CN112804820A - MINI multi-color lamp strip and production process method - Google Patents
MINI multi-color lamp strip and production process method Download PDFInfo
- Publication number
- CN112804820A CN112804820A CN202110123563.XA CN202110123563A CN112804820A CN 112804820 A CN112804820 A CN 112804820A CN 202110123563 A CN202110123563 A CN 202110123563A CN 112804820 A CN112804820 A CN 112804820A
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- power supply
- pcb substrate
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- fluorescent glue
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 235000012431 wafers Nutrition 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims description 20
- 238000005507 spraying Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 6
- 238000001228 spectrum Methods 0.000 claims description 4
- 239000003086 colorant Substances 0.000 abstract description 11
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The invention discloses a MINI multicolor lamp strip and a production process method, wherein the MINI multicolor lamp strip comprises the following components: the PCB comprises a PCB substrate and a plurality of wafers which are inversely arranged on the PCB substrate and are arranged in a line, wherein a plurality of mutually independent power supply circuits are printed on the PCB substrate, each power supply circuit is respectively connected with the wafers in a circulating and staggered mode one by one, a single point on the wafer on the same power supply circuit is coated with a same fluorescent glue, and all the fluorescent glues and the PCB substrate are coated with a whole strip of outer-sealed silica gel. When the MINI multicolor lamp strip works, one power supply circuit lights one color when being conducted, the other power supply circuit lights the other color when being conducted, and a plurality of power supply circuits light the third color when being conducted simultaneously, and so on, so that one lamp strip realizes the light of various colors, and the simultaneously lighted mixed light has very uniform color, simple circuit design, lowest manufacturing cost and more efficient light emission.
Description
Technical Field
The invention relates to a MINI multi-color lamp strip, in particular to a MINI multi-color lamp strip which is more efficient in light emitting and lower in cost and a production process method.
Background
The common practice in the prior art is:
1) a product scheme in the current market is as follows: the two lamp strips with different colors are arranged in parallel from top to bottom, when the two lamp strips with different colors are simultaneously lightened, light mixing cannot be well realized, the light on the upper side and the light on the lower side of the product cannot be mixed, and the lighting effect is poor;
2) another product scheme in the current market is as follows: the wafer is packaged into the CSP light source by the CSP process, the two CSP light sources with different colors are respectively arranged in a line in a crossed and spaced mode, the manufacturing cost of the scheme is about 40% expensive, the CSP process mainly causes the problem that insufficient soldering is easy to occur between the CSP light source and the PCB after the CSP light source passes through a reflow furnace, and the product yield on the market can reach about 92% at most.
In addition, the existing product has a problem that due to the current situations of a packaging process and a coating process, blue light leaks from the upper side and the lower side of the wafer when the wafer is lightened, and the using effect is greatly influenced.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects of the prior art and provide the MINI multicolor lamp strip and the production process method.
The technical scheme adopted by the invention for solving the technical problems is as follows: a MINI multi-colored light strip comprising: the PCB comprises a PCB substrate and a plurality of wafers which are inversely arranged on the PCB substrate and are arranged in a line, wherein a plurality of mutually independent power supply circuits are printed on the PCB substrate, each power supply circuit is respectively connected with the wafers in a circulating and staggered mode one by one, a single point on the wafer on the same power supply circuit is coated with a same fluorescent glue, and all the fluorescent glues and the PCB substrate are coated with a whole strip of outer-sealed silica gel.
The adjacent two points of fluorescent glue can not interfere with each other, each point of fluorescent glue covers the whole wafer by taking the corresponding wafer as the center, and the drop area of the fluorescent glue is larger than the surface area of the wafer.
The PCB substrate is provided with a plurality of power input ends, the power input ends correspond to the power supply circuits one by one respectively, each power input end is provided with a negative electrode pad input port, and one positive electrode pad input port can be shared.
The PCB substrate is provided with a plurality of circuit devices in an inverted manner, the power supply circuits are respectively connected with the circuit devices in a one-to-one correspondence manner, and the circuit devices comprise resistors or ICs.
The two power supply circuits are a first power supply circuit and a second power supply circuit, the first power supply circuit is connected with the odd-numbered sequence of wafers, and the second power supply circuit is connected with the even-numbered sequence of wafers.
One path of power supply circuit is white light when lighted, the other path of power supply circuit is warm white light when lighted, and the two paths of power supply circuit are mixed natural white light when lighted simultaneously.
The wafer selects an LED wafer emitting blue light; the fluorescent glue adopts full-spectrum fluorescent powder, and the wavelength range of the fluorescent powder is 480680nm full-wave band.
The technical scheme adopted by the invention for solving the technical problems is as follows: a production process method of the MINI multicolor lamp strip comprises the following steps:
firstly, providing a PCB substrate, and printing a plurality of mutually independent power supply circuits on the PCB substrate in advance;
secondly, attaching the wafer and the circuit devices on the PCB substrate by adopting a flip-chip process, arranging the wafer into a row, and circularly and alternately connecting each power supply circuit with the wafer one by one;
thirdly, spraying fluorescent powder on the surface of each wafer in a single point one by one through spraying or dispensing, spraying the wafers on the same power supply circuit to form the same fluorescent glue, and baking and curing the fluorescent glue;
and fourthly, spraying and covering a whole piece of silica gel on the surfaces of the fluorescent glue and the PCB substrate through spraying or dispensing, covering all the fluorescent glue with the outer sealing silica gel, and baking and curing the outer sealing silica gel.
And in the second step, when the PCB is inverted, the chip, the circuit device and the PCB substrate are electrically connected by using the solder paste, and the solder paste is solidified after the inversion is finished.
And in the third step, when the fluorescent powder is sprayed, two adjacent fluorescent powders cannot interfere with each other, and the drop point area of the fluorescent glue is required to be larger than the surface area of the wafer, so that the whole wafer is completely covered and wrapped.
Compared with the prior art, the invention has the beneficial effects that:
the invention arranges a plurality of wafers into a line, designs a plurality of power supply circuits on a PCB substrate, wherein each power supply circuit is respectively connected with the wafers in a cross and spaced way, the single point on the wafer on the same power supply circuit is coated with the same fluorescent glue, one color is lightened when one power supply circuit is conducted, the other color is lightened when the other power supply circuit is conducted, the third color is lightened when the plurality of power supply circuits are conducted simultaneously, and the like; the lamp strip realizes light with various colors, and the simultaneously lightened mixed light has very uniform color, simple circuit design, lowest manufacturing cost and more efficient light emission;
the fluorescent glue completely covers the whole wafer by taking the corresponding wafer as a center, and the fluorescent glue at two adjacent points on the left and right does not interfere with each other, so that the problem of light leakage is thoroughly solved;
in the production process method, the wafer and the circuit device adopt an inverted process, solder paste is used for assisting in connection and solidification, and the fluorescent glue and the externally-sealed silica gel are gradually coated after the mounting, so that the product quality is improved, and the yield of the MINI multicolor lamp strip prepared by the method can be close to 100%.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced, wherein:
FIG. 1 is a schematic diagram of a PCB substrate with a chip and a circuit device mounted thereon according to a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a PCB substrate coated with a fluorescent glue according to a preferred embodiment of the present invention;
FIG. 3 is a side view of a PCB substrate coated with fluorescent glue according to a preferred embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an application of an encapsulating silicone gel on a PCB substrate according to a preferred embodiment of the invention.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments. In the preferred embodiments, the terms "upper", "lower", "left", "right", "middle" and "a" are used for clarity of description only, and are not used to limit the scope of the invention, and the relative relationship between the terms and the terms is not changed or modified substantially without changing the technical content of the invention.
Referring to fig. 1 to 4, a MINI multi-color lamp strip designed in the preferred embodiment of the present invention mainly includes: PCB base plate 1 and a plurality of chips 2 that the flip-chip installed is arranged on PCB base plate 1 in a row, PCB base plate 1 is printed with two mutually independent supply circuit, for first supply circuit and second supply circuit, every supply circuit is connected with chip 2 intercrossing interval respectively, counted from the left, first supply circuit and 1, 3, 5 … chips link to each other, second supply circuit and 2, 4, 6 … chips link to each other, the single point coating has the same kind of fluorescence glue 3 on every chip 2 on the same supply circuit, the chip that two supply circuits adopt different fluorescence glues, every point fluorescence glue 3 regards its corresponding chip 2 as the center, cover whole chip 2 completely, and two adjacent point fluorescence glues can not interfere each other about, coat the whole piece of outer silica gel 4 on all fluorescence glues 3 at last.
The PCB substrate 1 may be a flexible substrate as a basic carrier. The PCB substrate 1 is further flip-chip mounted with a plurality of circuit devices 5, each power supply circuit is connected with a one-to-one corresponding circuit device 5, and the circuit devices 5 may be resistors or ICs, etc. Flip-chip is one type of mounting process.
The PCB substrate 1 is provided with a first power input end and a second power input end, namely, pad ports for welding with wires, the first power input end and the second power input end respectively correspond to a first power supply circuit and a second power supply circuit, the first power input end and the second power input end are respectively provided with a negative pad input port 6, and can share a positive pad input port 7. Certainly, a plurality of first power supply circuits and a plurality of second power supply circuits which are distributed in an equal mode can be arranged on one PCB substrate 1, the first power supply circuits are controlled to operate simultaneously, the second power supply circuits are controlled to operate simultaneously, and the whole lamp strip is designed by adopting a sectional type circuit, so that the lamp strip is more favorable for use, overhaul and maintenance.
The chip 2 can be an LED chip emitting blue light in the wavelength range of 450460nm, the cost of the chip is the lowest, the chip is most easily obtained, and the scheme is optimal when the chip is used for white light illumination.
The fluorescent glue 3 can be full spectrum fluorescent powder, and the wavelength range of the fluorescent powder is 480680nm full wave band, and can emit light with different colors, for example: 480500nm is blue green powder, 500540nm is yellow green powder, 550560nm is yellow powder, 585630nm is orange red powder, 650680nm is red powder. Different fluorescent glue 3 is coated on the wafer 2, and the lighting light with different colors is realized by applying the optical color matching principle. When the power input end of the first power supply circuit is conducted, one color is lightened, when the power input end of the second power supply circuit is conducted, the other color is lightened, and when the power input ends of the two power supply circuits are simultaneously conducted, the third color is lightened. The general conventional product requirements are: one is about 6500k white, the other is about 30001800k warm white, and the mixture is about 5000k natural white. Compared with the scheme on the market, three application environments of lamplight are realized in one lamp strip, the product inventory can be saved, the light mixing effect is good, and the blue light leakage phenomenon is avoided.
The outer-sealing silica gel 4 can be transparent or atomized, and mainly plays a role in packaging protection.
Referring to fig. 1 to 4, a method for manufacturing a MINI multi-color strip lamp according to a preferred embodiment of the present invention mainly includes the following steps:
firstly, providing a PCB substrate 1, wherein two mutually independent power supply circuits are pre-printed on the PCB substrate and are a first power supply circuit and a second power supply circuit, and power supply input ends which correspond to the power supply circuits one by one are arranged at one end of the PCB substrate;
secondly, attaching the wafers 2 and various circuit devices 5 on the PCB substrate 1 by using full-automatic die attaching equipment through a flip-chip process, arranging all the wafers 2 in a row, connecting each power supply circuit with the wafers 2 at intervals in a crossed manner, connecting the first power supply circuit with … wafers 1, 3 and 5, and connecting the second power supply circuit with … wafers 2, 4 and 6;
when the chip is inversely installed, the chip 2 and various circuit devices 5 are electrically connected with the PCB substrate 1 by using solder paste;
thirdly, curing in a reflow furnace: after the flip chip is completed, the solder paste at the connecting part is solidified through a reflow oven, and the connection of the wafer 2 and various circuit devices 5 and the PCB substrate 1 is reinforced;
step four, coating fluorescent glue 3: the fluorescent powder is sprayed on the surface of each wafer 2 in a single point one by one through spraying or dispensing, and the wafers 2 on the same power supply circuit are sprayed to form the same type of fluorescent glue 3;
when the fluorescent powder is sprayed and coated, the two adjacent fluorescent powder on the left and the right cannot interfere with each other, the drop point area of the fluorescent glue 3 must be larger than the surface area of the wafer 3, the whole wafer 3 is completely covered and coated, and the light leakage of the side surface of the wafer 3 is prevented;
fifthly, curing the fluorescent glue 3: baking and curing the fluorescent glue 3 by using a tunnel curing oven, and reinforcing the connection between the fluorescent glue 3 and the wafer 2;
sixthly, coating external silica gel 4: spraying a whole piece of silica gel on the surfaces of the fluorescent glue 3 and the PCB substrate 1 by using a spraying machine or a dispenser, wherein the silica gel covers all the fluorescent glue 3;
seventhly, curing the outer sealing silica gel 4: the tunnel curing oven is used for baking and curing the outer-sealed silica gel 4, and the connection between the outer-sealed silica gel 4 and the fluorescent glue 3 as well as the PCB substrate 1 is reinforced, so that the tunnel curing oven can better play a role in protecting internal devices.
The MINI multicolor lamp strip is manufactured through the manufacturing method, and when the MINI multicolor lamp strip is installed and used, the power input end at one end of the PCB substrate is welded through the conducting wire, so that an external power supply is realized. When the power input end of one power supply circuit is conducted, one color is lightened, when the power input end of the other power supply circuit is conducted, the other color is lightened, and when the power input ends of the two power supply circuits are conducted simultaneously, the third color is lightened. The general conventional product requirements are: one is about 6500k white, the other is about 30001800k warm white, and the mixture is about 5000k natural white.
In the preferred embodiment of the present invention, the chip 2 is specifically exemplified to be an LED chip emitting blue light in a wavelength range of 450460nm, which is mainly used for illumination, but in other embodiments, the chip 2 may also be an LED chip emitting red, green, orange, etc. with different colors, and the design may be made according to actual requirements. Similarly, the fluorescent glue 3 can be selected with different colors according to actual needs.
In the preferred embodiment of the present invention, two independent power supply circuits are specifically designed, and the chips 2 are correspondingly connected with each other in an intersecting and spaced manner, so as to emit light of three colors, but in other embodiments, three, four or more independent power supply circuits can be designed, and the chips 2 are correspondingly connected with each power supply circuit in a circulating and alternating manner one by one, so as to realize light of more colors.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any indirect modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention by those skilled in the art are within the technical scope of the present invention.
Claims (10)
1. A MINI multi-color light strip, comprising: the PCB comprises a PCB substrate and a plurality of wafers which are inversely arranged on the PCB substrate and are arranged in a line, wherein a plurality of mutually independent power supply circuits are printed on the PCB substrate, each power supply circuit is respectively connected with the wafers in a circulating and staggered mode one by one, a single point on the wafer on the same power supply circuit is coated with a same fluorescent glue, and all the fluorescent glues and the PCB substrate are coated with a whole strip of outer-sealed silica gel.
2. The MINI multicolor light strip according to claim 1, wherein the adjacent two dots of fluorescent glue cannot interfere with each other, each dot of fluorescent glue covers the whole wafer with its corresponding wafer as the center, and the area of the dropped dot of fluorescent glue must be larger than the surface area of the wafer.
3. The MINI multi-color light strip according to claim 1 or 2, wherein the PCB substrate is provided with a plurality of power input terminals, the power input terminals respectively correspond to the power supply circuits one by one, each power input terminal is provided with a negative pad input port, and the negative pad input ports can share a positive pad input port.
4. The MINI multi-color light strip according to claim 1 or 2, wherein a plurality of circuit devices are inversely arranged on the PCB substrate, the power supply circuits are respectively connected with the circuit devices in a one-to-one correspondence manner, and the circuit devices comprise resistors or ICs.
5. A MINI multi-color light strip according to claim 1 or 2, wherein said power supply circuits are two in number, a first power supply circuit connected to an odd number of chips and a second power supply circuit connected to an even number of chips.
6. The MINI multi-color light strip according to claim 5, wherein one power supply circuit is illuminated with a white light, the other power supply circuit is illuminated with a warm white light, and the two power supply circuits are simultaneously illuminated with a mixed natural white light.
7. A MINI multi-color light strip according to claim 1 or 2, wherein said wafers are selected from blue light emitting LED wafers; the fluorescent glue adopts full-spectrum fluorescent powder, and the wavelength range of the fluorescent powder is 480-680nm full wave band.
8. A process for the production of a MINI multi-color strip according to any of the claims 1 to 6, comprising the steps of:
firstly, providing a PCB substrate, and printing a plurality of mutually independent power supply circuits on the PCB substrate in advance;
secondly, attaching the wafer and the circuit devices on the PCB substrate by adopting a flip-chip process, arranging the wafer into a row, and circularly and alternately connecting each power supply circuit with the wafer one by one;
thirdly, spraying fluorescent powder on the surface of each wafer in a single point one by one through spraying or dispensing, spraying the wafers on the same power supply circuit to form the same fluorescent glue, and baking and curing the fluorescent glue;
and fourthly, spraying and covering a whole piece of silica gel on the surfaces of the fluorescent glue and the PCB substrate through spraying or dispensing, covering all the fluorescent glue with the outer sealing silica gel, and baking and curing the outer sealing silica gel.
9. The method of claim 8, wherein in the third step, when spraying the phosphors, the two adjacent phosphors cannot interfere with each other, and the drop area of the phosphors must be larger than the surface area of the wafer to completely cover and wrap the entire wafer.
10. The method according to claim 8, wherein said wafer is selected from the group consisting of blue-emitting LED wafers; the fluorescent glue adopts full-spectrum fluorescent powder, and the wavelength range of the fluorescent powder is 480-680nm full wave band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110123563.XA CN112804820A (en) | 2021-01-27 | 2021-01-27 | MINI multi-color lamp strip and production process method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110123563.XA CN112804820A (en) | 2021-01-27 | 2021-01-27 | MINI multi-color lamp strip and production process method |
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| Publication Number | Publication Date |
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| CN112804820A true CN112804820A (en) | 2021-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110123563.XA Pending CN112804820A (en) | 2021-01-27 | 2021-01-27 | MINI multi-color lamp strip and production process method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113446526A (en) * | 2021-07-01 | 2021-09-28 | 深圳市卷对卷光电科技有限公司 | LED light bar production method and production system applying same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0921568A2 (en) * | 1997-11-25 | 1999-06-09 | Matsushita Electric Works, Ltd. | LED Luminaire |
| CN109638008A (en) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | A kind of flexible filament and its packaging method of double-colored temperature |
| CN210575943U (en) * | 2019-11-21 | 2020-05-19 | 惠州市慧昊光电有限公司 | Multi-color COB lamp belt |
| CN214256753U (en) * | 2021-01-27 | 2021-09-21 | 恒太工业科技(深圳)股份有限公司 | MINI multi-color lamp belt |
-
2021
- 2021-01-27 CN CN202110123563.XA patent/CN112804820A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0921568A2 (en) * | 1997-11-25 | 1999-06-09 | Matsushita Electric Works, Ltd. | LED Luminaire |
| CN109638008A (en) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | A kind of flexible filament and its packaging method of double-colored temperature |
| CN210575943U (en) * | 2019-11-21 | 2020-05-19 | 惠州市慧昊光电有限公司 | Multi-color COB lamp belt |
| CN214256753U (en) * | 2021-01-27 | 2021-09-21 | 恒太工业科技(深圳)股份有限公司 | MINI multi-color lamp belt |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113446526A (en) * | 2021-07-01 | 2021-09-28 | 深圳市卷对卷光电科技有限公司 | LED light bar production method and production system applying same |
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Effective date of registration: 20211215 Address after: 363000 led North Avenue, Mashan village, Yunling Industrial Development Zone, Yunxiao County, Zhangzhou City, Fujian Province Applicant after: Zhangzhou handing Intelligent Drive Technology Co.,Ltd. Address before: 518000 2nd floor, No.1 Factory building, Lingya Industrial Park, No.1 Tangtou Road, Tangtou community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: Hengtai Industrial Technology (Shenzhen) Co.,Ltd. |