CN112845184A - Packaged chip testing equipment and application method thereof - Google Patents
Packaged chip testing equipment and application method thereof Download PDFInfo
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- CN112845184A CN112845184A CN202110252522.0A CN202110252522A CN112845184A CN 112845184 A CN112845184 A CN 112845184A CN 202110252522 A CN202110252522 A CN 202110252522A CN 112845184 A CN112845184 A CN 112845184A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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Abstract
The invention provides a packaging chip testing device and an application method thereof.A first material transferring module extracts a chip to be tested from a loading unit, then the chip to be tested is subjected to gold wire spacing detection of a first chip detection CCD module, after the coming material is ensured to be normal, the chip to be tested is placed on a testing jig for performance testing, after the performance testing is finished, a second material transferring module extracts the chip to be tested, the chip to be tested is subjected to gold wire spacing detection of a second chip detection CCD module, whether a chip gold wire is damaged in the testing process is judged again, after the normal state is ensured, a qualified chip is placed on a good product tray, and chips which are unqualified in testing and unqualified in gold wire spacing detection are placed on a bad product tray, so that the automatic testing judgment of each link is realized, the testing efficiency is improved, the management and control of the unqualified products are more accurate, and the. The detection and positioning of the charge tray to be detected by the charge tray detection CCD module ensure the accurate grabbing of the first charge moving module; the testing jig is used for detecting the detection and positioning of the CCD module on the chip to be tested, so that the normal position of the chip to be tested is ensured.
Description
Technical Field
The invention belongs to the technical field of chip testing equipment, and particularly relates to packaged chip testing equipment and an application method thereof.
Background
The packaged chip enters a rapid development period at present, various industries have strong requirements on the packaged chip, and the automatic test equipment of the packaged chip has great significance on the research, development and production of the packaged chip. The automatic test equipment mainly works to test the working state and relevant performance of the packaged chip. Along with the continuous increase of chip output, more and more test demands become and all need to test to each chip, and this demand causes the specific gravity that test cost accounts for chip manufacturing cost to be bigger, and test cost is very high, and present test equipment is inaccurate to the location of bad reason, and unable accurate determination is that the link that appears unusually, and is not accurate enough to the management and control of defective products, and degree of automation is not high.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides the packaged chip testing equipment and the application method thereof, and solves the problems of low testing efficiency of packaged chips, inaccurate control of defective products and low automation degree in the prior art.
In a first aspect, the invention provides a packaged chip testing device, which comprises a base, a first material moving module, a second material moving module, a feeding unit, a discharging unit, a testing jig, a first chip detection CCD module, a bad material feeding placing disc and a second chip detection CCD module, wherein the first material moving module, the second material moving module, the feeding unit, the discharging unit, the testing jig, the first chip detection CCD module and the second chip detection CCD module are all arranged above the base, the feeding unit is used for providing a material disc to be tested, the chip to be tested is placed on the material disc to be tested, the first material moving module is used for grabbing the chip to be tested on the material disc to be tested and placing the chip to be tested on the testing jig, the first chip detection CCD module is used for detecting the gold thread spacing of the chip to be tested before the chip to be tested moves to the testing jig, the incoming material poor placement disc is used for placing the chips to be tested which are unqualified after being detected by the first chip detection CCD module, the test fixture is used for testing the performance of the qualified chip to be tested after the first chip detection CCD module detects the chip, the second material moving module is used for grabbing the chip to be tested on the test fixture and placing the chip on the discharging unit, the second chip detection CCD module is used for detecting the gold thread spacing of the chip to be detected before the chip to be detected moves to the blanking unit, the blanking unit comprises a defective product tray and a non-defective product tray, the defective product tray is used for placing the unqualified chips to be detected after being detected by the second chip detection CCD module, the good product tray is used for placing chips to be tested which are qualified after the second chip detection CCD module detects the chips, and the number of the test fixtures is at least one.
Further, still include charging tray detection CCD module, the charging tray detection CCD module is located the charging tray top that awaits measuring, the charging tray detects the CCD module and is used for right the charging tray that awaits measuring detects the location, first material module that moves according to the charging tray detects the locating information that the CCD module fed back, right the chip that awaits measuring on the charging tray that awaits measuring snatchs.
Further, the test fixture detection CCD module is arranged above the test fixture and used for detecting and positioning a chip to be detected on the test fixture.
Further, the device comprises a blank tray detection CCD module, wherein the blank tray detection CCD module is arranged above the good product tray, the blank tray detection CCD module is used for detecting and positioning the good product tray, and the second material moving module is used for placing a chip to be detected on the good product tray according to positioning information fed back by the blank tray detection CCD module.
The testing jig comprises a base plate and a cover plate, the cover plate is movably covered on the base plate, a plurality of chip grooves are formed in the base plate and used for placing the chips to be tested, each chip groove is connected with the corresponding image acquisition card, and each image acquisition card is connected with the corresponding processor.
Furthermore, the test fixture further comprises a heating unit, the heating unit is arranged below the bottom plate, and the heating unit is used for heating the chip slot of the bottom plate.
In a second aspect, the invention provides an application method applied to the above packaged chip test equipment, wherein the first material moving module grabs a chip to be tested from a material tray to be tested of the feeding unit, the chip to be tested passes through the first chip detection CCD module, the first chip detection CCD module performs gold wire spacing detection on the bottom of the chip to be tested and performs qualification judgment on the gold wire spacing, the first material moving module places the unqualified chip to be tested on a bad incoming material placing tray, and places the qualified chip to be tested on a test fixture;
the test fixture performs performance test on the chips to be tested, and determines the qualified state of each chip to be tested in the same test fixture by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is no more than 200s at most, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection;
according to the qualified state of each chip to be tested in the test fixture, the second material moving module extracts the unqualified chip to be tested and places the unqualified chip to be tested on the unqualified tray, the second material moving module extracts the qualified chip to be tested and detects the CCD module through the second chip, the second chip detection CCD module detects the gold thread space of the chip to be tested and judges the gold thread space to be qualified, and the second material moving module places the unqualified chip to be tested on the unqualified tray to place the qualified chip to be tested on the unqualified tray.
Further, before the first material moving module grabs the chip to be detected from the material disc to be detected of the feeding unit, the material disc detection CCD module detects and positions the material disc to be detected, whether the chip to be detected is arranged at the chip position on each material disc to be detected is judged, the material disc detection CCD module sends positioning information to the first material moving module, and the first material moving module grabs the chip to be detected on the material disc to be detected according to the positioning information fed back by the material disc detection CCD module;
before the qualified chips to be detected are placed on the good product trays by the second material moving module, the empty tray detection CCD module detects and positions the good product trays, whether each chip position on the good product trays is empty or not is judged, the empty tray detection CCD module generates positioning information to the second material moving module, and the second material moving module places the chips to be detected on the empty positions of the good product trays according to the positioning information fed back by the empty tray detection CCD module.
Furthermore, after the first material moving module is used for placing a chip to be tested in the test fixture, the test fixture detects the CCD module to detect and position the chip to be tested on the test fixture, detects and judges whether the chip to be tested is arranged on a chip groove of the test fixture or not, judges whether the chip to be tested is inclined, and controls the buzzer to send out warning sound if the chip to be tested on the chip groove is inclined.
Further, when the test fixture tests the chip to be tested, the chip groove of the bottom plate of the test fixture is heated by the heating unit, so that the test temperature is within the range of 38-48 ℃.
The invention has the beneficial effects that:
the invention provides a packaged chip testing device and an application method thereof.A first material transferring module extracts a chip to be tested from a feeding unit, then the chip to be tested is subjected to gold wire spacing detection of a first chip detection CCD module, after the coming material is ensured to be normal, the chip to be tested is placed on a testing jig for performance testing, after the performance testing is finished, a second material transferring module extracts the chip to be tested, the chip to be tested is subjected to gold wire spacing detection of a second chip detection CCD module, whether a chip gold wire is damaged in the testing process is judged again, a qualified chip is placed on a good product tray after the chip is ensured to be normal, chips which are unqualified in testing and unqualified in gold wire spacing detection are placed on a bad product tray, automatic testing judgment of each link is realized, the testing efficiency is improved, the control of the unqualified product is more accurate, and the automation degree is high.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic view of an overall structure of a packaged chip testing apparatus of this embodiment 1 in a viewing angle.
Fig. 2 is a schematic diagram of the overall structure of a packaged chip testing device of this embodiment 1 at another viewing angle.
Fig. 3 is a schematic diagram of an overall structure of a test fixture in the packaged chip testing apparatus of this embodiment 1.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1:
referring to fig. 1 to 3, embodiment 1 provides a packaged chip testing apparatus, including a base 10, a first material moving module 11, a second material moving module 12, a feeding unit 2, a discharging unit 3, a testing fixture 4, a first chip detecting CCD module 51, a bad incoming material placing tray 6, and a second chip detecting CCD module 52, where the first material moving module 11, the second material moving module 12, the feeding unit 2, the discharging unit 3, the testing fixture 4, the first chip detecting CCD module 51, and the second chip detecting CCD module 52 are all disposed above the base 10, and the first material moving module 11 and the second material moving module 12 are jointly and fixedly connected to a first fixing frame 13 and move along a cross bar portion of the first fixing frame 13 under the action of a linear motor, so as to realize the back and forth movement of the first material moving module 11 among the feeding unit 2, the first chip detecting CCD module 51, and the testing fixture 4, the second material moving module 12 moves back and forth among the test fixture 4, the second chip detection CCD module 52 and the blanking unit 3; on the base 10, the feeding unit 2, the first chip detection CCD module 51, the test fixture 4, the second chip detection CCD module 52 and the discharging unit 3 are sequentially arranged from left to right at intervals, and the whole test material moving process is also from left to right.
The feeding unit 2 is used for providing a material tray to be tested, a chip to be tested is placed on the material tray to be tested, the first material moving module 11 is used for grabbing the chip to be tested on the material tray to be tested and placing the chip to be tested on the test fixture 4, the first chip detection CCD module 51 is used for performing gold wire spacing detection on the chip to be tested before the chip to be tested moves to the test fixture 4, the chip to be tested is grabbed from top to bottom by the first material moving module 11, so that the chip to be tested is shot by the first chip detection CCD module 51 from bottom to top, the step does not need to turn over a gold wire for the chip to be tested, the gold wire spacing detection can be completed in the material moving process, the bad material placing disc 6 is used for placing the chip to be tested which is unqualified after being detected by the first chip detection CCD module 51, and the accurate force for controlling bad materials is improved, the chip to be tested can flow to the test fixture 4 after being detected by the gold wire spacing of the first chip detection CCD module 51, so as to determine whether the chip to be tested is in an abnormal condition in the incoming material link or the test link.
The test fixture 4 is used for testing the performance of the qualified chip to be tested after being detected by the first chip detection CCD module 51, the second material moving module 12 is used for grabbing and placing the chip to be tested on the test fixture 4 on the blanking unit 3, the second chip detection CCD module 52 is used for detecting the gold wire spacing of the chip to be tested before the chip to be tested moves to the blanking unit 3, the chip to be tested is grabbed from top to bottom by the second material moving module 12, so that the chip to be tested is shot by the second chip detection CCD module 52 from bottom to top, the step does not need to turn over the chip to be tested, the gold wire spacing detection can be completed in the material moving process, the blanking unit 3 comprises a defective product tray 31 and a good product tray 32, the defective product tray 31 is used for placing the unqualified chip to be tested after being detected by the second chip detection CCD module 52, the good products tray 32 is used for placing the warp qualified chip that awaits measuring after second chip detects CCD module 52 detects, in order to improve the accurate dynamics of defective products control, to the chip that awaits measuring after test fixture 4 tests, good products and defective products have been distinguished from this batch of chips that await measuring this moment, this differentiation is because test fixture 4 leads to, the chip that wherein defective products await measuring also can be placed on defective products tray 31, to the good products that produce in this link, after second chip detects CCD module 52, also can distinguish the good products and the defective products of this link, the defective products of this link mainly are distinguished through gold thread interval detection, the defective products of this part also can be placed on defective products tray 31.
The number of the test jigs 4 is two, the first test jig 4 is positioned on the left side, the second test jig 4 is positioned on the right side, the first material moving module 11 firstly places chips to be tested on the first test jig 4, in the test process of the first test jig 4, the first material moving module 11 then places the chips to be tested on the second test jig 4, when the first test jig 4 completes the test, the second material moving module 12 takes away the chips to be tested on the first test jig 4, and then the first test jig 4 supplements the chips to be tested on the first test jig 4, so that the material taking and placing are automatically performed, and the material moving efficiency is improved.
The first material moving module 11 includes a first vertical moving unit, a first fixing plate and six extracting units, the six extracting units are arranged side by side with the first fixing plate, and the first fixing plate is connected to the first fixing frame 13 through the first vertical moving unit. The second material moving module 12 comprises a second vertical moving unit, a second fixing plate and six extracting units, wherein the six extracting units are arranged side by side with the second fixing plate, and the second fixing plate is connected to the first fixing frame 13 through the second vertical moving unit. The first material moving module 11 and the second material moving module 12 are used for moving the extracting units on the first material moving module and the second material moving module on the vertical Z axis respectively through the first vertical moving unit and the second vertical moving unit, and then the chip to be detected is grabbed and put down.
It should be noted that, to material loading unit 2, when photoelectric sensor on its work or material rest that awaits measuring sensed to have the charging tray that awaits measuring on the work or material rest that awaits measuring, the tray that awaits measuring moves to location "tray lower wall that awaits measuring" that has set up, "the work or material rest lower wall support that awaits measuring jacks up earlier to" high level ", support cylinder unclamps and makes the charging tray that awaits measuring break away from the contact with the support cylinder clamp, the lower wall support descends to" meso position ", support cylinder closes and makes the charging tray that awaits measuring that overlaps separately, the lower wall support continues to descend to" low level ", the charging tray that awaits measuring is just stayed on the tray that awaits measuring, the centre gripping cylinder action on the tray that. The working principle for the blanking unit 3 is similar to that of the loading unit 2, but in reverse order.
Referring to fig. 1 and fig. 2, in this embodiment, encapsulation chip test equipment still includes that the charging tray detects CCD module 53, the charging tray detects CCD module 53 and locates the charging tray top that awaits measuring, the charging tray detects CCD module 53 and is used for right the charging tray that awaits measuring detects the location, first material module 11 that moves basis the charging tray detects positioning information that CCD module 53 feedbacks, right chip that awaits measuring on the charging tray that awaits measuring snatchs, detects CCD module 53 through the charging tray and can accurately confirm that which position has the chip that awaits measuring in the charging tray that awaits measuring, and which position is empty, according to this positioning information, first material module 11 that moves can accurately snatch the chip that awaits measuring on the charging tray that awaits measuring.
In this embodiment, the packaged chip testing device further includes a testing jig detection CCD module 54, the testing jig detection CCD module 54 is disposed above the testing jig 4, the testing jig detection CCD module 54 is used for detecting and positioning the chip to be tested on the testing jig 4, detecting and judging whether the chip to be tested is located on the chip slot of the testing jig 4 or not, and judging whether the chip to be tested is placed partially or not, and controlling the buzzer to send out a warning sound if the chip to be tested on the chip slot is placed partially or not.
In this embodiment, encapsulation chip test equipment still includes empty tray detection CCD module 55, empty tray detection CCD module 55 is located non-defective products tray 32 top, empty tray detection CCD module 55 is used for right non-defective products tray 32 detects the location, the second moves material module 12 basis empty tray detection CCD module 55 feedback positioning information, will await measuring the chip place on non-defective products tray 32, detect CCD module 55 through empty tray and can accurately judge whether every chip position on non-defective products tray 32 is empty, distinguish which position can put the chip that awaits measuring to make things convenient for the second to move material module 12 and can accurately place the chip that awaits measuring.
It should be noted that the tray detection CCD module 53, the test fixture detection CCD module 54, and the empty tray detection CCD module 55 are all fixedly connected to the second fixing frame 14, and the tray detection CCD module 53, the test fixture detection CCD module 54, and the empty tray detection CCD module 55 are respectively driven by the linear motor to move linearly along the cross bar of the second fixing frame 14. This linear electric motor has realized that charging tray detects CCD module 53, test fixture detects CCD module 54 and the horizontal X axle of empty plate detection CCD module 55 removes, has realized charging tray detection CCD module 53 horizontal migration and has carried out the detection and location to the top of the charging tray that awaits measuring promptly, has realized that test fixture detects CCD module 54 horizontal migration and carries out the detection and location to test fixture 4 top, has realized that empty plate detects CCD module 55 horizontal migration and carries out the detection and location to non-defective products tray 32 top.
Referring to fig. 3, as an implementation, the packaged chip testing device further includes a plurality of image acquisition cards and a plurality of processors, the testing fixture 4 includes a bottom plate 41 and a cover plate 42, the cover plate 42 is movably covered on the bottom plate 41, a plurality of chip slots are provided in the bottom plate 41, the chip slots are used for placing the chips to be tested, when the chips to be tested are placed in the chip slots, the control cover plate 42 is covered, so that the space where the chips to be tested are located is relatively closed, every the chip slots are connected with the corresponding image acquisition cards, every the image acquisition cards are connected with the corresponding processors, the image acquisition cards and the chip slots form a hardware combination for testing the performance of the chips to be tested, and after the test is completed, the control cover plate 42 is opened, so that the second material moving module 12 takes out the chips to be tested.
As an implementation manner, the test fixture 4 further includes a heating unit 43, the heating unit 43 is disposed under the bottom plate 41, the heating unit 43 is configured to heat the chip slot of the bottom plate 41, and the test performance of the chip to be tested at different temperatures is simulated by heating the heating unit 43, so as to provide a more real test environment.
Example 2:
the embodiment provides an application method applied to the package chip testing equipment in embodiment 1, wherein the first material moving module 11 grabs a chip to be tested from a material tray to be tested of the feeding unit 2, the chip to be tested passes through the first chip detection CCD module 51, the first chip detection CCD module 51 performs gold wire spacing detection on the bottom of the chip to be tested and performs qualification judgment on the gold wire spacing, the first material moving module 11 places an unqualified chip to be tested on the bad incoming material placing tray 6, and places the qualified chip to be tested on the testing jig 4;
the test fixture 4 performs performance test on the chip to be tested, and determines the qualified state of each chip to be tested in the same test fixture 4 by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is no longer than 200s, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection, wherein detection items can also include all the contents, and other test items can also be newly added;
according to the qualified state of each chip to be tested in the test fixture 4, the second material moving module 12 extracts the unqualified chip to be tested and places the unqualified chip to be tested on the defective product tray 31, the second material moving module 12 extracts the qualified chip to be tested and passes through the second chip detection CCD module 52, the second chip detection CCD module 52 detects the gold thread distance of the chip to be tested, the gold thread distance is judged to be qualified, the second material moving module 12 places the unqualified chip to be tested on the defective product tray 31, and the qualified chip to be tested is placed on the good product tray 32.
Before testing, the engineering control software proH and the vision software Vision Master are opened, an operator scans the chip product batch number into the industrial control software by using a scanning gun, the accuracy of the current batch number is judged by a PLC subprogram 'wafer ID' in the industrial control software, a subsequent program is executed if the batch number is correct, otherwise, the execution is stopped and an alarm is given. After the batch number is correct, an operator puts a material tray to be tested, which is provided with a certain number of chips to be tested, on the material frame to be tested, and simultaneously puts a certain number of good product trays 32 on the material frame of the blanking unit 3. After the preparation is completed, the start button can be pressed to allow the test equipment to operate normally.
When the gold wire spacing detection is carried out on the chip back side image, the chip back side image is sent to the VsionMaster so as to carry out gold wire spacing detection judgment. The different CCD modules are arranged differently at VsionMaster.
In this embodiment, before the first material moving module 11 captures a chip to be detected from a material tray to be detected of the feeding unit 2, the material tray detection CCD module 53 detects and positions the material tray to be detected, and determines whether the chip position on each material tray to be detected is filled with the chip to be detected, the material tray detection CCD module 53 sends positioning information to the first material moving module 11, and the first material moving module 11 captures the chip to be detected on the material tray to be detected according to the positioning information fed back by the material tray detection CCD module 53;
before the second material moving module 12 places qualified chips to be tested on the good product trays 32, the empty tray detection CCD module 55 detects and positions the good product trays 32 to judge whether each chip position on the good product trays 32 is empty, the empty tray detection CCD module 55 generates positioning information to the second material moving module 12, and the second material moving module 12 places the chips to be tested on the empty positions of the good product trays 32 according to the positioning information fed back by the empty tray detection CCD module 55.
In this embodiment, first material module 11 that moves puts the chip that awaits measuring in test fixture 4 back, and test fixture detects CCD module 54 is right the chip that awaits measuring on test fixture 4 detects the location, detects and judges whether have the chip that awaits measuring on test fixture 4's the chip groove and judge whether the chip that awaits measuring puts partially, if the chip that awaits measuring on the chip groove has and puts partially the phenomenon, control bee calling organ sends the warning sound, and bee calling organ sends the sound suggestion operating personnel of "dripping", only after operating personnel gets rid of the chip mistake, equipment just can resume normal work.
In this embodiment, when the testing fixture 4 tests the chip to be tested, the testing fixture 4 can set the light source brightness, the light source frequency and the like through the control interface, and can also heat the chip slot of the bottom plate 41 of the testing fixture 4 through the control heating unit 43, so that the testing temperature is within the range of 38-48 ℃, the testing performance of the chip to be tested at different temperatures is simulated, and a more real testing environment is provided.
Compared with the prior art, the invention provides a packaged chip testing device and an application method thereof, wherein a first material moving module 11 extracts a chip to be tested from a feeding unit 2, then the chip to be tested is subjected to gold wire spacing detection of a first chip detection CCD module 51, after the incoming materials are ensured to be normal, the chip to be tested is placed on a testing jig 4 for performance testing, after the performance testing is finished, a second material moving module 12 extracts the chip to be tested, the chip to be tested is subjected to gold wire spacing detection of a second chip detection CCD module 52, whether chip gold wires are broken in the testing process is judged again, the qualified chips are placed on a good product tray 32 after the chip is ensured to be normal, and the chips which are unqualified in testing and detection of the gold wire spacing are placed on a defective product tray 31, so that the automatic testing judgment of each link is realized, the testing efficiency is improved, the management and control of the defective products are more accurate, and the automation degree is.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A packaged chip testing device is characterized by comprising a base, a first material moving module, a second material moving module, a feeding unit, a discharging unit, a testing jig, a first chip detection CCD module, a bad material feeding placing disc and a second chip detection CCD module, wherein the first material moving module, the second material moving module, the feeding unit, the discharging unit, the testing jig, the first chip detection CCD module and the second chip detection CCD module are all arranged above the base, the feeding unit is used for providing a material disc to be tested, chips to be tested are placed on the material disc to be tested, the first material moving module is used for grabbing the chips to be tested on the material disc to be tested and placing the chips to be tested on the testing jig, the first chip detection CCD module is used for detecting the intervals between the chips to be tested before the chips to be tested move to the testing jig, the incoming material poor placement disc is used for placing the chips to be tested which are unqualified after being detected by the first chip detection CCD module, the test fixture is used for testing the performance of the qualified chip to be tested after the first chip detection CCD module detects the chip, the second material moving module is used for grabbing the chip to be tested on the test fixture and placing the chip on the discharging unit, the second chip detection CCD module is used for detecting the gold thread spacing of the chip to be detected before the chip to be detected moves to the blanking unit, the blanking unit comprises a defective product tray and a non-defective product tray, the defective product tray is used for placing the unqualified chips to be detected after being detected by the second chip detection CCD module, the good product tray is used for placing chips to be tested which are qualified after the second chip detection CCD module detects the chips, and the number of the test fixtures is at least one.
2. The packaged chip testing device according to claim 1, further comprising a tray detection CCD module, wherein the tray detection CCD module is disposed above the tray to be tested, the tray detection CCD module is used for detecting and positioning the tray to be tested, and the first material moving module is used for grabbing the chip to be tested on the tray to be tested according to positioning information fed back by the tray detection CCD module.
3. The packaged chip testing device of claim 2, further comprising a testing fixture detection CCD module, wherein the testing fixture detection CCD module is disposed above the testing fixture, and the testing fixture detection CCD module is used for detecting and positioning a chip to be tested on the testing fixture.
4. The packaged chip testing device according to claim 3, further comprising a dummy detection CCD module, wherein the dummy detection CCD module is disposed above the good product tray, the dummy detection CCD module is used for detecting and positioning the good product tray, and the second material moving module is used for placing a chip to be tested on the good product tray according to positioning information fed back by the dummy detection CCD module.
5. The device for testing a packaged chip according to claim 4, further comprising a plurality of image capture cards and a plurality of processors, wherein the testing fixture comprises a bottom plate and a cover plate, the cover plate is movably covered on the bottom plate, a plurality of chip slots are disposed in the bottom plate, the chip slots are used for placing the chips to be tested, each chip slot is connected to a corresponding image capture card, and each image capture card is connected to a corresponding processor.
6. The packaged chip testing device of claim 5, wherein the testing fixture further comprises a heating unit disposed under the bottom plate, the heating unit being configured to heat the chip slot of the bottom plate.
7. An application method applied to the packaged chip testing equipment according to any one of claims 1 to 6, wherein the first material moving module grabs a chip to be tested from a material tray to be tested of the feeding unit, the chip to be tested passes through the first chip detection CCD module, the first chip detection CCD module performs gold wire spacing detection on the bottom of the chip to be tested and performs qualification judgment on the gold wire spacing, the first material moving module places the unqualified chip to be tested on a poor material placing tray, and places the qualified chip to be tested on a testing jig;
the test fixture performs performance test on the chips to be tested, and determines the qualified state of each chip to be tested in the same test fixture by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is no more than 200s at most, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection;
according to the qualified state of each chip to be tested in the test fixture, the second material moving module extracts the unqualified chip to be tested and places the unqualified chip to be tested on the unqualified tray, the second material moving module extracts the qualified chip to be tested and detects the CCD module through the second chip, the second chip detection CCD module detects the gold thread space of the chip to be tested and judges the gold thread space to be qualified, and the second material moving module places the unqualified chip to be tested on the unqualified tray to place the qualified chip to be tested on the unqualified tray.
8. The method for using the packaged chip testing equipment according to claim 7, wherein before the first material moving module picks the chip to be tested from the material tray to be tested of the feeding unit, the material tray detection CCD module detects and positions the material tray to be tested, determines whether the chip to be tested is mounted at the chip position on each material tray to be tested, and sends positioning information to the first material moving module, and the first material moving module picks the chip to be tested on the material tray to be tested according to the positioning information fed back by the material tray detection CCD module;
before the qualified chips to be detected are placed on the good product trays by the second material moving module, the empty tray detection CCD module detects and positions the good product trays, whether each chip position on the good product trays is empty or not is judged, the empty tray detection CCD module generates positioning information to the second material moving module, and the second material moving module places the chips to be detected on the empty positions of the good product trays according to the positioning information fed back by the empty tray detection CCD module.
9. The method as claimed in claim 8, wherein after the first material-moving module places the chip to be tested on the testing fixture, the testing fixture detects the CCD module to perform positioning detection on the chip to be tested on the testing fixture, detects and determines whether the chip to be tested is located on the chip slot of the testing fixture, determines whether the chip to be tested is offset, and controls the buzzer to generate a warning sound if the chip to be tested on the chip slot is offset.
10. The method as claimed in claim 9, wherein the chip slot of the bottom board of the test fixture is heated by the heating unit to a temperature in the range of 38-48 ℃ when the test fixture tests the chip to be tested.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539872A (en) * | 2021-06-25 | 2021-10-22 | 广东歌得智能装备有限公司 | Semiconductor element translation type testing, coding and taping integrated machine |
| CN114130695A (en) * | 2021-11-29 | 2022-03-04 | 苏州乾鸣半导体设备有限公司 | Detection equipment for detecting surface of chip |
| CN114275260A (en) * | 2021-12-29 | 2022-04-05 | 浙江暨阳电子科技有限公司 | Automatic detection and packaging process and equipment for magnetic ring inductance |
| CN114295959A (en) * | 2021-12-17 | 2022-04-08 | 珠海市科迪电子科技有限公司 | Double-line driving chip testing method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539872A (en) * | 2021-06-25 | 2021-10-22 | 广东歌得智能装备有限公司 | Semiconductor element translation type testing, coding and taping integrated machine |
| CN113539872B (en) * | 2021-06-25 | 2022-02-22 | 广东歌得智能装备有限公司 | Semiconductor element translation type testing, coding and taping integrated machine |
| CN114130695A (en) * | 2021-11-29 | 2022-03-04 | 苏州乾鸣半导体设备有限公司 | Detection equipment for detecting surface of chip |
| CN114130695B (en) * | 2021-11-29 | 2023-12-22 | 苏州乾鸣半导体设备有限公司 | Detection equipment for detecting surface of chip |
| CN114295959A (en) * | 2021-12-17 | 2022-04-08 | 珠海市科迪电子科技有限公司 | Double-line driving chip testing method and device |
| CN114275260A (en) * | 2021-12-29 | 2022-04-05 | 浙江暨阳电子科技有限公司 | Automatic detection and packaging process and equipment for magnetic ring inductance |
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