CN112872629B - Four-optical-wedge rotary-cut drilling method and system based on ultrafast laser pulse sequence - Google Patents
Four-optical-wedge rotary-cut drilling method and system based on ultrafast laser pulse sequence Download PDFInfo
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- CN112872629B CN112872629B CN202110061801.9A CN202110061801A CN112872629B CN 112872629 B CN112872629 B CN 112872629B CN 202110061801 A CN202110061801 A CN 202110061801A CN 112872629 B CN112872629 B CN 112872629B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
The invention provides a four-optical-wedge rotary-cut drilling method and a system based on an ultrafast laser pulse sequence, which are characterized in that a pulse sequence generating device similar to a Fabry-Perot interferometer is utilized to shape ultrafast laser pulses into a pulse sequence with a specific energy ratio and a sub-pulse interval, then angle deflection parameters and displacement rotation parameters of a four-optical-wedge rotary-cut head are set according to requirements, the angle and the path of a light beam are controlled, laser is focused on the surface of a sample to be processed, and a needed micropore is processed. Compared with the prior art, the multi-axis laser processing device has the advantages of simple structure, no need of complex light path alignment, high repeatability, and capability of realizing high-depth-diameter-ratio and porous high-precision ultrafast laser processing by matching with a multi-axis precision motion control system and an intelligent control algorithm.
Description
Technical Field
The invention relates to the technical field of ultrafast laser processing, in particular to a processing method and a processing system based on an ultrafast laser pulse sequence and four-optical-wedge rotary-cut drilling.
Background
At present, laser processing technology is applied to almost all mainstream manufacturing fields, such as automobile manufacturing, electronic devices, aerospace, petrochemical industry, metallurgical mines, energy transportation and the like, and is only applied to different fields with different popularization degrees. The laser processing technology is a high and new technology without substitution due to the advantages of non-contact property, high processing efficiency, good processing quality and the like of the laser beam and the processing material, and the application of the laser processing technology in various fields directly or indirectly promotes the development of related fields. The long pulse laser processing mode, the material absorbs laser energy and the temperature rises to reach the melting point boiling point of the material, thereby achieving the effect of ablation processing of the material. The long pulse laser processing belongs to thermal processing, has stronger thermal effect, has larger thermal damage to a material body, and cannot be applied to the application field with extremely high requirements on processing quality and processing precision.
With the development of the Chirped Pulse Amplification (CPA) technology, the laser Pulse width can reach the femtosecond magnitude, so that the thermal effect of laser ablation is greatly reduced, and cold processing is realized. Ultrafast laser processing has the characteristics of wide range of processing materials, non-contact, high peak power, ultrashort pulse and the like, can realize cold processing without a recast layer and a heat-free influence area, and has a very small heat-affected area, so the ultrafast laser processing has attracted wide attention in the field of precise micropore processing such as aviation and aerospace and is applied in the processing of superhard, ultra-brittle and ultra-soft materials at first. However, the potential of direct ultrafast laser processing is limited, and effective ablation of materials requires overcoming a high pulse energy threshold, and when the laser energy is low, the effective ablation rate of materials is low, and if higher laser power is used, the ablation efficiency is improved while more complicated effects are brought. For example, at higher laser powers, the material can experience shielding, saturation, and thermal damage to the bulk of the material due to heat build-up. Meanwhile, due to the Gaussian distribution of laser spots, the holes processed by the direct impact type laser punching are conical, and the depth-diameter ratio is very limited. Therefore, how to ensure the processing quality while improving the laser power and control the hole pattern, the aperture and the depth-diameter ratio of the processed micropore is a technical difficulty faced by the ultrafast laser processing.
Disclosure of Invention
The invention aims to provide a four-optical-wedge rotary-cut drilling method and a four-optical-wedge rotary-cut drilling system based on an ultrafast laser pulse sequence, which aim at the defects of the prior art, shape the ultrafast laser pulse into a pulse sequence with a specific energy ratio and a sub-pulse interval, focus a laser beam on the surface of a sample to be processed by adopting a four-optical-wedge rotary-cut head according to the set pulse sequence, the beam angle and the path, process a required micropore, realize the ultrafast laser processing of a high depth-diameter ratio and a porous micropore, and match a pulse sequence generating device with a multi-axis precise motion control system to solve the control problems of hole pattern, hole diameter and depth-diameter ratio The ultrafast laser micro-hole processing with larger depth-diameter ratio well solves the problems of poor hole shape and limited depth-diameter ratio of direct processing.
The specific technical scheme for realizing the purpose of the invention is as follows: a four-optical-wedge rotary-cut drilling method based on an ultrafast laser pulse sequence is characterized in that ultrafast laser pulses are shaped into a pulse sequence with a certain energy ratio and sub-pulse intervals, a four-optical-wedge rotary-cut head is adopted to focus laser beams on the surface of a sample to be processed according to a set pulse sequence, a set light beam angle and a set path, and ultrafast laser processing of high depth-diameter-ratio and porous micropores is achieved.
A four-optical-wedge rotary-cut drilling system based on an ultrafast laser pulse sequence is characterized in that the four-optical-wedge rotary-cut drilling system consisting of a pulse sequence generating device, a sample monitoring unit and a sample processing unit is used for ultrafast laser processing of high depth-diameter ratio and porous micropores, and the system comprises: the device comprises an ultrafast laser, a mechanical switch, a half-wave plate, a Glan prism, a first semi-transparent semi-reflective mirror, a second semi-transparent semi-reflective mirror, a one-dimensional precise electric control translation stage, a four-optical-wedge rotary cutting head, an ultrafast laser high-reflective mirror, a focusing lens, a sample to be processed, a multi-axis precise electric control translation stage, a white light illumination source, a white light beam splitter and CCD imaging equipment.
Laser emitted by the ultrafast laser enters a half-wave plate, a Glan prism, a first semi-transparent semi-reflective mirror and a second semi-transparent semi-reflective mirror arranged on a one-dimensional electric control translation table through an opened mechanical switch to form a pulse sequence output by the second semi-transparent semi-reflective mirror, or a spectroscope, a high-reflective mirror and a light barrier are additionally arranged on a pulse sequence light path output by the first semi-transparent semi-reflective mirror to form a pulse sequence output by the first semi-transparent semi-reflective mirror; the pulse sequence output by the first semi-transparent semi-reflecting mirror or the pulse sequence output by the second semi-transparent semi-reflecting mirror is guided to a sample to be processed on the multi-axis electric control translation table for micropore processing by a light path formed by sequentially connecting a four-optical-wedge rotary cutting head, an ultrafast laser high-reflecting mirror and a focusing lens; the white light illumination light source reaches the surface of a sample to be processed through a light path formed by sequentially connecting a white light beam splitter, an ultrafast laser high-reflection mirror and a focusing lens, and returns to a CCD imaging device along an original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of micropore processing are realized.
Based on the interaction mechanism of laser and substance and the ablation cooling principle, the invention regulates and controls the local transient electronic dynamics in the material processing by a specific pulse sequence, thereby reducing the thermal effect in the material processing in principle, improving the processing quality of micropores and realizing the high-precision and ultra-fast laser processing with high depth-diameter ratio and porous type.
Compared with the prior art, the invention has the following beneficial effects and advantages:
1) the ultrafast laser pulse sequence generated by the invention can regulate and control local instantaneous free electron dynamics of a processed sample, can essentially control the interaction of laser and a processed material, and reduces the heat effect in material processing, thereby obviously improving the quality and precision of processed micropores.
2) The pulse sequence generation method based on the Fabry-Perot interferometer can conveniently regulate and control the energy ratio of the pulse sequence and the time interval of the sub-pulse, is flexible in regulation mode, has wide time interval range from femtosecond to nanosecond, and has the advantages of simple structure, low cost and the like.
3) The invention is based on the rotary cutting and drilling of the four-optical-wedge, improves the problems of uncontrollable hole-type taper, limited depth-diameter ratio and the like of a direct impact drilling mode, and can freely control the diameter, the depth-diameter ratio and the taper of a hole by matching the parameters of the four-optical-wedge.
4) The multi-axis precise electric control translation table is matched with a multi-axis precise sample multi-dimensional motion control, so that high-quality and high-precision machining with larger size can be realized, and meanwhile, special-shaped machining including special-shaped holes and special-shaped cutting such as machining of special-shaped air film holes of turbine blades and special-shaped cutting of the whole screen of a 3D mobile phone can be realized.
Drawings
Fig. 1 is a schematic diagram of a four-optical-wedge rotary-cut drilling system with a second half-mirror outputting a pulse sequence;
fig. 2 is a schematic diagram of a four-optical-wedge rotary-cut drilling system with a first half-mirror outputting a pulse sequence.
Detailed Description
The ultrafast laser used in the invention is a titanium-sapphire femtosecond laser regeneration amplification system, the central wavelength is 800nm, the pulse width is 50fs, the basic repetition frequency is 1000Hz, and linear polarization is realized. The high-quality high depth-diameter ratio micropore machining method of the ultrafast laser pulse sequence and the four-optical-wedge rotary cutting drilling specifically comprises the following steps:
the method comprises the following steps: and generating a proper ultrafast laser pulse sequence according to the requirement, wherein the proper reflectivity of the first half mirror and the second half mirror is selected, and the two half mirrors are adjusted to be at a proper distance. The different energy ratios of the pulse sequences can influence the interaction process of the laser and the substance, and the first half-mirror and the second half-mirror with different reflectivities are selected to be combined to generate the pulse sequences with different energy ratios. According to the interaction mechanism of the ultrafast laser and the substance and the ablation cooling principle, the dynamic process of the sample excited in different time scales after laser irradiation is different, so that the sub-pulse interval is the most important parameter for controlling the interaction of the laser and the substance. The second semi-transparent semi-reflecting mirror is arranged on the one-dimensional precise electric control translation platform, the pulse time interval of the sub-pulses is adjusted by controlling the distance between the two semi-transparent semi-reflecting mirrors, the heat effect in processing is reduced as much as possible, and the processing quality is improved.
Step two: inputting appropriate four-optical-wedge parameters according to requirements, wherein the four-optical-wedge rotary cutting head comprises: the angle deflection light wedge group and the displacement rotation light wedge group can not only change the direction of the light beam, but also control the movement path of the light beam. When zero tapering round hole needs to be processed, because direct impact punching can make the pass have certain tapering, consequently need set up suitable angle deflection and eliminate this tapering, simultaneously according to different aperture size, input different displacement rotation parameters. When the circular hole with the positive taper or the negative taper needs to be machined, corresponding angle deflection parameters are set, and different displacement rotation parameters are input according to different aperture sizes.
Step three: and carrying out laser processing by using the parameters set in the first step and the second step. And guiding the ultrafast laser processing light beam with the set laser parameters and the set light beam path to the surface of the sample to be processed, and observing and monitoring the processed micropore by using CCD imaging equipment.
The high-quality high-depth-diameter-ratio micropore machining method based on the ultrafast laser pulse sequence and the four-optical-wedge rotary cutting and drilling is matched with the multi-shaft precise electric control translation table and the related motion control algorithm, so that high-quality micropore machining with larger size and larger depth-diameter ratio can be realized, and high-quality special-shaped hole machining, special-shaped cutting and the like can be realized by matching with the intelligent motion control algorithm.
The present invention is further illustrated by the following specific examples.
Example 1:
referring to fig. 1, the four-optical-wedge rotary-cut drilling system comprises: pulse train generating device
Sample monitoring unit
And a sample processing unit
Said pulse train generating means
The device comprises an ultrafast laser 1, a half-wave plate 3, a Glan prism 4, a first semi-transparent semi-reflective mirror 5 and a second semi-transparent semi-reflective mirror 6 which are connected in sequence; the sample monitoring unit
The light path connected with the white light illumination light source 13 and the white light beam splitter 14 and the CCD imaging device 15; the sample processing unit
The device consists of a light path and a multi-axis electric control translation stage 12, wherein the light path is formed by sequentially connecting a four-optical-wedge rotary cutting head 8, an ultrafast laser high-reflection mirror 9 and a focusing lens 10; laser emitted by the ultrafast laser 1 enters a second semi-transparent semi-reflective mirror 6 arranged on a one-dimensional electric control translation stage 7 through a half-wave plate 3, a Glan prism 4 and a first semi-transparent semi-reflective mirror 5 to form a pulse sequence output by the second semi-transparent semi-reflective mirror 6; a pulse sequence output by the first semi-transparent semi-reflective mirror 5 is guided to a sample 11 to be processed on a multi-axis electric control translation table 12 for micro-hole processing through a light path formed by sequentially connecting a four-optical-wedge rotary cutting head 8, an ultrafast laser high-reflective mirror 9 and a focusing lens 10; the white light illumination light source 13 reaches the surface of the sample 11 to be processed through a light path formed by sequentially connecting a white light beam splitter 14, an ultrafast laser high-reflection mirror 9 and a focusing lens 10, and returns to the CCD imaging device 15 along the original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of the micropore processing are realized.
The four-optical-wedge rotary cutting and drilling system performs micropore machining in the following way: the mechanical switch 2 is turned on, laser emitted from the ultrafast laser 1 passes through the half-wave plate 3 and the Glan prism 4 and reaches a pulse sequence generating device consisting of a first semi-transparent semi-reflective mirror 5 and a second semi-transparent semi-reflective mirror 6, and based on the principle and the structure of the Fabry-Perot interferometer, the laser is reflected back and forth between the first semi-transparent semi-reflective mirror 5 and the second semi-transparent semi-reflective mirror 6 to form a pulse sequence with specific time delay and is output from the second semi-transparent semi-reflective mirror 6. The distance between the two half-transmitting half-reflecting mirrors is controlled to control the sub-pulse interval in the pulse sequence, wherein the minimum sub-pulse interval can reach 677 femtoseconds, and the maximum sub-pulse interval can reach more than 6.7 nanoseconds. Selecting proper half mirrors according to requirements, wherein the combination of the first half mirror 5 and the second half mirror 6 with different reflectivities can generate pulse sequences with different energy ratios, and if the reflectivity of the first half mirror 5 is a and the reflectivity of the second half mirror 6 is b, the generated pulse sequences can generate pulse sequences with different energy ratiosPulse sequence with a*b, for example, when the reflectivities of the first half mirror 5 and the second half mirror 6 are both selected to be 90%, the energy ratio of each sub-pulse in the generated pulse sequence is 1: 0.81: 0.66: 0.53: 0.43: … …. The time interval of the sub-pulse is adjusted, the heat effect during processing is reduced as much as possible, and the processing quality is improved. According to the interaction mechanism of the ultrafast laser and the substance and the ablation cooling principle, the dynamic process of the sample excited in different time scales after laser irradiation is different, so that the sub-pulse interval is the most important parameter for controlling the interaction of the laser and the substance. The second half-transmitting half-reflecting mirror 6 is arranged on a one-dimensional precise electric control translation stage 7, and the distance between the two half-transmitting half-reflecting mirrors is adjusted by controlling the one-dimensional electric control translation stage 7, so that the sub-pulse time interval is controlled. Different combinations of the semi-transparent and semi-reflective mirrors and different sub-pulse intervals in the test are changed, the surface appearance of the holes processed under different parameters is observed through the CCD imaging equipment 15, and the optimal parameter range is found.
The four-optical-wedge angle deflection parameter and the displacement rotation parameter are set according to the hole pattern and the aperture to be processed, the modulated pulse sequence is output by the second semi-transparent semi-reflective mirror 6, and the pulse sequence entering the four-optical-wedge rotary cutting head 8 sequentially enters the high-reflective mirror 9 and the focusing lens 10 to reach the surface of a sample 11 to be processed through the control of the angle and the rotation path of the light beam. By setting corresponding four-optical-wedge motion parameters, the incident angle and the motion path of the ultrafast laser pulse sequence on the surface of the sample are controlled, holes with different apertures and tapers can be machined, and round holes with zero taper, positive taper and negative taper can be machined. The sample 11 to be processed is placed on the multi-axis electric control translation table 12, and an intelligent motion control instruction is input through a computer, so that multi-axis precise posture adjustment and motion of the sample 11 to be processed are realized. The four-optical-wedge light beam path control is matched with the five-axis precision motion control, so that the diameter and depth-diameter ratio of a hole can be further increased, a special-shaped hole can be machined, and special-shaped cutting is realized. The laser and the substance interaction is controlled through the pulse sequence, the heat effect is reduced, the processing quality is improved, the taper and the aperture of the processed hole are controlled through the four-optical-wedge rotary cutting head, and high-quality micropore processing with different tapers, different apertures and different depth-diameter ratios is realized.
Example 2
Referring to fig. 2, the four-optical-wedge rotary-cut drilling system comprises: pulse sequence generating device
Sample monitoring unit
And a sample processing unit
Said pulse train generating means
The device comprises an ultrafast laser 1, a half-wave plate 3, a Glan prism 4, a first half-transmitting and half-reflecting mirror 5, a second half-transmitting and half-reflecting mirror 6, a spectroscope 16, a high-reflecting mirror 17 and a light barrier 18 which are connected; the sample monitoring unit
The light path connected with the white light illumination light source 13 and the white light beam splitter 14 and the CCD imaging device 15; the sample processing unit
The device consists of a light path and a multi-axis electric control translation stage 12, wherein the light path is formed by sequentially connecting a four-optical-wedge rotary cutting head 8, an ultrafast laser high-reflection mirror 9 and a focusing lens 10; laser emitted by the ultrafast laser 1 enters a second semi-transparent semi-reflecting mirror 6 arranged on a one-dimensional electric control translation stage 7 through a half-wave plate 3, a Glan prism 4 and a first semi-transparent semi-reflecting mirror 5, the laser is reflected back and forth between the first semi-transparent semi-reflecting mirror 5 and the second semi-transparent semi-reflecting mirror 6 to form a pulse sequence with specific time delay, the pulse sequence is output by the first semi-transparent semi-reflecting mirror 5 and is output by a beam splitter 16 and a high reflecting mirror 17 to form a pulse sequence output by the first semi-transparent semi-reflecting mirror 5; the pulse sequence output by the first semi-transparent semi-reflecting mirror 5 is guided to a light path formed by sequentially connecting a four-optical-wedge rotary cutting head 8, an ultrafast laser high-reflecting mirror 9 and a focusing lens 10, and a laser beam is guided to a multi-axis electric control translation table 12Carrying out micropore processing on a sample 11 to be processed; the white light illumination light source 13 reaches the surface of the sample 11 to be processed through a light path formed by sequentially connecting a white light beam splitter 14, an ultrafast laser high-reflection mirror 9 and a focusing lens 10, and returns to the CCD imaging device 15 along the original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of the micropore processing are realized.
The four-optical-wedge rotary cutting and drilling system performs micropore machining in the following way: the method comprises the steps that a mechanical switch 2 is started, laser emitted from an ultrafast laser 1 passes through a half-wave plate 3 and a Glan prism 4 and reaches a pulse sequence generating device composed of a first semi-transparent semi-reflecting mirror 5 and a second semi-transparent semi-reflecting mirror 6, based on the principle and the structure of a Fabry-Perot interferometer, the laser is reflected back and forth between the first semi-transparent semi-reflecting mirror 5 and the second semi-transparent semi-reflecting mirror 6 to form a pulse sequence with specific time delay and is output by the first semi-transparent semi-reflecting mirror 5, a spectroscope 16 and a high-reflecting mirror 17 which form an angle of 45 degrees with incident laser are arranged in front of the first semi-transparent semi-reflecting mirror 5, the pulse sequence is introduced into a four-optical wedge rotary cutting head 8, and then a laser beam is introduced into a sample 11 to be processed on a multi-axis electric control translation stage 12 by a high-reflecting mirror 9 and a focusing lens 10 to carry out micro-hole processing; the white light illumination light source 13 reaches the surface of the sample 11 to be processed through a light path formed by sequentially connecting a white light beam splitter 14, an ultrafast laser high-reflection mirror 9 and a focusing lens 10, and returns to the CCD imaging device 15 along the original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of the micropore processing are realized. The laser and the substance interaction is controlled through the pulse sequence, the heat effect is reduced, the processing quality is improved, the taper and the aperture of the processed hole are controlled through the four-optical-wedge rotary cutting head, and high-quality micropore processing with different tapers, different apertures and different depth-diameter ratios is realized.
The combination of the first half mirror 5 and the second half mirror 6 with different reflectivities is selected according to the requirement to generate pulse sequences with different energy ratios, and if the reflectivity of the first half mirror 5 is a and the reflectivity of the second half mirror 6 is b, the pulse sequence output by the first half mirror 5 except the first pulse is a*b, e.g. when the reflectivity of the first half mirror 5 is 40%, the second half mirror 6 is a high-reflectivity mirror with the reflectivity of 1 corresponding to the wavelength band, and the pulse output from the first half mirror 5The energy ratio of each sub-pulse in the pulse sequence is 40: 36: 14.4: 5.8: 2.3: … …. The time interval of the sub-pulse is adjusted, the heat effect during processing is reduced as much as possible, and the processing quality is improved. According to the interaction mechanism of the ultrafast laser and the substance and the ablation cooling principle, the dynamic process of the sample excited in different time scales after laser irradiation is different, so that the sub-pulse interval is the most important parameter for controlling the interaction of the laser and the substance. The second semi-transparent semi-reflecting mirror 6 is arranged on a one-dimensional precise electric control translation stage 7, and the distance between the two semi-transparent semi-reflecting mirrors is adjusted by controlling the one-dimensional electric control translation stage 7, so that the sub-pulse time interval is controlled. And (3) replacing different semi-transparent and semi-reflective mirror combinations and testing different sub-pulse intervals, observing the surface appearance of the holes processed under different parameters through a CCD monitoring imaging system, and finding out the optimal parameter range. The laser and the substance interaction is controlled through the pulse sequence, the heat effect is reduced, the processing quality is improved, the taper and the aperture of the processed hole are controlled through the four-optical-wedge rotary cutting head, and high-quality micropore processing with different tapers, different apertures and different depth-diameter ratios is realized.
The four-optical-wedge angle deflection parameter and the displacement rotation parameter are set according to the hole pattern and the aperture to be processed, the pulse sequence output by the first half-transmitting half-reflecting mirror 5 is used, the modulated pulse sequence is reflected by the spectroscope 16 and the high-reflecting mirror 17 to enter the four-optical-wedge rotary cutting head 8, the angle and the rotation path of a light beam are controlled, and then the light beam sequentially passes through the high-reflecting mirror 9 and the focusing lens 10 to reach the surface of a sample 11 to be processed. The incident angle and the motion path of the ultrafast laser pulse sequence on the surface of the sample are controlled by setting corresponding four-optical-wedge motion parameters, holes with different apertures and different tapers are processed, and round holes with zero taper, positive taper and negative taper can be processed. And the high-quality special-shaped hole machining, special-shaped cutting and the like can be realized by matching with a multi-axis precise electric control translation table and an intelligent motion control algorithm. The sample 11 to be processed is placed on the multi-axis electric control translation table 12, and an intelligent motion control instruction is input through a computer, so that multi-axis precise posture adjustment and motion of the sample to be processed are realized. The four-optical-wedge light beam path control is matched with the five-axis precision motion control, so that the diameter and depth-diameter ratio of a hole can be further increased, a special-shaped hole can be machined, and special-shaped cutting is realized.
The above embodiments are illustrative, but not restrictive, of the principles and principles of the present invention, and any other changes, modifications, substitutions, and combinations that do not depart from the spirit and scope of the invention are intended to be included therein.
Claims (12)
1. A four-optical-wedge rotary-cut drilling system based on an ultrafast laser pulse sequence is characterized in that the four-optical-wedge rotary-cut drilling system consisting of a pulse sequence generating device, a sample monitoring unit and a sample processing unit is used for ultrafast laser processing of micropores, wherein the pulse sequence generating device consists of an ultrafast laser, a half-wave plate, a Glan prism, a first semi-transparent semi-reflective mirror and a second semi-transparent semi-reflective mirror which are sequentially connected through a light path; the sample monitoring unit consists of a light path and a CCD imaging device, wherein the light path is formed by connecting a white light illumination source and a white light beam splitter; the sample processing unit consists of a light path and a multi-axis electric control translation table, wherein the light path is formed by sequentially connecting a four-optical-wedge rotary cutting head, an ultrafast laser high-reflection mirror and a focusing lens; laser emitted by the ultrafast laser enters a second semi-transparent semi-reflective mirror arranged on the one-dimensional electric control translation stage through a half-wave plate, a Glan prism and a first semi-transparent semi-reflective mirror to generate a pulse sequence output by the second semi-transparent semi-reflective mirror; the pulse sequence output by the second semi-transparent semi-reflecting mirror is guided to a sample to be processed on the multi-axis electric control translation table for micropore processing by a light path formed by sequentially connecting a four-optical-wedge rotary cutting head, an ultrafast laser high-reflecting mirror and a focusing lens; the white light illumination light source reaches the surface of a sample to be processed through a light path formed by sequentially connecting a white light beam splitter, an ultrafast laser high-reflection mirror and a focusing lens, and returns to a CCD imaging device along an original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of micropore processing are realized.
2. The system according to claim 1, wherein the first half mirror and the second half mirror are disposed in parallel and perpendicular to the incident laser beam, the distance between the two half mirrors is adjusted to control the sub-pulse interval in the pulse sequence, and the energy ratio of the generated pulse sequence is controlled by selecting the combination of the half mirrors with different reflectivities.
3. The ultrafast laser pulse sequence-based four-optical-wedge rotary-cut drilling system of claim 1, wherein the four-optical-wedge rotary-cut head comprises an angle deflection optical wedge set and a displacement rotation optical wedge set, and the beam angle and the beam movement path are controlled by adjusting the angle deflection and displacement rotation parameters, so as to achieve micro-hole processing with different tapers and different apertures.
4. The ultrafast laser pulse train-based quad-wedge atherectomy drilling system of claim 1, wherein said ultrafast laser is controlled by a mechanical switch to turn the laser on or off.
5. The ultrafast laser pulse sequence-based four-optical-wedge rotary-cut drilling system of claim 1, wherein the multi-axis electrically-controlled translation stage is a five-axis electrically-controlled translation stage having three translation motion axes X/Y/Z and two rotation axes, and intelligent motion control commands are input through a computer to perform multi-axis precise attitude adjustment and motion, thereby realizing special-shaped hole machining or special-shaped cutting.
6. A four-optical wedge rotary cutting drilling method based on an ultrafast laser pulse sequence of the drilling system of any one of claims 1 to 5, characterized in that a pulse sequence generating device is adopted to shape the ultrafast laser pulses into a pulse sequence with a certain energy ratio and sub-pulse intervals, a four-optical wedge rotary cutting head is adopted to focus laser beams on the surface of a sample to be processed according to the set pulse sequence, beam angles and paths, and ultrafast laser processing of high depth-diameter ratio and porous micropores is realized, the pulse sequence generates pulse sequences with different energy ratios by two semi-transparent semi-reflecting mirrors with different reflectivities and parallel to each other, and the sub-pulse intervals in the pulse sequence are controlled by changing the distance between the two semi-transparent semi-reflecting mirrors.
7. A four-optical-wedge rotary-cut drilling system based on an ultrafast laser pulse sequence is characterized in that the four-optical-wedge rotary-cut drilling system consisting of a pulse sequence generating device, a sample monitoring unit and a sample processing unit is used for ultrafast laser processing of micropores, wherein the pulse sequence generating device consists of an ultrafast laser, a half-wave plate, a Glan prism, a first semi-transparent semi-reflective mirror, a second semi-transparent semi-reflective mirror, a spectroscope, a high-reflective mirror and a light path connected with a light barrier; the sample monitoring unit consists of a light path and a CCD imaging device, wherein the light path is formed by connecting a white light illuminating source and a white light beam splitter; the sample processing unit consists of a light path and a multi-axis electric control translation table, wherein the light path is formed by sequentially connecting a four-optical-wedge rotary cutting head, an ultrafast laser high-reflection mirror and a focusing lens; laser emitted by the ultrafast laser enters a second semi-transparent semi-reflecting mirror arranged on the one-dimensional electric control translation stage through a half-wave plate, a Glan prism and a first semi-transparent semi-reflecting mirror, the laser is reflected back and forth between the first semi-transparent semi-reflecting mirror and the second semi-transparent semi-reflecting mirror to form a pulse sequence with specific time delay, the pulse sequence is output by the first semi-transparent semi-reflecting mirror and is reflected and output by a spectroscope and a high-reflection mirror in sequence; the pulse sequence output by the high-reflection mirror is guided to a sample to be processed on the multi-axis electric control translation table for micropore processing by a light path formed by sequentially connecting a four-optical-wedge rotary cutting head, an ultrafast laser high-reflection mirror and a focusing lens; the white light illumination light source reaches the surface of a sample to be processed through a light path formed by sequentially connecting a white light beam splitter, an ultrafast laser high-reflection mirror and a focusing lens, and returns to a CCD imaging device along an original path through the reflection of the surface of the sample, so that the imaging observation and monitoring of micropore processing are realized.
8. The system according to claim 7, wherein the first half mirror and the second half mirror are disposed in parallel and perpendicular to the incident laser beam, the distance between the two half mirrors is adjusted to control the sub-pulse interval in the pulse sequence, and the energy ratio of the generated pulse sequence is controlled by selecting the combination of the half mirrors with different reflectivities.
9. The ultrafast laser pulse sequence-based four-optical-wedge rotary-cut drilling system of claim 7, wherein the four-optical-wedge rotary-cut head comprises an angle deflection optical wedge set and a displacement rotation optical wedge set, and micro-hole processing with different tapers and different apertures is realized by adjusting and controlling the angle of a light beam and the movement path of the light beam through angle deflection and displacement rotation parameters.
10. The ultrafast laser pulse sequence-based quad-optic rotary-cut drilling system of claim 7, wherein the ultrafast laser is controlled by a mechanical switch to turn on or off the laser.
11. The ultrafast laser pulse sequence-based four-optical-wedge rotary-cut drilling system of claim 7, wherein the multi-axis electrically controlled translation stage is a five-axis electrically controlled translation stage having three translation motion axes of X/Y/Z and two rotation axes, and intelligent motion control commands are input through a computer to perform multi-axis precise attitude adjustment and motion, thereby realizing special-shaped hole machining or special-shaped cutting.
12. A four-optical-wedge rotary-cut drilling method based on an ultrafast laser pulse sequence of a drilling system of any one of claims 7 to 11, characterized in that a pulse sequence generating device is adopted to shape ultrafast laser pulses into a pulse sequence with a certain energy ratio and sub-pulse intervals, a four-optical-wedge rotary-cut head is adopted to focus laser beams on the surface of a sample to be processed according to the set pulse sequence, beam angles and paths, and ultrafast laser processing of porous micropores with a high depth-diameter ratio is realized, the pulse sequence generates pulse sequences with different energy ratios by two semi-transparent semi-reflecting mirrors with different reflectivities and parallel to each other, and the sub-pulse intervals in the pulse sequence are controlled by changing the distance between the two semi-transparent semi-reflecting mirrors.
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