CN112770556A - High-integration-level DSP (digital signal processor) automobile power amplifier - Google Patents
High-integration-level DSP (digital signal processor) automobile power amplifier Download PDFInfo
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- CN112770556A CN112770556A CN202011297478.7A CN202011297478A CN112770556A CN 112770556 A CN112770556 A CN 112770556A CN 202011297478 A CN202011297478 A CN 202011297478A CN 112770556 A CN112770556 A CN 112770556A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a high-integration-level DSP (digital signal processor) automobile power amplifier, and relates to the field of automobile power amplifiers. The high-integration DSP automobile power amplifier comprises a shell, a circuit board and a DSP chip, wherein the shell is also provided with a data interface and a power interface, and the data interface and the power interface are respectively in conductive connection with the circuit board; the shell is provided with a plurality of heat dissipation holes, and heat dissipation baffles are movably arranged on the shell corresponding to the plurality of heat dissipation holes and have a closed state for shielding the heat dissipation holes and a heat dissipation state far away from the heat dissipation holes; the circuit board is also provided with a temperature detection element and a control element, the temperature detection element is electrically connected with the control element, and the temperature detection element is used for detecting the internal temperature of the shell and sending a temperature detection signal to the control element; the driving structure is connected between the radiating baffle and the shell, the driving structure is in conductive connection with the control element, and the control element is used for controlling the driving structure to work when the detected temperature reaches a set temperature so as to drive the radiating baffle to be adjusted from a closed state to a radiating state.
Description
Technical Field
The invention relates to the technical field of automobile power amplifiers, in particular to a high-integration-level DSP automobile power amplifier.
Background
The automobile power amplifier, also called as an automobile sound power amplifier, is used for amplifying a weak electric signal emitted by a signal source so as to drive a loudspeaker to produce sound. And DSP car power amplifier increases the design and has the DSP chip, can carry out the adaptability increase and decrease to the frequency that the environment caused in the car to the effect of sound broadcast has been improved.
The DSP automobile power amplifier integrates more electronic elements, so that the power and the heat productivity of the DSP automobile power amplifier are larger, and the heat radiation performance influences the stability of the whole power amplifier. If the utility model discloses a chinese utility model patent with an authorization notice number CN209002225U and an authorization notice date 2019.06.18 discloses an automobile DSP power amplifier, and specifically discloses that the automobile DSP power amplifier comprises an power amplifier housing, a circuit board is installed in the power amplifier housing, the power amplifier housing is formed by assembling a heat dissipation bottom shell, a cover plate, a left side plate and a right side plate, an input port is arranged on the left side plate, an output port is arranged on the right side plate, the heat dissipation bottom shell is integrally formed by a bottom plate, a front side plate and a rear side plate, and a plurality of elastic clamping components for elastically clamping heating elements on the circuit board are installed on the front side plate and the rear side plate; the elastic clamping assembly comprises a substrate and an elastic sheet arranged on the substrate, and the substrate is fixed on the heat dissipation bottom shell through a bolt.
The heat radiation structure design of car DSP power amplifier among the prior art is: the heat of the heating element is transferred to the substrate through the elastic sheet, then transferred to the corresponding side plate through the substrate, and finally dissipated through the heat dissipation bottom shell. However, the efficiency of radiating heat outwards only by using the bottom shell of the DSP power amplifier is low, and the heat generated inside the shell is easily accumulated to cause a high temperature problem.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a highly integrated DSP power amplifier for an automobile, so as to solve the problems that the efficiency of dissipating heat outwards only by using a bottom case of the DSP power amplifier is low, and heat generated inside the case is easily accumulated to cause high temperature.
The technical scheme of the high-integration-level DSP automobile power amplifier comprises the following steps:
the high-integration DSP automobile power amplifier comprises a shell, a circuit board and a DSP chip, wherein the circuit board and the DSP chip are installed in the shell;
the shell is provided with a plurality of heat dissipation holes, heat dissipation baffles are movably arranged at the positions, corresponding to the plurality of heat dissipation holes, of the shell, and the heat dissipation baffles have a closed state for shielding the heat dissipation holes and a heat dissipation state far away from the heat dissipation holes;
the circuit board is also provided with a temperature detection element and a control element, the temperature detection element is electrically connected with the control element, and the temperature detection element is used for detecting the internal temperature of the shell and sending a temperature detection signal to the control element;
the driving structure is connected between the heat dissipation baffle and the casing, the driving structure is in conductive connection with the control element, and the control element is used for controlling the driving structure to work when the detection temperature reaches a set temperature so as to drive the heat dissipation baffle to be adjusted from a closed state to a heat dissipation state.
Furthermore, the casing is cuboid, the data interface and the power interface are arranged on the front side wall of the casing, and the radiating holes are formed in the left side wall and/or the right side wall of the casing.
Furthermore, a plurality of first heat dissipation holes are formed in the left side wall of the casing and are arranged at intervals along the length direction of the casing; a plurality of second heat dissipation holes are formed in the right side wall of the machine shell, and the second heat dissipation holes are arranged at intervals along the length direction of the machine shell.
Further, the first heat dissipation hole and the second heat dissipation hole are both long holes, and the long holes extend along the height direction of the machine shell.
Furthermore, the heat dissipation baffle is movably installed in the casing along the length direction of the casing, a plurality of ventilation holes are formed in the heat dissipation baffle, and the ventilation holes correspond to the heat dissipation holes respectively.
Further, remove in the casing and install the U-shaped frid that falls, the U-shaped frid that falls includes horizontal segment and two vertical sections, two vertical section is laminated respectively and is installed on the left side wall and the right side wall of casing, two the ventilation hole has been seted up in the vertical section, two vertical sections of the U-shaped frid constitute respectively thermal baffle.
Furthermore, the driving structure is a gear and rack mechanism, the gear and rack mechanism comprises a micro motor, a rack and a gear, the micro motor is fixedly connected in the casing, the micro motor is in rotation stopping connection with the gear, the rack extends along the length direction of the casing and is fixed on the inverted U-shaped slotted plate, and the gear is in meshing fit with the rack;
or, the driving structure is a screw-nut mechanism, the screw-nut mechanism includes a micro motor, a screw and a nut, the micro motor is fixedly connected in the casing, the micro motor is connected with the screw in a transmission manner, the screw extends along the length direction of the casing, the screw is in threaded fit with the nut, and the nut is fixedly connected on the inverted U-shaped groove plate.
Furthermore, guide grooves are formed in the lower portions of the left side wall and the right side wall of the machine shell, and the lower edges of the two vertical sections of the inverted U-shaped groove plate are slidably mounted in the guide grooves.
Further, the inboard of the left side wall and the right side wall of casing still is equipped with dustproof the pad, heat radiation baffle with dustproof the pad removes the laminating and arranges.
Further, the temperature detection element is an infrared temperature sensor or a thermal resistance temperature sensor.
Has the advantages that: the high-integration-level DSP automobile power amplifier adopts the structural design that the heat dissipation holes are formed in the casing, and the heat dissipation baffles are movably arranged at the corresponding heat dissipation holes, when the power amplifier is not in operation, internal electronic elements do not generate heat, the heat dissipation baffles are in a closed state of shielding the heat dissipation holes, dust or sundries in external air are prevented from entering the inside of the casing through the heat dissipation baffles, and the working stability of the whole machine is guaranteed against being influenced by the external environment; when the power amplifier during operation, but the inside temperature of temperature detect element real-time detection casing, heat up along with electronic component's the generating heat, the inside heat of casing piles up gradually and leads to the temperature to rise, when the temperature that detects if the temperature detect element reaches the settlement temperature, then by control element control drive structure start-up work, make heat radiation baffle adjust to the radiating state by the encapsulated situation under drive structure's drive, heat radiation baffle is in the position of keeping away from the louvre promptly, thereby communicate the inside with the casing with the external world, be convenient for inside heat outwards gives off through gas flow fast, the air current heat dissipation is compared in the radiating efficiency of drain pan higher, prevent the inside high temperature problem that appears of casing.
Drawings
Fig. 1 is a schematic perspective view of an internal structure of a high-integration-level DSP car power amplifier in embodiment 1 of the high-integration-level DSP car power amplifier of the present invention;
fig. 2 is a schematic cross-sectional view of a high-integration-level DSP car power amplifier in embodiment 1 of the high-integration-level DSP car power amplifier of the present invention;
fig. 3 is a schematic perspective view of an inverted U-shaped slot plate in the embodiment 1 of the highly integrated DSP car power amplifier of the present invention;
fig. 4 is a control schematic diagram between a control element and a rack and pinion mechanism in embodiment 1 of the highly integrated DSP car power amplifier of the present invention.
In the figure: 1-machine shell, 11-front side wall of machine shell, 12-rear side wall of machine shell, 13-left side wall of machine shell, 130-first radiating hole, 14-right side wall of machine shell, 140-second radiating hole, 15-data interface, 16-power interface, 17-guide groove, 18-dustproof pad, 2-circuit board, 20-DSP chip, 21-infrared temperature sensor, 22-control element, 3-inverted U-shaped groove plate, 30-radiating baffle, 300-vent hole, 31-horizontal section, 4-gear rack mechanism, 40-micro motor, 41-rack and 42-gear.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In embodiment 1 of the high-integration-level DSP car power amplifier of the present invention, as shown in fig. 1 to 4, the high-integration-level DSP car power amplifier includes a casing 1, a circuit board 2 and a DSP chip 20 installed in the casing 1, the casing 1 is further provided with a data interface 15 and a power interface 16, and the data interface 15 and the power interface 16 are respectively electrically connected to the circuit board 2; the casing 1 is provided with a plurality of heat dissipation holes, the heat dissipation baffle 30 is movably mounted at the position corresponding to the heat dissipation holes on the casing 1, and the heat dissipation baffle 30 has a closed state for shielding the heat dissipation holes and a heat dissipation state for keeping away from the heat dissipation holes.
The circuit board 2 is further provided with a temperature detection element and a control element 22, the temperature detection element is electrically connected with the control element 22, and the temperature detection element is used for detecting the internal temperature of the casing 1 and sending a temperature detection signal to the control element 22; a driving structure is connected between the heat dissipation baffle 30 and the enclosure 1, the driving structure is electrically connected with the control element 22, and the control element 22 is used for controlling the driving structure to work when the detected temperature reaches a set temperature, so as to drive the heat dissipation baffle 30 to be adjusted from a closed state to a heat dissipation state.
The high-integration-level DSP automobile power amplifier adopts the structural design that the radiating holes are formed in the casing 1, and the radiating baffle 30 is movably arranged at the corresponding radiating holes, when the power amplifier does not work, internal electronic elements do not generate heat, the radiating baffle 30 is in a closed state of shielding the radiating holes, dust or sundries in external air are prevented from entering the casing 1 through the radiating baffle 30, and the working stability of the whole machine is ensured not to be influenced by the external environment; when the power amplifier during operation, but the inside temperature of temperature detect element real-time detection casing 1, heat up along with electronic component's the generating heat, the heat of casing 1 inside piles up gradually and leads to the temperature to rise, if the temperature that temperature detect element detected reaches when setting for the temperature, then control drive structure start-up work by controlling element 22, make heat radiation baffle 30 adjust to the radiating state by the encapsulated situation under drive structure's drive, heat radiation baffle 30 is in the position of keeping away from the louvre promptly, thereby with external and casing 1's inside intercommunication, it gives off to outside fast through the gas flow to be convenient for inside heat, the air current heat dissipation is compared in the radiating efficiency of drain pan higher, prevent the inside high temperature problem that appears of casing 1.
In this embodiment, the casing 1 is rectangular, the periphery of the casing 1 is a front side wall, a rear side wall, a left side wall and a right side wall, respectively, the data interface 15 and the power interface 16 are disposed on the front side wall 11 of the casing, and the heat dissipation holes are disposed on the left side wall 13 of the casing and/or the right side wall 14 of the casing. Defining the length direction of the casing 1 as the front-back direction, specifically, a plurality of first heat dissipation holes 130 are formed in the left side wall 13 of the casing, and the plurality of first heat dissipation holes 130 are arranged at intervals along the length direction of the casing 1; the right side wall 15 of the housing is provided with a plurality of second heat dissipating holes 140, and the plurality of second heat dissipating holes 140 are arranged at intervals along the length direction of the housing 1.
A first heat dissipation hole 130 is opened on the left side wall 13 of the casing, a second heat dissipation hole 140 is opened on the right side wall 14 of the casing, and the first heat dissipation hole 130 and the second heat dissipation hole 140 are arranged on the opposite side walls of the casing 1. When the heat dissipation baffle 30 is in a heat dissipation state, the first heat dissipation hole 130 and the second heat dissipation hole 140 are communicated to form a convection channel, so that heat inside the casing 1 can be diffused outwards quickly, and external air enters the casing 1 to effectively reduce the internal temperature. Moreover, the first heat dissipation hole 130 and the second heat dissipation hole 140 are both elongated holes, and the elongated holes extend along the height direction of the casing 1. The radiating holes are designed into the elongated holes, so that the sectional area of gas circulation is increased, and the radiating efficiency is higher.
Wherein, heat baffle 30 moves along the length direction of casing 1 and installs in casing 1, has seted up a plurality of ventilation holes 300 on heat baffle 30, and a plurality of ventilation holes 300 correspond with the louvre respectively. Specifically, remove in casing 1 and install inverted U-shaped frid 3, inverted U-shaped frid 3 includes horizontal segment 31 and two vertical sections, and two vertical sections are laminated respectively and are installed on the left side wall 13 of casing and the right side wall 14 of casing, have seted up ventilation hole 300 on two vertical sections, and two vertical sections of inverted U-shaped frid 3 constitute heat shield 30 respectively. The two vertical sections of the inverted U-shaped groove plate 3 are used for forming the heat dissipation baffles 30 respectively, so that the internal structure of the power amplifier is simplified, and the two heat dissipation baffles 30 are controlled to be opened or closed synchronously.
In this embodiment, the driving structure is a rack and pinion mechanism 4, the rack and pinion mechanism 4 includes a micro motor 40, a rack 41 and a gear 42, the micro motor 40 is fixedly connected in the casing 1, the micro motor 40 is connected with the gear 42 in a rotation stopping manner, the rack 41 extends along the length direction of the casing 1 and is fixed on the inverted U-shaped slot plate 3, and the gear 42 is engaged with the rack 41. It should be noted that the micro motor 40 is fixedly connected to the rear side wall 12 of the housing, the rack 41 is fixedly connected to the horizontal section 31 of the inverted U-shaped slot plate 3, and the micro motor 40 drives the gear 42 to rotate when operating, so that the purpose of driving the inverted U-shaped slot plate 3 to move is achieved through the meshing cooperation of the gear 42 and the rack 41.
In addition, a travel switch (not shown in the figure) is further disposed on the housing 1, the travel switch is electrically connected to the control element 22, when the heat dissipation baffle 30 moves to the heat dissipation state, the inverted U-shaped slot plate 3 just triggers the travel switch, and the control element 22 immediately controls the inverted U-shaped slot plate 3 to stop moving after receiving a power-off signal of the travel switch, so as to ensure that the heat dissipation baffle 30 can accurately reach and maintain the heat dissipation state. Specifically, the control element 22 is a single chip microcomputer.
In order to improve the moving accuracy of the inverted U-shaped groove plate 3, guide grooves 17 are provided at lower portions of the left side wall 13 and the right side wall 14 of the cabinet, and lower edges of two heat dissipation baffles 30 of the inverted U-shaped groove plate 3 are slidably fitted in the guide grooves 17. And, still be equipped with dustproof pad 18 in the inboard of left side wall 13 of casing and the right side wall 14 of casing, heat baffle 30 and dustproof pad 18 move the laminating and arrange, utilize the dustproof pad 18 of clamp between casing 1 and heat baffle 30, can effectively eliminate the gap of removing between the two and stop the dust to get into the inside problem of casing 1. The temperature detection element is an infrared temperature sensor 21, and the temperature inside the housing 1 is detected in real time by the infrared temperature sensor 21. In other embodiments, in order to meet different use requirements, the infrared temperature sensor can be replaced by a thermal resistance temperature sensor, and the purpose of detecting the internal temperature in real time can be achieved.
In order to meet different use requirements, the driving structure of the high-integration-level DSP automobile power amplifier of the invention can be not only limited to the rack and pinion mechanism in embodiment 1, but also can be a screw nut mechanism, the screw nut mechanism comprises a micro motor, a screw rod and a nut, the micro motor is fixedly connected in a shell, the micro motor is in transmission connection with the screw rod, the screw rod extends along the length direction of the shell, the screw rod is in threaded fit with the nut, and the nut is fixedly connected on the inverted U-shaped groove plate. The micro motor is utilized to work to drive the screw rod to rotate, and the purpose of driving the inverted U-shaped groove plate to move is achieved through the threaded fit of the screw rod and the nut.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A high-integration-level DSP (digital signal processor) automobile power amplifier is characterized by comprising a shell, a circuit board and a DSP chip, wherein the circuit board and the DSP chip are installed in the shell;
the shell is provided with a plurality of heat dissipation holes, heat dissipation baffles are movably arranged at the positions, corresponding to the plurality of heat dissipation holes, of the shell, and the heat dissipation baffles have a closed state for shielding the heat dissipation holes and a heat dissipation state far away from the heat dissipation holes;
the circuit board is also provided with a temperature detection element and a control element, the temperature detection element is electrically connected with the control element, and the temperature detection element is used for detecting the internal temperature of the shell and sending a temperature detection signal to the control element;
the driving structure is connected between the heat dissipation baffle and the casing, the driving structure is in conductive connection with the control element, and the control element is used for controlling the driving structure to work when the detection temperature reaches a set temperature so as to drive the heat dissipation baffle to be adjusted from a closed state to a heat dissipation state.
2. The highly integrated DSP car power amplifier of claim 1, wherein the casing is shaped as a rectangular parallelepiped, the data interface and the power interface are disposed on a front sidewall of the casing, and the heat dissipation holes are disposed on a left sidewall and/or a right sidewall of the casing.
3. The highly integrated DSP automobile power amplifier of claim 2, characterized in that a plurality of first heat dissipation holes are opened on the left side wall of the case, and the plurality of first heat dissipation holes are arranged at intervals along the length direction of the case; a plurality of second heat dissipation holes are formed in the right side wall of the machine shell, and the second heat dissipation holes are arranged at intervals along the length direction of the machine shell.
4. The highly integrated DSP car power amplifier of claim 3, wherein the first heat dissipation hole and the second heat dissipation hole are both elongated holes, and the elongated holes extend along the height direction of the enclosure.
5. The highly integrated DSP car power amplifier of claim 1, wherein the heat dissipation baffle is movably installed in the housing along the length direction of the housing, the heat dissipation baffle is opened with a plurality of ventilation holes, and the plurality of ventilation holes correspond to the heat dissipation holes respectively.
6. The highly integrated DSP car power amplifier of claim 1, characterized in that an inverted U-shaped slot plate is movably installed in the housing, the inverted U-shaped slot plate comprises a horizontal section and two vertical sections, the two vertical sections are respectively attached to the left side wall and the right side wall of the housing, the two vertical sections are provided with ventilation holes, and the two vertical sections of the inverted U-shaped slot plate respectively constitute the heat dissipation baffle.
7. The highly integrated DSP automobile power amplifier of claim 6, wherein the driving structure is a rack and pinion mechanism, the rack and pinion mechanism comprises a micro motor, a rack and a gear, the micro motor is fixedly connected in the casing, the micro motor is connected with the gear in a rotation stopping manner, the rack extends along the length direction of the casing and is fixed on the inverted U-shaped slot plate, and the gear is engaged with the rack;
or, the driving structure is a screw-nut mechanism, the screw-nut mechanism includes a micro motor, a screw and a nut, the micro motor is fixedly connected in the casing, the micro motor is connected with the screw in a transmission manner, the screw extends along the length direction of the casing, the screw is in threaded fit with the nut, and the nut is fixedly connected on the inverted U-shaped groove plate.
8. The highly integrated DSP car power amplifier of claim 6, wherein the lower portions of the left and right side walls of the case are provided with guide grooves in which the lower edges of the two vertical sections of the inverted U-shaped channel plate are slidably installed.
9. The highly integrated DSP automobile power amplifier of claim 2, characterized in that the inner side of the left and right side walls of the casing is further provided with a dustproof pad, and the heat dissipation baffle is movably attached to the dustproof pad.
10. The highly integrated DSP car power amplifier of claim 1, wherein the temperature detecting element is an infrared temperature sensor or a thermal resistance temperature sensor.
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| CN202011297478.7A CN112770556A (en) | 2020-11-18 | 2020-11-18 | High-integration-level DSP (digital signal processor) automobile power amplifier |
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| CN202011297478.7A CN112770556A (en) | 2020-11-18 | 2020-11-18 | High-integration-level DSP (digital signal processor) automobile power amplifier |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114362669A (en) * | 2021-12-14 | 2022-04-15 | 江苏海天微电子股份有限公司 | Assembled photovoltaic terminal box of controllable type of temperature rise |
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