CN112743821A - PEEK material jig plate processing method - Google Patents
PEEK material jig plate processing method Download PDFInfo
- Publication number
- CN112743821A CN112743821A CN202011491310.XA CN202011491310A CN112743821A CN 112743821 A CN112743821 A CN 112743821A CN 202011491310 A CN202011491310 A CN 202011491310A CN 112743821 A CN112743821 A CN 112743821A
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- CN
- China
- Prior art keywords
- jig
- plate
- substrate
- positioning
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004696 Poly ether ether ketone Substances 0.000 title claims abstract description 19
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 title claims abstract description 19
- 229920002530 polyetherether ketone Polymers 0.000 title claims abstract description 19
- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 15
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 7
- 230000002787 reinforcement Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 12
- 230000000246 remedial effect Effects 0.000 abstract description 3
- 238000004904 shortening Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Jigs For Machine Tools (AREA)
Abstract
The embodiment of the application discloses a PEEK material jig plate processing method, which comprises the following steps: positioning: detecting and positioning the jig substrate to ensure that the jig substrate is at a processing position; reinforcing: the jig substrate is adsorbed by the vacuum chuck to reduce the deformation. Before processing, the jig substrate is detected and positioned, clamping and checking are reduced, and therefore time consumption in the processing process is reduced. Meanwhile, the vacuum chuck is adopted to adsorb the jig substrate, so that the deformation in the machining process is reduced, and the time consumption caused by taking remedial measures for large deformation in the machining process is avoided, so that the purpose of shortening the machining time is achieved, the machining efficiency is improved, and the market competition is preferentially seized for customers.
Description
Technical Field
The application relates to the technical field of jig preparation, in particular to a PEEK material jig plate processing method.
Background
In the processing process of the PEEK material jig plate, due to the fact that the surface of the PEEK material jig plate needs to be provided with patterns, the processing time of the back pattern and the front pattern is generally more than ten hours, and the processing time is long. Meanwhile, in the processing process, the position deviation of the substrate can also affect the processing time, so that the processing amount of the finished jig plate reaches dozens of hours, and the processing efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problems and provides a processing method of a PEEK material jig plate, which reduces the processing time of the jig plate and improves the processing efficiency of the jig plate.
In order to achieve the purpose, the invention discloses a processing method of a PEEK material jig plate, which comprises the following steps:
positioning: detecting and positioning the jig substrate to ensure that the jig substrate is at a processing position;
reinforcing: the jig substrate is adsorbed by the vacuum chuck to reduce the deformation.
Preferably, the positioning specifically comprises detecting and positioning the jig substrate through a positioning push plate assembly, the positioning push plate assembly comprises a plurality of groups of push plates which are oppositely arranged, and the two oppositely arranged push plates synchronously move in opposite directions and then abut against the side part of the jig substrate.
Preferably, the method further comprises clamping the jig substrate after the positioning step, wherein the clamping position of the jig substrate is a side portion.
Preferably, the reinforcing specifically includes that the vacuum chuck adsorbs the bottom of the jig substrate.
Preferably, the method further comprises back processing before the reinforcing step and pattern processing after the reinforcing step, wherein the back processing comprises processing the bottom of the jig substrate to obtain a jig board mounting area, and the pattern processing specifically comprises processing the top of the jig substrate to obtain a jig board pattern area.
Preferably, the jig plate processed by the method comprises a bottom plate, a pattern area arranged on the front surface of the bottom plate and a mounting area arranged on the back surface of the bottom plate.
Preferably, a plurality of positioning grooves are arranged on the pattern area.
Has the advantages that: according to the processing method of the PEEK material jig plate, before processing, the jig substrate is detected and positioned, clamping and checking are reduced, and therefore time consumption in the processing process is reduced. Meanwhile, the vacuum chuck is adopted to adsorb the jig substrate, so that the deformation in the machining process is reduced, and the time consumption caused by taking remedial measures for large deformation in the machining process is avoided, so that the purpose of shortening the machining time is achieved, the machining efficiency is improved, and the market competition is preferentially seized for customers.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a front view of a jig plate in an embodiment of the present application;
FIG. 2 is a right side view of a jig plate in an embodiment of the present application;
fig. 3 is a bottom view of the jig plate in the embodiment of the present application;
fig. 4 is a partially enlarged schematic view of a portion a in fig. 1.
Reference numerals: 1. a base plate; 2. a pattern area; 3. and (7) a mounting area.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example (b): a processing method of a PEEK material jig plate comprises the following steps:
s1, feeding: placing the jig substrate at a processing station;
s2, positioning: detecting and positioning the jig substrate to ensure that the jig substrate is at a processing position; the fixture substrate detection and positioning device specifically comprises a positioning push plate assembly for detecting and positioning the fixture substrate, wherein the positioning push plate assembly comprises a plurality of groups of push plates which are oppositely arranged, and the two oppositely arranged push plates synchronously move in opposite directions and then abut against the side part of the fixture substrate.
S3, clamping: the clamping structure in the prior art is adopted to clamp the jig substrate, and the clamping position of the jig substrate is a side part.
S4, back processing: and processing the bottom of the jig substrate so as to finish the processing of the mounting area 3 on the jig substrate.
S5, reinforcement: the fixture substrate is adsorbed by the vacuum chuck to reduce the deformation; the method specifically comprises the step of adsorbing the bottom of a jig substrate by using a vacuum chuck.
S6, pattern processing: and processing the top of the jig substrate to complete the processing of the pattern area 2 on the jig substrate, and obtaining a finished jig substrate after the processing is completed.
In the present embodiment, the PEEK jig plate processed by the above method, as shown in fig. 1 to 4, includes a bottom plate 1, a pattern region 2 disposed on the front surface of the bottom plate 1, and a mounting region 3 disposed on the back surface of the bottom plate 1. In the same way, the pattern area 2 is the pattern formed after the pattern processing of the step S6, the mounting area 3 is the structure obtained after the back processing of the step S4, a plurality of positioning grooves are arranged on the pattern area 2, and the jig plate is convenient to position between materials to be processed through the arrangement of the positioning grooves.
Based on the processing method of the PEEK material jig plate, the jig substrate is detected and positioned before processing, clamping and checking are reduced, and therefore time consumption in the processing process is reduced. Meanwhile, the vacuum chuck is adopted to adsorb the jig substrate, so that the deformation in the machining process is reduced, and the time consumption caused by taking remedial measures for large deformation in the machining process is avoided, so that the purpose of shortening the machining time is achieved, the machining efficiency is improved, and the market competition is preferentially seized for customers.
The foregoing description is for the purpose of illustration and is not for the purpose of limitation. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego the subject matter and should not be construed as an admission that the applicant does not consider such subject matter to be part of the disclosed subject matter.
Claims (7)
1. A processing method of a PEEK material jig plate is characterized by comprising the following steps:
positioning: detecting and positioning the jig substrate to ensure that the jig substrate is at a processing position;
reinforcing: the jig substrate is adsorbed by the vacuum chuck to reduce the deformation.
2. The processing method of the PEEK material jig plate as claimed in claim 1, wherein the positioning specifically comprises detecting and positioning the jig substrate by a positioning push plate assembly, the positioning push plate assembly comprises a plurality of sets of push plates which are oppositely arranged, and the two oppositely arranged push plates synchronously move in opposite directions and then abut against the side portion of the jig substrate.
3. The processing method of PEEK material jig plate of claim 1, further comprising clamping the jig substrate after the positioning step, wherein the clamping position of the jig substrate is a side portion.
4. The processing method of PEEK material jig plate according to claim 1 or 3, wherein the reinforcing body includes the vacuum chuck sucking the bottom of the jig base plate.
5. The processing method of PEEK material tool plate of claim 4, further comprising a back process before the reinforcement step and a pattern process after the reinforcement step, wherein the back process includes processing the bottom of the tool substrate to obtain a tool plate mounting region, and the pattern process specifically includes processing the top of the tool substrate to obtain a tool plate pattern region.
6. The processing method of PEEK material jig plate according to claim 1, wherein the jig plate processed by the method comprises a bottom plate (1), a pattern area (2) disposed on the front surface of the bottom plate (1), and a mounting area (3) disposed on the back surface of the bottom plate (1).
7. The processing method of PEEK material jig plate according to claim 6, characterized in that the pattern region (2) is provided with a plurality of positioning grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011491310.XA CN112743821A (en) | 2020-12-17 | 2020-12-17 | PEEK material jig plate processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011491310.XA CN112743821A (en) | 2020-12-17 | 2020-12-17 | PEEK material jig plate processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112743821A true CN112743821A (en) | 2021-05-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011491310.XA Pending CN112743821A (en) | 2020-12-17 | 2020-12-17 | PEEK material jig plate processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN112743821A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670462A (en) * | 2009-09-29 | 2010-03-17 | 江西洪都航空工业集团有限责任公司 | Wall plate processing technology for hyperboloid thin wall |
| CN208374813U (en) * | 2018-12-13 | 2019-01-15 | 常州纺织服装职业技术学院 | A kind of workpiece vacuum siphon fixture |
| CN110270799A (en) * | 2019-07-02 | 2019-09-24 | 东莞盛翔精密金属有限公司 | Laser detection jig plate manufacturing process |
| CN210899849U (en) * | 2019-09-29 | 2020-06-30 | 佛山市顺德区顺达电脑厂有限公司 | PCB (printed circuit board) splitting jig |
-
2020
- 2020-12-17 CN CN202011491310.XA patent/CN112743821A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670462A (en) * | 2009-09-29 | 2010-03-17 | 江西洪都航空工业集团有限责任公司 | Wall plate processing technology for hyperboloid thin wall |
| CN208374813U (en) * | 2018-12-13 | 2019-01-15 | 常州纺织服装职业技术学院 | A kind of workpiece vacuum siphon fixture |
| CN110270799A (en) * | 2019-07-02 | 2019-09-24 | 东莞盛翔精密金属有限公司 | Laser detection jig plate manufacturing process |
| CN210899849U (en) * | 2019-09-29 | 2020-06-30 | 佛山市顺德区顺达电脑厂有限公司 | PCB (printed circuit board) splitting jig |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215300 No. 358, Youbi Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshan youjieke automation equipment Co.,Ltd. Address before: 215300 No. 928-6, Changjiang North Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Kunshan youjieke automation equipment Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210504 |