CN112809802A - Cutting device and method for manufacturing cut product - Google Patents

Cutting device and method for manufacturing cut product Download PDF

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Publication number
CN112809802A
CN112809802A CN202011276568.8A CN202011276568A CN112809802A CN 112809802 A CN112809802 A CN 112809802A CN 202011276568 A CN202011276568 A CN 202011276568A CN 112809802 A CN112809802 A CN 112809802A
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CN
China
Prior art keywords
blade
cutting
cut
blocking plate
working fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202011276568.8A
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Chinese (zh)
Inventor
坂上雄哉
堀聪子
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Towa Corp
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Towa Corp
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Publication date
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Publication of CN112809802A publication Critical patent/CN112809802A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0616Grinders for cutting-off using a tool turning around the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0683Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/15Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614Means for mounting the cutting member
    • B26D7/2621Means for mounting the cutting member for circular cutters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

The invention provides a cutting device and a method for manufacturing cut products, wherein the cutting device enables a blade to be in sufficient contact with a processing liquid when the blade rotates. The cutting device includes: a cutting table, a working fluid supply unit, and a cutting mechanism. The cutting table is configured to mount a cutting object. The working fluid supply unit is configured to supply the working fluid to the cutting table. The cutting mechanism is configured to cut the object to be cut in a state where the object to be cut is immersed in the working fluid. The cutting mechanism comprises a blade, a rotating mechanism and a blocking plate. The rotating mechanism is configured to rotate the blade. The blocking plate is provided between the tip of the blade on the object cutting side and the rotating shaft of the blade.

Description

Cutting device and method for manufacturing cut product
Technical Field
The present invention relates to a cutting device and a method for manufacturing a cut product.
Background
Japanese patent laying-open No. 2018-117091 (patent document 1) discloses a cutting device for cutting a workpiece. In this cutting apparatus, the workpiece held on the chuck table is cut by a cutting blade while being immersed in cutting water (see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2018-117091.
In the cutting device disclosed in patent document 1, when the cutting blade rotates, cutting water (machining fluid) is kept away from the periphery of the cutting blade by the air flow caused by the rotation of the cutting blade. As a result, when the cutting insert rotates, the cutting insert may not be sufficiently in contact with the machining fluid.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object thereof is to provide a cutting device and a method of manufacturing a cut product, in which a blade is brought into sufficient contact with a working fluid when the blade rotates.
A cutting device according to an aspect of the present invention includes: a cutting table, a working fluid supply unit, and a cutting mechanism. The cutting table is configured to mount a cutting object. The working fluid supply unit is configured to supply the working fluid to the cutting table. The cutting mechanism is configured to cut the object to be cut in a state where the object to be cut is immersed in the working fluid. The cutting mechanism includes: a blade, a rotating mechanism and a blocking plate. The rotating mechanism is configured to rotate the blade. The blocking plate is provided between the tip of the blade on the object cutting side and the rotating shaft of the blade.
According to another aspect of the present invention, a method for manufacturing a cut product includes: placing the object to be cut on a cutting table; supplying a working fluid to a cutting table; and cutting the object to be cut by the cutting mechanism in a state in which the object to be cut is immersed in the working fluid, thereby producing a cut product. The cutting mechanism includes: a blade, a rotating mechanism and a blocking plate. The rotating mechanism is configured to rotate the blade. The blocking plate is provided between the tip of the blade on the object cutting side and the rotating shaft of the blade.
Effects of the invention
According to the present invention, it is possible to provide a cutting device and a method for manufacturing a cut product, in which the blade is brought into sufficient contact with the working fluid when the blade rotates.
Drawings
Fig. 1 is a diagram schematically showing the configuration of a cutting device.
Fig. 2 is a diagram for explaining a problem that may generally occur when cutting an object in a state where the object is immersed in a working fluid.
Fig. 3 is a plan view of the cutting mechanism.
Fig. 4 is a side view of the cutting mechanism.
Fig. 5 is a view showing a part of the V-V section of fig. 3.
Fig. 6 is a perspective view of the blocking plate.
Fig. 7 is a diagram for explaining the operation of the cutting mechanism.
Fig. 8 is a side view of the cutting mechanism in embodiment 2.
Fig. 9 is a diagram schematically showing a side surface of the cutting mechanism in the first other embodiment.
Fig. 10 is a partial sectional view including a cutting mechanism in a second another embodiment and an enlarged view of the partial sectional view.
Fig. 11 is a perspective view of a blocking plate in a second alternative embodiment.
Fig. 12 is a partial sectional view of a third embodiment including a cutting mechanism and an enlarged view of the partial sectional view.
Fig. 13 is a perspective view of a blocking plate in a third alternative embodiment.
Description of the reference numerals
10 a cutting device;
100 a cutting table;
200 of a processing liquid;
300 a working fluid supply unit;
400 cutting the object;
500. 500A, 500B, 500C, 500D, 900 cutoff mechanisms;
502 a rotation mechanism;
504 a blade unit;
506 a fixing part;
508 rotating the mechanism body;
509 a rotation part;
510. 910 a blade;
511. 551 a threaded bore portion;
520 a flange;
522 an outer flange;
524 an inboard flange;
530 a nut;
540 bolts;
550. 550B, 550C, 550D blocking plates;
552 a screw;
553C, 553D, 554C, 554D slot portions;
560 a working fluid ejection unit;
h1, H1C, H1D slits;
p1, P2 position;
s1 rotating the shaft;
x1 recess.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.
[1, embodiment 1]
<1-1. constitution >
(1-1-1. construction of cutting device)
Fig. 1 is a diagram schematically showing the configuration of a cutting device 10 according to embodiment 1. The cutting device 10 is configured to cut a lead frame on which a semiconductor chip is mounted or a package substrate in which a wiring substrate is sealed with resin, for example, and divide the package into a plurality of packages of electronic components. For example, QFN (Quad Flat No-Lead) Package substrates, BGA (Ball Grid Array) Package substrates, LGA (Land Grid Array) Package substrates, CSP (Chip Size Package) Package substrates, LED (Light Emitting Diode) Package substrates, and the like are used as Package substrates.
That is, the cutting device 10 is a so-called cutting device. In fig. 1, the direction of arrow F indicates the "front" of the cutting device 10, and the direction of arrow B indicates the "rear" of the cutting device 10. The direction of arrow L indicates the "outer direction" of the cutting device 10, and the direction of arrow R indicates the "inner direction" of the cutting device 10. The direction of arrow U indicates "upper" of the cutting device 10, and the direction of arrow D indicates "lower" of the cutting device 10. The directions indicated by the arrows are common in the drawings.
As shown in fig. 1, the cutting device 10 includes: cutting table 100, working fluid supply unit 300, and cutting mechanism 500.
The cutting table 100 is configured to place a cutting object 400 thereon. For example, the cutting table 100 includes a mechanism for sucking the object 400 to be cut placed thereon. In this case, the object 400 is fixed to the cutting table 100 by sucking the object 400 onto the upper surface of the cutting table 100. A recess X1 is formed on the upper surface of the cutting table 100, and the object 400 to be cut is placed in the recess X1. The cutting table 100 is configured to be movable in the arrow FB direction and rotatable by 90 ° in a plan view.
The machining liquid supply unit 300 is configured to supply the machining liquid 200 into the recess X1. The machining liquid 200 is, for example, pure water, and the machining liquid supply unit 300 supplies the machining liquid 200 supplied from, for example, a water storage tank or a water pipe into the recess X1. Note that the processing liquid 200 does not necessarily have to be pure water, and may be a liquid containing a predetermined raw material. For example, during the operation of the cutting device 10, the supply of the working fluid 200 is continued by the working fluid supply unit 300. After the machining liquid 200 is supplied in an amount to fill the inside of the recess X1, the machining liquid 200 overflows from the recess X1.
The cutting mechanism 500 is configured to cut the object 400 in a state where the object 400 is immersed in the working fluid 200. By cutting the object 400 in a state where the object 400 is immersed in the working fluid 200, temperature rise of the object 400 and the like during cutting is suppressed, and scattering of dust accompanying cutting is suppressed. The cutting mechanism 500 is configured to be movable in the arrow UD direction and the arrow LR direction. The cutting mechanism 500 will be described in detail later.
In the cutting device 10, after the positioning of the cutting mechanism 500 in the direction of the arrow LRUD is completed, the cutting table 100 is moved in the direction of the arrow FB to cut the object 400. In a state where the cutting mechanism 500 is retracted in the arrow U direction, the cutting table 100 is rotated by 90 ° in a plan view, and the cutting direction of the object 400 is changed.
Fig. 2 is a diagram for explaining a problem that may generally occur when cutting an object in a state where the object is immersed in a working fluid. As shown in fig. 2, a cutting mechanism 900, which is a comparative object different from that of embodiment 1, includes a blade 910. The blade 910 cuts the object to be cut by rotating at high speed. When the blade 910 rotates at a high speed, an air flow from the blade 910 side to the machining liquid side is generated by the rotation of the blade 910. The machining liquid moves in a direction away from the blade 910 by this air flow. As a result, there is a problem that the blade 910 does not contact the processing liquid when the blade 910 rotates.
In the cutting apparatus 10 according to embodiment 1, the possibility of occurrence of such a problem is suppressed by structurally improving the cutting mechanism 500. Next, the cutting mechanism 500 will be described in detail.
(1-1-2. constitution of cutting mechanism)
Fig. 3 is a plan view of the cutting mechanism 500. Fig. 4 is a side view of the cutting mechanism 500. Fig. 5 is a view showing a part of the V-V section of fig. 3.
Referring to fig. 3, 4 and 5, the cleaving mechanism 500 includes: a rotation mechanism 502 and a blade unit 504. The rotation mechanism 502 is configured to rotate the blade unit 504. The rotating mechanism 502 includes: a rotation mechanism main body 508, a rotation portion 509, a plurality of (two) fixing portions 506, and a blocking plate 550.
The rotation mechanism main body portion 508 includes, for example, a motor for rotating the blade unit 504. The rotating portion 509 rotates about the rotation axis S1 based on the power supplied from the rotating mechanism main body portion 508. The rotating portion 509 has a threaded hole portion 511 formed in the central portion in a side view. The rotating portion 509 has a tapered shape whose diameter increases from the direction of arrow L toward the direction of arrow R on the outer peripheral surface. As described later, the screw hole portion 511 is used to fix the blade unit 504 to the rotating portion 509. The fixing portions 506 extend in the arrow L direction from both ends in the arrow FB direction at the lower end of the rotation mechanism main body portion 508.
Fig. 6 is a perspective view of the blocking plate 550. As shown in fig. 6, a slit H1 extending in the longitudinal direction is formed in each of the longitudinal and width center portions of the blocking plate 550. The slit H1 penetrates the blocking plate 550. In addition, threaded holes 551 are formed at both ends of the blocking plate 550 in the longitudinal direction. The fixing portion 506 (fig. 4) and the threaded hole portion 551 are fixed by a screw 552. Thereby, the blocking plate 550 is fixed to the rotation mechanism main body 508.
Referring again to fig. 3, 4, and 5, the blade unit 504 is configured to rotate about the rotation axis S1 based on the rotation of the rotation portion 509. The blade unit 504 includes: a blade 510, a pair of flanges 520, a nut 530, and a bolt 540.
The blade 510, the flange 520, and the nut 530 are each annular in shape in side view. That is, a hole is formed in the center portion in side view of each of the blade 510, the flange 520, and the nut 530. By inserting the rotation portion 509 into the hole, each component is directly or indirectly attached to the rotation portion 509.
The blade 510 has a blade portion on the outer periphery. The flange 520 includes: an outboard flange 522 and an inboard flange 524. The outer flange 522 and the inner flange 524 secure the blade 510 by clamping the blade 510. An inner peripheral surface of the flange 520 (inner flange 524) is formed with a taper corresponding to the taper of the outer peripheral surface of the rotating portion 509. The flange 520 is pushed in the direction of arrow R, and the inner peripheral surface of the flange 520 contacts the outer peripheral surface of the rotating portion 509, whereby the flange 520 is positioned with respect to the rotating portion 509. Further, a threaded portion is formed on the outer peripheral surface of the end portion of the inner flange 524 in the arrow L direction.
A threaded portion is formed on the inner circumferential surface of the nut 530. A threaded portion formed on the inner peripheral surface of the nut 530 is screwed into a threaded portion formed on the outer peripheral surface of the end portion of the inner flange 524 in the arrow L direction. By screwing the screw portions into each other, the nut 530 is disposed at a position in contact with the outer flange 522, and pushes the outer flange 522 in the arrow R direction. When the bolt 540 is screwed into the threaded hole portion 511 of the rotating portion 509, the bolt 540 is pushed into the inner flange 524 in the arrow R direction. That is, the nut 530 and the bolt 540 are pushed into the flange 520 from the arrow L direction to the arrow R direction. More specifically, the inner flange 524 is disposed so that the taper of the outer peripheral surface of the rotating portion 509 and the taper of the inner peripheral surface of the inner flange 524 are fitted to each other, and is fixed to the rotating portion 509 by screwing the bolt 540 into the screw portion 511 in the R direction. The outer flange 522 is fixed by screwing a nut 530 into a screw portion provided at an end of the inner flange 524 in the arrow L direction in the arrow R direction. Therefore, the outer flange 522 is fixed together with the insert 510 so as to be sandwiched between the inner flange 524 and the nut 530.
In a state where the blade unit 504 is fixed to the rotating portion 509, a part of the blade 510 penetrates the slit H1 of the blocking plate 550. That is, the blocking plate 550 is provided between the distal end of the blade 510 on the object side and the rotation axis S1 of the blade 510. More specifically, the blocking plate 550 is provided between the tip of the blade 510 on the object side and the tip of the flange 520 on the object side. Note that the length of the slit H1 in the short side direction is slightly longer than the length of the blade 510 in the width direction (arrow LR direction). The length of the slit H1 in the longitudinal direction is set as appropriate according to the size of the region of the blade 510 through which the slit H1 penetrates.
<1-2. actions >
Fig. 7 is a diagram for explaining the operation of the cutting mechanism 500. As shown in fig. 7, the cutting mechanism 500 cuts the object 400 in a state where the object 400 is immersed in the working fluid 200. That is, the object 400 is placed on the cutting table 100 (fig. 1), and after the working fluid 200 is supplied to the cutting table 100, the cutting mechanism 500 rotates the blade 510 at a high speed to cut the object 400 with the blade 510. Thus, a package of the electronic component as a cut product is manufactured. Note that the machining liquid 200 is supplied into the recess X1 (fig. 1) at a position substantially the same as or slightly higher than the position of the blocking plate 550 when the object 400 is cut.
Since the blade 510 rotates at a high speed, an air flow is generated around the blade 510. When the air flows toward the surface of the machining liquid 200, the machining liquid 200 may be avoided from the blade 510 as shown in fig. 2. In embodiment 1, the cutting mechanism 500 includes a blocking plate 550. In the cutting mechanism 500, the blocking plate 550 blocks the flow of air toward the working fluid 200 side. In addition, since the gap between the slit H1 of the blocking plate 550 and the blade 510 is small, air rarely enters from the gap. Since the flow of air toward the machining liquid 200 side is suppressed, the amount of the machining liquid 200 that is avoided from the blade 510 is suppressed.
Therefore, according to the cutting apparatus 10 of embodiment 1, since the air flow caused by the rotation of the blade 510 is blocked by the blocking plate 550, the possibility that the blade 510 does not contact the working fluid 200 when the blade 510 rotates can be reduced. Further, by stably supplying the working fluid 200 to the blade 510, the cutting quality can be stabilized. Further, by providing the blocking plate 550, water splash caused by rotation of the blade 510 can be suppressed, and maintainability within the apparatus can be improved.
<1-3. Effect and the like >
As described above, in the cutting apparatus 10 according to embodiment 1, the blocking plate 550 is provided between the distal end of the blade 510 on the cutting object side and the rotation axis of the blade 510. Therefore, according to the cutting apparatus 10, since the air flow caused by the rotation of the blade 510 is blocked by the blocking plate 550, the possibility that the blade 510 does not contact the working fluid 200 when the blade 510 rotates can be reduced.
[2. embodiment 2]
In embodiment 1 described above, since the object 400 is cut while the object 400 is immersed in the working fluid 200, the working fluid 200 easily contacts the blade 510 during cutting of the object 400. However, during the cutting of the object 400 to be cut, a measure for making the working fluid 200 more likely to contact the blade 510 may be further implemented on the cutting apparatus 10. In embodiment 2, measures are taken to make it easier for the working fluid 200 to contact the blade 510 during the cutting of the object 400. According to this measure, the cooling effect of the blade 510 can be further improved. Only the portions different from embodiment 1 described above will be described below, and description of common portions will not be repeated.
Fig. 8 is a side view of the cutting mechanism 500A in embodiment 2. As shown in fig. 8, cutting mechanism 500A includes a working fluid ejecting section 560. The machining liquid ejecting unit 560 is configured to eject the machining liquid 200 toward the blade 510. The machining liquid ejecting unit 560 ejects the machining liquid 200 supplied from, for example, a water tank or a water pipe toward the blade 510. For example, the machining-fluid jetting unit 560 jets the machining fluid 200 onto at least a part of a region where the blade 510 rotates from the distal end (position P1) on the opposite side to the object side toward the distal end (position P2) on the object side.
According to the cutting device including the cutting mechanism 500A in embodiment 2, since the machining liquid 200 is ejected to the rotating blade 510 by the machining liquid ejecting portion 560, the machining liquid 200 can be brought into contact with the blade 510 more, and the blade 510 can be cooled more efficiently.
[3 ] other embodiments ]
The ideas of the above embodiments 1 and 2 are not limited to the above described embodiments 1 and 2. Next, an example of another embodiment to which the ideas of embodiments 1 and 2 described above can be applied will be described.
<3-1>
The configuration of the blocking plate 550 is not limited to the configurations in embodiments 1 and 2 described above. Fig. 9 is a diagram schematically showing a side surface of a cutting mechanism 500B in the first alternative embodiment. As shown in fig. 9, the cutting mechanism 500B includes a blocking plate 550B.
In the blocking plate 550 of embodiment 1 described above, the slit H1 is formed in the center portion in the longitudinal direction of the blocking plate 550, but in the blocking plate 550B, the slit is formed from one end portion to the center portion in the longitudinal direction. The blocking plate 550B faces the cutting edge of the blade 510 in at least a part of a region (left side region of the blade 510 in fig. 9) where the blade 510 rotates from the top end (position P1) on the opposite side to the object side toward the top end (position P2) on the object side. On the other hand, the blocking plate 550B does not face the cutting edge of the blade 510 in a region (right side region of the blade 510 in fig. 9) where the blade 510 rotates from the top end (position P2) on the object side toward the top end (position P1) on the opposite side of the object side.
In such an embodiment, since the air flow caused by the rotation of the blade 510 is blocked by the blocking plate 550B, the possibility that the blade 510 does not contact the machining liquid 200 when the blade 510 rotates is reduced. When a mechanism for retracting the blocking plate 550 from the blade 510 is provided when the blade 510 is replaced, a mechanism for moving at least the blocking plate 550 downward is required in the structure of the blocking plate 550 covering the entire blade 510. In contrast, in a configuration such as the blocking plate 550B that does not cover at least a part of the blade 510, a mechanism for moving the blocking plate 550B downward is not necessary, and for example, a mechanism for moving the blocking plate 550B horizontally in a direction away from the blade 510 may be provided. In this way, by adopting a configuration in which the blocking plate 550B does not cover at least a part of the blade 510, the degree of freedom in designing a mechanism for retracting the blocking plate 550B from the blade 510 when replacing the blade 510 can be increased.
<3-2>
Fig. 10 is a partial sectional view including a cutting mechanism 500C in another second embodiment and an enlarged view of the partial sectional view. Fig. 11 is a perspective view of a blocking plate 550C in a second alternative embodiment. As shown in fig. 10 and 11, the cutting mechanism 500C includes a blocking plate 550C. The blocking plate 550C is formed with a slit H1C. The slit H1C includes a slit portion 554C that is wide in opening in the short side direction and a plurality of (two) slit portions 553C that are each narrow in opening in the short side direction. The slit portions 553C extend from both longitudinal ends of the slit portion 554C toward the longitudinal side of the blocking plate 550C.
Each slit portion 553C covers the periphery of the blade 510, and the slit portion 554C covers the peripheries of the outer flange 522 and the inner flange 524. That is, in the second embodiment, the blocking plate 550C is provided between the distal end of the outer flange 522 and the inner flange 524 (flange 520) on the object side and the rotation axis S1 of the blade 510. More specifically, the blocking plate 550C is provided at a position where the back surface of the blocking plate 550C is flush with the top ends of the outer flange 522 and the inner flange 524 on the side of the object to be cut.
According to such an embodiment, since the region of the blade 510 located below the blocking plate 550C is longer than that of embodiment 1, the object 400 to be cut arranged at a deeper position of the working fluid 200 can be cut, and the object 400 to be cut can be more reliably immersed in the working fluid 200. Further, according to this embodiment, since the blade 510 located below the blocking plate 550C has a longer area than that of embodiment 1, the object 400 can be cut even if the object 400 is thicker.
<3-3>
Fig. 12 is a partial sectional view of a third embodiment including a cutting mechanism 500D and an enlarged view of the partial sectional view. Fig. 13 is a perspective view of a blocking plate 550D in a third alternative embodiment. As shown in fig. 12 and 13, the cutting mechanism 500D includes a blocking plate 550D. The blocking plate 550D is formed with a slit H1D. The slit H1D includes a slit portion 554D which is wide in opening in the short side direction and a plurality of (two) slit portions 553D each of which is narrow in opening in the short side direction. The slit portions 553D extend from both longitudinal ends of the slit portion 554D toward the longitudinal side of the blocking plate 550D.
Each slit portion 553D covers the periphery of the blade 510, and the slit portion 554D covers the peripheries of the outer flange 522 and the inner flange 524. That is, in the third embodiment, the blocking plate 550D is provided between the distal end of the outer flange 522 and the inner flange 524 (flange 520) on the object side and the rotation shaft S1 of the blade 510. In more detail, in the third other embodiment, the blocking plate 550D is provided at a position closer to the rotation axis S1 than the blocking plate 550C in the second other embodiment described above.
According to this embodiment, since the region of the blade 510 located below the blocking plate 550D is longer than that in embodiment 1, the object 400 to be cut placed at a deeper position in the working fluid 200 can be cut. Further, according to this embodiment, since the blade 510 located below the blocking plate 550D has a longer area than that of embodiment 1, the object 400 can be cut even if the object 400 is thicker.
<3-4>
In embodiments 1 and 2, the machining liquid 200 is supplied from above the recess X1 by the machining liquid supply unit 300. However, the method of supplying the working fluid 200 is not limited thereto. For example, a supply hole for the working fluid 200 may be provided in the bottom surface of the cutting table 100, and the working fluid 200 may be supplied through the supply hole.
<3-5>
In embodiments 1 and 2 described above, the cutting apparatus 10 includes only one cutting mechanism 500. However, the number of the cutting mechanisms 500 included in the cutting device 10 is not limited to this. For example, the cutting device 10 may include a plurality of cutting mechanisms 500.
<3-6>
In embodiments 1 and 2, the working fluid 200 is continuously supplied into the recessed portion X1 by the working fluid supply unit 300 during the operation of the cutting device 10. However, the supply method of the machining liquid 200 is not limited thereto. For example, before the object 400 is cut, the machining liquid 200 may be supplied into the recess X1 in an amount capable of immersing the object 400, and the machining liquid 200 may be replenished into the recess X1 as the machining liquid 200 in the recess X1 decreases.
<3-7>
In embodiments 1 and 2, after the positioning of the cutting mechanism 500 in the direction of arrow LRUD is completed, the cutting table 100 is moved in the direction of arrow FB to cut the object 400. However, the cutting method is not limited thereto. The cutting table 100 may be operated only by rotation, or the object 400 may be cut by moving the cutting mechanism 502 in the FB direction. That is, the object 400 is cut by relatively moving the cutting table 100 and the cutting mechanism 502.
The embodiments of the present invention have been described above as examples. That is, the detailed description and drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings may include components that are not necessary for solving the technical problem. Therefore, although the non-essential components are described in the detailed description and the drawings, it should not be directly assumed that the non-essential components are essential.
The above embodiments are merely illustrative in all aspects of the present invention. The above embodiment can be modified and changed variously within the scope of the present invention. That is, when the present invention is implemented, a specific configuration can be appropriately adopted according to the embodiment.

Claims (7)

1. A cut-off device, comprising:
a cutting table configured to mount a cutting object thereon;
a working fluid supply unit configured to supply a working fluid to the cutting table; and
a cutting mechanism configured to cut the object to be cut in a state where the object to be cut is immersed in the working fluid, the cutting mechanism including:
a blade;
a rotating mechanism configured to rotate the blade; and
and a blocking plate provided between a tip of the blade on the side of the object to be cut and a rotation shaft of the blade.
2. The shut-off device of claim 1,
the severing mechanism further includes a pair of flanges that secure the blade by clamping the blade,
the blocking plate is provided between a tip of the blade on the side of the object to be cut and a tip of the flange on the side of the object to be cut.
3. The shut-off device of claim 1,
the severing mechanism further includes a pair of flanges that secure the blade by clamping the blade,
the blocking plate is provided between a tip of the flange on the side of the object to be cut and a rotation shaft of the blade.
4. The shut-off device according to any one of claims 1 to 3,
the cutting mechanism further includes a machining liquid ejecting portion configured to eject the machining liquid toward the blade.
5. The cutting device according to claim 4, wherein the machining liquid ejecting portion is configured to apply the machining liquid to at least a part of a region where the blade rotates from a distal end on a side opposite to the side of the cutting object toward a distal end on the side of the cutting object.
6. The shut-off device according to any one of claims 1 to 5,
the blocking plate is opposed to a cutting edge of the blade in at least a part of a region where the blade rotates from a tip on a side opposite to the cutting object side toward the tip on the cutting object side;
on the other hand, the blade does not face the cutting edge of the blade in a region where the blade rotates from the distal end on the side of the object to be cut toward the distal end on the opposite side to the side of the object to be cut.
7. A method for manufacturing a cut product, using the cutting apparatus according to any one of claims 1 to 6, the method comprising:
placing the object to be cut on the cutting table;
supplying the working fluid to the cutting table; and
the cutting mechanism cuts the object to be cut in a state where the object to be cut is immersed in the working fluid, thereby manufacturing a cut product.
CN202011276568.8A 2019-11-18 2020-11-16 Cutting device and method for manufacturing cut product Pending CN112809802A (en)

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JP2019207752A JP7203712B2 (en) 2019-11-18 2019-11-18 CUTTING DEVICE AND METHOD FOR MANUFACTURING CUTTING GOODS

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TW202120253A (en) 2021-06-01
JP7203712B2 (en) 2023-01-13

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Application publication date: 20210518