CN112852110A - 一种防静电环氧塑封料及其制备方法 - Google Patents
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- 229920000647 polyepoxide Polymers 0.000 claims description 12
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
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- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 125000001246 bromo group Chemical group Br* 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种防静电环氧塑封料及其制备方法。通过调整环氧塑封料中脱模剂的预混合工艺,使得脱模剂在环氧塑封料中的分布更加均匀,提高了脱模力在半导体封装工程中的稳定性,从而抑制了封装工程中局部静电损伤的发生。通过调整环氧塑封料中鏻盐催化剂和膦盐催化剂两者的使用比例,以及炭黑的添加量,降低了环氧塑封料的体电阻率,从而使得环氧塑封料积聚电荷的能力减弱,减少静电释放风险,由此降低了封装产品表面积聚电荷的能力,最终有效抑制了封装工程中静电释放的发生,提高了半导体封装工程中的良品率。
Description
技术领域
本发明属于环氧塑封料应用领域,涉及一种防静电环氧塑封料及其制备方法。
背景技术
随着对芯片集成度要求的不断提高,芯片封装也朝着尺寸小、密度高的方向发展,为了满足这一发展需求,球栅阵列封装(Ball Grid Array Package,BGA)被开发并大量应用于封装塑封过程中。
当封装材料中的静电电荷与低电势物体接触时,静电释放(ElectrostaticDischarge,ESD)瞬间产生的高电流和高热量会击穿芯片内部线路造成电子产品失效。因此,高密度的电路单元必然会提高对静电敏感的风险。
在封装过程中ESD防护一般只从设备和操作方法角度来考虑,极少考虑封装材料对ESD的影响。封装塑封过程的主要材料是环氧塑封料(Epoxy Molding Compound,简称EMC)。EMC是用于半导体封装的一种高分子材料,其主要作用是保护芯片和互连线免受外界的湿气、冲击等影响。EMC特性中,脱模力和体积电阻率过高是造成ESD损伤的主要因素;脱模力过大,导致EMC脱模时摩擦力增大,静电电荷增多;同时,体积电阻率过高会降低EMC静电衰减能力。
发明内容
针对现有技术存在的缺陷,本发明提供了一种防静电环氧塑封料及其制备方法,提高脱模力的稳定性,降低环氧塑封料的体积电阻率能够有效抑制封装过程中静电释放的发生,提高半导体封装工程中的良品率。
一种防静电环氧塑封料,其特征在于,主要由以下重量份的组分制备而成:环氧树脂40-100重量份、固化剂40-100重量份、填充剂480-1500重量份、阻燃剂15-150重量份、催化剂2-10重量份、脱模剂2-10重量份、炭黑1.6-14重量份,偶联剂1-10重量份;所述脱模剂为天然脱模剂与合成脱模剂按照4:1的质量比混合而成。
进一步地,所述炭黑的平均粒径为23-25mm,比表面积为100-115m2/g,吸油性为100cm3/100g。
进一步地,所述填充剂为二氧化硅或氧化铝。
进一步地,所述天然脱模剂为巴西棕榈,所述合成脱模剂为PE。
进一步地,所述阻燃剂为溴环氧树脂或Sb2O3,催化剂为胺或磷化物,所述结合剂为硅氧烷或氨基硅油。
进一步地,所述环氧树脂可以为双酚A型结构环氧、联苯型结构环氧、萘型结构环氧、邻甲酚型结构环氧中的一种或多种。
进一步地,所述固化剂为线性酚醛树脂、弹性硬化剂中的一种或多种。
所述的防静电环氧塑封料的制备方法,其特征在于,包括以下步骤:
(1)将天然脱模剂及合成脱模剂按照4:1的质量比预混合,再与环氧树脂进行预混合,通过高速搅拌机搅拌混合;
(2)将天然脱模剂及合成脱模剂按照4:1的质量比预混合的脱模剂与固化剂、阻燃剂、炭黑、偶联剂进行预混合,通过高速搅拌机搅拌混合;
(3)将(1)和(2)中混合后的环氧塑封料与填充剂以及催化剂进行最终混合。
进一步地,所述催化剂为鏻盐和膦盐按照4:3的质量比混合而成。
在环氧塑封料特性中,影响静电释放的因素主要是脱模力和体积电阻率。脱模力来自脱模过程中环氧塑封料与模具表面的摩擦阻力,摩擦大会使得脱模后的环氧塑封料表面积聚大量的电荷,接触到低压器件易造成芯片损坏;体积电阻率越高,环氧塑封料积聚电荷的能力越强,静电释放风险越大。所以,减小环氧塑封料脱模力和体积电阻率是提高芯片成品率的有效措施。
本发明减小环氧塑封料脱模力的方法是改进传统的混合工艺,改进脱模剂混合比例以及调整炭黑的用量。传统的混合工艺分散性较差,本发明第一次预混合是通过环氧塑封料配方优化对脱模剂进行预混合(Melted Master Batch, MMB),改善脱模剂分散性,使得脱模剂在环氧树脂中混合充分均匀,这样可以有利于脱模剂充分分散到塑封料中,使得整个塑封料的各个地方脱模力均匀,可以有效地防止局部脱模力过大的现象,从而抑制了封装工程中局部静电损伤的发生。
本发明所使用的两种脱模剂分别是天然脱模剂和合成脱模剂,天然脱模剂的熔点比合成脱模剂偏低,分散性比合成脱模剂好,但合成脱模剂的润滑效果比天然脱模剂更佳。在粘结力方面,天然脱模剂明显比合成的要高。同时使用这两种脱模剂,并按一定的比例混合,来达到合适的润滑效果和粘结力。
本发明以炭黑为着色剂,通过调整炭黑的用量大幅降低了体积电阻率,本发明所述的塑封料的体积电阻率最小可达到1.8×1010Ω*cm。环氧树脂的交联反应度会影响到EMC 的体积电阻率,本发明同时在在交联反应中通过鏻盐和膦盐两种催化剂混合使得反应生成物的网状结构更加疏松,具有良好的机械性能和介电性能。通过1 H-NMR和DSC 来对鏻盐和膦盐不同配比催化剂制作的样品交联反应致密度和体积电阻率进行分析,当使用鏻盐和膦盐催化剂通过4:3混合的催化剂对体积电阻率的降低有明显的效果。
具体实施方式
下面结合具体实施例,进一步阐明本发明,应理解这些实施例仅用于说明本发明而不用于限制本发明的范围。
本发明所述的防静电环氧塑封料,主要由以下重量份的组分制备而成:环氧树脂40-100重量份、固化剂40-100重量份、填充剂480-1500重量份、阻燃剂15-150重量份、催化剂2-10重量份、脱模剂2-10重量份、炭黑1.6-14重量份,偶联剂1-10重量份;所述脱模剂为天然脱模剂与合成脱模剂按照4:1的质量比混合而成。
按照表1所述的原料配比来制备防静电环氧塑封料。
表1 原料配料表
制备过程如下:
(1)将天然脱模剂巴西棕榈及合成脱模剂PE按照4:1的质量比预混合,再与环氧树脂进行预混合,通过高速搅拌机搅拌混合;
(2)将天然脱模剂巴西棕榈及合成脱模剂PE按照4:1的质量比预混合的脱模剂与固化剂、阻燃剂、炭黑、偶联剂进行预混合,通过高速搅拌机搅拌混合;
(3)将(1)和(2)中混合后的环氧塑封料与填充剂以及催化剂进行最终混合。
针对实施例1,根据炭黑选材不同做了两组对比实验,一组采用平均粒径为24mm,比表面积为110m2/g,吸油性为100cm3/100g的炭黑,标记为1A;一组采用平均粒径为20mm,比表面积为140m2/g,吸油性为131cm3/100g的炭黑,并标记为1B;通过两个对比实验来考察塑封料体积电阻率。1A、1B制备的塑封料的体积电阻率为分别为1.8×1010Ω*cm、3.2×1010Ω*cm。说明1A所使用的炭黑具有更好的降低塑封料体积电阻率性能。
实施例1与实施例2制备的塑封料相比具有更低的体积电阻率,且反应速率更慢。鏻盐催化剂与膦盐催化剂按照4:3的比例复配后,鏻盐催化剂的使用降低了环氧塑封料交联反应中环氧基的开环反应速率,使得反应生成物的网状结构更加疏松,降低了环氧塑封料的体积电阻率,由此降低了封装产品表面积聚电荷的能力,最终有效抑制了封装工程中静电释放的发生。
天然脱模剂巴西棕榈的熔点为85℃,粘结力为105Kgf;合成脱模剂PE的熔点为98℃,粘结力为62Kgf。合成脱模剂的使用能够显著降低脱模力,但会影响其粘结力。当巴西棕榈与PE按照4:1的质量比使用时,能够达到塑封料量产的标准。
所述实施例为本发明的优选的实施方式,但本发明并不限于上述实施方式,在不背离本发明的实质内容的情况下,本领域技术人员能够做出的任何显而易见的改进、替换或变型均属于本发明的保护范围。
Claims (9)
1.一种防静电环氧塑封料,其特征在于,主要由以下重量份的组分制备而成:环氧树脂40-80100重量份、固化剂40-80100重量份、填充剂480-10001500重量份、阻燃剂15-150重量份、催化剂0.2-310重量份、脱模剂0.12-310重量份、炭黑1.6-2414重量份,偶联剂0.011-410重量份;所述脱模剂为天然脱模剂与合成脱模剂按照4:1的质量比混合而成。
2.根据权利要求1所述的基于环氧塑封料,其特征在于,所述炭黑的平均粒径为23-25mm,比表面积为100-115m2/g,吸油性为100cm3/100g。
3.根据权利要求1所述的基于环氧塑封料,其特征在于,所述填充剂为二氧化硅或氧化铝。
4.根据权利要求1所述的基于环氧塑封料,其特征在于,所述天然脱模剂为巴西棕榈,所述合成脱模剂为PE。
5.权利要求1所述的防静电环氧塑封料,其特征在于,所述阻燃剂为溴环氧树脂或Sb2O3,催化剂为胺或磷化物,所述结合剂为硅氧烷或氨基硅油。
6.权利要求1所述的防静电环氧塑封料的制备方法,其特征在于,所述环氧树脂可以为双酚A型结构环氧、联苯型结构环氧、萘型结构环氧、邻甲酚型结构环氧中的一种或多种。
7.权利要求2所述的防静电环氧塑封料的制备方法,其特征在于,所述固化剂为线性酚醛树脂、弹性硬化剂中的一种或多种。
8.根据权利要求1所述的防静电环氧塑封料的制备方法,其特征还在于改进脱模剂的预混合工艺:
(1)将天然脱模剂及合成脱模剂按照4:1的质量比预混合,再与环氧树脂进行预混合,通过高速搅拌机搅拌混合;
(2)将天然脱模剂及合成脱模剂按照4:1的质量比预混合的脱模剂与固化剂、阻燃剂、炭黑、偶联剂进行预混合,通过高速搅拌机搅拌混合;
(3)将(1)和(2)中混合后的环氧塑封料与填充剂以及催化剂进行最终混合。
9.根据权利要求8所述的防静电环氧塑封料的制备方法,其特征在于:所述催化剂为鏻盐和膦盐按照4:3的质量比混合而成。
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