CN112802950A - Light-emitting module, display screen and display - Google Patents
Light-emitting module, display screen and display Download PDFInfo
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- CN112802950A CN112802950A CN202110337167.7A CN202110337167A CN112802950A CN 112802950 A CN112802950 A CN 112802950A CN 202110337167 A CN202110337167 A CN 202110337167A CN 112802950 A CN112802950 A CN 112802950A
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- 230000003287 optical effect Effects 0.000 claims description 19
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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Abstract
The application relates to the technical field of optics, and discloses a light-emitting module, includes: a light conversion layer including a plurality of pixels; the pixel comprises a plurality of composite sub-pixels, and each composite sub-pixel comprises a plurality of sub-pixels with the same color; a first isolation structure is arranged between two adjacent composite sub-pixels in the plurality of composite sub-pixels; a second isolation structure is disposed between two adjacent sub-pixels of the plurality of sub-pixels. The light emitting module provided by the application can avoid light emitted by the light conversion layer from being conducted in an undesired direction as much as possible through the first isolation structure and the second isolation structure, for example, one part of light emitted by a certain composite sub-pixel is prevented from entering another adjacent composite sub-pixel as much as possible, or one part of light emitted by a certain sub-pixel is prevented from entering another adjacent sub-pixel as much as possible, so that the display effect is improved. The application also discloses a display module assembly, a display screen and a display.
Description
Technical Field
The application relates to the technical field of optics, for example, relate to luminous module, display module assembly, display screen and display.
Background
In the display field, color display is generally performed using a light conversion layer.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
some of the light emitted by the light conversion layer will be transmitted in undesired directions, and light transmitted in undesired directions will affect the display effect.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a light-emitting module, a display screen and a display, which are used for solving the technical problem that the display effect is influenced because part of light emitted by a light conversion layer is conducted to an undesirable direction.
The embodiment of the present disclosure provides a light emitting module, including:
a light conversion layer including a plurality of pixels;
the pixel comprises a plurality of composite sub-pixels, and each composite sub-pixel comprises a plurality of sub-pixels with the same color;
a first isolation structure is arranged between two adjacent composite sub-pixels in the plurality of composite sub-pixels;
a second isolation structure is disposed between two adjacent sub-pixels of the plurality of sub-pixels.
In some embodiments, the first isolation structure may be disposed in a part or all of a region between two adjacent composite subpixels.
In some embodiments, there may be a first separation region between two adjacent composite subpixels, and part or all of the first separation region may be provided with a first isolation structure.
In some embodiments, the first isolation structure may include at least one of an optical isolation structure, a light transmissive structure.
In some embodiments, the optical isolation structure may comprise an optical isolation material.
In some embodiments, the light transmissive structure may comprise a light transmissive material.
In some embodiments, the second isolation structure may be disposed in a part or all of a region between two adjacent sub-pixels.
In some embodiments, a second isolation region may exist between two adjacent sub-pixels, and a part or all of the second isolation region may be provided with a second isolation structure.
In some embodiments, the second isolation structure may include an optical isolation body.
In some embodiments, the optically isolating body may comprise an optically isolating material.
In some embodiments, the second isolation structure may be provided with a first spacer structure, which may be provided between the optically isolating body and the sub-pixel to be isolated.
In some embodiments, a first spacer structure may be disposed between the optically isolating body and at least one of the adjacent two sub-pixels.
In some embodiments, the first spacer structure may cover part or all of the optically isolating body.
In some embodiments, a partial or entire shape of a cross-sectional shape of the second isolation structure in a light-in direction of the light conversion layer may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
In some embodiments, a cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer may include a trapezoid, and an upper base of the trapezoid may face the light incident side of the light conversion layer.
In some embodiments, an accommodation space may be provided between the first isolation structure and at least one of the adjacent two second isolation structures.
In some embodiments, a part or all of the region in the accommodating space may be provided with a light conversion material corresponding to the sub-pixel isolated by at least one of the two adjacent second isolation structures.
In some embodiments, it may further include: a light emitting layer; the light conversion layer can be disposed on the light emitting surface of the light emitting layer.
In some embodiments, the first isolation structure may be in direct contact with the light emitting layer, or a second isolation structure may be disposed between the first isolation structure and the light emitting layer.
In some embodiments, the light emitting layer may include a plurality of light emitting cells.
In some embodiments, the plurality of light emitting units may be from the same continuous region of the same wafer, and the relative positions of the plurality of light emitting units on the light emitting module may be identical to the relative positions of the plurality of light emitting units on the wafer.
In some embodiments, the plurality of light emitting units may include: at least one of LED, Mini LED and Micro LED.
In some embodiments, it may further include: a substrate; the light conversion layer can be disposed on the substrate.
In some embodiments, the first isolation structure may be in direct contact with the substrate, or a third isolation structure may be disposed between the first isolation structure and the substrate.
In some embodiments, it may further include: a grating structure; the grating structure may be disposed on the substrate.
The embodiment of the present disclosure further provides a display module, which includes the above-mentioned light emitting module.
The embodiment of the present disclosure further provides a display screen, which includes the above display module.
The embodiment of the disclosure also provides a display, which comprises the display screen.
The luminous module, the display module assembly, the display screen and the display that this disclosed embodiment provided can realize following technological effect:
by arranging the first isolation structure between two adjacent composite sub-pixels in the plurality of composite sub-pixels of the light conversion layer and arranging the second isolation structure between two adjacent sub-pixels in the plurality of sub-pixels, the light emitted by the light conversion layer can be prevented from being conducted in an undesired direction as much as possible, for example, a part of the light emitted by a certain composite sub-pixel is prevented from entering another adjacent composite sub-pixel as much as possible, or a part of the light emitted by a certain sub-pixel is prevented from entering another adjacent sub-pixel as much as possible, which is beneficial to improving the display effect.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
At least one embodiment is illustrated by the accompanying drawings, which correspond to the accompanying drawings, and which do not form a limitation on the embodiment, wherein elements having the same reference numeral designations are shown as similar elements, and which are not to scale, and wherein:
fig. 1 is a schematic structural diagram of a light emitting module according to an embodiment of the disclosure;
fig. 2A, fig. 2B, and fig. 2C are schematic structural diagrams of a first isolation structure provided in an embodiment of the disclosure;
fig. 3A, 3B, and 3C are schematic structural diagrams of a first isolation structure provided in an embodiment of the disclosure;
fig. 4A, fig. 4B, and fig. 4C are schematic structural diagrams of a second isolation structure provided in an embodiment of the disclosure;
fig. 5A, 5B, and 5C are schematic structural diagrams of a second isolation structure provided in an embodiment of the disclosure;
fig. 6A, 6B, 6C, and 6D are schematic structural diagrams of a second isolation structure provided in an embodiment of the disclosure;
fig. 7A, 7B, and 7C are schematic structural diagrams of a first spacing structure provided in an embodiment of the disclosure;
fig. 8 is a schematic structural diagram of an accommodating space provided by an embodiment of the disclosure;
fig. 9 is a schematic structural diagram of another light emitting module provided in the embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a light emitting module according to an embodiment of the disclosure;
fig. 12 is a schematic structural diagram of a light emitting module according to an embodiment of the disclosure;
fig. 13 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
FIG. 14 is a schematic diagram of a display screen provided in the practice of the present disclosure;
fig. 15 is a schematic structural diagram of a display provided in the practice of the present disclosure.
Reference numerals:
100: a light emitting module; 200: a light conversion layer; 201: a pixel; 202: a composite sub-pixel; 203: a sub-pixel; 2031: a first sub-pixel; 2032: a second sub-pixel; 301: a first isolation structure; 3011: a second spacer structure; 3012: a third spacer structure; 302: a second isolation structure; 3021: an optical isolation body; 3022: a first spacer structure; 401: a first spaced area; 402: a second spaced-apart region; 500: an accommodating space; 510: a light conversion material; 600: a light emitting layer; 610: a light emitting unit; 700: a substrate; 800: a grating structure; 900: a display module; 901: a display screen; 902: a display; s: and a light-emitting surface.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, at least one embodiment may be practiced without these specific details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
Referring to fig. 1, fig. 1 shows a schematic structural diagram of a light emitting module provided in an embodiment of the present disclosure, and the embodiment of the present disclosure provides a light emitting module 100, including:
a light conversion layer 200 including a plurality of pixels 201;
wherein, the pixel 201 comprises a plurality of composite sub-pixels 202, and the composite sub-pixels 202 comprise a plurality of sub-pixels 203 with the same color;
a first isolation structure 301 is disposed between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202;
a second isolation structure 302 is disposed between two adjacent sub-pixels 203 of the plurality of sub-pixels 203.
In the embodiment of the disclosure, by disposing the first isolation structure 301 between two adjacent composite sub-pixels 202 in the plurality of composite sub-pixels 202 of the light conversion layer 200 and disposing the second isolation structure 302 between two adjacent sub-pixels 203 in the plurality of sub-pixels 203, it is possible to avoid as much as possible that the light emitted from the light conversion layer 200 is transmitted in an undesired direction, for example, it is possible to avoid as much as possible that a part of the light emitted from a certain composite sub-pixel 202 enters into another adjacent composite sub-pixel 202 or that a part of the light emitted from a certain sub-pixel 203 enters into another adjacent sub-pixel 203, which is beneficial to improving the display effect.
In some embodiments, two adjacent composite subpixels 202 in the plurality of composite subpixels 202 comprise the same or different light conversion materials 510.
In some embodiments, two adjacent subpixels 203 of the plurality of subpixels 203 comprise the same light conversion material 510.
In some embodiments, the plurality of composite sub-pixels 202 are arranged in an array, or irregularly;
in some embodiments, the plurality of sub-pixels 203 are arranged in an array, or arranged irregularly.
In some embodiments, the light conversion layer 200 may implement color conversion of light by means of wavelength selection, for example: at least one of the plurality of composite sub-pixels 202 and sub-pixels 203 included in the light conversion layer 200 performs color conversion on light from the light emitting layer 400.
Referring to fig. 2A, 2B, and 2C, in some embodiments, the first isolation structure 301 may be disposed in a part or all of the region between two adjacent composite sub-pixels 202.
In some embodiments, as shown in fig. 2A, the first isolation structure 301 may be disposed in a partial region between two adjacent composite sub-pixels 202, the partial region being located between two adjacent composite sub-pixels 202 and being close to one of the composite sub-pixels 202 (the composite sub-pixel 202 located on the left side in the figure).
In some embodiments, as shown in fig. 2B, the first isolation structure 301 may be disposed in a partial region between two adjacent composite sub-pixels 202, the partial region being located between the two adjacent composite sub-pixels 202 and being opposite to the position where the first isolation structure 301 is located in fig. 2A (close to the composite sub-pixel 202 located at the right side in the figure).
In some embodiments, as shown in fig. 2C, the first isolation structure 301 may be disposed in the entire region between two adjacent composite subpixels 202.
In some embodiments, the region where the first isolation structure 301 is disposed between two adjacent composite sub-pixels 202 may be determined according to practical situations such as process requirements, so long as the first isolation structure 301 can prevent light emitted by two adjacent composite sub-pixels 202 from being transmitted in an undesired direction (for example, light emitted by two adjacent composite sub-pixels is transmitted to each other).
Referring to fig. 3A, 3B, and 3C, in some embodiments, a first isolation region 401 may exist between two adjacent composite subpixels 202, and a part or all of the first isolation region 401 may be provided with the first isolation structure 301.
In some embodiments, as shown in fig. 3A, a first spacing region 401 having a rectangular shape may be used as a spacing region between two adjacent composite sub-pixels 202, and a projection formed by the two adjacent composite sub-pixels 202 and the first spacing region 401 may form a regular shape such as a rectangular quadrilateral as shown in fig. 3A.
In some embodiments, the position, shape, size, etc. of the first spacing region 401 between two adjacent composite sub-pixels 202 may be determined according to practical situations such as process requirements.
In some embodiments, as shown in fig. 3A, the first isolation structure 301 may be disposed in all of the first interval region 401 between two adjacent composite subpixels 202.
In some embodiments, as shown in fig. 3B, the first isolation structure 301 may be disposed in a partial region in the first spacing region 401 between two adjacent composite sub-pixels 202, the partial region being located between two adjacent composite sub-pixels 202 and near one of the composite sub-pixels 202 (the composite sub-pixel 202 located on the left side in the figure).
In some embodiments, as shown in fig. 3C, the first isolation structure 301 may be disposed in a partial region in the first spacing region 401 between two adjacent composite sub-pixels 202, the partial region being located between the two adjacent composite sub-pixels 202 and being opposite to the position where the first isolation structure 301 is located in fig. 3B (near the composite sub-pixel 202 located on the right side in the figure).
In some embodiments, the first isolation structure 301 may include at least one of an optical isolation structure, a light transmissive structure.
In some embodiments, the optical isolation structure may comprise an optical isolation material. Optionally, the optical isolation material may include at least one of a light absorbing material, a light reflecting material. Optionally, the light reflective material comprises a high reflectivity metallic Ag, Al, Ag/Cu, Al/Cu structure. Optionally, the light reflecting material comprises a composite reflective structure of metal and non-metal, such as an Ag/ITO, Al/ITO structure.
In some embodiments, the light transmissive structure may comprise a light transmissive material.
Referring to fig. 4A, 4B, and 4C, in some embodiments, the second isolation structure 302 may be disposed in a part or all of the region between two adjacent sub-pixels 203.
In some embodiments, as shown in fig. 4A, the second isolation structure 302 may be disposed in a partial region between two adjacent sub-pixels 203, the partial region being located between two adjacent sub-pixels 203 and being close to one of the sub-pixels 203 (the sub-pixel 203 located on the left side in the figure).
In some embodiments, as shown in fig. 4B, the second isolation structure 302 may be disposed in a partial region between two adjacent sub-pixels 203, the partial region being located between two adjacent sub-pixels 203 and being opposite to the position where the second isolation structure 302 is located in fig. 4A (close to the sub-pixel 203 located on the right side in the figure).
In some embodiments, as shown in fig. 4C, the second isolation structure 302 may be disposed in the entire region between two adjacent sub-pixels 203.
Referring to fig. 5A, 5B, and 5C, in some embodiments, a second isolation region 402 may exist between two adjacent sub-pixels 203, and a part or all of the second isolation region 402 may be provided with the second isolation structure 302.
In some embodiments, as shown in fig. 5A, the second spacing region 402 having a rectangular shape may be used as the spacing region between two adjacent sub-pixels 203, and the projection formed by the two adjacent sub-pixels 203 and the second spacing region 402 may form a regular shape such as a rectangular quadrangle shown in fig. 5A.
In some embodiments, the position, shape, size, etc. of the second spacing region 402 between two adjacent sub-pixels 203 may be determined according to practical situations such as process requirements.
In some embodiments, as shown in fig. 5A, the second isolation structure 302 may be disposed in all of the second spaced region 402 between two adjacent sub-pixels 203.
In some embodiments, as shown in fig. 5B, the second isolation structure 302 may be disposed in a partial region of the second interval region 402 between two adjacent sub-pixels 203, the partial region being located between the two adjacent sub-pixels 203 and near one of the sub-pixels 203 (the sub-pixel 203 located on the left side in the figure).
In some embodiments, as shown in fig. 5C, the second isolation structure 302 may be disposed in a partial region of the second spacing region 402 between two adjacent sub-pixels 203, the partial region being located between the two adjacent sub-pixels 203 and being opposite to the position where the second isolation structure 302 is located in fig. 5B (close to the sub-pixel 203 located on the right side in the figure).
Referring to fig. 6A, 6B, 6C, and 6D, in some embodiments, the two adjacent sub-pixels 203 may include a first sub-pixel 2031 and a second sub-pixel 2032, the first sub-pixel 2031 may include a first surface 2034 adjacent to the second sub-pixel 2032, and the second sub-pixel 2032 may include a second surface 2035 adjacent to the first sub-pixel 2031. Alternatively, the second isolation structure 302 may be disposed on at least one of the first side 2034 and the second side 2035, or not in contact with the first side 2034 and the second side 2035.
In some embodiments, as shown in fig. 6A, the second isolation structure 302 is disposed on the first surface 2034 of the first subpixel 2031, contacting the first surface 2034 of the first subpixel 2031, and not contacting the second surface 2035 of the second subpixel 2032.
In some embodiments, as shown in fig. 6B, the second isolation structure 302 is disposed on the second side 2035 of the second subpixel 2032, contacting the second side 2035 of the second subpixel 2032, and not contacting the first side 2034 of the first subpixel 2031.
In some embodiments, as shown in fig. 6C, the second isolation structure 302 is disposed on the first surface 2034 of the first subpixel 2031 and the second surface 2035 of the second subpixel 2032, contacting the first surface 2034 of the first subpixel 2031 and contacting the second surface 2035 of the second subpixel 2032.
In some embodiments, as shown in fig. 6D, the second isolation structure 302 is disposed between the first side 2034 of the first subpixel 2031 and the second side 2035 of the second subpixel 2032, and is not in contact with the first side 2034 of the first subpixel 2031 and is not in contact with the second side 2035 of the second subpixel 2032.
In some embodiments, the arrangement relationship between the second isolation structure 302 and the first and second sub-pixels 2031 and 2032 may be determined according to practical situations such as process requirements, as long as the second isolation structure 302 can prevent the light emitted by the first and second sub-pixels 2031 and 2032 from being transmitted in undesired directions (for example, the light emitted by the first and second sub-pixels 2031 and 2032 is transmitted to each other).
In some embodiments, the second isolation structure 302 may include an optical isolation body 3021.
In some embodiments, the optically isolating body 3021 may include an optically isolating material.
In some embodiments, the second isolation structure 302 may be provided with a first spacer structure 3022, and the first spacer structure 3022 may be provided between the optical isolation body 3021 and the sub-pixel 203 that needs to be isolated.
Optionally, at least one of the optical isolation body 3021 and the first spacer structure 3022 comprises an optical isolation material.
Referring to fig. 7A, 7B, 7C, in some embodiments, a first spacer structure 3022 may be disposed between the optically isolating body 3021 and at least one of the adjacent two sub-pixels 203.
Referring to fig. 7A, in some embodiments, two adjacent subpixels 203 may include a first subpixel 2031 and a second subpixel 2032, and a first spacer structure 3022 may be disposed between an optically isolated body 3021 and the first subpixel 2031.
Referring to FIG. 7B, in some embodiments, a first spacer structure 3022 may be disposed between the optically isolating body 3021 and the second subpixel 2032.
Referring to FIG. 7C, in some embodiments, a first spacer structure 3022 may be disposed between the optically-isolated body 3021 and the first subpixel 2031, and between the optically-isolated body 3021 and the second subpixel 2032.
In some embodiments, the first spacer structure 3022 may cover part or all of the optically isolating body 3021.
Referring to fig. 7A, 7B, 7C, a first spacer structure 3022 may cover the entirety of the optical isolation body 3021. Optionally, the first spacer structure 3022 may cover a portion of the optical isolation body 3021.
In some embodiments, some or all of the cross-sectional shape of the second isolation structure 302 along the light-in direction of the light conversion layer 200 may include at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
In some embodiments, the cross-sectional shape of the second isolation structure 302 along the light-in direction of the light conversion layer 200 may include a trapezoid, and an upper base of the trapezoid may face the light-in side of the light conversion layer 200.
In some embodiments, an accommodating space 500 may be disposed between the first isolation structure 301 and at least one of the two adjacent second isolation structures 302.
In some embodiments, a part or all of the area in the accommodating space 500 may be provided with a light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302. The accommodating space 500 is used for accommodating the light conversion material 510 which may overflow from the first isolation structure 301 and the second isolation structure 302.
Referring to fig. 8, in some embodiments, all regions in the accommodating space 500 may be provided with a light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the adjacent two second isolation structures 302. Alternatively, a partial region in the accommodating space 500 may be provided with a light conversion material 510 corresponding to the sub-pixel 203 isolated by at least one of the two adjacent second isolation structures 302.
Referring to fig. 9, in some embodiments, the light emitting module 100 may further include: a light emitting layer 600; the light conversion layer 200 may be disposed on the light emitting surface S of the light emitting layer 600. Alternatively, the light emitting layer 600 may include a plurality of light emitting cells 610.
Referring to fig. 9, in some embodiments, at least one first isolation structure 301 may be in direct contact with the light emitting layer 600.
Referring to fig. 10, in some embodiments, a second spacer structure 3011 may be disposed between at least one first isolation structure 301 and the light emitting layer 600.
In some embodiments, the light emitting units 610 may be from the same continuous region of the same wafer, and the relative positions of the light emitting units 610 on the light emitting module 100 may be identical to the relative positions of the light emitting units 610 on the wafer.
In some embodiments, the plurality of light emitting units 610 may include: at least one of LED, Mini LED and Micro LED. Alternatively, the plurality of light emitting units 610 may include at least one LED. Alternatively, the plurality of light emitting units 111 may include at least one Mini LED. Alternatively, the plurality of light emitting units 610 may include at least one Micro LED. Alternatively, the plurality of light emitting units 610 may include at least one LED, and at least one Mini LED. Alternatively, the plurality of light emitting units 610 may include at least one LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 610 may include at least one Mini LED, and at least one Micro LED. Optionally, the plurality of light emitting units 610 may include at least one LED, at least one Mini LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 610 may include other light emitting devices other than LEDs, Mini LEDs, Micro LEDs.
Referring to fig. 11, in some embodiments, the light emitting module 100 may further include: a substrate 700; the light conversion layer 200 may be disposed on the substrate 700.
Referring to fig. 11, in some embodiments, the first isolation structure 301 may be in direct contact with the substrate 700.
A third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700.
Alternatively, the first isolation structure 301 may be in direct contact with the substrate 700, and the first isolation structure 301 is not in contact with the light emitting layer 600. Alternatively, the first isolation structure 301 may be in direct contact with the light emitting layer 600, and the first isolation structure 301 is not in contact with the substrate 700. Alternatively, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700, and the first isolation structure 301 is not in contact with the light emitting layer 600. Alternatively, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600, and the first isolation structure 301 is not in contact with the substrate 700. Alternatively, the first isolation structure 301 may be in direct contact with the substrate 700 and the light emitting layer 600. Alternatively, the first isolation structure 301 may be in direct contact with the substrate 700, and a third spacer structure 3012 may be disposed between the first isolation structure 301 and the light emitting layer 600. Alternatively, a third spacer structure 3012 may be disposed between the first isolation structure 301 and the substrate 700, and the first isolation structure 301 and the light emitting layer 600 may be in direct contact.
Referring to fig. 12, in some embodiments, the light emitting module 100 may further include: a grating structure 800; the grating structure 800 may be disposed on the substrate 700.
Optionally, the grating structure 800 may include at least one of a slit grating, a lenticular grating, and a ball lenticular grating. The grating structure 800 is used to project the emitted light of the sub-pixels 203 at different positions in the same composite sub-pixel 202 to different directions, and forms a 3D display effect based on the principle of binocular parallax.
Referring to fig. 13, an embodiment of the present disclosure further provides a display module 900 including the light emitting module 100.
Referring to fig. 14, an embodiment of the present disclosure further provides a display screen 901, which includes the display module 900 described above.
Referring to fig. 15, an embodiment of the present disclosure further provides a display 902, which includes the display 901 described above.
According to the light emitting module, the display screen and the display provided by the embodiment of the disclosure, the first isolation structure is arranged between two adjacent composite sub-pixels in the plurality of composite sub-pixels of the light conversion layer, and the second isolation structure is arranged between two adjacent sub-pixels in the plurality of sub-pixels, so that the light emitted by the light conversion layer can be prevented from being conducted in an undesired direction as much as possible, for example, a part of the light emitted by a certain composite sub-pixel is prevented from entering into another adjacent composite sub-pixel as much as possible, or a part of the light emitted by a certain sub-pixel is prevented from entering into another adjacent sub-pixel as much as possible, and the display effect is improved.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It is clear to those skilled in the art that, for convenience and brevity of description, the working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit may be merely a division of a logical function, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In the drawings, the width, length, thickness, etc. of structures such as elements or layers may be exaggerated for clarity and descriptive purposes. When an element or layer is referred to as being "disposed on" (or "mounted on," "laid on," "attached to," "coated on," or the like) another element or layer, the element or layer may be directly "disposed on" or "over" the other element or layer, or intervening elements or layers may be present, or even partially embedded in the other element or layer.
Claims (28)
1. A light emitting module, comprising:
a light conversion layer including a plurality of pixels;
wherein the pixel comprises a plurality of composite sub-pixels, the composite sub-pixels comprising a plurality of sub-pixels having the same color;
a first isolation structure is arranged between two adjacent composite sub-pixels in the plurality of composite sub-pixels;
and a second isolation structure is arranged between two adjacent sub-pixels in the plurality of sub-pixels.
2. The light-emitting module according to claim 1, wherein the first isolation structure is disposed in a part or all of a region between two adjacent composite sub-pixels.
3. The light-emitting module according to claim 1, wherein a first spacing region is present between two adjacent composite sub-pixels, and part or all of the first spacing region is provided with the first isolation structure.
4. The lighting module of claim 1, wherein the first isolation structure comprises at least one of an optical isolation structure and a light transmissive structure.
5. The lighting module of claim 4, wherein the optical isolation structure comprises an optical isolation material.
6. The lighting module of claim 4, wherein the light-transmissive structure comprises a light-transmissive material.
7. The light emitting module of claim 1, wherein the second isolation structure is disposed in a part or all of a region between two adjacent sub-pixels.
8. The light emitting module according to claim 7, wherein a second isolation region is disposed between two adjacent sub-pixels, and a part or all of the second isolation region is provided with the second isolation structure.
9. The lighting module of claim 1, wherein the second isolation structure comprises an optically isolating body.
10. The lighting module of claim 9, wherein the optically isolating body comprises an optically isolating material.
11. The lighting module of claim 9, wherein the second isolation structure is provided with a first spacer structure, and the first spacer structure is disposed between the optical isolation body and the sub-pixel to be isolated.
12. The lighting module of claim 11, wherein the first spacer structure is disposed between the light-isolating body and at least one of the adjacent sub-pixels.
13. The lighting module of claim 11, wherein the first spacer structure covers part or all of the optically isolating body.
14. The light emitting module of claim 1, wherein a partial or entire shape of the cross-sectional shape of the second isolation structure along the incident light direction of the light conversion layer comprises at least one of a rectangle, a triangle, a trapezoid, and an inverted trapezoid.
15. The light emitting module of claim 14, wherein a cross-sectional shape of the second isolation structure along the light incident direction of the light conversion layer comprises a trapezoid, and an upper base of the trapezoid faces the light incident side of the light conversion layer.
16. The illumination module as recited in claim 1, wherein an accommodating space is disposed between the first isolation structure and at least one of the two adjacent second isolation structures.
17. The illumination module according to claim 16, wherein a part or all of the area in the accommodating space is provided with a light conversion material corresponding to the sub-pixel isolated by at least one of the two adjacent second isolation structures.
18. The lighting module according to any one of claims 1 to 17, further comprising: a light emitting layer;
the light conversion layer is arranged on the light emitting surface of the light emitting layer.
19. The lighting module of claim 18,
the first isolation structure is in direct contact with the light emitting layer, or,
and a second spacing structure is arranged between the first spacing structure and the light-emitting layer.
20. The lighting module of claim 18, wherein the light emitting layer comprises a plurality of light emitting cells.
21. The lighting module of claim 20, wherein the plurality of lighting units are from a same continuous region of a same wafer, and the relative positions of the plurality of lighting units on the display device are the same as the relative positions of the plurality of lighting units on the wafer.
22. The lighting module of claim 21, wherein the plurality of lighting units comprise:
at least one of a light emitting diode LED, a Mini light emitting diode LED and a Micro light emitting diode Micro LED.
23. The lighting module according to any one of claims 1 to 17, further comprising:
a substrate;
the light conversion layer is arranged on the substrate.
24. The lighting module of claim 23,
the first isolation structure is in direct contact with the substrate, or,
and a third spacing structure is arranged between the first spacing structure and the substrate.
25. The lighting module of claim 23, further comprising:
a grating structure;
the grating structure is arranged on the substrate.
26. A display module comprising the light-emitting module according to any one of claims 1 to 25.
27. A display screen comprising the display module of claim 26.
28. A display comprising a display screen as claimed in claim 27.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110337167.7A CN112802950A (en) | 2021-03-30 | 2021-03-30 | Light-emitting module, display screen and display |
| PCT/CN2022/081061 WO2022206379A1 (en) | 2021-03-30 | 2022-03-16 | Light-emitting module, display module, display screen, and display |
| TW111110031A TWI802322B (en) | 2021-03-30 | 2022-03-18 | Light emitting modules, display modules, display screens and monitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110337167.7A CN112802950A (en) | 2021-03-30 | 2021-03-30 | Light-emitting module, display screen and display |
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| CN112802950A true CN112802950A (en) | 2021-05-14 |
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| CN202110337167.7A Pending CN112802950A (en) | 2021-03-30 | 2021-03-30 | Light-emitting module, display screen and display |
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| Country | Link |
|---|---|
| CN (1) | CN112802950A (en) |
| TW (1) | TWI802322B (en) |
| WO (1) | WO2022206379A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021233100A1 (en) * | 2020-05-22 | 2021-11-25 | 北京芯海视界三维科技有限公司 | Light-emitting module, display module, display screen, and display |
| WO2022206379A1 (en) * | 2021-03-30 | 2022-10-06 | 北京芯海视界三维科技有限公司 | Light-emitting module, display module, display screen, and display |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110231733A (en) * | 2019-06-26 | 2019-09-13 | 惠科股份有限公司 | Color membrane substrates and preparation method thereof and display device |
| CN110364641A (en) * | 2019-08-20 | 2019-10-22 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN110518052A (en) * | 2019-08-29 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| US20200127069A1 (en) * | 2013-01-17 | 2020-04-23 | Kateeva, Inc. | High resolution organic light-emitting diode devices, displays, and related method |
| CN111341804A (en) * | 2018-12-18 | 2020-06-26 | 广东聚华印刷显示技术有限公司 | Display device, preparation method thereof and display device |
| CN111599938A (en) * | 2020-05-25 | 2020-08-28 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN112394567A (en) * | 2020-12-11 | 2021-02-23 | 厦门天马微电子有限公司 | Liquid crystal display panel and display device |
| CN212624644U (en) * | 2020-05-22 | 2021-02-26 | 北京芯海视界三维科技有限公司 | Light-emitting module, display screen and display |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104297832B (en) * | 2014-09-28 | 2017-02-15 | 合肥鑫晟光电科技有限公司 | Color filter, color filter manufacturing method, display panel, display device and driving method |
| WO2017116136A1 (en) * | 2015-12-31 | 2017-07-06 | 서울반도체주식회사 | Display device |
| CN106154800B (en) * | 2016-09-09 | 2018-12-25 | 京东方科技集团股份有限公司 | Holographic display and its holographic display methods |
| CN112802950A (en) * | 2021-03-30 | 2021-05-14 | 北京芯海视界三维科技有限公司 | Light-emitting module, display screen and display |
-
2021
- 2021-03-30 CN CN202110337167.7A patent/CN112802950A/en active Pending
-
2022
- 2022-03-16 WO PCT/CN2022/081061 patent/WO2022206379A1/en active Application Filing
- 2022-03-18 TW TW111110031A patent/TWI802322B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200127069A1 (en) * | 2013-01-17 | 2020-04-23 | Kateeva, Inc. | High resolution organic light-emitting diode devices, displays, and related method |
| CN111341804A (en) * | 2018-12-18 | 2020-06-26 | 广东聚华印刷显示技术有限公司 | Display device, preparation method thereof and display device |
| CN110231733A (en) * | 2019-06-26 | 2019-09-13 | 惠科股份有限公司 | Color membrane substrates and preparation method thereof and display device |
| CN110364641A (en) * | 2019-08-20 | 2019-10-22 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN110518052A (en) * | 2019-08-29 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| CN212624644U (en) * | 2020-05-22 | 2021-02-26 | 北京芯海视界三维科技有限公司 | Light-emitting module, display screen and display |
| CN111599938A (en) * | 2020-05-25 | 2020-08-28 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN112394567A (en) * | 2020-12-11 | 2021-02-23 | 厦门天马微电子有限公司 | Liquid crystal display panel and display device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021233100A1 (en) * | 2020-05-22 | 2021-11-25 | 北京芯海视界三维科技有限公司 | Light-emitting module, display module, display screen, and display |
| WO2022206379A1 (en) * | 2021-03-30 | 2022-10-06 | 北京芯海视界三维科技有限公司 | Light-emitting module, display module, display screen, and display |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022206379A1 (en) | 2022-10-06 |
| TWI802322B (en) | 2023-05-11 |
| TW202240938A (en) | 2022-10-16 |
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