CN112743865A - Edge sealing process of sawtooth-shaped wave-absorbing honeycomb sandwich plate - Google Patents
Edge sealing process of sawtooth-shaped wave-absorbing honeycomb sandwich plate Download PDFInfo
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- CN112743865A CN112743865A CN202011500180.1A CN202011500180A CN112743865A CN 112743865 A CN112743865 A CN 112743865A CN 202011500180 A CN202011500180 A CN 202011500180A CN 112743865 A CN112743865 A CN 112743865A
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- edge sealing
- honeycomb sandwich
- sandwich plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/0044—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping edges or extremities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a process for edge sealing of a sawtooth wave-absorbing honeycomb sandwich plate, belonging to the technical field of edge sealing of honeycomb sandwich plates and comprising the following steps: s1, processing to form a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size; s2, preparing a silicon rubber soft mold edge sealing tool with sawtooth-shaped edges and scaled sawteeth according to the theoretical size of the sawteeth and by combining the thermal expansion coefficient of silicon rubber; s3, sticking demoulding cloth with glue and paving an edge sealing glue film on the surface of a sawtooth of the edge sealing tool of the silicon rubber soft mould; s4, inserting the sawteeth of the edge sealing tool for the silicon rubber soft die into the sawteeth of the sawtooth-shaped wave-absorbing honeycomb sandwich plate; s5, packaging a vacuum bag outside, vacuumizing and detecting leakage; and S6, demoulding after heating and curing to obtain a finished product of the sawtooth-shaped wave-absorbing honeycomb sandwich plate. The edge sealing size is effectively controlled, and the influence of the edge sealing adhesive film on the electric performance of the wave-absorbing honeycomb sandwich plate is reduced; the problem of when the banding face size is less, operating space is not enough is solved, fine assurance banding surface quality.
Description
Technical Field
The invention belongs to the technical field of edge sealing of honeycomb sandwich plates, and particularly relates to an edge sealing process of a sawtooth-shaped wave-absorbing honeycomb sandwich plate.
Background
The honeycomb sandwich plate is used as a light and high-strength composite material and is widely applied to the industries of aerospace, rail transit, ships, buildings and the like; in addition, part of the honeycomb sandwich plate also has excellent dielectric property, and can be applied to the manufacture of wave-absorbing components. In order to prevent the honeycomb sandwich panel from absorbing water and being affected by moisture, thereby affecting the performance and the service life of the honeycomb sandwich panel, the sealing edge is required to be protected.
Because of the wide application of honeycomb sandwich panels, the edge sealing process has been a research hotspot in the field. The existing edge sealing process comprises the steps that firstly, before a honeycomb sandwich panel is formed, a filling tool is used, foaming glue is used for filling honeycombs according to the required product appearance, and the theoretical appearance is machined after the honeycomb sandwich panel is formed; secondly, when the honeycomb sandwich panel is formed, the panel is bent to carry out edge sealing, and the edge sealing method is only suitable for edge sealing of right-angle edges, has limitation and poor later-period machinability; and thirdly, directly pasting an edge sealing adhesive film on the edge sealing surface after the honeycomb sandwich panel is formed, or mechanically milling off honeycombs (reserved panels) on the edge sealing surface, and filling powdery or pasty foaming glue for sealing the edges.
In the existing edge sealing process, when the edge of the honeycomb sandwich plate is in a sawtooth shape, the tooth space is only a few millimeters, the operation space is very narrow, and the influence on the electrical property of the honeycomb sandwich plate after edge sealing is required to be as small as possible, so that the existing edge sealing process loses effectiveness when the requirement on the edge sealing size is very strict. Therefore, a new edge sealing process needs to be developed to overcome the shortcomings of the existing edge sealing process.
Disclosure of Invention
The invention aims to provide a sealing process of a zigzag wave-absorbing honeycomb sandwich plate, which overcomes the defects of the existing sealing process and solves the sealing problem of the zigzag honeycomb sandwich plate.
In order to realize the purpose of the invention, the technical scheme is as follows: a technology for edge sealing of a zigzag wave-absorbing honeycomb sandwich plate comprises the following steps:
s1, processing to form a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size;
s2, according to the theoretical size of the sawteeth of the wave-absorbing honeycomb sandwich plate with the sawtooth shape, the theoretical size of the sawteeth is zoomed by combining the thermal expansion coefficient of the silicon rubber to obtain the zoom size of the sawteeth, and a silicon rubber soft mold edge sealing tool with the sawtooth shape at the edge and the zoom size of the sawteeth is prepared;
s3, sticking adhesive demolding cloth on the surface of a sawtooth of the edge sealing tool for the silicon rubber soft mold, and paving an edge sealing adhesive film on the surface of the adhesive demolding cloth;
s4, correspondingly inserting the sawteeth of the edge sealing tool for the silicon rubber soft die into the sawteeth of the sawtooth wave-absorbing honeycomb sandwich plate;
s5, packaging a vacuum bag outside the silicon rubber soft die edge sealing tool and the sawtooth-shaped wave-absorbing honeycomb sandwich plate, vacuumizing and detecting leakage;
and S6, demoulding after heating and curing, taking out the silicon rubber soft mould edge sealing tool, and finishing edge sealing to obtain a finished product of the zigzag wave-absorbing honeycomb sandwich plate.
As a further alternative, the S1 includes the steps of: s1-1, cutting a honeycomb with a proper size, and preparing the honeycomb material with the wave absorbing function through the working procedures of strengthening, soaking and drying in sequence; s1-2, bonding the honeycomb material and the prepreg to prepare the wave-absorbing honeycomb sandwich plate; and S1-3, machining the wave-absorbing honeycomb sandwich plate into a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size.
As a further alternative, in S1-2, two plate surfaces of the honeycomb material are bonded to the prepreg by using an adhesive film.
As a further alternative, before the step S4, the edge sealing tool for the soft silicone rubber mold is segmented according to actual conditions.
As a further alternative, in S4, the edge sealing tools of the soft silicon rubber molds are plugged into the saw teeth of the wave-absorbing honeycomb sandwich plate with an auxiliary tool.
The invention has the beneficial effects that: the size of the edge sealing tool of the silicon rubber soft die is scaled by utilizing the thermal expansion of the silicon rubber, so that the operation space is further increased; the edge sealing size is effectively controlled, and the influence of the edge sealing adhesive film on the electric performance of the wave-absorbing honeycomb sandwich plate is reduced; the flexibility of the edge sealing tool of the silicon rubber soft die is utilized, so that the problem that when the size of the edge sealing surface is small, the operation space is insufficient is solved; by adopting the edge sealing tool with the silicon rubber soft mold, the quality of the surface of the sealed edge is well ensured, and the workload in the later period is greatly reduced; the edge sealing tool for the silicone rubber soft mold is simple in manufacturing process, can be repeatedly used for multiple times, and can effectively reduce production cost; the edge sealing process is also suitable for edge sealing of honeycomb sandwich plates with other shapes, and has wider applicability compared with the existing edge sealing process.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it should be understood that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a process for manufacturing a wave-absorbing honeycomb sandwich plate in an edge sealing process of a zigzag wave-absorbing honeycomb sandwich plate provided by an embodiment of the invention;
fig. 2 is a schematic diagram of the content of S2 in the edge sealing process of the zigzag wave-absorbing honeycomb sandwich panel provided by the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention. It is to be understood that the drawings are provided solely for the purposes of reference and illustration and are not intended as a definition of the limits of the invention. The connection relationships shown in the drawings are for clarity of description only and do not limit the manner of connection.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention is further described with reference to the following figures and specific embodiments.
The invention provides a process for edge sealing of a zigzag wave-absorbing honeycomb sandwich plate, which comprises the following steps:
s1, processing to form a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size;
s2, according to the theoretical size of the sawteeth of the wave-absorbing honeycomb sandwich plate with the sawtooth shape, the theoretical size of the sawteeth is zoomed by combining the thermal expansion coefficient of the silicon rubber to obtain the zoom size of the sawteeth, and a silicon rubber soft mold edge sealing tool with the sawtooth shape at the edge and the zoom size of the sawteeth is prepared;
s3, sticking adhesive demolding cloth on the surface of a sawtooth of the edge sealing tool for the silicon rubber soft mold, and paving an edge sealing adhesive film on the surface of the adhesive demolding cloth;
s4, correspondingly inserting the sawteeth of the edge sealing tool for the silicon rubber soft die into the sawteeth of the sawtooth wave-absorbing honeycomb sandwich plate;
s5, packaging a vacuum bag outside the silicon rubber soft die edge sealing tool and the sawtooth-shaped wave-absorbing honeycomb sandwich plate, vacuumizing and detecting leakage;
and S6, demoulding after heating and curing, taking out the silicon rubber soft mould edge sealing tool, and finishing edge sealing to obtain a finished product of the zigzag wave-absorbing honeycomb sandwich plate.
The silicon rubber soft mold edge sealing tool with the copying edge is manufactured according to the theoretical appearance of the sawtooth-shaped wave-absorbing honeycomb sandwich plate, the figure 2 is shown, the size of the sawtooth of the silicon rubber soft mold edge sealing tool is zoomed compared with the theoretical size of the sawtooth-shaped wave-absorbing honeycomb sandwich plate, the specific zoomed size is determined according to the thermal expansion coefficient of a silicon rubber material, and the difference between the theoretical size and the thermal expansion amount is the zoomed size. The edge sealing tool for the silicon rubber soft mold is formed in one step by adopting a rubber vulcanization process.
Vacuumizing and applying negative pressure to enable the edge sealing tool of the silicon rubber soft die to be attached to the edge sealing adhesive film and the sawtooth-shaped wave-absorbing honeycomb sandwich plate more tightly. According to the curing parameters of the edge sealing adhesive film, curing is carried out, heating is carried out according to curing process conditions, the flowability of the edge sealing adhesive film becomes strong along with the temperature rise, and meanwhile, the edge sealing adhesive film is extruded by the thermal expansion of the silicon rubber soft die edge sealing tool and is attached to the sawtooth-shaped edge of the wave-absorbing honeycomb sandwich plate; as the cure is complete, the temperature drops, the product cools, and the silicone rubber rebounds and contracts.
The S1 includes the steps of: s1-1, cutting a honeycomb with a proper size, and preparing the honeycomb material with the wave absorbing function through the working procedures of strengthening, soaking and drying in sequence; s1-2, bonding the honeycomb material and the prepreg to prepare the wave-absorbing honeycomb sandwich plate; and S1-3, machining the wave-absorbing honeycomb sandwich plate into a sawtooth wave-absorbing honeycomb sandwich plate with theoretical size, namely forming a theoretical appearance, which is shown in figure 1. And in the step S1-2, two plate surfaces of the honeycomb material are glued with the prepreg by using glue films to form the wave-absorbing honeycomb sandwich plate.
Before S4, the edge sealing tool for the silicon rubber soft mold is segmented according to actual conditions, can be cut into multiple segments, facilitates subsequent operation, and avoids the problem that the edge sealing effect is affected due to too long operation, deformation and displacement of the tool and the like when the edge of the sawtooth-shaped wave-absorbing honeycomb sandwich plate is embedded. And in the step S4, the auxiliary tool is used for correspondingly inserting the edge sealing tools of the soft silicon rubber molds into the saw teeth of the wave-absorbing honeycomb sandwich plate respectively, so that the wave-absorbing honeycomb sandwich plate can be better operated by the aid of the auxiliary tool, and the efficiency is improved.
The invention is not limited to the above alternative embodiments, and any other various forms of products can be obtained by anyone in the light of the present invention, but any changes in shape or structure thereof, which fall within the scope of the present invention as defined in the claims, fall within the scope of the present invention.
Claims (5)
1. A technology for edge sealing of a zigzag wave-absorbing honeycomb sandwich plate is characterized by comprising the following steps:
s1, processing to form a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size;
s2, according to the theoretical size of the sawteeth of the wave-absorbing honeycomb sandwich plate with the sawtooth shape, the theoretical size of the sawteeth is zoomed by combining the thermal expansion coefficient of the silicon rubber to obtain the zoom size of the sawteeth, and a silicon rubber soft mold edge sealing tool with the sawtooth shape at the edge and the zoom size of the sawteeth is prepared;
s3, sticking adhesive demolding cloth on the surface of a sawtooth of the edge sealing tool for the silicon rubber soft mold, and paving an edge sealing adhesive film on the surface of the adhesive demolding cloth;
s4, correspondingly inserting the sawteeth of the edge sealing tool for the silicon rubber soft die into the sawteeth of the sawtooth wave-absorbing honeycomb sandwich plate;
s5, packaging a vacuum bag outside the silicon rubber soft die edge sealing tool and the sawtooth-shaped wave-absorbing honeycomb sandwich plate, vacuumizing and detecting leakage;
and S6, demoulding after heating and curing, taking out the silicon rubber soft mould edge sealing tool, and finishing edge sealing to obtain a finished product of the zigzag wave-absorbing honeycomb sandwich plate.
2. The edge sealing process of the zigzag wave-absorbing honeycomb sandwich plate according to claim 1, wherein the step S1 comprises the following steps: s1-1, cutting a honeycomb with a proper size, and preparing the honeycomb material with the wave absorbing function through the working procedures of strengthening, soaking and drying in sequence; s1-2, bonding the honeycomb material and the prepreg to prepare the wave-absorbing honeycomb sandwich plate; and S1-3, machining the wave-absorbing honeycomb sandwich plate into a sawtooth wave-absorbing honeycomb sandwich plate with a theoretical size.
3. The edge sealing process of the zigzag wave-absorbing honeycomb sandwich plate according to claim 2, wherein in S1-2, two plate surfaces of the honeycomb material are glued with prepreg by using glue films.
4. The edge sealing process of the zigzag wave-absorbing honeycomb sandwich plate according to claim 1, wherein before the step S4, a silicone rubber soft mold edge sealing tool is segmented according to actual conditions.
5. The edge sealing process of the zigzag wave-absorbing honeycomb sandwich plate according to claim 4, wherein in the step S4, each section of the edge sealing tool of the soft silicon rubber mold is plugged into the zigzag of the zigzag wave-absorbing honeycomb sandwich plate by an auxiliary tool.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113858663A (en) * | 2021-09-24 | 2021-12-31 | 成都佳驰电子科技股份有限公司 | Method for forming sawtooth-provided L-shaped variable cross-section hollow-structure composite wave-absorbing component |
CN113927995A (en) * | 2021-10-15 | 2022-01-14 | 上海朗旦复合材料科技有限公司 | Honeycomb sandwich plate processing and leveling method |
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- 2020-12-18 CN CN202011500180.1A patent/CN112743865A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113858663A (en) * | 2021-09-24 | 2021-12-31 | 成都佳驰电子科技股份有限公司 | Method for forming sawtooth-provided L-shaped variable cross-section hollow-structure composite wave-absorbing component |
CN113927995A (en) * | 2021-10-15 | 2022-01-14 | 上海朗旦复合材料科技有限公司 | Honeycomb sandwich plate processing and leveling method |
CN113927995B (en) * | 2021-10-15 | 2024-05-28 | 上海朗旦复合材料科技有限公司 | Honeycomb sandwich plate processing and leveling method |
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Address after: No.288, west section of Wenming street, new economic Industrial Park, south area of Chengdu modern industrial port, Pidu District, Chengdu, Sichuan 610000 Applicant after: Chengdu Jiachi Electronic Technology Co.,Ltd. Address before: No.288, west section of Wenming street, new economic Industrial Park, south area of Chengdu modern industrial port, Pidu District, Chengdu, Sichuan 610000 Applicant before: CHENGDU JIACHI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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