CN112743470B - Positioning clamp and positioning method for chip capacitor - Google Patents
Positioning clamp and positioning method for chip capacitor Download PDFInfo
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- CN112743470B CN112743470B CN202110022830.4A CN202110022830A CN112743470B CN 112743470 B CN112743470 B CN 112743470B CN 202110022830 A CN202110022830 A CN 202110022830A CN 112743470 B CN112743470 B CN 112743470B
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- chip capacitor
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- positioning block
- positioning
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- 239000003990 capacitor Substances 0.000 title claims abstract description 194
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 238000004080 punching Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 3
- 238000012797 qualification Methods 0.000 abstract description 6
- 230000004308 accommodation Effects 0.000 description 27
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Abstract
The invention relates to the technical field of positioning fixtures, and discloses a positioning fixture and a positioning method of a chip capacitor, wherein the positioning fixture comprises: the first positioning block and the second positioning block are arranged on the top surface of the first positioning block, a first accommodating cavity capable of accommodating the chip capacitor is formed in the bottom of the first accommodating cavity, a second accommodating cavity capable of accommodating the chip capacitor is also formed in the bottom of the first accommodating cavity, one end of the second accommodating cavity in the length direction of the first accommodating cavity is arranged, and a first through hole penetrating through the first positioning block is formed in the bottom of the second accommodating cavity; the second locating block is provided with a cavity channel capable of accommodating the chip capacitor, so that the chip capacitor can move into the cavity channel from the second accommodating cavity when the first locating block and the second locating block are folded. The invention can correctly position the chip capacitor with the width larger than the length, and the prepared external electrode can form correct electric connection with the internal electrode of the chip capacitor, thereby ensuring that the chip capacitor can play the circuit function of the chip capacitor and improving the qualification rate of the prepared external electrode.
Description
Technical Field
The invention relates to the technical field of positioning fixtures, in particular to a positioning fixture and a positioning method of a chip capacitor.
Background
For chip capacitors, external electrodes are prepared by dipping, and the external electrodes are disposed on two sides of the chip capacitor having both width and thickness, which are denoted as end faces. For chip capacitors having a width greater than the length thereof, the positioning device in the prior art cannot be used to obtain correct positioning, resulting in that the external electrode is formed on the other surface of the chip capacitor than the lead-out surface of the internal electrode, and the internal electrode of the chip capacitor cannot be electrically connected correctly, resulting in that the chip capacitor cannot perform its circuit function. If the chip ceramic capacitor which is positioned by mistake is corrected manually, the efficiency of preparing the external electrode is very low, and the production requirement of the prior art cannot be met.
Disclosure of Invention
The purpose of the invention is that: the positioning fixture and the positioning method thereof can accurately position the chip capacitor with the width larger than the length, and improve the qualification rate of preparing the external electrode.
In order to achieve the above object, the present invention provides a positioning jig for chip capacitors, comprising: the first positioning block is provided with a first accommodating cavity capable of accommodating the chip capacitor on the top surface, the length and the width of the first accommodating cavity are respectively matched with those of the chip capacitor, the bottom of the first accommodating cavity is provided with a second accommodating cavity capable of accommodating the chip capacitor, the length and the width of the second accommodating cavity are respectively matched with those of the chip capacitor, the second accommodating cavity is communicated with the first accommodating cavity, the second accommodating cavity is arranged at one end of the first accommodating cavity in the length direction, the bottom of the second accommodating cavity is provided with a first through hole penetrating through the first positioning block, and the cross section area of the first through hole is smaller than the projection area of the chip capacitor on the first through hole; the second locating block is provided with a cavity channel capable of accommodating the chip capacitor, the cavity channel penetrates through the second locating block, the length and the width of the cavity channel are respectively matched with the width and the thickness of the chip capacitor, the cavity channel corresponds to the second accommodating cavity, and when the first locating block and the second locating block are folded, the chip capacitor can move from the second accommodating cavity to the cavity channel.
Optionally, a second through hole penetrating through the first positioning block is formed in the bottom of the first accommodating cavity.
Optionally, the sum of the depth value of the first accommodating cavity and the depth value of the second accommodating cavity is larger than the length value of the chip capacitor.
Optionally, the width value of the first accommodating cavity is equal to the width value of the second accommodating cavity.
Optionally, the first through hole is disposed at a center position of a bottom of the second accommodating cavity.
Optionally, a protrusion is disposed on an inner wall of the cavity along the length direction, and the protrusion is used for pressing against an outer wall of the chip capacitor.
The invention also provides a positioning method of the positioning clamp of the chip capacitor, which comprises the following steps:
step one: the chip capacitor is placed in the first receiving cavity of the first positioning block.
Step two: the chip capacitor is pushed into the second accommodating cavity of the first positioning block through the first punching pin, so that the end face of the chip capacitor is opposite to the bottom face of the second accommodating cavity.
Step three: and folding the first positioning block and the second positioning block, and pushing part of the chip capacitor into the cavity channel by the second punching needle through the first through hole communicated with the second accommodating cavity.
Step four: and separating the first positioning block from the second positioning block, and preparing a first external electrode on the end surface of the chip capacitor, which is positioned outside the cavity.
Step five: the second punch pin pushes the chip capacitor so that an end face of the chip capacitor located inside the cavity is pushed out of the cavity and a second external electrode is prepared on the end face.
Optionally, the first step further includes: the second punching needle penetrates through the first through hole, the top end of the second punching needle is located at the junction of the first accommodating cavity and the second accommodating cavity, and the chip capacitor is placed in the first accommodating cavity of the first positioning block.
Optionally, the second step further includes: after the second punching needle is withdrawn from the second accommodating cavity, the first punching needle penetrates through a second through hole communicated with the first accommodating cavity to push the chip capacitor into the second accommodating cavity of the first positioning block.
Optionally, the third step further includes: after the first punching needle is withdrawn from the second through hole, the first positioning block and the second positioning block are folded.
The invention provides a positioning clamp and a positioning method of a chip capacitor, which have the beneficial effects that compared with the prior art:
the invention relates to a positioning clamp of a chip capacitor, which comprises: the first positioning block and the second positioning block are arranged on the top surface of the first positioning block, the length and the width of the first positioning block are respectively matched with those of the chip capacitor, the bottom of the first positioning block is provided with a second positioning block which is also used for accommodating the chip capacitor, the length and the width of the second positioning block are respectively matched with those of the chip capacitor, the second positioning block is communicated with the first positioning block, one end of the second positioning block in the length direction of the first positioning block is provided with a first through hole penetrating through the first positioning block, and the cross section area of the first through hole is smaller than the projection area of the chip capacitor on the first through hole; the second locating block is provided with a cavity channel capable of accommodating the chip capacitor, the cavity channel penetrates through the second locating block, the length and the width of the cavity channel are respectively matched with the width and the thickness of the chip capacitor, the cavity channel corresponds to the second accommodating cavity, and when the first locating block and the second locating block are folded, the chip capacitor can move from the second accommodating cavity to the cavity channel. The chip capacitor is placed in the first accommodating cavity and then enters the second accommodating cavity, and in the process, the end faces of the chip capacitor can be ensured to extend out of the two openings of the cavity after the chip capacitor enters the cavity, so that an external electrode is prepared. Through the structure, the chip capacitor with the width larger than the length can be correctly positioned, and the prepared external electrode can form correct electric connection with the internal electrode of the chip capacitor, so that the chip capacitor can play a circuit function, and the qualification rate of the prepared external electrode is improved.
The invention also provides a positioning method of the positioning clamp of the chip capacitor, which can accurately position the chip capacitor with the width larger than the length, and the prepared external electrode can form accurate electric connection with the internal electrode of the chip capacitor, so that the chip capacitor can play the circuit function, and the qualification rate of the prepared external electrode is improved.
Drawings
Fig. 1 is a schematic structural view of a chip capacitor according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a first positioning block according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a first positioning block according to an embodiment of the present invention.
Fig. 4 is a schematic structural view of a second positioning block according to an embodiment of the present invention.
Fig. 5 is a schematic view of a chip capacitor according to an embodiment of the present invention disposed in a first receiving cavity.
Fig. 6 is a schematic view of a chip capacitor according to an embodiment of the present invention disposed at another angle in the first receiving chamber.
Fig. 7 is a schematic view of a chip capacitor according to an embodiment of the present invention being pushed into a second receiving cavity.
Fig. 8 is a schematic view of a chip capacitor according to an embodiment of the present invention disposed in a second receiving cavity.
Fig. 9 is a schematic diagram of a chip capacitor pushed into a cavity in accordance with an embodiment of the present invention.
Fig. 10 is a schematic diagram of a chip capacitor placed in a cavity according to an embodiment of the invention.
In the figure, 1, a first positioning block; 2. a first accommodation chamber; 3. a second accommodation chamber; 4. a first through hole; 5. a second positioning block; 6. a cavity channel; 7. a second through hole; 8. a chip capacitor; 9. an end face of the chip capacitor; 10. a protrusion; 11. a first punch pin; 12. and a second punch pin.
L, length of chip capacitor; w, width of chip capacitor; t, the thickness of the chip capacitor;
a1, the length of the first accommodating cavity; b1, the width of the first accommodating cavity; d1, the depth of the first accommodating cavity; a2, the length of the second accommodating cavity; b2, the width of the second accommodating cavity; d2, the depth of the second accommodating cavity; a3, the length of the first through hole; b3, the width of the first through hole; a4, the length of the second through hole; b4, the width of the second through hole; c1, the distance between the inner wall of the first through hole and the side wall of the second accommodating cavity; c2, the distance between the inner wall of the second through hole and the side wall of the second accommodating cavity.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 2-4, a positioning fixture for a chip capacitor 8 according to a preferred embodiment of the present invention includes a first positioning block 1 and a second positioning block 5.
The first positioning block 1 is provided with a first accommodating cavity 2 capable of accommodating the chip capacitor 8 on the top surface thereof, the length A1 and the width B1 of the first accommodating cavity 2 are respectively matched with the length and the width of the chip capacitor 8, the bottom of the first accommodating cavity 2 is provided with a second accommodating cavity 3 capable of accommodating the chip capacitor 8, the length A2 and the width B2 of the second accommodating cavity 3 are respectively matched with the thickness and the width of the chip capacitor 8, the second accommodating cavity 3 is communicated with the first accommodating cavity 2, the second accommodating cavity 3 is arranged at one end in the length direction of the first accommodating cavity 2, the bottom of the second accommodating cavity 3 is provided with a first through hole 4 penetrating through the first positioning block 1, and the cross section area of the first through hole 4 is smaller than the projection area of the chip capacitor 8 on the first through hole 4. In the present embodiment, the first receiving chamber 2 and the second receiving chamber 3 are each provided in the shape of rectangular grooves, and in other embodiments, other similar shapes may be selected. The length and width of the first accommodating cavity 2 are respectively matched with the length and width of the chip capacitor 8, namely, the length of the first accommodating cavity 2 is slightly larger than the length of the chip capacitor 8, and the width of the first accommodating cavity 2 is slightly larger than the width of the chip capacitor 8. So arranged, the end face 9 faces the side wall of the first accommodation chamber 2 in the width direction while the chip capacitor 8 is placed in the first accommodation chamber 2. The length and width of the second accommodating cavity 3 are respectively matched with the thickness and width of the chip capacitor 8, namely, the length of the second accommodating cavity 3 is slightly larger than the thickness of the chip capacitor 8, and the width of the second accommodating cavity 3 is slightly larger than the width of the chip capacitor 8. So arranged, the end face 9 can face the bottom face of the second accommodation chamber 3 when the chip capacitor 8 is placed in the second accommodation chamber 3. The first through hole 4 is used for the second punch pin 12 to pass through, and in this embodiment, the second punch pin 12 can ensure that the chip capacitor 8 is stably placed in the first accommodating cavity 2, and can push the chip capacitor 8 into the cavity 6 from the second accommodating cavity 3.
The second positioning block 5 is provided with a cavity 6 capable of accommodating the chip capacitor 8, the cavity 6 penetrates through the second positioning block 5, the length and the width of the cavity 6 are respectively matched with the width and the thickness of the chip capacitor 8, the cavity 6 corresponds to the second accommodating cavity 3, and when the first positioning block 1 and the second positioning block 5 are folded, the chip capacitor 8 can move from the second accommodating cavity 3 to the cavity 6. The length and width of the cavity 6 are respectively matched with the width and thickness of the chip capacitor 8, that is, the length of the cavity 6 is slightly larger than the width of the chip capacitor 8, the width of the cavity 6 is slightly larger than the thickness of the chip capacitor 8, and when the chip capacitor 8 is placed in the cavity 6, the end face 9 can be located outside the second positioning block 5 and is not in contact with the inner wall of the cavity 6. In terms of material selection, the second positioning block 5 can be made of aluminum alloy materials, and die-casting rubber is arranged on the inner wall of the cavity 6, so that friction on the chip capacitor 8 is reduced. In this embodiment, the thickness of the second positioning block 5 is greater than the length of the chip capacitor 8.
In the positioning fixture for the chip capacitor 8 of this embodiment, the chip capacitor 8 is placed in the first accommodating cavity 2 and then enters the second accommodating cavity 3, in this process, the end faces 9 of the chip capacitor 8 can be ensured to protrude from two openings of the cavity 6 after the chip capacitor 8 enters the cavity 6, so that the external electrode can be prepared. Through the structure, the chip capacitor 8 with the width larger than the length can be correctly positioned, and the prepared external electrode can form correct electric connection with the internal electrode of the chip capacitor 8, so that the chip capacitor 8 can play the circuit function, and the qualification rate of the external electrode is improved.
For the shape of the chip capacitor 8 and its length L, width W and thickness T, refer to fig. 1.
In the present embodiment, the first through hole 4 is provided at the center of the bottom of the second accommodation chamber 3. Thus, when the second punch pin 12 pushes the chip capacitor 8 into the cavity 6, the chip capacitor 8 is stressed stably, and the path of the chip capacitor 8 is prevented from deflecting.
In the present embodiment, the bottom of the first accommodation chamber 2 is provided with a second through hole 7 penetrating the first positioning block 1. The second through hole 7 is used for the first punch pin 11 to pass through, and the first punch pin 11 can push the chip capacitor 8 from the first accommodating cavity 2 into the second accommodating cavity 3.
Furthermore, the sum of the value of the depth D1 of the first accommodation chamber 2 and the value of the depth D2 of the second accommodation chamber 3 is greater than the value of the length of the chip capacitor 8. Thus, when the chip capacitor 8 is placed in the second accommodating cavity 3, the chip capacitor 8 does not protrude from the surface of the first positioning block 1, so that the first positioning block 1 and the second positioning block 5 can be tightly attached, accurate alignment of the second accommodating cavity 3 and the cavity channel 6 is facilitated, and the chip capacitor 8 can be smoothly pushed into the cavity channel 6.
In the present embodiment, the width of the first accommodation chamber 2 is equal to the width of the second accommodation chamber 3. The three side walls of the second accommodating cavity 3 are coplanar with the three side walls of the first accommodating cavity 2, so that the second accommodating cavity 3 is beneficial to production and processing, and is convenient to implement.
It should be noted that the inner wall of the cavity 6 in the length direction is provided with a protrusion 10, and the protrusion 10 is used for pressing against the outer wall of the chip capacitor 8. Referring to fig. 4, the protrusion 10 contacts the chip capacitor 8, so that the contact area between the chip capacitor 8 and the inner wall of the cavity 6 is reduced, friction is reduced, and the chip capacitor 8 is easy to move in the cavity 6 when being pushed. The die-casting rubber is arranged on the bulge 10, so that the chip capacitor 8 can be clamped and fixed, and the external electrode is conveniently prepared on the end face 9.
Referring to fig. 5-10, the present embodiment further provides a positioning method of a positioning fixture of a chip capacitor 8, including the following steps:
step one: the chip capacitor 8 is placed in the first receiving chamber 2 of the first positioning block 1.
The chip capacitor 8 is placed on the upper surface of the first positioning block 1, a vibration force is applied, and the chip capacitor 8 is placed in the first accommodation chamber 2.
It should be noted that the second punch pin 12 may be disposed through the first through hole 4, and after the top end of the second punch pin 12 is located at the junction of the first accommodating cavity 2 and the second accommodating cavity 3, the chip capacitor 8 is placed in the first accommodating cavity 2 of the first positioning block 1. In this way, the chip capacitor 8 can be held by the second punch pin 12 when the chip capacitor 8 is placed in the first accommodating chamber 2, and the chip capacitor 8 can be stably placed in the first accommodating chamber 2. Since the length and width of the first accommodating chamber 2 are matched with the length and width of the chip capacitor 8, the chip capacitor 8 can only be in a correct position state when the end face 9 of the chip capacitor 8 is opposite to the side wall of the first accommodating chamber 2 in the width direction.
In the present embodiment, the depth D1 of the first accommodation chamber 2 is 0.6 to 0.8 times the length of the chip capacitor 8. This arrangement makes it possible to correct the position of the chip capacitor 8 when the vibration force is applied, and the chip capacitor 8 can enter the first accommodation chamber 2 at the correct position and make the chip capacitor 8 be in the correct position state when placed in the first accommodation chamber 2. In addition, the size range of the first accommodation chamber 2 ensures that the chip capacitor 8, which is already in the correct position, is not vibrated out of the first accommodation chamber 2.
The distance C1 between the inner wall of the first through hole 4 and the side wall of the second accommodation chamber 3 is less than 0.5mm, and the first through hole 4 is located in the middle of the bottom surface of the second accommodation chamber 3. The length A3 of the first through hole 4 is 0.5-0.8 times the length of the second accommodation chamber 3, and the width B3 of the first through hole 4 is 0.5-0.8 times the width of the chip capacitor 8. Through setting up the size scope of first through-hole 4 like this, first through-hole 4 can make the great second punch pin 12 of size pass, increases the area of contact of second punch pin 12 and chip capacitor 8, and the atress of chip capacitor 8 is steady. And the clearance distance between the second punch pin 12 and the first accommodating cavity 2 can not be too large, so that the chip capacitor 8 is prevented from being clamped by the clearance in an inclined posture, and the chip capacitor 8 can smoothly enter the first accommodating cavity 2.
Step two: the chip capacitor 8 is pushed into the second receiving chamber 3 of the first positioning block 1 by the first punch pin 11 such that the end face 9 of the chip capacitor 8 faces the bottom face of the second receiving chamber 3.
Of course, if the chip capacitor 8 is held by the second punch pin 12 when entering the first accommodating chamber 2, after the second punch pin 12 is set to withdraw from the second accommodating chamber 3, the first punch pin 11 pushes the chip capacitor 8 into the second accommodating chamber 3 of the first positioning block 1 through the second through hole 7 communicated with the first accommodating chamber 2. The first punching pin 11 penetrates through the second through hole 7 from bottom to top to push the chip capacitor 8, and one end of the chip capacitor 8, which is far away from the second accommodating cavity 3, is tilted, so that the chip capacitor is turned over and falls into the second accommodating cavity 3. Since the end face 9 is already facing the side wall of the first accommodation chamber 2 in the width direction in the first step, the end face 9 faces the bottom face of the second accommodation chamber 3 when the chip capacitor 8 falls into the second accommodation chamber 3.
The second through hole 7 is provided at a middle position in the width direction of the bottom surface of the first accommodation chamber 2, and a distance C2 between the inner wall of the second through hole 7 and the side wall of the second accommodation chamber 3 is 0.2 to 0.5 times the length of the chip capacitor 8. The length A4 of the second via hole 7 is 0.2 to 0.3 times the length of the chip capacitor 8, and the width B4 of the second via hole 7 is 0.3 to 0.9 times the width of the chip capacitor 8. Through setting these size ranges, the second through hole 7 can make the first punch pin 11 with larger size pass through and jack up the chip capacitor 8, and the thrust action point of the first punch pin 11 deviates from the center of gravity of the chip capacitor 8, so that one end of the chip capacitor 8 is tilted up and turned over smoothly to fall into the second accommodating cavity 3.
The width B3 of the first through hole 4 is 0.5-0.8 times the width of the chip capacitor 8, so that the end face 9 of the chip capacitor 8 cannot pass through the first through hole 4, and the chip capacitor 8 can be held by a step formed between the second accommodating chamber 3 and the first through hole 4 when it falls into the second accommodating chamber 3.
The depth D2 of the second receiving chamber 3 is 0.6-0.8 times the length of the chip capacitor 8. By setting the size range in this way, the drop between the chip capacitor 8 and the bottom surface of the second accommodating cavity 3 can be reduced, and damage to the chip capacitor 8 can be avoided. Further, the chip capacitor 8 does not protrude from the surface of the first positioning block 1 when placed in the second accommodation chamber 3, and at the same time, the thickness of the first positioning block 1 is reduced.
Step three: the first positioning block 1 and the second positioning block 5 are closed, and the second punching needle 12 penetrates through the first through hole 4 communicated with the second accommodating cavity 3 to push part of the chip capacitor 8 into the cavity channel 6.
After the first punching needle 11 is withdrawn from the second through hole 7, the first positioning block 1 and the second positioning block 5 are folded.
The punching pin pushes a part of the chip capacitor 8 into the cavity 6 instead of pushing the chip capacitor 8 completely into the cavity 6, and the end face 9 of the chip capacitor 8 is located outside the cavity 6, which can facilitate the subsequent preparation of external electrodes on the end face 9.
Step four: the first positioning block 1 and the second positioning block 5 are separated, and a first external electrode is prepared on the end surface 9 of the chip capacitor 8, which is positioned outside the cavity 6.
Step five: the second punch pin 12 pushes the chip capacitor 8 so that the end face 9 of the chip capacitor 8 located inside the cavity 6 is pushed out of the cavity 6 and a second external electrode is prepared on the end face 9.
In summary, the embodiment of the invention provides a positioning fixture and a positioning method for a chip capacitor 8, which can accurately position the chip capacitor 8 with a width larger than a length, and the prepared external electrode can form accurate electric connection with the internal electrode of the chip capacitor 8, so that the chip capacitor 8 can play a circuit function, and the qualification rate of preparing the external electrode is improved.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present invention, and these modifications and substitutions should also be considered as being within the scope of the present invention.
Claims (6)
1. A positioning jig for a chip capacitor, comprising:
the first positioning block is provided with a first accommodating cavity capable of accommodating the chip capacitor on the top surface, the length and the width of the first accommodating cavity are respectively matched with those of the chip capacitor, the bottom of the first accommodating cavity is provided with a second accommodating cavity capable of accommodating the chip capacitor, the length and the width of the second accommodating cavity are respectively matched with those of the chip capacitor, the second accommodating cavity is communicated with the first accommodating cavity, the second accommodating cavity is arranged at one end of the first accommodating cavity in the length direction, the bottom of the second accommodating cavity is provided with a first through hole penetrating through the first positioning block, and the cross section area of the first through hole is smaller than the projection area of the chip capacitor on the first through hole;
the second positioning block is provided with a cavity channel capable of accommodating the chip capacitor, the cavity channel penetrates through the second positioning block, the length and the width of the cavity channel are respectively matched with the width and the thickness of the chip capacitor, the cavity channel corresponds to the second accommodating cavity, and when the first positioning block and the second positioning block are closed, the chip capacitor can move from the second accommodating cavity to the cavity channel;
the bottom of the first accommodating cavity is provided with a second through hole penetrating through the first positioning block;
the first through hole is arranged at the center of the bottom of the second accommodating cavity.
2. The positioning fixture for chip capacitors according to claim 1, wherein a sum of a depth value of the first receiving chamber and a depth value of the second receiving chamber is greater than a length value of the chip capacitor.
3. The positioning jig for chip capacitors as recited in claim 1, wherein a width of said first receiving cavity is equal in value to a width of said second receiving cavity.
4. The positioning jig for chip capacitors as set forth in claim 1, wherein the inner wall of the cavity in the length direction is provided with a projection for pressing against the outer wall of the chip capacitor.
5. A positioning method for a positioning jig for a chip capacitor as claimed in any one of claims 1 to 4, comprising the steps of:
step one: the second punching needle passes through the first through hole, and the top end of the second punching needle is positioned at the junction of the first accommodating cavity and the second accommodating cavity, and then the chip capacitor is arranged in the first accommodating cavity of the first positioning block;
step two: pushing the chip capacitor into a second accommodating cavity of the first positioning block through a first punching pin, so that the end face of the chip capacitor is opposite to the bottom face of the second accommodating cavity;
after the second punching needle is withdrawn from the second accommodating cavity, the first punching needle passes through a second through hole communicated with the first accommodating cavity to push the chip capacitor into the second accommodating cavity of the first positioning block;
step three: folding the first positioning block and the second positioning block, and pushing part of the chip capacitor into a cavity channel by a second punching needle through a first through hole communicated with the second accommodating cavity;
step four: separating the first positioning block from the second positioning block, and preparing a first external electrode on the end surface of the chip capacitor, which is positioned outside the cavity;
step five: the second punch pin pushes the chip capacitor so that an end face of the chip capacitor located inside the cavity is pushed out of the cavity and a second external electrode is prepared on the end face.
6. The method of positioning a positioning jig for a chip capacitor as set forth in claim 5, wherein said step three further includes: after the first punching needle is withdrawn from the second through hole, the first positioning block and the second positioning block are folded.
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| CN202110022830.4A CN112743470B (en) | 2021-01-08 | 2021-01-08 | Positioning clamp and positioning method for chip capacitor |
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| CN202110022830.4A CN112743470B (en) | 2021-01-08 | 2021-01-08 | Positioning clamp and positioning method for chip capacitor |
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| CN112743470A CN112743470A (en) | 2021-05-04 |
| CN112743470B true CN112743470B (en) | 2024-03-19 |
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| DE4023249A1 (en) * | 1990-03-16 | 1991-09-19 | Asea Brown Boveri | Fixing unit for electrical capacitors - has cylindrical section capacitors held in elongated slot by elastomer clamping elements |
| JPH0697002A (en) * | 1992-09-14 | 1994-04-08 | Witco Of Jupiter Dentsu Kk | Feedthrough capacitor |
| US5788814A (en) * | 1996-04-09 | 1998-08-04 | David Sarnoff Research Center | Chucks and methods for positioning multiple objects on a substrate |
| CN2915389Y (en) * | 2006-07-11 | 2007-06-27 | 友厚新科技股份有限公司 | Passive element positioning jig |
| CN202795325U (en) * | 2012-09-19 | 2013-03-13 | 江西联创电子有限公司 | Positioning fixture for adhering anisotropic conductive adhesive to flexible circuit board for capacitive screens |
| CN109968240A (en) * | 2019-04-01 | 2019-07-05 | 湖南艾华集团股份有限公司 | A kind of grip device of capacitor |
| CN214603897U (en) * | 2021-01-08 | 2021-11-05 | 广东风华高新科技股份有限公司 | Positioning fixture of chip capacitor |
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| CN112743470A (en) | 2021-05-04 |
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