CN112809548A - Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad - Google Patents

Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad Download PDF

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Publication number
CN112809548A
CN112809548A CN202110205400.6A CN202110205400A CN112809548A CN 112809548 A CN112809548 A CN 112809548A CN 202110205400 A CN202110205400 A CN 202110205400A CN 112809548 A CN112809548 A CN 112809548A
Authority
CN
China
Prior art keywords
hydrophobicity
grinding pad
hydrophilicity
material grinding
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110205400.6A
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Chinese (zh)
Inventor
颜冠致
毛长虹
李文华
朱咏民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Quandehe Semiconductor Co ltd
Original Assignee
Hefei Quandehe Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Quandehe Semiconductor Co ltd filed Critical Hefei Quandehe Semiconductor Co ltd
Priority to CN202110205400.6A priority Critical patent/CN112809548A/en
Publication of CN112809548A publication Critical patent/CN112809548A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a method for adjusting hydrophilicity and hydrophobicity of a PU material grinding pad, which is characterized in that an additive with hydrophilicity and hydrophobicity is added in a preparation raw material so as to adjust the hydrophilicity and hydrophobicity of the PU material grinding pad. The effects of good hydrophobicity of the grinding pad and improvement of the quality of the grinding chip are achieved.

Description

Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad
Technical Field
The invention relates to the field of semiconductor production processes, in particular to a method for adjusting hydrophilicity and hydrophobicity of a PU material grinding pad used in a chip processing and polishing process.
Background
In the chip processing and manufacturing process, with the upgrade of the process technology and the reduction of the sizes of the conductive lines and the gates, the requirement of the photolithography technology on the flatness of the chip surface is higher and higher, and the chemical mechanical polishing process is the most effective and mature planarization technology at present. In the process of polishing the chip, the chip grinding pad can absorb certain moisture due to the use of liquid water, and the water absorption has the effect that the hardness of the grinding pad is slowly softened along with the time, so that the grinding quality of the chip is influenced.
Disclosure of Invention
The invention aims to provide a method for adjusting the hydrophilicity and hydrophobicity of a PU material grinding pad.
A method for adjusting hydrophilicity and hydrophobicity of a PU material grinding pad is characterized in that an additive with hydrophilicity and hydrophobicity is added in a preparation raw material so as to adjust the hydrophilicity and hydrophobicity of the PU material grinding pad.
The additive for increasing hydrophobicity in the raw materials is prepared so that the water contact angle of the polishing pad is more than 100 degrees. The hydrophobic additive is surfactant and silicone.
The invention aims to change the hydrophilic and hydrophobic properties of the PU material grinding pad by adding the hydrophilic and hydrophobic additives at the beginning of preparing the PU material grinding pad. The effects of good hydrophobicity of the grinding pad and improvement of the quality of the grinding chip are achieved.
Detailed description of the preferred embodiments
A method for adjusting hydrophilicity and hydrophobicity of a PU material grinding pad is characterized in that additives of silicone and a surfactant are added into raw materials to make the water contact angle of the grinding pad larger than 100 degrees.
The traditional process is that polyether polyol and butanediol or ethylene glycol are firstly mixed to prepare a polymer, the main chain of the polymer contains ether bond (-R-O-R) -and the end group or the side group of the polymer contains more than 2 hydroxyl groups (-OH), the polymer is mixed with isocyanate isomer through a high-pressure mixer, equivalent reaction ratio is converted, a PU material grinding pad is formed through pouring, the PU material grinding pad is formed through cutting by a CNC (computer numerical control) tool machine, the hardness of the PU material grinding pad reaches ShoreD 45-ShoreD 60, and the surface water contact angle is 90 degrees. In the invention, in order to prepare the PU material grinding pad, hydrophilic and hydrophobic additive silicone is added at the beginning, 5 percent of the silicone is added into polyether polyol and mixed, then the mixture is poured and molded with isocyanate through a high-pressure mixer, the hardness of the PU material grinding pad can still reach ShoreD 45 to ShoreD 60, the mixture is processed and molded, and the measured surface water contact angle is more than 100 degrees and is about 100 degrees to 120 degrees.

Claims (3)

1. A method for adjusting the hydrophilicity and hydrophobicity of a PU material grinding pad is characterized in that an additive with hydrophilicity and hydrophobicity is added in a preparation raw material to adjust the hydrophilicity and hydrophobicity of the PU material grinding pad.
2. The method of claim 1, wherein the additive for increasing hydrophobicity is added to the raw materials to make the water contact angle of the polishing pad greater than 100 degrees.
3. The method of claim 2, wherein the hydrophobic additive is silicone or surfactant.
CN202110205400.6A 2021-02-24 2021-02-24 Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad Pending CN112809548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110205400.6A CN112809548A (en) 2021-02-24 2021-02-24 Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110205400.6A CN112809548A (en) 2021-02-24 2021-02-24 Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad

Publications (1)

Publication Number Publication Date
CN112809548A true CN112809548A (en) 2021-05-18

Family

ID=75865209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110205400.6A Pending CN112809548A (en) 2021-02-24 2021-02-24 Method for adjusting hydrophilicity and hydrophobicity of PU material grinding pad

Country Status (1)

Country Link
CN (1) CN112809548A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115873207A (en) * 2023-02-17 2023-03-31 山东一诺威聚氨酯股份有限公司 High-performance CMP polyurethane polishing pad and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1586002A (en) * 2001-11-13 2005-02-23 东洋纺织株式会社 Grinding pad and method of producing the same
US20090047876A1 (en) * 2007-08-16 2009-02-19 Bo Jiang Chemical mechanical polishing pad with controlled wetting
CN107407011A (en) * 2015-03-31 2017-11-28 信越化学工业株式会社 Organic silicon modified polyurethane series fiber and its manufacture method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1586002A (en) * 2001-11-13 2005-02-23 东洋纺织株式会社 Grinding pad and method of producing the same
US20090047876A1 (en) * 2007-08-16 2009-02-19 Bo Jiang Chemical mechanical polishing pad with controlled wetting
CN107407011A (en) * 2015-03-31 2017-11-28 信越化学工业株式会社 Organic silicon modified polyurethane series fiber and its manufacture method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115873207A (en) * 2023-02-17 2023-03-31 山东一诺威聚氨酯股份有限公司 High-performance CMP polyurethane polishing pad and preparation method thereof
CN115873207B (en) * 2023-02-17 2023-06-27 山东一诺威聚氨酯股份有限公司 High-performance CMP polyurethane polishing pad and preparation method thereof

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