CN112880307B - Porous medium type device for drying multiple wafers and achieving method thereof - Google Patents
Porous medium type device for drying multiple wafers and achieving method thereof Download PDFInfo
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- CN112880307B CN112880307B CN202110033300.XA CN202110033300A CN112880307B CN 112880307 B CN112880307 B CN 112880307B CN 202110033300 A CN202110033300 A CN 202110033300A CN 112880307 B CN112880307 B CN 112880307B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
- F26B3/06—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried
- F26B3/08—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried so as to loosen them, e.g. to form a fluidised bed
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
- F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/063—Movable containers or receptacles, e.g. carts, trolleys, pallet-boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
- F26B3/06—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried
- F26B3/08—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried so as to loosen them, e.g. to form a fluidised bed
- F26B3/082—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried so as to loosen them, e.g. to form a fluidised bed arrangements of devices for distributing fluidising gas, e.g. grids, nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Microelectronics & Electronic Packaging (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The device can solve the problems that the existing wafer is easily damaged by adopting a clamping mode during drying, and the clamped part cannot be sufficiently dried. The traditional mechanical arm clamping is not adopted, and the gas suspension mode is adopted, so that the damage of the wafer caused by uneven stress in the clamping process can be reduced. Compared with the prior art, the invention can perform suspension drying on a plurality of wafers, thereby improving the working efficiency. In order to realize stable adjustable airflow, the shielding plate is provided with a through hole and a grid hole, when the through hole is concentric with the air outlet hole of the suspension platform, the airflow speed and the pressure on the wafer are not influenced, when the shielding plate rotates by 15 degrees, the grid hole is just concentric with the air outlet hole of the suspension platform, the airflow can be slowed down, and the pressure on the surface of the wafer can be reduced. Therefore, the drying of wafers with different thicknesses can be realized.
Description
Technical Field
The invention relates to the technical field of wafer drying, in particular to a device capable of realizing wafer suspension drying and a realization method thereof.
Technical Field
The wafer is a new product which appears along with the development of high and new technologies in the fields of semiconductors, optics and the like. Silicon wafers are the main material of common semiconductor integrated circuits, and cleaning and drying after cleaning are indispensable links in the use and preparation processes of the wafers. In the prior art, the common wafer drying methods mainly include three methods: gas blown processes, IPA drying processes and processes with marangoni.
As the semiconductor devices are increasingly miniaturized and integrated, the market demand for wafers is also shifting to the category of products with larger size and thinner thickness. The increase in size and the decrease in thickness decrease the strength of the wafer, so that the difficulty in drying the wafer is increasing. The drying method is difficult to be applied to the drying of large-size ultrathin wafers, centrifugal drying method and gas blowing method. And the wafer is more easily damaged and scratched in the conveying process.
The invention discloses a wafer drying device (application publication number: CN 102768972A) in Chinese patent application. The wafer drying device includes: the wafer clamping mechanism is arranged on the body and used for supporting a wafer oriented in the vertical direction; the water tank is arranged on the body in a manner of moving up and down, and a notch which penetrates through the top wall along the up-down direction is arranged on the top wall of the water tank and is used for passing through the wafer; the water tank driving part is arranged on the body and connected with the water tank so as to drive the water tank to move up and down. However, the present invention has a complicated structure, high production cost and needs to clamp the wafer, so that the wafer is damaged during the process of clamping the wafer.
A safe and energy-saving wafer drying device (No. CN 207338315U) disclosed in chinese patent, which discloses a wafer drying device. The water mark problem of leaving behind after wafer surface dehydration has been solved to this patent, solves spin-drying and causes the broken problem of wafer easily, has also reduced the rotatory dehydration granule of wafer and has stained the problem, has reduced manufacturing cost. However, since the wafer is very thin, the wafer clamped by the robot is easily damaged, and the clamped area cannot be completely dried.
Aiming at the problems, the invention designs a wafer suspension drying device, namely a porous medium type device for drying a plurality of wafers, which is capable of stabilizing and adjusting an air suspension flow field, and an implementation method thereof, so that the wafers can be dried without clamping.
Disclosure of Invention
Aiming at the problems, the invention designs a wafer suspension drying device, namely a porous medium type device for drying a plurality of wafers, which is capable of stabilizing and adjusting an air suspension flow field, and an implementation method thereof, so that the wafers can be dried without clamping. The wafer drying device solves the problem that the wafer is easy to damage due to the clamping mode adopted by the conventional wafer during drying, and solves the problem that the clamped part cannot be sufficiently dried. The wafer clamping device adopts an air suspension mode instead of the traditional mechanical arm clamping mode, so that the damage to the wafer caused by uneven stress in the clamping process of the wafer can be reduced.
In order to solve the problems, the invention adopts the following technical scheme:
the porous medium type device for stabilizing and adjusting the gas suspension flow field for drying the wafers is characterized by comprising a workbench, a drying box, a suspension bin and a suspension bin bearing mechanism, wherein the suspension bin bearing mechanism and the drying box are arranged on the workbench, and the suspension bin is conveyed into or moved out of the drying box through the suspension bin bearing mechanism; the suspension bin is formed by arranging a plurality of suspension platforms at intervals from top to bottom, a ventilating pipeline is arranged in each suspension platform, a plurality of air outlets are formed in each suspension platform, the air outlets between every two adjacent suspension platforms are oppositely arranged to form air flow, and therefore the wafer is suspended between the two suspension platforms.
Furthermore, the suspension platform bearing mechanism comprises a guide rail, a motor, a fixed frame plate, a screw rod, a cross frame plate and a sliding table; the guide rail is fixed on the workbench, the sliding table is in sliding fit with the guide rail, the lead screw is supported on the workbench through the fixed frame plate, and the lead screw is in threaded fit with the sliding table; the suspension bin is installed on the cross frame plate, the cross frame plate is installed on the top of the sliding table, and the motor drives the screw rod to enable the sliding table to drive the cross frame plate and the suspension bin to horizontally displace along the guide rail, so that the suspension bin enters or moves out of the drying box.
Further, an air cylinder is installed on one side of the sliding table, and a left side push plate and a right side push plate are respectively arranged on two sides of the tail of the cross frame plate; the left side push plate and the right side push plate are respectively positioned at two sides of the sliding table and are in up-and-down sliding fit with the sliding table through the sliding grooves; the output shaft of the cylinder is connected with the left side plate or the right side plate, and drives the cross frame plate to drive the suspension cabin to move upwards or downwards.
Furthermore, the suspension bin comprises a rotary fixed table, and the suspension table is formed by connecting a single-pass suspension table at the upper side and the lower side and a double-pass suspension table at the middle side into a whole through a plurality of support shafts at the side edges and is rotatably connected with the rotary fixed table; the ventholes are arranged on the upper side and the lower side of the two-way suspension platform, and the ventholes are arranged on the single side of the single-way suspension platform.
Furthermore, porous media are arranged in the air outlet holes, the air outlet holes are divided into a plurality of groups, and each group of air outlet holes are distributed in a linear shape along the radial direction of the suspension table.
Furthermore, each suspension platform is provided with a shielding plate at the air outlet, the shielding plate is provided with a plurality of groups of through holes and grid holes which are arranged in a linear manner, and the through holes and the grid holes are arranged at intervals and are respectively distributed along the radial direction of the shielding plate; the central angle between two adjacent groups of through holes or grid holes is equal to the central angle between two adjacent groups of air outlet holes; through rotating the shielding plate, the through holes or the grid holes of the shielding plate correspond to the air outlet holes of the corresponding suspension table so as to change the air flow of the air outlet holes of the suspension table.
Further, the sunshade passes through the sunshade holder and rotates with rotatory fixed station to be connected, the sunshade holder is linked as an organic whole by the splint of chassis, both sides, the chassis rotates with rotatory fixed station to be connected, and the splint of both sides are arranged in the platform both sides that suspend to the fixed sunshade that corresponds of common centre gripping, rotatory sunshade holder to make the sunshade take place rotatoryly, in order to change the airflow of the platform venthole that suspends.
Furthermore, the through hole of the shielding plate is in a stepped hole shape, when the airflow enters the upper small hole from the lower large hole, pressure difference is formed, and enough pressure is generated to suspend the wafer.
Furthermore, the central angle between the through holes and the grid holes of two adjacent groups is 15 degrees, and the central angle between the air outlet holes of two adjacent groups is 30 degrees.
The method for realizing the porous medium type device for drying the wafers, which is used for stabilizing and adjusting the gas suspension flow field, is characterized by comprising the following steps:
1) Placing the wafer between two adjacent suspension platforms, ventilating the pipeline, and arranging air outlet holes between the two adjacent suspension platforms oppositely to form air flow so as to enable the wafer to be suspended between the two suspension platforms;
2) According to actual requirements, rotating the shield plate retainer to enable grid holes or through holes on the shield plate to correspond to the positions of the air outlet holes of the corresponding suspension platform, and switching the size of air flow of the air outlet holes to change the pressure of the air flow on the surface of the wafer and the drying speed of the air flow;
3) Rotating the suspension table to a proper position according to actual requirements;
4) The cylinder is connected with the left side plate or the right side plate to drive the cross frame plate to drive the suspension cabin to move upwards or downwards;
5) The motor drives the screw rod to enable the sliding table to drive the cross frame plate to horizontally displace along the guide rail, so that the suspension bin enters or moves out of the drying box.
The invention solves the drying problem of large-size ultrathin wafers and provides a wafer drying device which is free of clamping, thorough in drying, safe and pollution-free; meanwhile, a plurality of wafers can be dried simultaneously, the airflow field can be adjusted, and the wafer drying device can adapt to wafers with different thicknesses.
Compared with the prior art, the invention has the beneficial effects that:
first, the invention can realize the suspension drying of a plurality of wafers, and compared with the traditional drying technology, the invention can realize the drying without contact and clamping in the drying process, and the drying has no dead points. Thereby avoiding damage and incomplete drying of the wafer caused by clamping of the manipulator. A plurality of suspension platforms are used to form a suspension bin, so that a plurality of plates can be dried simultaneously. The air outlet holes of the suspension table are arranged at intervals, so that the pressure difference caused by instability of air flow to the wafer can be reduced to a certain extent. The gas suspension drying method is adopted to avoid the damage of the wafer caused by the clamping of a mechanical arm to a certain extent.
Secondly, in order to realize that adjustable air current is stable, the sunshade design has through-hole and grid hole, and when the venthole of through-hole and suspension platform was concentric (coincide), air velocity and pressure to the wafer were not influenced, when the sunshade rotated 15, the grid hole just in time was concentric (coincide) with suspension platform venthole this moment, and the air current can slow down this moment, and the pressure to the wafer surface can reduce. Therefore, the drying of wafers with different thicknesses can be realized.
Thirdly, in order to take out the wafer from the suspension bin conveniently, the suspension bin bearing mechanism can also realize the movement in the upper and lower directions, is particularly suitable for suckers which cannot be lifted and can take out the wafer conveniently.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic structural diagram of a suspension cabin bearing mechanism of the present invention;
FIG. 3 is a schematic view of the suspension cabin structure of the present invention;
FIG. 4 is a schematic structural view of a double-pass suspension stage of the present invention;
FIG. 5 is a schematic view of a shutter structure according to the present invention;
FIG. 6 is a schematic view of the position of the shutter and the suspension stage of the present invention;
FIG. 7 is a schematic view of the structure of through holes and grid holes of the cover plate of the present invention;
FIG. 8 is a schematic view of the position of the shutter and shutter retainer of the present invention;
in the figure: the device comprises a workbench 1, a stand 2, a drying box 3, a spray head 4, a rotary fixing table 5, a suspension bin 6, a suspension bin bearing mechanism 7, a motor 71, a fixing frame plate 72, a coupling 73, a bearing seat 74, a lead screw 75, a cross frame plate 76, a right side push plate 77, a left side push plate 78, a cylinder 712, a single-pass suspension table 61, a double-pass wafer suspension table 62, a supporting shaft 63, a shielding plate 64, a shielding plate holder 66, a bottom frame 661, a clamping plate 662, a feeler 663, a wafer 65, a porous medium 623, a grid hole 641 and a through hole 642.
Detailed Description
The invention is further described with reference to the following figures and detailed description:
a porous medium type device for stabilizing and adjusting an air suspension flow field for drying a plurality of wafers comprises a workbench 1, a stand 2, a drying box 3, a spray head 4, a rotary fixing table 5, a suspension bin 6, a suspension bin bearing mechanism 7, a motor 71, a fixing frame plate 72, a shaft coupling 73, a bearing seat 74, a lead screw 75, a cross frame plate 76, a right side push plate 77, a left side push plate 78, an air cylinder 712, a one-way suspension table 61, a two-way wafer suspension table 62, a supporting shaft 63, a shielding plate 64, a shielding plate holder 66, a wafer 65, a porous medium 623, a grid hole 641 and the like.
The suspension bin bearing mechanism 7 is installed above the workbench 1, and the suspension bin bearing mechanism 7 comprises a motor 71, a motor frame 72, a coupler 73, a bearing seat 74, a screw rod 75, a cross frame plate 76, a right side push plate 77, a left side push plate 78, a sliding table 79, a cylinder 712 and a guide rail 711.
The wafer suspension bin 6 is arranged in the middle of the rotary fixing table 5, and the rotary fixing table 5 is arranged on a cross frame plate 76 through 4 screws. The pipeline is hollow, so that hot nitrogen can be conveniently introduced into the pipeline. Suspension storehouse 6 is by a plurality of suspension platforms stack, connects through four optical axes 63, and rotatory fixing base 5 is installed and is born the weight of on the mechanism 7 motionless in suspension storehouse, and suspension storehouse 6 can be rotatory certain angle relatively rotatory fixing base.
Four double-pass suspension stages 62 are located between two single-pass suspension stages 61, with a separation height of 5mm.
The double-pass suspension platform 62 is provided with a light shaft hole 621, a pipeline 622, a porous medium 623 and an air inlet hole 624. The light shaft hole 621 is mainly used for the support shaft 63 to pass through and connect 6 suspension platforms. The pipeline 622 is opened to mainly introduce the hot nitrogen gas from the inlet holes 624 into each outlet hole. The porous medium 623 is filled in the air outlet hole, and mainly plays a role in uniformly distributing pressure and stabilizing an air field.
The shielding plate 64 is provided with two holes, i.e. a through hole 642 and a grid hole 641. The center of the through hole 642 and the center of the grid hole 641 are separated by an angle of 15 °. When the through hole 642 is concentric with the air outlet of the suspension table 62, the air flow rate and the pressure on the wafer 65 are not affected, and when the shutter 64 rotates by 15 °, the grid hole 641 is exactly concentric with the air outlet of the suspension table 62, the air flow is slowed down, and the pressure on the surface of the wafer is reduced. Therefore, the drying of wafers with different thicknesses can be realized.
As shown in fig. 8, the shutter holder 66 is connected to the rotary fixing table 5, and 10 tentacles are arranged opposite to each side plate of the shutter holder 66, and the shutter 64 is fixed to the tentacles of the holder 66 by screws.
The suspension platform is a porous disc, the air outlet holes are distributed on the table top in a corona shape, the number of holes in the central area is large, and the edges are small; the through holes are stepped holes, and when the airflow enters the upper part from the lower part with larger diameter, pressure difference is formed, so that the airflow passing through the through holes has enough pressure to suspend the wafer; the porous material is filled in the air outlet hole and mainly plays a role in uniformly distributing the pressure of the air flow on the surface of the wafer.
A plurality of holes are formed in the surface of the shielding plate, and the holes are uniformly distributed and arrayed along the circumference at intervals of 15 degrees. The shielding plates are respectively arranged on the upper surface and the lower surface of the bi-pass suspension platform, so that the pressure on the surface of the wafer is uniformly distributed. In order to realize the adjustable air flow stability, the shielding plate is designed with through holes and grid holes, when the through holes are concentric with the air outlet holes of the suspension table, the air flow speed and the pressure on the wafer are not influenced, when the shielding plate rotates by 15 degrees, the grid holes are just concentric with the air outlet holes of the suspension table, the air flow is slowed down at the moment, and the pressure on the surface of the wafer is reduced.
The arrangement of the holes on the suspension platform is in clearance, and the arrangement mode of the holes is mainly considered. According to the flowing process of fluid in the internal pipeline of the suspension table, a continuity equation and a momentum conservation equation are respectively satisfied.
And a porous medium filling material is added into the pores, so that the flow of gas inside the pores is regular. As shown in table 1:
TABLE 1
Note: the air outlet holes of the suspension table are distributed on the table top in a corona shape, and the air outlet holes are distributed in a linear shape along the radial direction of the suspension table, so that the air outlet holes form a plurality of concentric circles with different diameters, and the outer circle and the inner circle in the table 1 represent two adjacent circles of concentric circles.
The flow through the orifice can be formulated by integration:
now, the magnitude of the airflow of the innermost turn and the second turn are compared:
so that Q can be clearly found 1 ＝Q 2 So it can be deduced from this that the gas flow within each turn is equal.
Considering now that under ideal conditions, the pressure across the orifice can be expressed by the following equation, disregarding the drag losses:
in the formula: ρ — gas density;
q-flow rate of the orifice;
s-cross-sectional area of the hole;
as can be seen from the above formula, the smaller the cross-sectional area S of the hole, i.e., the smaller the diameter of the hole, the smaller the pressure applied to the wafer surface. Therefore, the application of the shielding plate is provided with the grid holes, so that when the thinner wafer is dried, the shielding plate can be used for shielding, and the gas pressure borne by the surface of the wafer can be effectively reduced.
The invention relates to a method and a device for realizing a porous medium type stable and adjustable gas suspension flow field for drying a plurality of wafers, which have the following working procedures:
1) Placing the wafer between two adjacent suspension platforms, ventilating the pipeline, and arranging air outlet holes between the two adjacent suspension platforms oppositely to form air flow so as to enable the wafer to be suspended between the two suspension platforms;
2) According to actual requirements, rotating the shield plate retainer to enable grid holes or through holes on the shield plate to correspond to the positions of the air outlet holes of the corresponding suspension platform, and switching the size of air flow of the air outlet holes to change the pressure of the air flow on the surface of the wafer and the drying speed of the air flow;
3) Rotating the suspension table to a proper position according to actual requirements;
4) The cylinder is connected with the left side plate or the right side plate to drive the cross frame plate to drive the suspension cabin to move upwards or downwards;
5) The motor drives the screw rod to enable the sliding table to drive the cross frame plate to horizontally displace along the guide rail, so that the suspension bin enters or moves out of the drying box.
And (3) placing the wafer into the suspension bin, wherein the wafer can be suspended between the two suspension platforms under the action of the upper air flow and the lower air flow. At the moment, the bearing mechanism slowly sends the suspension bin into the drying box, and faster drying in one container is realized. When the drying is finished, the bearing mechanism can remove the drying box from the suspension bin again, so that the wafer can be taken out conveniently.
Compared with the prior art, the method for realizing the porous medium type stable and adjustable gas suspension flow field for drying the wafers provided by the invention has the advantages that the drying of the wafers can be realized in a multi-wafer manner, and no contact or clamping is generated during drying. The invention aims to solve the problems that the conventional wafer is easy to damage due to the clamping mode during drying, and the clamped part cannot be sufficiently dried. The traditional manipulator clamping is not adopted, and the gas suspension mode is adopted, so that the damage to the wafer caused by uneven stress in the clamping process can be reduced. The flow field can be adjusted, and the drying of wafers with different thicknesses can be met. Improves the working efficiency and has great market prospect and popularization value.
Claims (3)
1. The device for the porous medium type stable and adjustable gas suspension flow field for drying the wafers is characterized by comprising a workbench (1), a drying box (3), a suspension bin (6) and a suspension bin bearing mechanism (7), wherein the suspension bin bearing mechanism and the drying box are arranged on the workbench, and the suspension bin is conveyed into or moved out of the drying box through the suspension bin bearing mechanism; the suspension bin is formed by arranging a plurality of suspension tables at intervals up and down, a ventilating pipeline (622) is arranged in each suspension table, each suspension table is provided with a plurality of air outlets, and the air outlets between every two adjacent suspension tables are oppositely arranged to form air flow so that the wafer (65) is suspended between the two suspension tables;
the suspension bin comprises a rotary fixed table (5), the suspension table is formed by connecting a single-pass suspension table (61) at the upper side and the lower side and a double-pass suspension table (62) in the middle into a whole through a plurality of supporting shafts (63) at the side edges, and the suspension table is rotatably connected with the rotary fixed table; air outlet holes are arranged on the upper side and the lower side of the two-way suspension platform, and air outlet holes are arranged on one side of the single-way suspension platform;
porous media (623) are arranged in the air outlet holes, the air outlet holes are divided into a plurality of groups, and each group of air outlet holes are distributed in a linear shape along the radial direction of the suspension table;
each suspension platform is provided with a shielding plate (64) at the air outlet, the shielding plate is provided with a plurality of groups of through holes (642) and grid holes (641) which are arranged in a linear manner, and the through holes and the grid holes are arranged at intervals and are respectively distributed along the radial direction of the shielding plate; the central angle between two adjacent groups of through holes or grid holes is equal to the central angle between two adjacent groups of air outlet holes; through rotating the shielding plate, the through holes or grid holes of the shielding plate correspond to the air outlet holes of the corresponding suspension table so as to change the air flow of the air outlet holes of the suspension table;
the shielding plate is rotationally connected with the rotary fixed table through a shielding plate retainer (66), the shielding plate retainer is formed by connecting an underframe (661) and clamping plates (662) on two sides into a whole, the underframe is rotationally connected with the rotary fixed table, the clamping plates on two sides are arranged on two sides of the suspension table and clamp and fix the corresponding shielding plate together, and the shielding plate retainer is rotated to enable the shielding plate to rotate so as to change the air flow of the air outlet hole of the suspension table;
the through hole of the shielding plate is in a stepped hole shape, when airflow enters the upper smaller hole from the lower larger hole, pressure difference is formed, and sufficient pressure is generated to suspend the wafer;
the central angle between the through holes and the grid holes of the two adjacent groups is 15 degrees, and the central angle between the air outlet holes of the two adjacent groups is 30 degrees;
the implementation method of the porous medium type device for stabilizing and adjusting the air suspension flow field for drying the wafers comprises the following steps:
1) Placing the wafer between two adjacent suspension platforms, ventilating the pipeline, and arranging air outlet holes between the two adjacent suspension platforms oppositely to form air flow so as to enable the wafer to be suspended between the two suspension platforms;
2) According to actual requirements, rotating the shield plate retainer to enable grid holes or through holes on the shield plate to correspond to the positions of the air outlet holes of the corresponding suspension platform, and switching the size of air flow of the air outlet holes to change the pressure of the air flow on the surface of the wafer and the drying speed of the air flow;
3) Rotating the suspension table to a proper position according to actual requirements;
4) The cylinder is connected with the left side plate or the right side plate to drive the cross frame plate to drive the suspension cabin to move upwards or downwards;
5) The motor drives the screw rod to enable the sliding table to drive the cross frame plate to horizontally displace along the guide rail, so that the suspension bin enters or moves out of the drying box.
2. The porous medium type device for stabilizing and adjusting the air suspension flow field for drying a plurality of wafers as claimed in claim 1, wherein the suspension platform bearing mechanism comprises a guide rail (711), a motor (71), a fixed frame plate (72), a screw rod (75), a cross frame plate (76) and a sliding table (79); the guide rail is fixed on the workbench, the sliding table is in sliding fit with the guide rail, the lead screw is supported on the workbench through the fixed frame plate, and the lead screw is in threaded fit with the sliding table; the suspension bin is installed on the cross frame plate, the cross frame plate is installed on the top of the sliding table, and the motor drives the screw rod to enable the sliding table to drive the cross frame plate and the suspension bin to horizontally displace along the guide rail, so that the suspension bin enters or moves out of the drying box.
3. The multi-wafer drying porous medium type device for stabilizing and adjusting the air suspension flow field according to claim 2, wherein a cylinder (712) is installed on one side of the sliding table, and a left side push plate (78) and a right side push plate (77) are respectively arranged on two sides of the tail of the cross frame plate; the left side push plate and the right side push plate are respectively positioned at two sides of the sliding table and are in up-and-down sliding fit with the sliding table through the sliding grooves; the output shaft of the cylinder is connected with the left side plate or the right side plate, and drives the cross frame plate to drive the suspension cabin to move upwards or downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033300.XA CN112880307B (en) | 2021-01-12 | 2021-01-12 | Porous medium type device for drying multiple wafers and achieving method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033300.XA CN112880307B (en) | 2021-01-12 | 2021-01-12 | Porous medium type device for drying multiple wafers and achieving method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112880307A CN112880307A (en) | 2021-06-01 |
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| CN103811383A (en) * | 2014-02-28 | 2014-05-21 | 北京七星华创电子股份有限公司 | Wafer drying device and drying method thereof |
| CN203644750U (en) * | 2013-12-30 | 2014-06-11 | 上海集成电路研发中心有限公司 | Semiconductor wafer bearing platform |
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| CN208336165U (en) * | 2018-07-09 | 2019-01-04 | 安徽宏实自动化装备有限公司 | Blowing-dry apparatus after the cleaning of single-wafer Carrier box |
| CN110048027A (en) * | 2015-09-29 | 2019-07-23 | 东京毅力科创株式会社 | Drying device and drying method |
| CN211320059U (en) * | 2020-03-03 | 2020-08-21 | 大连威凯特科技有限公司 | Device for drying and decontaminating cleaned silicon wafer |
| CN112103207A (en) * | 2019-06-18 | 2020-12-18 | 盛美半导体设备(上海)股份有限公司 | Wafer drying device and method |
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| CN203644750U (en) * | 2013-12-30 | 2014-06-11 | 上海集成电路研发中心有限公司 | Semiconductor wafer bearing platform |
| CN103811383A (en) * | 2014-02-28 | 2014-05-21 | 北京七星华创电子股份有限公司 | Wafer drying device and drying method thereof |
| TWM513870U (en) * | 2015-09-22 | 2015-12-11 | Ssa Wet Technology Co Ltd | Non-contact continuous wafer processing device |
| CN110048027A (en) * | 2015-09-29 | 2019-07-23 | 东京毅力科创株式会社 | Drying device and drying method |
| CN208336165U (en) * | 2018-07-09 | 2019-01-04 | 安徽宏实自动化装备有限公司 | Blowing-dry apparatus after the cleaning of single-wafer Carrier box |
| CN112103207A (en) * | 2019-06-18 | 2020-12-18 | 盛美半导体设备(上海)股份有限公司 | Wafer drying device and method |
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