CN112846443A - Welding device and method for liquid cooling plate of micro-channel - Google Patents
Welding device and method for liquid cooling plate of micro-channel Download PDFInfo
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- CN112846443A CN112846443A CN202110050513.3A CN202110050513A CN112846443A CN 112846443 A CN112846443 A CN 112846443A CN 202110050513 A CN202110050513 A CN 202110050513A CN 112846443 A CN112846443 A CN 112846443A
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- cover plate
- micro
- channel substrate
- channel
- substrate
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- 238000003466 welding Methods 0.000 title claims abstract description 32
- 239000007788 liquid Substances 0.000 title claims abstract description 26
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 238000005219 brazing Methods 0.000 claims abstract description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/007—Spot arc welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of direct brazing of a microchannel liquid cooling plate, in particular to a welding device and a welding method of the microchannel liquid cooling plate, which are characterized in that: the novel micro-channel connector at least comprises a micro-channel substrate and a cover plate, wherein the micro-channel substrate and the cover plate have the same area and shape, m rows of cable connector through holes are respectively arranged on the micro-channel substrate and the cover plate at the same position, n cable connector through holes are arranged in each row, a through groove is arranged on one side of the cover plate, which is parallel to each other, of the n rows of cable connector through holes, a boss is arranged on one side of the micro-channel substrate, the through groove is used for being matched with the boss of the micro-channel substrate on the cover plate, and the boss is designed at the welding weak position of the micro; two opposite corners of the cover plate are respectively provided with a cooling liquid inflow riser and a cooling liquid outflow riser; the cover plate and the micro-channel substrate are welded by direct brazing. The micro-channel substrate structure is convenient for solving the defects that the part with smaller contact area between the cover plate and the micro-channel substrate is not easy to generate desoldering, liquid leakage and the like under the pressure state.
Description
Technical Field
The invention relates to the technical field of direct brazing of a microchannel liquid cooling plate, in particular to a welding device and a welding method of the microchannel liquid cooling plate.
Background
In recent years, phased array radars are more and more widely applied, and phased array antennas are more and more high in integration level. Thousands of T/R components are integrated in a limited space of a phased array radar, and generate a large amount of heat in the radar working process, especially in the application of GaN devices for several years, so that the power density of the devices reaches more than three times of the power density of the devices, and the element assembly density, the power consumption and the heat load are rapidly increased. The micro-channel liquid cooling plate is an ideal heat dissipation device, and is widely popularized and applied as a heat dissipation device in a phased array radar.
A microchannel liquid cooled plate generally refers to a heat exchanger having channels with equivalent diameters of 10-1000 μm. The liquid flow microchannel cooling device generally comprises a cover plate and a microchannel base plate, wherein a liquid flow microchannel is processed on the microchannel base plate through a reasonable process, and a riser, a cable through hole and the like for enabling cooling liquid to enter and exit the microchannel base plate are processed on the cover plate. The cover plate is welded on the upper surface of the micro-channel substrate in a brazing mode, and cooling liquid enters and exits the micro-channel radiator through the riser to meet the heat dissipation requirement.
Conventional microchannel heat sinks have been fabricated by soldering the cover plate and microchannel substrate together by a direct brazing process. The method is specifically described in that a brazing welding sheet is placed between a cover plate and a micro-channel substrate, the cover plate, the micro-channel substrate and the micro-channel substrate are compressed, the workpiece is not melted after being heated, a prefabricated welding flux is melted, and metal is connected together through reactions such as metallurgy and diffusion at the gap of a flow channel welding seam by utilizing liquid brazing filler metal.
However, in some high-density phased array radar systems, some special designs require that the contact area of the cover plate of the cold plate and the micro-channel substrate is quite limited at some positions, and the contact width is less than 5 mm. If the positions are welded firmly by a direct brazing method, the welding quality is poor.
When the high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation, large pressure is generated on the cover plate, and the part with small contact area between the cover plate and the micro-channel substrate is easy to have the defects of welding failure, liquid leakage and the like in a pressure state, which is not allowed by the system.
Disclosure of Invention
Aiming at the problems of the existing direct brazing technology, the invention provides a welding device and a welding method for a liquid cooling plate of a micro-channel, so as to solve the defects that the part with smaller contact area between a cover plate and a micro-channel substrate is not easy to generate desoldering, liquid leakage and the like in a pressure state.
In order to achieve the above object, the present invention provides a welding apparatus for a microchannel liquid-cooled plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, n rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, m cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the n rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.
The n cable joint via holes 3 of the n row of the micro-channel substrate 2 and the n cable joint via holes 3 of the cover plate 1 have the same structure and are of an oval strip structure, the micro-channel substrate 2 and the cover plate 1 are rectangular, and the oval strip faces the short side direction of the rectangle.
The specific position size is designed between the 4 rows of elliptic long strips of the micro-channel substrate 2 and the cover plate 1 according to the design requirement.
The inlet and outlet main flow channel 7 of the micro-channel substrate is respectively arranged on two sides of the short side of the micro-channel substrate 2, the inlet and outlet main flow channel 7 of the micro-channel substrate is of a long-strip groove-shaped structure, and the specific position size is designed at two ends of the long-strip groove-shaped structure according to design requirements.
The microchannel substrate 2 is provided with a plurality of microchannels 8 to meet the heat dissipation requirement, and two ends of each microchannel 8 are flush with the inlet and outlet main flow channel 7 of the microchannel substrate.
The height of the boss 6 is consistent with the thickness of the upper cover plate 1.
The upper cover plate 1 is provided with a through groove 9 corresponding to the boss 6, the cross section of the through groove 9 is the same as that of the boss, and the boss is tightly matched with the through groove.
Preferably, the width of the boss is 0.5-0.8 times of the width of the contact weak part;
and the surface of the cover plate 1, the matching position of the lug boss 6 and the cover plate 1 are packaged by adopting argon arc welding spot welding.
The invention has the advantages that: in order to overcome the problems that the contact width of the micro-channel substrate and the cover plate is too narrow, and the welding is not firm and too narrow in the direct brazing process, bosses 6 are designed on one side of through holes of 3 rows of cable connectors arranged side by side on the micro-channel substrate 2, the heights of the bosses are consistent with the thickness of the upper cover plate, through grooves are formed in the positions, corresponding to the bosses, of the upper cover plate, the cross sections of the through grooves are the same as the interfaces of the bosses, and the bosses. The width of the boss is preferably 0.5-0.8 times of the width of the weak contact part, the cover plate and the base plate are welded by a direct brazing method, the surface of the cover plate, the boss and the cover plate are matched, the interface position is packaged by adopting argon arc welding spot welding, the welding quality at the position with the too narrow contact width is ensured, and finally the design flatness requirement of the surface of the whole cover plate is ensured by milling the upper surface of the cover plate 1.
Drawings
The invention is further illustrated by the following examples and figures:
FIG. 1 is a schematic diagram of an improved microchannel liquid cooling plate configuration;
FIG. 2A is a front view of a microchannel substrate structure;
FIG. 2B is a side view of a microchannel substrate structure;
FIG. 3A is a front view of a cover plate construction;
fig. 3B is a side view of the cover plate structure.
In the figure, 1, a cover plate; 2. a microchannel substrate; 3. a cable connector via hole; 4. cooling liquid flows into the riser; 5. the coolant flows out of the riser; 6. a boss; 7. an inlet and outlet main channel of the microchannel substrate; 8. a microchannel; 9. a through groove.
Detailed Description
Example 1
As shown in fig. 1, 2A, 2B, 3A, and 3B, a welding apparatus for a microchannel liquid-cooled plate is characterized in that: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, 4 rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, 4 cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the 3 rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.
The specific values of m and n are determined according to different application scenarios and the number of cable joints, and are generally not more than 5.
The 4 rows of cable connector through holes 3 of the microchannel substrate 2 and the 4 rows of cable connector through holes 3 of the cover plate 1 shown in fig. 2A and 2B have the same structure and are oval long structures, and the microchannel substrate 2 and the cover plate 1 are rectangular.
The 4 rows of elliptic long strips of the micro-channel substrate 2 and the cover plate 1 are distributed at equal intervals.
The inlet and outlet main flow channel 7 of the micro-channel substrate is respectively arranged on two sides of the short side of the micro-channel substrate 2, the inlet and outlet main flow channel 7 of the micro-channel substrate is of a long-strip groove-shaped structure, and two ends of the long-strip groove-shaped structure are respectively close to the positions of 4 rows of oval strips.
Two microchannels 8 are respectively arranged between the 4 rows of elliptic strips of the microchannel substrate 2, and two ends of each microchannel 8 are flush with the inlet and outlet main flow channels 7 of the microchannel substrate.
The height of the boss 6 is consistent with the thickness of the upper cover plate 1.
As shown in fig. 3A and 3B, the cover plate 1 has a through groove 9 formed at a position corresponding to the boss 6, and the cross section of the through groove 9 is the same as the boss interface, so that the boss and the through groove are tightly fitted.
Preferably, the width of the boss is 0.5-0.8 times of the width of the contact weak part;
and the surface of the cover plate 1, the boss 6 and the cover plate 1 are matched, and argon arc welding spot welding is adopted to package the interface position. And finally, the design flatness requirement of the surface of the whole cover plate is ensured in a mode of milling the upper surface of the cover plate 1.
The cover plate 1 is provided with a cooling liquid inflow riser 4, a cooling liquid outflow riser 5 and a cable joint via hole 3, the cover plate 1 is welded on the upper surface of the micro-channel substrate 2 in a direct brazing mode, the cooling liquid flows into the riser 4 through the cooling liquid, and the cooling liquid outflow riser 5 outputs the cooling liquid, so that the heat dissipation requirement is guaranteed.
Example 2
Referring to fig. 1, 2A, 2B, 3A, 3B, a welding apparatus for a microchannel liquid cooling plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, 4 rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, 5 cable connector through holes are arranged in each row, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes arranged side by side on the cover plate 1, bosses 6 are arranged on one side of the 3 rows of cable connector through holes arranged side by side on the micro-channel substrate 2, the through grooves 9 are used for being matched with the bosses 6 of the micro-channel substrate 2 on the cover plate 1, and the bosses 6 are designed at the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 and the micro-channel substrate 2 are welded by direct brazing.
This embodiment gives m =4 columns of cable connector vias 3, with n =5 cable connector vias 3 per column.
Example 3
Referring to fig. 1, 2A, 2B, 3A, 3B, a welding apparatus for a microchannel liquid cooling plate, comprising: the novel micro-channel connector at least comprises a micro-channel substrate 2 and a cover plate 1, wherein the micro-channel substrate 2 and the cover plate 1 have the same area and shape, m rows of cable connector through holes 3 are respectively arranged at the same position of the micro-channel substrate 2 and the cover plate 1, n cable connector through holes 3 are arranged in each row, m and n are not more than 5, when m =3 and n =3, a through groove 9 is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the cover plate 1, a boss 6 is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the micro-channel substrate 2, the through groove 9 is used for being matched with the boss 6 of the micro-channel substrate 2 on the cover plate 1, and the; two opposite corners of the cover plate 1 are respectively provided with a cooling liquid inflow riser 4 and a cooling liquid outflow riser 5; the cover plate 1 is welded on the upper surface of the micro-channel base plate 2 in a brazing mode, so that cooling liquid flows into the riser 4 through the cooling liquid and flows out of the riser 5 for output, pressure generated on the cover plate when high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation is enabled, and the situation that the part, with a small contact area, of the cover plate and the micro-channel base plate is subjected to pressure to generate desoldering and liquid leakage is not influenced.
In fact, the specific values of m and n are determined according to different application scenarios and the number of cable joints, and are generally not more than 5.
The components and structures of the present embodiments that are not described in detail are well known in the art and do not constitute essential structural elements or elements.
Claims (10)
1. The utility model provides a welding set of liquid cooling board of microchannel which characterized by: the novel micro-channel connector at least comprises a micro-channel substrate (2) and a cover plate (1), wherein the micro-channel substrate (2) and the cover plate (1) have the same area and shape, m rows of cable connector through holes (3) are respectively arranged on the micro-channel substrate (2) and the cover plate (1) at the same position, a through groove (9) is arranged on one side of n rows of cable connector through holes arranged side by side on the cover plate (1), bosses (6) are arranged on one side of 3 rows of cable connector through holes arranged side by side on the micro-channel substrate (2), the through groove (9) is used on the cover plate (1) and matched with the bosses (6) of the micro-channel substrate (2) for use, and the bosses (6) are designed at the welding weak part; two opposite corners of the cover plate (1) are respectively provided with a cooling liquid inflow riser (4) and a cooling liquid outflow riser (5); the cover plate (1) and the micro-channel substrate (2) are welded by direct brazing.
2. The apparatus of claim 1, wherein: m and n be not more than 5, the cable joint via hole 3 is listed as, every cable joint via hole 3 has n =5, when m =4, n =4, 4 cable joint via holes (3) of microchannel base plate (2) and 4 cable joint via holes (3) of apron (1) have the same structure, be oval rectangular structure, microchannel base plate (2) and apron (1) be the rectangle, oval rectangular orientation rectangle minor face direction.
3. The apparatus of claim 2, wherein: the 4 rows of elliptic long strips of the micro-channel substrate (2) and the cover plate (1) are distributed at equal intervals.
4. The apparatus of claim 1, wherein: the two sides of the short side of the microchannel substrate (2) are respectively provided with an inlet and outlet main flow passage (7) of the microchannel substrate, the inlet and outlet main flow passage (7) of the microchannel substrate is of a long strip groove-shaped structure, and two ends of the long strip groove-shaped structure are respectively close to the positions of 4 rows of oval strips.
5. The apparatus of claim 2, wherein: two microchannels (8) are respectively arranged between the 4 rows of elliptic strips of the microchannel substrate (2), and two ends of each microchannel (8) are flush with the inlet and outlet main flow channel (7) of the microchannel substrate.
6. The apparatus of claim 1, wherein: the height of the boss (6) is consistent with the thickness of the cover plate (1).
7. The apparatus of claim 1, wherein: the cover plate (1) is provided with a through groove (9) at the position corresponding to the boss (6), the cross section of the through groove (9) is the same as the boss interface, and the boss is ensured to be matched with the through groove tightly.
8. The apparatus of claim 1, wherein: preferably, the width of the boss is 0.5 to 0.8 times the width of the contact weakness.
9. The apparatus of claim 1, wherein: and the surface of the cover plate (1), the boss (6) and the cover plate (1) are matched and positioned by adopting argon arc welding spot welding.
10. A welding method of a liquid cooling plate of a micro-channel is characterized by comprising the following steps: the utility model provides a welding set of liquid cooling board of microchannel which characterized by: the novel micro-channel connector at least comprises a micro-channel substrate (2) and a cover plate (1), wherein the micro-channel substrate (2) and the cover plate (1) have the same area and shape, m rows of cable connector through holes (3) are formed in the micro-channel substrate (2) and the cover plate (1) at the same position respectively, n cable connector through holes (3) are formed in each row, m and n are not more than 5, when m =3 and n =3, a through groove (9) is formed in one side of the 3 rows of cable connector through holes which are arranged side by side on the cover plate (1), a boss (6) is arranged on one side of the 3 rows of cable connector through holes which are arranged side by side on the micro-channel substrate (2), the through groove (9) is used for being matched with the boss (6) of the micro-channel substrate (2) on the cover plate (1), and the boss (6); two opposite corners of the cover plate (1) are respectively provided with a cooling liquid inflow riser (4) and a cooling liquid outflow riser (5); the cover plate (1) is welded on the upper surface of the micro-channel substrate (2) in a brazing mode, so that cooling liquid flows into the riser (4) through the cooling liquid and is output through the coolant flowing out of the riser (5), pressure generated on the cover plate when high-pressure cooling liquid flows in the liquid cooling plate for heat dissipation is enabled to be avoided, and the parts, with small contact area, of the cover plate and the micro-channel substrate are not affected by pressure to generate desoldering and liquid leakage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110050513.3A CN112846443A (en) | 2021-01-14 | 2021-01-14 | Welding device and method for liquid cooling plate of micro-channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110050513.3A CN112846443A (en) | 2021-01-14 | 2021-01-14 | Welding device and method for liquid cooling plate of micro-channel |
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| CN112846443A true CN112846443A (en) | 2021-05-28 |
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| CN202110050513.3A Pending CN112846443A (en) | 2021-01-14 | 2021-01-14 | Welding device and method for liquid cooling plate of micro-channel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121891A (en) * | 2022-07-20 | 2022-09-30 | 飞荣达科技(江苏)有限公司 | Method for fixing soldered joint |
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Application publication date: 20210528 |
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