CN112771114B - Sealing resin composition, electronic component device, and method for manufacturing electronic component device - Google Patents
Sealing resin composition, electronic component device, and method for manufacturing electronic component device Download PDFInfo
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- CN112771114B CN112771114B CN201880098052.3A CN201880098052A CN112771114B CN 112771114 B CN112771114 B CN 112771114B CN 201880098052 A CN201880098052 A CN 201880098052A CN 112771114 B CN112771114 B CN 112771114B
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- resin composition
- sealing resin
- ester compound
- active ester
- compound
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- 238000007789 sealing Methods 0.000 title claims abstract description 84
- 239000011342 resin composition Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- -1 ester compound Chemical class 0.000 claims abstract description 104
- 239000003822 epoxy resin Substances 0.000 claims abstract description 67
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 67
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 61
- 239000002245 particle Substances 0.000 claims abstract description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- RMVRSNDYEFQCLF-UHFFFAOYSA-N phenyl mercaptan Natural products SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical group OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims description 2
- 239000003826 tablet Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 abstract description 30
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 30
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 26
- 150000001875 compounds Chemical class 0.000 description 23
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000005011 phenolic resin Substances 0.000 description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 15
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 14
- 229920001568 phenolic resin Polymers 0.000 description 13
- 239000007822 coupling agent Substances 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 9
- 239000007983 Tris buffer Substances 0.000 description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 125000004185 ester group Chemical group 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 239000005350 fused silica glass Substances 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 4
- 239000004843 novolac epoxy resin Substances 0.000 description 4
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 4
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 3
- 229940005561 1,4-benzoquinone Drugs 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- VTWDKFNVVLAELH-UHFFFAOYSA-N 2-methylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=CC1=O VTWDKFNVVLAELH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229960001545 hydrotalcite Drugs 0.000 description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004206 montan acid ester Substances 0.000 description 2
- 235000013872 montan acid ester Nutrition 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical group 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical group 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 150000003739 xylenols Chemical class 0.000 description 2
- QJIMTLTYXBDJFC-UHFFFAOYSA-N (4-methylphenyl)-diphenylphosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QJIMTLTYXBDJFC-UHFFFAOYSA-N 0.000 description 1
- QKUSYGZVIAWWPY-UHFFFAOYSA-N 1,3-dioxane;7-oxabicyclo[4.1.0]heptane Chemical compound C1COCOC1.C1CCCC2OC21 QKUSYGZVIAWWPY-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- FQJZPYXGPYJJIH-UHFFFAOYSA-N 1-bromonaphthalen-2-ol Chemical compound C1=CC=CC2=C(Br)C(O)=CC=C21 FQJZPYXGPYJJIH-UHFFFAOYSA-N 0.000 description 1
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
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- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- MNOJRWOWILAHAV-UHFFFAOYSA-N 3-bromophenol Chemical compound OC1=CC=CC(Br)=C1 MNOJRWOWILAHAV-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- FXTKWBZFNQHAAO-UHFFFAOYSA-N 3-iodophenol Chemical compound OC1=CC=CC(I)=C1 FXTKWBZFNQHAAO-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ARUBXNBYMCVENE-UHFFFAOYSA-N 4-(4-bromophenyl)phenol Chemical group C1=CC(O)=CC=C1C1=CC=C(Br)C=C1 ARUBXNBYMCVENE-UHFFFAOYSA-N 0.000 description 1
- ZLVFYUORUHNMBO-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol Chemical compound CC1=CC(Br)=CC(C)=C1O ZLVFYUORUHNMBO-UHFFFAOYSA-N 0.000 description 1
- SSQQUEKFNSJLKX-UHFFFAOYSA-N 4-bromo-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(Br)=CC(C(C)(C)C)=C1O SSQQUEKFNSJLKX-UHFFFAOYSA-N 0.000 description 1
- IWJGMJHAIUBWKT-UHFFFAOYSA-N 4-bromo-2-methylphenol Chemical compound CC1=CC(Br)=CC=C1O IWJGMJHAIUBWKT-UHFFFAOYSA-N 0.000 description 1
- WMUWDPLTTLJNPE-UHFFFAOYSA-N 4-bromo-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Br WMUWDPLTTLJNPE-UHFFFAOYSA-N 0.000 description 1
- GPOQODYGMUTOQL-UHFFFAOYSA-N 4-bromo-3-methylphenol Chemical compound CC1=CC(O)=CC=C1Br GPOQODYGMUTOQL-UHFFFAOYSA-N 0.000 description 1
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- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- VSMDINRNYYEDRN-UHFFFAOYSA-N 4-iodophenol Chemical compound OC1=CC=C(I)C=C1 VSMDINRNYYEDRN-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- YLDFTMJPQJXGSS-UHFFFAOYSA-N 6-bromo-2-naphthol Chemical compound C1=C(Br)C=CC2=CC(O)=CC=C21 YLDFTMJPQJXGSS-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- ARRNBPCNZJXHRJ-UHFFFAOYSA-M hydron;tetrabutylazanium;phosphate Chemical compound OP(O)([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC ARRNBPCNZJXHRJ-UHFFFAOYSA-M 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- DOXFBSZBACYHFY-UHFFFAOYSA-N phenol;stilbene Chemical class OC1=CC=CC=C1.C=1C=CC=CC=1C=CC1=CC=CC=C1 DOXFBSZBACYHFY-UHFFFAOYSA-N 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000005497 tetraalkylphosphonium group Chemical group 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Abstract
A sealing resin composition comprising an epoxy resin, a curing agent and an inorganic filler, wherein the curing agent comprises an active ester compound, and the inorganic filler has an average particle diameter of 5-100 [ mu ] m.
Description
Technical Field
The invention relates to a sealing resin composition, an electronic component device and a method for manufacturing the electronic component device.
Background
The amount of transmission loss generated by thermal conversion of a radio wave transmitted for communication in a dielectric medium is expressed as the product of the square root of the frequency and the relative permittivity and the dielectric loss tangent. In other words, the transmission signal is easily converted into heat in proportion to the frequency, and therefore, in order to suppress the transmission loss, the higher the frequency band, the lower the dielectric characteristics are required for the material of the communication member.
For example, patent documents 1 and 2 disclose thermosetting resin compositions containing an active ester resin as a curing agent for epoxy resins, whereby the dielectric loss tangent of the cured product can be suppressed to be low.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2012-246367
Patent document 2: japanese patent laid-open publication No. 2014-114352
Disclosure of Invention
Problems to be solved by the invention
In the field of information communication, the frequency of radio waves has been increased with an increase in the number of channels and an increase in the amount of information to be transmitted. Currently, research on the 5 th generation mobile communication system is being conducted worldwide, and several of the ranges of about 30GHz to 70GHz are given as candidates for the frequency band to be used. In the future, the mainstream of wireless communication is communication in such a high frequency band, and therefore, a material of a communication member is required to have a lower dielectric loss tangent.
Embodiments of the present disclosure have been completed based on the above-described situation.
The present disclosure provides a sealing resin composition having a low dielectric loss tangent of a cured product, an electronic component device sealed by using the same, and a method for manufacturing an electronic component device sealed by using the same.
Means for solving the problems
Specific means for solving the above problems include the following means.
[1] A sealing resin composition comprising an epoxy resin, a curing agent and an inorganic filler, wherein the curing agent comprises an active ester compound, and the inorganic filler has an average particle diameter of 5-100 [ mu ] m.
[2] An electronic component device, comprising: a support member; an element disposed on the support member; and a cured product of the sealing resin composition according to [1] for sealing the element.
[3] A method of manufacturing an electronic component device, comprising: a step of disposing the element on the support member; and sealing the element with the sealing resin composition according to [1 ].
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present disclosure, there are provided a sealing resin composition having a low dielectric loss tangent of a cured product, an electronic component device sealed with the same, and a method for manufacturing an electronic component device sealed with the same.
Detailed Description
In the present disclosure, the term "process" includes not only a process independent of other processes, but also a process which is not clearly distinguished from other processes, as long as the purpose of the process is achieved.
In the present disclosure, the numerical range indicated by the term "to" includes the numerical values described before and after the term "to" as the minimum value and the maximum value, respectively.
In the numerical ranges described in stages in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other stages. In addition, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the embodiment.
In the present disclosure, each component may comprise a plurality of conforming substances. When a plurality of substances corresponding to the respective components are present in the composition, unless otherwise specified, the content or content of the respective components means the total content or content of the plurality of substances present in the composition.
In the present disclosure, particles conforming to each component may contain a plurality of kinds. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component is a value indicating a mixture of the plurality of particles present in the composition unless otherwise specified.
< sealing resin composition >
The sealing resin composition of the present disclosure contains an epoxy resin, a curing agent containing an active ester compound, and an inorganic filler having an average particle diameter of 5 to 100 [ mu ] m.
The active ester compound in the present disclosure means a compound having 1 or more ester groups reactive with epoxy groups in 1 molecule and having a curing effect of an epoxy resin.
Conventionally, as a curing agent for epoxy resins, phenol curing agents, amine curing agents, and the like have been generally used, whereby secondary hydroxyl groups are generated in the reaction of epoxy resins with phenol curing agents or amine curing agents. In contrast, in the reaction of an epoxy resin with an active ester compound, an ester group is generated instead of a secondary hydroxyl group. Since the ester group has a lower polarity than the secondary hydroxyl group, the resin composition for sealing of the present disclosure can suppress the dielectric loss tangent of the cured product to be low as compared with a resin composition for sealing containing only a curing agent that generates a secondary hydroxyl group as a curing agent.
Further, the resin composition for sealing of the present disclosure can suppress the dielectric loss tangent of the cured product to be lower by making the average particle diameter of the inorganic filler contained to be 5 μm or more. The inorganic filler tends to have a larger specific surface area and a larger amount of surface hydroxyl groups per unit amount as the particle diameter is smaller, and the average particle diameter of the inorganic filler is 5 μm or more to reduce the amount of surface hydroxyl groups, so that the amount of hydroxyl groups contained in the cured product of the sealing resin composition is reduced, and as a result, the dielectric loss tangent of the cured product can be suppressed to be lower.
On the other hand, from the viewpoint of ensuring the filling property of the sealing resin composition, the inorganic filler contained in the sealing resin composition of the present disclosure has an average particle diameter of 100 μm or less.
(epoxy resin)
The kind of the epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
Specific examples of the epoxy resin include: epoxy resins obtained by epoxidizing a novolac resin obtained by condensing or co-condensing a phenolic compound selected from at least 1 of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, and naphthol compounds such as α -naphthol, β -naphthol, dihydroxynaphthalene, etc., with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc., namely, novolac epoxy resins (phenol novolac epoxy resins, orthocresol novolac epoxy resins, etc.); an epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensing or co-condensing the phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde in the presence of an acidic catalyst, that is, a triphenylmethane type epoxy resin; an epoxy resin obtained by epoxidizing a novolac resin obtained by co-condensing the phenol compound and the naphthol compound with an aldehyde compound in the presence of an acidic catalyst, namely, a copolymerized epoxy resin; diglycidyl ethers of bisphenol a, bisphenol F, and the like, that is, diphenylmethane-type epoxy resins; diglycidyl ethers of alkyl-substituted or unsubstituted biphenols, i.e., biphenyl-type epoxy resins; diglycidyl ethers of stilbene phenol compounds, i.e. stilbene type epoxy resins; diglycidyl ethers of bisphenol S and the like, that is, epoxy resins containing sulfur atoms; epoxy resins as glycidyl ethers of alcohols such as butanediol, polyethylene glycol, polypropylene glycol, etc.; glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid and tetrahydrophthalic acid, that is, glycidyl ester type epoxy resins; an epoxy resin obtained by substituting active hydrogen bonded to nitrogen atoms such as aniline, diaminodiphenylmethane, and isocyanuric acid with a glycidyl group, that is, a glycidylamine type epoxy resin; an epoxy resin obtained by epoxidizing a cocondensated resin of dicyclopentadiene and a phenol compound, that is, a dicyclopentadiene type epoxy resin; alicyclic epoxy resins such as vinylcyclohexene dioxide, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexane carboxylate, and 2- (3, 4-epoxy) cyclohexyl-5, 5-spiro (3, 4-epoxy) cyclohexane-m-dioxane, which are epoxy resins obtained by epoxidation of an intramolecular olefin bond; glycidyl ethers of para-xylene modified phenolic resins, namely para-xylene modified epoxy resins; glycidyl ethers of meta-xylene modified phenolic resins, i.e. meta-xylene modified epoxy resins; glycidyl ethers of terpene modified phenolic resins, i.e., terpene modified epoxy resins; glycidyl ethers of dicyclopentadiene modified phenolic resins, i.e., dicyclopentadiene modified epoxy resins; glycidyl ethers of cyclopentadiene-modified phenolic resins, i.e., cyclopentadiene-modified epoxy resins; glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, i.e., polycyclic aromatic ring-modified epoxy resins; glycidyl ethers of phenolic resins containing naphthalene rings, i.e., naphthalene type epoxy resins; halogenated phenol novolac epoxy resins; hydroquinone type epoxy resin; trimethylolpropane type epoxy resin; linear aliphatic epoxy resins obtained by oxidizing an ethylenic bond with a peracid such as peracetic acid; an aralkyl type epoxy resin which is an epoxy resin obtained by epoxidizing an aralkyl type phenol resin such as a phenol aralkyl resin or a naphthol aralkyl resin; etc. Further, epoxy resins such as epoxy resins of acrylic resins can be mentioned. These epoxy resins may be used alone or in combination of 1 or more than 2.
The epoxy equivalent (molecular weight/epoxy number) of the epoxy resin is not particularly limited. From the viewpoint of balance of various properties such as formability, reflow resistance, and electrical reliability, it is preferably 100g/eq to 1000g/eq, more preferably 150g/eq to 500g/eq.
The epoxy equivalent of the epoxy resin was set to be as defined in JIS K7236: 2009, a value measured by the method of the present invention.
In the case where the epoxy resin is solid, its softening point or melting point is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably 40 to 180 ℃, and from the viewpoint of handling properties when preparing the sealing resin composition, it is more preferably 50 to 130 ℃.
The melting point of the epoxy resin was set to a value measured by Differential Scanning Calorimeter (DSC), and the softening point of the epoxy resin was set to a value measured by the method according to JIS K7234: 1986 (cycloball method).
The content of the epoxy resin in the sealing resin composition is preferably 0.5 to 50% by mass, more preferably 2 to 30% by mass, from the viewpoints of strength, flowability, heat resistance, moldability, and the like.
(curing agent)
The sealing resin composition of the present disclosure contains at least an active ester compound as a curing agent. The sealing resin composition of the present disclosure may contain a curing agent other than the active ester compound.
As described above, the resin composition for sealing of the present disclosure can suppress the dielectric loss tangent of a cured product to be low by using the active ester compound as a curing agent.
In addition, the polar group in the cured product improves the water absorption of the cured product, and the use of the active ester compound as the curing agent can suppress the concentration of the polar group in the cured product, and can suppress the water absorption of the cured product. And, by suppressing the water absorption of the cured product, i.e., suppressing H as a polar molecule 2 The content of O can thereby suppress the dielectric loss tangent of the cured product to be lower. The water absorption of the cured product is preferably 0% to 0.35%, more preferably 0% to 0.30%, and even more preferably 0% to 0.25%. The water absorption of the cured product was a mass increase obtained by a pressure cooker boiling test (121 ℃,2.1 atm, 24 hours).
The type of the active ester compound is not particularly limited as long as it is a compound having 1 or more ester groups reactive with epoxy groups in the molecule.
Examples of the active ester compound include: phenol ester compounds, thiophenol ester compounds, N-hydroxylamine ester compounds, esters of heterocyclic hydroxyl compounds, and the like.
Examples of the active ester compound include: an ester compound obtained from at least 1 of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least 1 of an aliphatic hydroxyl compound and an aromatic hydroxyl compound. Ester compounds having aliphatic chains as components of polycondensation tend to have excellent compatibility with epoxy resins. Ester compounds having an aromatic compound as a component of polycondensation tend to have an aromatic ring and thus to be excellent in heat resistance.
Specific examples of the active ester compound include aromatic esters obtained by condensation reaction of an aromatic carboxylic acid and a phenolic hydroxyl group. Among them, preferred is: an aromatic ester obtained by a condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group, wherein the aromatic carboxylic acid component is obtained by substituting 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, diphenylsulfonic acid, etc. with a carboxyl group, the monohydric phenol is obtained by substituting 1 hydrogen atom of the aromatic ring with a hydroxyl group, and the polyhydric phenol is obtained by substituting 2 to 4 hydrogen atoms of the aromatic ring with a hydroxyl group. That is, an aromatic ester having a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monohydric phenol, and a structural unit derived from the polyhydric phenol is preferable.
Specific examples of the active ester compound include: an active ester resin having a structure obtained by reacting a phenolic resin having a molecular structure in which a phenol compound is bonded via an aliphatic cyclic hydrocarbon group, an aromatic dicarboxylic acid or a halide thereof, and an aromatic monohydroxy compound, as described in japanese patent application laid-open No. 2012-246367. The active ester resin is preferably a compound represented by the following structural formula (1).
[ chemical formula 1]
In the structural formula (1), R 1 X is a benzene ring, a naphthalene ring, a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group, Y is a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, k is 0 or 1, and n represents an average of the number of repetitions and is 0.25 to 1.5.
Specific examples of the compound represented by the structural formula (1) include the following exemplary compounds (1-1) to (1-10). t-Bu in the structural formula is tert-butyl.
[ chemical formula 2]
[ chemical formula 3]
As another specific example of the active ester compound, there are a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3) described in JP-A2014-114352.
[ chemical formula 4]
In the structural formula (2), R 1 And R is 2 Each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, Z represents an ester-forming structural moiety (Z1) selected from the group consisting of benzoyl, naphthoyl, benzoyl or naphthoyl substituted with an alkyl group having 1 to 4 carbon atoms and an acyl group having 2 to 6 carbon atoms, or at least 1 of Z represents an ester-forming structural moiety (Z1).
In the structural formula (3), R 1 And R is 2 Each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, Z represents an ester-forming structural moiety (Z1) selected from the group consisting of a benzoyl group, a naphthoyl group, a benzoyl group or a naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (Z2), and at least 1 of Z represents an ester-forming structural moiety (Z1).
Specific examples of the compound represented by the structural formula (2) include the following exemplary compounds (2-1) to (2-6).
[ chemical formula 5]
Specific examples of the compound represented by the structural formula (3) include the following exemplary compounds (3-1) to (3-6).
[ chemical formula 6]
As the active ester compound, commercially available ones can be used. Examples of the commercially available active ester compounds containing a dicyclopentadiene type diphenol structure include "EXB9451", "EXB9460S" and "HPC-8000-65T" (manufactured by DIC Co., ltd.); examples of the active ester compound having an aromatic structure include "EXB9416-70BK", "EXB-8" and "EXB-9425" (manufactured by DIC Co., ltd.); examples of the active ester compound including an acetylate of phenol novolac include "DC808" (manufactured by Mitsubishi Chemical corporation); examples of the active ester compound containing a phenol formaldehyde-containing benzoyl compound include "YLH1026" (manufactured by Mitsubishi Chemical Co., ltd.).
The active ester compound may be used alone or in combination of 1 or more than 2.
The equivalent amount of the ester group of the active ester compound is not particularly limited. From the viewpoint of balance of various properties such as formability, reflow resistance, and electrical reliability, it is preferably 150g/eq to 400g/eq, more preferably 170g/eq to 300g/eq, and still more preferably 200g/eq to 250g/eq.
The equivalent weight of the ester group of the active ester compound was set by the method according to JIS K0070: 1992.
From the viewpoint of suppressing the dielectric loss tangent of the cured product to be low, the equivalent ratio (ester group/epoxy group) of the epoxy resin to the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and still more preferably 0.97 or more.
From the viewpoint of suppressing the unreacted components of the active ester compound to a small extent, the equivalent ratio (ester group/epoxy group) of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, and still more preferably 1.03 or less.
The curing agent may contain other curing agents than the active ester compound. In this case, the type of the other curing agent is not particularly limited, and may be selected according to the desired properties of the sealing resin composition, and the like. Examples of the other curing agent include phenol curing agents, amine curing agents, acid anhydride curing agents, polythiol curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like.
Specific examples of the phenol curing agent include: polyhydric phenol compounds such as resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted biphenol; a novolac phenol resin obtained by condensing or co-condensing a phenolic compound with an aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde in the presence of an acidic catalyst, wherein the phenolic compound is at least one phenol compound selected from phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, aminophenol, and the like, and a naphthol compound such as α -naphthol, β -naphthol, and dihydroxynaphthalene; aralkyl type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above phenolic compounds and dimethoxypara-xylene, bis (methoxymethyl) biphenyl, and the like; para-xylene modified phenolic resin, meta-xylene modified phenolic resin; melamine modified phenolic resins; terpene modified phenolic resin; dicyclopentadiene type phenol resins and dicyclopentadiene type naphthol resins synthesized by copolymerization of the above phenolic compounds and dicyclopentadiene; cyclopentadiene modified phenolic resin; polycyclic aromatic ring modified phenolic resin; biphenyl type phenolic resin; a triphenylmethane type phenol resin obtained by condensing or co-condensing the phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde in the presence of an acidic catalyst; a phenolic resin obtained by copolymerizing two or more of these; etc. These phenol curing agents may be used alone or in combination of 1 or more than 2.
The functional group equivalent of the other curing agent (hydroxyl equivalent in the case of the phenol curing agent) is not particularly limited. From the viewpoint of balance of various properties such as formability, reflow resistance, and electrical reliability, it is preferably 70g/eq to 1000g/eq, more preferably 80g/eq to 500g/eq.
The functional group equivalent of the other curing agent (hydroxyl equivalent in the case of the phenol curing agent) is set by the method according to JIS K0070: 1992.
In the case where the curing agent is solid, its softening point or melting point is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably 40 to 180 ℃, and from the viewpoint of handling properties in the production of the sealing resin composition, it is more preferably 50 to 130 ℃.
The melting point or softening point of the curing agent is determined in the same manner as the melting point or softening point of the epoxy resin.
The equivalent ratio of the epoxy resin to the entire curing agent (active ester compound and other curing agent), that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (the number of functional groups in the curing agent/the number of functional groups in the epoxy resin), is not particularly limited. From the viewpoint of suppressing the respective unreacted components to a small extent, the content is preferably set to a range of 0.5 to 2.0, and more preferably set to a range of 0.6 to 1.3. From the viewpoints of formability and reflow resistance, the range of 0.8 to 1.2 is more preferable.
The content of the active ester compound relative to the total mass of the active ester compound and other curing agents is preferably 80 mass% or more, more preferably 85 mass% or more, and even more preferably 90 mass% or more, from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low.
The content of the total of the epoxy resin and the active ester compound relative to the total mass of the epoxy resin, the active ester compound, and other curing agents is preferably 70 mass% or more, more preferably 80 mass% or more, and even more preferably 85 mass% or more, from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low.
(curing accelerator)
The sealing resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and may be selected according to the type of the epoxy resin or the curing agent, desired properties of the sealing resin composition, and the like.
Examples of the curing accelerator include: cyclic amidine compounds such as diazabicycloolefins (e.g., 1, 5-diazabicyclo [4.3.0] nonene-5 (DBN) and 1, 8-diazabicyclo [5.4.0] undecene-7 (DBU)), 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; derivatives of the above cyclic amidine compounds; phenol novolac salts of the above cyclic amidine compounds or derivatives thereof; a compound having intramolecular polarization, which is obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or a compound having pi bond such as diazophenylmethane to these compounds; cyclic amidine ( of Japanese patent application No. ヅ) compounds such as tetraphenylborate of DBU, tetraphenylborate of DBN, tetraphenylborate of 2-ethyl-4-methylimidazole, tetraphenylborate of N-methylmorpholine, and isocyanate-added compounds; isocyanate adducts of DBU, isocyanate adducts of DBN, isocyanate adducts of 2-ethyl-4-methylimidazole, isocyanate adducts of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyl dimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide, and the like; tertiary phosphines such as triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkyl alkoxyphenyl) phosphine, tris (dialkylphenyl) phosphine, tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine; phosphine compounds such as complexes of the tertiary phosphine and organoboron compounds; a compound having intramolecular polarization, which is obtained by adding the tertiary phosphine or the phosphine compound to a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or a compound having pi bond such as diazophenylmethane; a compound having an intramolecular polarization obtained by a dehydrohalogenation step after reacting the tertiary phosphine or the phosphine compound with a halogenated phenol compound such as 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2, 6-dimethylphenol, 4-bromo-3, 5-dimethylphenol, 4-bromo-2, 6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4' -hydroxybiphenyl and the like; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-substituted phosphonium and tetra-substituted borate in which a phenyl group bonded to a boron atom is not present such as tetra-p-tolylborate; salts of tetraphenylphosphonium with phenolic compounds; salts of partial hydrolysates of tetraalkylphosphonium and aromatic carboxylic anhydrides, and the like.
When the sealing resin composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass, relative to 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). If the amount of the curing accelerator is 0.1 part by mass or more relative to 100 parts by mass of the resin component, the curing tends to be performed satisfactorily in a short time. If the amount of the curing accelerator is 30 parts by mass or less relative to 100 parts by mass of the resin component, the curing speed will not be too high, and a good molded article will tend to be obtained.
(inorganic filler)
In the sealing resin composition of the present disclosure, the inorganic filler is contained in an average particle diameter of 5 μm to 100 μm. The average particle diameter of the inorganic filler is 5 μm or more, preferably 8 μm or more, more preferably 10 μm or more, from the viewpoint of reducing the amount of surface hydroxyl groups per unit amount and consequently suppressing the dielectric loss tangent of the cured product to be low. The average particle diameter of the inorganic filler is 100 μm or less, preferably 50 μm or less, more preferably 20 μm or less, from the viewpoint of improving the filling property of the sealing resin composition.
The average particle diameter of the inorganic filler is the following value: in an image obtained by photographing a sheet sample of the sealing resin composition or a cured product thereof by a scanning electron microscope, the long diameters of 100 randomly selected inorganic fillers were measured, and the arithmetic average was performed to obtain a value.
The kind of the inorganic filler is not particularly limited. Specifically, examples thereof include inorganic materials such as fused silica, crystalline silica, glass, alumina, talc, clay, and mica. An inorganic filler having a flame retardant effect may also be used. Examples of the inorganic filler having a flame retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, and composite hydroxide of magnesium and zinc, zinc borate, and the like.
Among the inorganic fillers, silica such as fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The inorganic filler may be used alone or in combination of at least 2 kinds. Examples of the form of the inorganic filler include powder, beads obtained by spheroidizing the powder, and fibers.
The content of the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoint of fluidity and strength, the total amount of the sealing resin composition is preferably 30 to 90% by volume, more preferably 35 to 80% by volume, and even more preferably 40 to 70% by volume. If the content of the inorganic filler is 30% by volume or more of the entire sealing resin composition, the thermal expansion coefficient, thermal conductivity, elastic modulus, and other properties of the cured product tend to be further improved. If the content of the inorganic filler is 90% by volume or less of the entire sealing resin composition, the viscosity of the sealing resin composition is prevented from rising, and the fluidity is further improved, so that the moldability tends to be further improved.
[ various additives ]
The sealing resin composition may contain various additives such as a coupling agent, an ion exchanger, a release agent, a flame retardant, and a colorant, which are exemplified below, in addition to the above components. The sealing resin composition may contain various additives known in the art, as required, in addition to the additives exemplified below.
(coupling agent)
The sealing resin composition may contain a coupling agent. The sealing resin composition preferably contains a coupling agent from the viewpoint of improving the adhesion between the resin component and the inorganic filler. Examples of the coupling agent include: known coupling agents such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, disilazane and other silane compounds, titanium compounds, aluminum chelate compounds, aluminum/zirconium compounds and the like.
When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, more preferably 0.1 to 2.5 parts by mass, based on 100 parts by mass of the inorganic filler. If the amount of the coupling agent is 0.05 parts by mass or more relative to 100 parts by mass of the inorganic filler, the adhesion to the frame tends to be further improved. If the amount of the coupling agent is 5 parts by mass or less relative to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
(ion exchanger)
The sealing resin composition may contain an ion exchanger. The sealing resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and the high-temperature storage characteristics of the electronic component device including the element to be sealed. The ion exchanger is not particularly limited, and conventionally known ion exchangers can be used. Specifically, a hydrotalcite compound, an aqueous oxide of at least 1 element selected from magnesium, aluminum, titanium, zirconium and bismuth, and the like can be cited. The ion exchanger may be used alone or in combination of at least 2 kinds. Among them, hydrotalcite represented by the following general formula (a) is preferable.
Mg (1-X) Al X (OH) 2 (CO 3 ) X/2 ·mH 2 O……(A)
(0<X is less than or equal to 0.5, m is a positive number)
When the sealing resin composition contains an ion exchanger, the content thereof is not particularly limited as long as it is a sufficient amount for capturing halogen ion plasma. For example, the amount of the epoxy resin curing agent is preferably 0.1 to 30 parts by mass, more preferably 1 to 10 parts by mass, based on 100 parts by mass of the resin component (total amount of the epoxy resin curing agents).
(Release agent)
The sealing resin composition may contain a release agent from the viewpoint of obtaining good releasability from a mold during molding. The release agent is not particularly limited, and conventionally known release agents can be used. Specifically, examples thereof include higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as oxidized polyethylene and nonoxidized polyethylene. The release agent may be used alone or in combination of 1 or more than 2.
When the sealing resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, relative to 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). If the amount of the release agent is 0.01 parts by mass or more relative to 100 parts by mass of the resin component, releasability tends to be sufficiently obtained. If the amount is 10 parts by mass or less, better adhesion tends to be obtained.
(flame retardant)
The sealing resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specifically, there may be mentioned: organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, metal hydroxides, and the like. The flame retardant may be used alone or in combination of at least 2.
When the sealing resin composition contains a flame retardant, the amount thereof is not particularly limited as long as it is a sufficient amount to obtain a desired flame retardant effect. For example, the amount of the epoxy resin is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, based on 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).
(colorant)
The sealing resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead oxide, and iron oxide. The content of the colorant may be appropriately selected depending on the purpose and the like. The colorant may be used alone or in combination of at least 2.
(Process for producing sealing resin composition)
The method for producing the resin composition for sealing is not particularly limited. As a general method, there is mentioned: the method comprises sufficiently mixing the components in a predetermined amount by a mixer or the like, and then melt-kneading, cooling and pulverizing the mixture by a grinding roll, an extruder or the like. More specifically, examples thereof include: the above components are uniformly stirred and mixed in predetermined amounts, and kneaded, cooled and pulverized by a kneader, a roll, an extruder or the like preheated to 70 to 140 ℃.
The sealing resin composition is preferably solid at ordinary temperature and pressure (e.g., 25 ℃ C. At atmospheric pressure). The shape of the sealing resin composition when it is solid is not particularly limited, and examples thereof include powder, granule, sheet and the like. From the viewpoint of handling properties, the size and quality of the sealing resin composition in the form of a sheet are preferably such that they meet the molding conditions of the package.
< electronic component device >
An electronic component device according to one embodiment of the present disclosure includes a support member, an element disposed on the support member, and a cured product of the sealing resin composition of the present disclosure for sealing the element.
Examples of the electronic component device include: a device in which an element portion obtained by mounting an element (an active element such as a semiconductor chip, a transistor, a diode, a thyristor, or the like, a passive element such as a capacitor, a resistor, or a coil, or the like) on a support member such as a lead frame, a tape carrier after wiring, a wiring board, glass, a silicon wafer, or an organic substrate is sealed with a sealing resin composition.
More specifically, there may be mentioned: typical resin-sealed ICs such as DIP (Dual Inline Package: dual in-line package), PLCC (Plastic Leaded Chip Carrier: leaded plastic chip carrier), QFP (Quad Flat Package: quad flat package), SOP (Small Outline Package: small Outline package), SOJ (Small Outline J-lead package), TSOP (Thin Small Outline Package: thin Small Outline package), TQFP (Thin Quad Flat Package: thin quad flat package) and the like have a structure in which a device is fixed to a lead frame, a terminal portion of a device such as a bonding pad is connected to a lead portion by wire bonding, bumps or the like, and then the device is sealed by transfer molding or the like using a sealing resin composition; TCP (Tape Carrier Package: tape carrier package) having a structure in which an element connected to a tape carrier via a bump is sealed with a sealing resin composition; COB (Chip On Board) modules, hybrid ICs, multi-Chip modules, and the like, which have a structure in which an element connected to a wiring formed On a support member by wire bonding, flip-Chip bonding, solder, or the like is sealed with a sealing resin composition; BGA (Ball Grid Array) package, CSP (Chip Size Package: chip size package), MCP (Multi Chip Package: multi-chip package) having a structure in which an element is mounted on a surface of a support member having a terminal for wiring board connection formed on a back surface thereof, the element is connected to a wiring formed on the support member by bump or wire bonding, and then the element is sealed with a sealing resin composition; etc. In addition, the sealing resin composition can be suitably used for a printed wiring board.
< method for manufacturing electronic component device >
The manufacturing method of the electronic component device of the present disclosure includes: a step of disposing the element on a support member, and a step of sealing the element with the sealing resin composition of the present disclosure.
The method for carrying out each step is not particularly limited, and may be carried out by a usual method. The type of the support member and the element used in the manufacture of the electronic component device is not particularly limited, and a support member and an element commonly used in the manufacture of the electronic component device can be used.
As a method of sealing an element using the sealing resin composition of the present disclosure, a low pressure transfer molding method, an injection molding method, a compression molding method, and the like can be given. Among them, the low pressure transfer molding method is common.
Examples
The above embodiments are specifically described below by way of examples, but the scope of the above embodiments is not limited to these examples.
< preparation of sealing resin composition >
The following components were mixed in the mixing ratios shown in table 1 to prepare sealing resin compositions of examples and comparative examples. The sealing resin composition is solid at normal temperature and pressure.
Epoxy resin 1: biphenyl aralkyl type epoxy resin, epoxy equivalent 274g/eq (Japanese chemical Co., ltd., trade name "NC-3000")
Epoxy resin 2: dicyclopentadiene type epoxy resin, 258g/eq of epoxy equivalent (DIC Co., ltd., trade name "HP-7200")
Epoxy resin 3: triphenylmethane type epoxy resin, 167g/eq of epoxy equivalent (Mitsubishi Chemical Co., ltd., trade name "1032H 60")
Epoxy resin 4: biphenyl type epoxy resin, epoxy equivalent 192g/eq (Mitsubishi Chemical Co., ltd., trade name "YX-4000")
Active ester compound 1: DIC Co., ltd., trade name "EXB-8"
Phenol curing agent 1: phenol aralkyl resin, hydroxyl equivalent 175g/eq (Ming He Chemicals Co., ltd., trade name "MEH7800 SS")
Cure accelerator 1: triphenylphosphine/1, 4-benzoquinone adduct
Filler 1: fused silica (DENKA Co., ltd. "FB-870 FD")
Filler material 2: fused silica (Heshisen, co., ltd., "EUF-46V" trade name)
Filler material 3: fused silica (Heshisen, co., ltd., "MUF-2 BV")
Filler material 4: fused silica (Admatechs Co., ltd., "SO-25R")
Coupling agent 1: n-phenyl-3-aminopropyl trimethoxysilane (trade name "KBM-573" from Xinyue chemical industries, ltd.)
Coupling agent 2: 3-mercaptopropyl-trimethoxysilane (trade name "KBM-803" from Xinyue chemical industries, ltd.)
Mold release agent: montan acid ester wax (Clariant Japan Co., ltd., trade name "HW-E")
Coloring agent: carbon black (Mitsubishi Chemical Co., ltd., trade name "MA 600")
< evaluation of Property of sealing resin composition >
(average particle diameter of inorganic filler)
In an image obtained by photographing a sheet sample of the sealing resin composition by a scanning electron microscope, the long diameters (μm) of 100 inorganic fillers selected at random were measured and arithmetically averaged.
(spiral flow)
The sealing resin composition was molded using a spiral flow measuring die according to EMMI-1-66 at a die temperature of 180℃under a molding pressure of 6.9MPa for a curing time of 90 seconds, and a flow distance (cm) was obtained.
(relative permittivity and dielectric loss tangent)
The sealing resin composition was put into a vacuum hand press, molded at a mold temperature of 175℃under a molding pressure of 6.9MPa for a curing time of 600 seconds, and cured at 180℃for 6 hours to give a plate-shaped cured product (12.5 mm in the longitudinal direction, 25mm in the transverse direction, and 0.2mm in thickness). The plate-like cured product was used as a test piece, and the relative permittivity and dielectric loss tangent at about 60GHz were measured at a temperature of 25±3 ℃ using a dielectric constant measuring device (trade name "network analyzer N5227A", manufactured by Agilent Technologies).
(Water absorption)
The plate-like cured product immediately after the production was put into a pressure cooker retort test apparatus at 121 ℃/2.1 air pressure, taken out after 24 hours, and the rate of increase (%) with respect to the mass immediately before the input was determined.
TABLE 1
All documents, patent applications and technical standards described in the present specification are incorporated by reference to the same extent as if each document, patent application and technical standard were specifically and individually described, and are incorporated by reference to the same extent as if each document, patent application and technical standard was specifically and individually described.
Claims (7)
1. A sealing resin composition comprising an epoxy resin, a curing agent and silica particles,
the curing agent comprises an active ester compound,
the silica particles have an average particle diameter of 5 to 100 μm,
the sealing resin composition is in the form of powder, granule or tablet.
2. The sealing resin composition according to claim 1, wherein the active ester compound comprises at least one of an ester compound selected from the group consisting of a phenol ester compound, a thiophenol ester compound, an N-hydroxylamine ester compound and a heterocyclic hydroxyl compound.
3. The sealing resin composition according to claim 1 or 2, wherein the active ester compound contains at least one selected from the group consisting of an active ester compound containing a dicyclopentadiene type diphenol structure, an active ester compound containing an aromatic structure, an active ester compound containing an acetyl compound of phenol novolac, and an active ester compound containing a benzoyl compound of phenol novolac.
4. The sealing resin composition according to claim 1 or 2, wherein the content of the active ester compound relative to the total mass of the curing agent is 80 mass% or more.
5. A cured product of the sealing resin composition according to any one of claims 1 to 4, wherein the water absorption of the cured product, which is the mass increase rate obtained by a pressure cooker retort test under conditions of 121 ℃,2.1 atm and 24 hours, is 0% to 0.35%.
6. An electronic component device, comprising:
a support member;
an element disposed on the support member; and
a cured product of the sealing resin composition according to any one of claims 1 to 4, wherein the sealing resin composition seals the element.
7. A method of manufacturing an electronic component device, comprising:
a step of disposing the element on the support member; and
a process for sealing the element with the sealing resin composition according to any one of claims 1 to 4.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/036099 WO2020065872A1 (en) | 2018-09-27 | 2018-09-27 | Resin composition for encapsulation, electronic component device and method for manufacturing electronic component device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112771114A CN112771114A (en) | 2021-05-07 |
| CN112771114B true CN112771114B (en) | 2024-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201880098052.3A Active CN112771114B (en) | 2018-09-27 | 2018-09-27 | Sealing resin composition, electronic component device, and method for manufacturing electronic component device |
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| Country | Link |
|---|---|
| JP (2) | JP7272368B2 (en) |
| CN (1) | CN112771114B (en) |
| TW (1) | TWI816887B (en) |
| WO (1) | WO2020065872A1 (en) |
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|---|---|---|---|---|
| JP7460025B2 (en) | 2021-07-16 | 2024-04-02 | 住友ベークライト株式会社 | Resin composition for semiconductor encapsulation and semiconductor device |
| WO2023112281A1 (en) * | 2021-12-16 | 2023-06-22 | 株式会社アドマテックス | Filler for electronic materials and method for producing same, slurry for electronic materials, and resin composition for electronic materials |
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| JP2014009232A (en) * | 2012-06-27 | 2014-01-20 | Hitachi Chemical Co Ltd | Encapsulation epoxy resin molding material and electronic part device |
| JP2015007147A (en) * | 2013-06-24 | 2015-01-15 | 日立化成株式会社 | Element sealing epoxy resin molding material and electronic part device |
| CN104292749A (en) * | 2013-07-19 | 2015-01-21 | 味之素株式会社 | Resin composition |
| CN105440582A (en) * | 2011-05-13 | 2016-03-30 | 日立化成株式会社 | Use of epoxy resin molding material as sealing material |
| CN106085316A (en) * | 2011-01-06 | 2016-11-09 | 日立化成工业株式会社 | Encapsulating epoxy resin composition and electronic part apparatus |
| CN107924886A (en) * | 2015-09-02 | 2018-04-17 | 日立化成株式会社 | Resin combination, solidfied material, film for sealing and seal structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4760010B2 (en) * | 2004-12-22 | 2011-08-31 | 三菱化学株式会社 | Polyether polyol resin, curable resin composition and cured product thereof |
| JP5569215B2 (en) * | 2010-07-26 | 2014-08-13 | 三菱化学株式会社 | Method for producing highly flexible resin |
| JP2012211269A (en) * | 2011-03-31 | 2012-11-01 | Sekisui Chem Co Ltd | Precured product, roughened precured product and laminate |
| TWI694109B (en) * | 2013-06-12 | 2020-05-21 | 日商味之素股份有限公司 | Resin composition |
| JP6497125B2 (en) * | 2015-02-25 | 2019-04-10 | Dic株式会社 | Polyarylene ether resin, production method of polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, semiconductor device, prepreg, printed circuit board, buildup film, buildup board |
| CN109983052B (en) * | 2016-11-18 | 2021-07-23 | 昭和电工材料株式会社 | Sealing film, cured product thereof, and electronic device |
-
2018
- 2018-09-27 JP JP2020547758A patent/JP7272368B2/en active Active
- 2018-09-27 CN CN201880098052.3A patent/CN112771114B/en active Active
- 2018-09-27 WO PCT/JP2018/036099 patent/WO2020065872A1/en active Application Filing
-
2019
- 2019-09-25 TW TW108134503A patent/TWI816887B/en active
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2023
- 2023-04-26 JP JP2023072567A patent/JP2023100761A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085316A (en) * | 2011-01-06 | 2016-11-09 | 日立化成工业株式会社 | Encapsulating epoxy resin composition and electronic part apparatus |
| CN105440582A (en) * | 2011-05-13 | 2016-03-30 | 日立化成株式会社 | Use of epoxy resin molding material as sealing material |
| JP2014009232A (en) * | 2012-06-27 | 2014-01-20 | Hitachi Chemical Co Ltd | Encapsulation epoxy resin molding material and electronic part device |
| JP2015007147A (en) * | 2013-06-24 | 2015-01-15 | 日立化成株式会社 | Element sealing epoxy resin molding material and electronic part device |
| CN104292749A (en) * | 2013-07-19 | 2015-01-21 | 味之素株式会社 | Resin composition |
| CN107924886A (en) * | 2015-09-02 | 2018-04-17 | 日立化成株式会社 | Resin combination, solidfied material, film for sealing and seal structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7272368B2 (en) | 2023-05-12 |
| TWI816887B (en) | 2023-10-01 |
| CN112771114A (en) | 2021-05-07 |
| JPWO2020065872A1 (en) | 2021-08-30 |
| WO2020065872A1 (en) | 2020-04-02 |
| TW202024167A (en) | 2020-07-01 |
| JP2023100761A (en) | 2023-07-19 |
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