belt 35, the stirring screw 33 rotates and rotates to drive the placing barrel 2 to rotate clockwise, and the lifting plates 36 are driven to move upwards when the two lifting screws 31 rotate positively, so that the rotating lifting rod 391 is stretched upwards, and the silicon crystal bar is stretched and formed;
the guiding device 4 comprises an adjusting screw rod 41, a direction adjusting plate 42, an I-shaped sliding groove 43, I-shaped sliding blocks 44, pulling plates 45, a synchronizing rod 46, a fixing block 47, an arc-shaped guide frame 48 and a return spring 49, the adjusting screw rod 41 penetrating through the I-shaped frame 1 is arranged in the cavity of the I-shaped frame 1, the adjusting screw rod 41 is in threaded connection with the I-shaped frame 1, the direction adjusting plates 42 are symmetrically hinged to two sides of the upper surface of the I-shaped frame 1, the I-shaped sliding grooves 43 are symmetrically arranged on the front sides of two opposite sides of the two direction adjusting plates 42, the I-shaped sliding blocks 44 are slidably arranged in the two groups of I-shaped sliding grooves 43 on the front sides, the pulling plates 45 are fixedly arranged on the opposite sides of the two groups of I-shaped sliding blocks 44 on the; the left side and the right side between the front and the back groups of pulling plates 45 are both fixedly provided with a synchronizing rod 46, the upper parts of the opposite sides of the two direction adjusting plates 42 are both fixedly provided with a fixed block 47, the front parts of the two fixed blocks 47 are both fixedly provided with an arc-shaped guide frame 48, the upper part of one side of the arc-shaped guide frame 48 is provided with a return spring 49 fixedly connected with the direction adjusting plate 42, when the silicon crystal bars with different diameters after stretch forming are fixedly guided before being polished, the adjusting screw rod 41 is rotated clockwise, the adjusting screw rod 41 rotates clockwise to drive the I-shaped sliding blocks 44 on the two sides of the pulling plate 45 to move upwards in the I-shaped sliding groove 43, the I-shaped sliding blocks 44 drive the two direction adjusting plates 42 to approach each other when moving upwards, and the two direction adjusting plates 42 drive the two arc-shaped guide frames 48 to approach each other when approaching each other so as to guide the pulled silicon crystal bars with different diameters, so that the suspended upward silicon crystal bars are prevented from deviating when being polished and the polishing effect is prevented from being influenced;
the polishing device 5 comprises polishing support plates 51, two-way screw rods 52, sliding plates 53, polishing frames 54 and cleaning units 7, wherein the polishing support plates 51 are fixedly arranged at two sides of the rear part of the I-shaped frame 1, the two-way screw rods 52 are rotatably arranged between the two polishing support plates 51, the sliding plates 53 which are in sliding connection with the I-shaped frame 1 are respectively arranged at two sides of the two-way screw rods 52 in a threaded manner, the polishing frames 54 are respectively fixedly arranged at one opposite sides of the two sliding plates 53, the cleaning units 7 are respectively arranged in the inner cavities of the, when the fixed silicon crystal bar stretched out after being pulled out is stretched and polished, the bidirectional screw 52 is rotated in the forward direction, the bidirectional screw 52 drives the two sliding plates 53 to slide oppositely on the I-shaped frame 1 when rotating in the forward direction, the two sliding plates 53 drive the two polishing frames 54 to move oppositely when approaching to each other so as to fix and polish the silicon crystal plate after being pulled up, and the silicon crystal bar is rubbed with the inner cavity of the polishing frame 54 when being stretched upwards so as to polish the silicon crystal bar while stretching.
The stabilizing unit 6 comprises an annular T-shaped groove 61 and a plurality of T-shaped rods 62, the annular T-shaped groove 61 is formed in the lower surface of the stretching circular plate 390, the T-shaped rods 62 are slidably mounted in the annular T-shaped groove 61, one end of each T-shaped rod 62, which is far away from the annular T-shaped groove 61, is fixedly connected with the lower surface of the lifting plate 36, and the stretching circular plate 390 is more stable when the silicon crystal rods stretched below the stretching circular plate 390 are lifted upwards by the rotation of the T-shaped rods 62 in the annular T-shaped groove 61.
The cleaning unit 7 comprises a groove 71, a fixing frame 72, a clamping port 73, L-shaped clamping rods 74, a clamping spring 75, a baffle 76, a polishing roller 77, a placing groove 78 and a wiping sponge 79, wherein the groove 71 is formed in the inner cavity of the polishing frame 54, the groove 71 is arc-shaped, the fixing frame 72 is placed in the groove 71, the clamping ports 73 are respectively formed in the upper side and the lower side of the fixing frame 72 close to one side of the groove 71, the L-shaped clamping rods 74 are slidably mounted in the inner cavity of the polishing frame 54 up and down, the clamping spring 75 is fixedly mounted between the two L-shaped clamping rods 74, the baffle 76 is fixedly mounted in the upper side and the lower side of the two sides of the groove 71, the polishing rollers 77 are rotatably mounted on the inner side of the polishing frame 54, the plurality of the polishing rollers 77 are arc-shaped, the placing groove 78 formed in the inner cavity at the top of the polishing frame 54 is arranged on the rear side, press two L type kellies 74, make L type kellies 74 break away from with mount 72 and can dismantle mount 72, put into recess 71 with new mount 72 after that, loosen two L type kellies 74, two L type kellies 74 are fixed mount 72 under the effect of connecing the spring, when polishing roller 77 and carry out the limit and polish the clean time of edging, will clean sponge 79 and put into standing groove 78, it can realize rotating the back and clean sponge 79 contact when polishing silicon crystal bar rotation to polish roller 77 to clean the dust on polishing roller 77, avoid the secondary pollution to the silicon crystal bar.
The equal fixed mounting in arc leading truck 48 both sides has locking plate 81, and right side locking plate 81 internal thread installs check lock lever 82, with right side locking plate 81 in locking lever 82 clockwise rotation to left side locking plate 81, makes two locking plate 81 locks and embraces to it is more stable when polishing to the silicon crystal stick to realize the frame 54 of polishing, and the effect of polishing is better.
When the lifting plate 36 rises, the rotation direction of the placing barrel 2 is opposite to the rotation direction of the lifting rod 391, the threads on the two lifting screws 31 are arranged oppositely, and the rotation direction of the placing barrel 2 is opposite to that of the lifting rod 391, so that the solution in the placing barrel 2 and the surface texture of the silicon crystal rod are more uniform when the silicon crystal rod is pulled.
The rotating speed of the central rotating shaft 39 is accurately adjusted through the rotating motor 38, the diameter of the silicon crystal bar is adjusted through the rotating speed of the central rotating shaft 39, and the diameter of the stretched silicon crystal bar is accurately controlled through adjusting the rotating motor 38.
The present invention is not limited to the above-described embodiments, which are described in the specification and illustrated only to illustrate the principle of the present invention, but various changes and modifications may be made within the scope of the present invention as claimed without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A semiconductor silicon wafer processing and forming method uses a polishing device which comprises a tool rest (1), a placing cylinder (2), a stretching device (3), a guiding device (4) and a polishing device (5), and is characterized in that: the method for processing and forming the semiconductor silicon wafer by adopting the polishing equipment comprises the following steps:
s1, stretching a silicon crystal bar: putting the molten polycrystalline silicon into a placing cylinder (2), starting a stretching device (3) to pull the silicon crystal plate to a certain height, and stopping the stretching device to facilitate guiding and polishing of a subsequent silicon crystal rod;
s2, guiding a silicon crystal bar: the silicon crystal bar is fixed through the guide device (4) before polishing, so that the bottom of the silicon crystal plate is prevented from deviating during suspension stretching;
s3, polishing the silicon crystal bar: the silicon dip rod which is continuously stretched upwards is ground by a grinding device (5);
a placing cylinder (2) is arranged in the middle of the upper surface of the I-shaped frame (1), a stretching device (3) is arranged on the rear side of the upper surface of the I-shaped frame (1), guide devices (4) connected with the I-shaped frame (1) are arranged on two sides of the placing cylinder (2), and a polishing device (5) fixedly connected with the I-shaped frame (1) is arranged on the upper side of each guide device (4);
the stretching device (3) comprises a lifting screw (31), a lifting motor (32), stirring screws (33), belt wheels (34), a belt (35), a lifting plate (36), an L-shaped plate (37), a rotating motor (38), a central rotating shaft (39), a stretching circular plate (390), a lifting rod (391) and a stabilizing unit (6), wherein the lifting screw (31) is rotatably arranged at two sides of the upper surface of the tool frame (1) through a bearing, the left lifting screw (31) penetrates through the inner cavity of the tool frame (1) and is rotatably connected with the lower surface of the inner cavity of the tool frame (1), the lifting motor (32) is fixedly arranged at the right side of the inner cavity of the tool frame (1) through a motor plate, the right lifting screw (31) penetrates through the inner cavity of the tool frame (1) and is fixedly connected with the output end of the lifting motor (32), the stirring screws (33) rotatably connected with the lower surface of the inner cavity of the tool frame (1, the top of each stirring screw (33) is fixedly connected with the placing barrel (2), belt wheels (34) are fixedly mounted on the outer sides of the stirring screws (33) and the lifting screws (31), a belt (35) is arranged between the belt wheels (34) for transmission, lifting plates (36) are mounted on the upper portions of the two lifting screws (31) in a threaded mode, an L-shaped plate is fixedly mounted in the middle of the upper surface of each lifting plate (36), a rotating motor (38) is fixedly mounted on the lower side of each L-shaped plate through a motor plate, a central rotating shaft (39) penetrating through the lifting plates (36) is fixedly mounted at the output end of the rotating motor (38), a stretching circular plate (390) is fixedly mounted at one end, far away from the rotating motor (38), of the central rotating shaft (;
the guiding device (4) comprises an adjusting screw rod (41), a direction adjusting plate (42), an I-shaped sliding groove (43), an I-shaped sliding block (44), a pulling plate (45), a synchronizing rod (46), a fixed block (47), an arc-shaped guiding frame (48) and a return spring (49), the adjusting screw rod (41) penetrating through the I-shaped frame (1) is arranged in the inner cavity of the I-shaped frame (1), the adjusting screw rod (41) is in threaded connection with the I-shaped frame (1), two sides of the upper surface of the I-shaped frame (1) are symmetrically hinged with direction adjusting plates (42), I-shaped sliding grooves (43) are symmetrically formed in the front sides of the two opposite sides of the two direction adjusting plates (42), I-shaped sliding blocks (44) are respectively arranged in the two groups of I-shaped sliding grooves (43) on the front side in a sliding mode, pulling plates (45) are respectively and fixedly arranged on the opposite sides of the two groups of I-shaped sliding blocks (44) on the front side, and the top of the adjusting screw rod (41) penetrates through the pulling plate (45) on the front side and is; the left side and the right side between the front pulling plate and the rear pulling plate (45) are respectively and fixedly provided with a synchronizing rod (46), the upper parts of the opposite sides of the two direction adjusting plates (42) are respectively and fixedly provided with a fixed block (47), the front parts of the two fixed blocks (47) are respectively and fixedly provided with an arc-shaped guide frame (48), and the upper part of one side of the arc-shaped guide frame (48) is provided with a reset spring (49) fixedly connected with the direction adjusting plates (42);
the polishing device (5) comprises polishing support plates (51), two-way lead screws (52), sliding plates (53), polishing frames (54) and cleaning units (7), wherein the polishing support plates (51) are fixedly installed on two sides of the rear portion of the I-shaped frame (1), the two-way lead screws (52) are installed between the two polishing support plates (51) in a rotating mode, the sliding plates (53) which are connected with the I-shaped frame (1) in a sliding mode are installed on two sides of the two-way lead screws (52) in a threaded mode, the polishing frames (54) are fixedly installed on one opposite sides of the two sliding plates (53), and the inner cavities of the two polishing frames (54) are.
2. The semiconductor silicon wafer processing and shaping method according to claim 1, wherein: the stabilizing unit (6) comprises an annular T-shaped groove (61) and a T-shaped rod (62), the annular T-shaped groove (61) is formed in the lower surface of the stretching circular plate (390), the T-shaped rod (62) is arranged in the annular T-shaped groove (61) in a sliding mode, the T-shaped rods (62) are multiple, and the T-shaped rods (62) are far away from one end of the annular T-shaped groove (61) and fixedly connected with the lower surface of the lifting plate (36).
3. The semiconductor silicon wafer processing and shaping method according to claim 1, wherein: the cleaning unit (7) comprises a groove (71), a fixing frame (72), a clamping port (73), L-shaped clamping rods (74), a clamping spring (75), a baffle (76), a polishing roller (77), a placing groove (78) and a wiping sponge (79), wherein the groove (71) is formed in the inner cavity of the polishing frame (54), the groove (71) is arc-shaped, the fixing frame (72) is placed in the groove (71), the clamping ports (73) are formed in the upper part and the lower part of one side, close to the groove (71), of the fixing frame (72), the L-shaped clamping rods (74) are arranged in the inner cavity of the polishing frame (54) in an up-and-down sliding mode, the clamping spring (75) is fixedly arranged between the two L-shaped clamping rods (74), the baffle (76) is fixedly arranged on the upper part and the lower part of the two sides of the groove (71), the polishing rollers (77) are rotatably arranged on the, a placing groove (78) arranged in the top inner cavity of the grinding frame (54) is arranged at the rear side of the grinding roller (77), and a wiping sponge (79) is arranged in the placing groove (78).
4. The semiconductor silicon wafer processing and shaping method according to claim 1, wherein: locking plates (81) are fixedly mounted on two sides of the arc-shaped guide frame (48), and locking rods (82) are mounted in the inner threads of the right locking plates (81).
5. The semiconductor silicon wafer processing and shaping method according to claim 3, wherein: when the lifting plate (36) rises, the rotation direction of the placing barrel (2) is opposite to the rotation direction of the lifting rod (391), and the threads on the two lifting screws (31) are arranged oppositely.
6. The semiconductor silicon wafer processing and shaping method according to claim 1, wherein: the rotating speed of the central rotating shaft (39) is accurately adjusted through the rotating motor (38), and the diameter of the silicon crystal bar is adjusted through the rotating speed of the central rotating shaft (39).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110066798.XA CN112894505A (en) | 2021-01-19 | 2021-01-19 | Semiconductor silicon wafer processing and forming method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110066798.XA CN112894505A (en) | 2021-01-19 | 2021-01-19 | Semiconductor silicon wafer processing and forming method |
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| CN112894505A true CN112894505A (en) | 2021-06-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091308A (en) * | 2022-07-06 | 2022-09-23 | 浙江理工大学科技与艺术学院 | Polishing equipment for production based on intelligent lamp and using method thereof |
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2021
- 2021-01-19 CN CN202110066798.XA patent/CN112894505A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091308A (en) * | 2022-07-06 | 2022-09-23 | 浙江理工大学科技与艺术学院 | Polishing equipment for production based on intelligent lamp and using method thereof |
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Application publication date: 20210604 |